JPWO2021034445A5 - - Google Patents
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- JPWO2021034445A5 JPWO2021034445A5 JP2021537730A JP2021537730A JPWO2021034445A5 JP WO2021034445 A5 JPWO2021034445 A5 JP WO2021034445A5 JP 2021537730 A JP2021537730 A JP 2021537730A JP 2021537730 A JP2021537730 A JP 2021537730A JP WO2021034445 A5 JPWO2021034445 A5 JP WO2021034445A5
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- thermal
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- thermal resistance
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- resistance value
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- 238000000034 method Methods 0.000 claims 24
- 230000000737 periodic effect Effects 0.000 claims 12
- 230000010363 phase shift Effects 0.000 claims 3
- 230000007547 defect Effects 0.000 claims 2
- 238000004590 computer program Methods 0.000 claims 1
- 230000002950 deficient Effects 0.000 claims 1
- 238000003786 synthesis reaction Methods 0.000 claims 1
Claims (20)
所定の質問周波数に基づいて、周期的正弦波入力を使用して前記熱構成要素を駆動することと、
前記周期的正弦波入力を使用して前記熱構成要素を駆動することに応答する、熱センサからの複数の温度出力を測定することであって、前記熱センサは、前記熱構成要素の温度を検出するように配置および構成され、
前記複数の温度出力に、前記周期的正弦波入力と同相の基準信号を乗算して、結果として得られる直流(DC)信号成分を計算し、同相成分Xを判定することと、
前記複数の温度出力に、90°位相シフト基準信号を乗算して、結果として得られるDC信号成分を計算し、直交位相ずれ成分Yを判定することと、
tan-1(Y/X)又はatan2(X,Y)に基づいて、前記周期的正弦波入力に応答する位相オフセットを計算することと、
較正された抵抗位相オフセット式、及び計算された前記位相オフセットを使用して、熱境界面の抵抗値を判定することと、
判定された前記抵抗値を所定の抵抗閾値と比較することと、を含む、方法。 contacting a known consumable with a thermal component of an instrument under test , the consumable and the thermal component forming a thermal interface;
driving the thermal component using a periodic sinusoidal input based on a predetermined interrogation frequency;
measuring a plurality of temperature outputs from a thermal sensor responsive to driving the thermal component using the periodic sinusoidal input, the thermal sensor measuring the temperature of the thermal component; arranged and configured to detect
multiplying the plurality of temperature outputs by a reference signal in phase with the periodic sinusoidal input and calculating a resulting direct current (DC) signal component to determine an in-phase component X;
multiplying the plurality of temperature outputs by a 90° phase-shifted reference signal and calculating a resulting DC signal component to determine a quadrature phase shift component Y;
calculating a phase offset in response to the periodic sinusoidal input based on tan −1 (Y/X) or atan2(X,Y);
determining a resistance value of a thermal interface using a calibrated resistance phase offset equation and the calculated phase offset;
and comparing the determined resistance value to a predetermined resistance threshold.
所定の質問周波数に基づいて、周期的正弦波入力を使用して前記熱構成要素を駆動することと、
前記周期的正弦波入力を使用して前記熱構成要素を駆動することに応答する、熱センサからの複数の温度出力を測定することであって、前記熱センサは、前記熱構成要素の温度を検出するように配置および構成され、
前記複数の温度出力に、前記周期的正弦波入力と同相の基準信号を乗算して、結果として得られる直流(DC)信号成分を計算し、同相成分Xを判定することと、
前記複数の温度出力に、90°位相シフト基準信号を乗算して、結果として得られるDC信号成分を計算し、直交位相ずれ成分Yを判定することと、
tan-1(Y/X)又はatan2(X,Y)に基づいて、前記周期的正弦波入力に応答する位相オフセットを計算することと、
較正された抵抗位相オフセット式、及び計算された前記位相オフセットを使用して、熱境界面の熱抵抗値を判定することと、
判定された前記熱抵抗値を所定の熱抵抗閾値と比較することと、を含む、方法。 contacting the consumable to be tested with a known thermal component of the instrument , the consumable and the thermal component forming a thermal interface;
driving the thermal component using a periodic sinusoidal input based on a predetermined interrogation frequency;
measuring a plurality of temperature outputs from a thermal sensor responsive to driving the thermal component using the periodic sinusoidal input, the thermal sensor measuring the temperature of the thermal component; arranged and configured to detect
multiplying the plurality of temperature outputs by a reference signal in phase with the periodic sinusoidal input and calculating a resulting direct current (DC) signal component to determine an in-phase component X;
multiplying the plurality of temperature outputs by a 90° phase-shifted reference signal and calculating a resulting DC signal component to determine a quadrature phase shift component Y;
calculating a phase offset in response to the periodic sinusoidal input based on tan −1 (Y/X) or atan2(X,Y);
determining a thermal resistance value of a thermal interface using a calibrated resistance phase offset equation and the calculated phase offset;
and comparing the determined thermal resistance value to a predetermined thermal resistance threshold.
