JPWO2021014760A1 - - Google Patents

Info

Publication number
JPWO2021014760