所定の質問周波数に基づいて、周期的正弦波入力を使用して前記熱構成要素を駆動することと、
前記周期的正弦波入力を使用して前記熱構成要素を駆動することに応答する、熱センサからの複数の温度出力を測定することであって、前記熱センサは、前記熱構成要素の温度を検出するように配置および構成され、
前記複数の温度出力に、前記周期的正弦波入力と同相の基準信号を乗算して、結果として得られる直流(DC)信号成分を計算し、同相成分Xを判定することと、
前記複数の温度出力に、90°位相シフト基準信号を乗算して、結果として得られるDC信号成分を計算し、直交位相ずれ成分Yを判定することと、
tan-1(Y/X)又はatan2(X,Y)に基づいて、前記周期的正弦波入力に応答する位相オフセットを計算することと、
較正された抵抗位相オフセット式、及び計算された前記位相オフセットを使用して、熱境界面の熱抵抗値を判定することと、
判定された前記熱抵抗値を第1の所定の熱抵抗閾値と比較することと、
判定された前記熱抵抗値を第2の所定の熱抵抗閾値と比較することと、
判定された前記熱抵抗値と、前記第1及び第2の所定の熱抵抗閾値との前記比較に基づいて、前記熱境界面の特性を判定することと、を含む、方法。 contacting the consumable with a thermal component of the instrument , the consumable and the thermal component forming a thermal interface;
driving the thermal component using a periodic sinusoidal input based on a predetermined interrogation frequency;
measuring a plurality of temperature outputs from a thermal sensor responsive to driving the thermal component using the periodic sinusoidal input, the thermal sensor measuring the temperature of the thermal component; arranged and configured to detect
multiplying the plurality of temperature outputs by a reference signal in phase with the periodic sinusoidal input and calculating a resulting direct current (DC) signal component to determine an in-phase component X;
multiplying the plurality of temperature outputs by a 90° phase-shifted reference signal and calculating a resulting DC signal component to determine a quadrature phase shift component Y;
calculating a phase offset in response to the periodic sinusoidal input based on tan −1 (Y/X) or atan2(X,Y);
determining a thermal resistance value of a thermal interface using a calibrated resistance phase offset equation and the calculated phase offset;
comparing the determined thermal resistance value to a first predetermined thermal resistance threshold;
comparing the determined thermal resistance value to a second predetermined thermal resistance threshold;
determining a characteristic of the thermal interface based on the comparison of the determined thermal resistance value and the first and second predetermined thermal resistance thresholds.
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201962887901P | 2019-08-16 | 2019-08-16 | |
US62/887,901 | 2019-08-16 | ||
NL2023792 | 2019-09-06 | ||
NL2023792A NL2023792B1 (en) | 2019-08-16 | 2019-09-06 | Method for measuring thermal resistance at interface between consumable and thermocycler |
PCT/US2020/043376 WO2021034445A1 (en) | 2019-08-16 | 2020-07-24 | Method for measuring thermal resistance between a thermal component of an instrument and a consumable |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2022543938A JP2022543938A (en) | 2022-10-17 |
JPWO2021034445A5 true JPWO2021034445A5 (en) | 2023-07-18 |
JP7389121B2 JP7389121B2 (en) | 2023-11-29 |
Family
ID=68000047
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2021537730A Active JP7389121B2 (en) | 2019-08-16 | 2020-07-24 | Method for measuring thermal resistance between thermal components of equipment and consumables |
Country Status (12)
Country | Link |
---|---|
US (3) | US11327035B2 (en) |
EP (1) | EP3881060A1 (en) |
JP (1) | JP7389121B2 (en) |
KR (1) | KR102603721B1 (en) |
CN (1) | CN113287007A (en) |
AU (1) | AU2020333461A1 (en) |
BR (1) | BR112021012947A2 (en) |
CA (1) | CA3123023A1 (en) |
IL (1) | IL284177B1 (en) |
MX (1) | MX2021006294A (en) |
NL (1) | NL2023792B1 (en) |
TW (1) | TWI764224B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL2023792B1 (en) | 2019-08-16 | 2021-03-24 | Illumina Inc | Method for measuring thermal resistance at interface between consumable and thermocycler |
CN113419120B (en) * | 2021-05-08 | 2022-10-25 | 同济大学 | Method and system for measuring thermal resistance of dielectric film and metal interface |
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JPS604870A (en) * | 1983-06-22 | 1985-01-11 | Nec Corp | Thermal resistance measuring apparatus of laser diode |
US6491426B1 (en) * | 2001-06-25 | 2002-12-10 | Sbs Technologies Inc. | Thermal bond verification |
JPWO2003044509A1 (en) * | 2001-11-19 | 2005-03-24 | 財団法人理工学振興会 | Thermal analysis method and thermal analysis apparatus |
US6648504B2 (en) * | 2002-03-01 | 2003-11-18 | Waters Investment Limited | System and method for calibrating contact thermal resistances in differential scanning calorimeters |
JP2005345385A (en) | 2004-06-04 | 2005-12-15 | Rikogaku Shinkokai | Characteristic measuring instrument and characteristic measuring method |
WO2006104019A1 (en) | 2005-03-28 | 2006-10-05 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, manufacturing method thereof, and measuring method thereof |
US20090139311A1 (en) * | 2007-10-05 | 2009-06-04 | Applied Biosystems Inc. | Biological Analysis Systems, Devices, and Methods |
WO2012018323A1 (en) * | 2010-08-02 | 2012-02-09 | Micro Motion, Inc. | Method and apparatus for determining a temperature of a vibrating sensor component of a vibrating meter |
TWI495868B (en) | 2013-09-03 | 2015-08-11 | China Steel Corp | System and method for measuring properties of thermoelectric module |
TW201809712A (en) | 2014-10-29 | 2018-03-16 | 因諾帝歐股份有限公司 | Apparatus, method, and system for testing IC chip |
TWI570419B (en) | 2015-07-31 | 2017-02-11 | 陽榮科技股份有限公司 | Device and method for forcing temperature of ic |
CN109312392B (en) * | 2016-04-11 | 2022-06-24 | 马斯特里赫特大学 | Thermocouple including polymer coating for detecting analytes and related methods |
US10324087B2 (en) * | 2016-04-11 | 2019-06-18 | Universiteit Maastricht | Thermocouples comprising a polymer for detecting analytes and related methods |
CN107590295B (en) | 2016-07-08 | 2021-02-02 | 台达电子企业管理(上海)有限公司 | Method and device for evaluating condition of heat dissipation system of power module |
JP2018080919A (en) | 2016-11-14 | 2018-05-24 | セイコーエプソン株式会社 | Temperature measurement device, inspection device, and method for control |
JP6722779B2 (en) * | 2017-02-20 | 2020-07-15 | 株式会社日立製作所 | Temperature control device and nucleic acid amplification device |
WO2019039508A1 (en) | 2017-08-22 | 2019-02-28 | 株式会社新川 | Mounting device and temperature measuring method |
US11193902B2 (en) | 2017-09-15 | 2021-12-07 | Wuhan Joule Yacht Science & Technology Co., Ltd. | Method and device for measuring transverse thermal conductivity of thin film |
JP2019132760A (en) | 2018-02-01 | 2019-08-08 | 学校法人 東洋大学 | Heat characteristic measuring method, and device therefor |
NL2023792B1 (en) | 2019-08-16 | 2021-03-24 | Illumina Inc | Method for measuring thermal resistance at interface between consumable and thermocycler |
JP2022101744A (en) | 2020-12-25 | 2022-07-07 | 国立研究開発法人物質・材料研究機構 | Thermoelectric conversion characteristic evaluation method, thermoelectric conversion characteristic analysis device and analysis program and thermoelectric conversion characteristic evaluation system |
CN115308515B (en) | 2022-08-26 | 2024-02-20 | 天津电气科学研究院有限公司 | IGCT three-level power unit test system and method |
-
2019
- 2019-09-06 NL NL2023792A patent/NL2023792B1/en active
-
2020
- 2020-07-24 CA CA3123023A patent/CA3123023A1/en active Pending
- 2020-07-24 BR BR112021012947A patent/BR112021012947A2/en unknown
- 2020-07-24 US US16/937,781 patent/US11327035B2/en active Active
- 2020-07-24 CN CN202080007618.4A patent/CN113287007A/en active Pending
- 2020-07-24 IL IL284177A patent/IL284177B1/en unknown
- 2020-07-24 KR KR1020217020194A patent/KR102603721B1/en active IP Right Grant
- 2020-07-24 AU AU2020333461A patent/AU2020333461A1/en active Pending
- 2020-07-24 EP EP20751039.7A patent/EP3881060A1/en active Pending
- 2020-07-24 MX MX2021006294A patent/MX2021006294A/en unknown
- 2020-07-24 JP JP2021537730A patent/JP7389121B2/en active Active
- 2020-08-03 TW TW109126227A patent/TWI764224B/en active
-
2022
- 2022-04-11 US US17/717,297 patent/US11709143B2/en active Active
-
2023
- 2023-06-08 US US18/207,352 patent/US20230314353A1/en active Pending
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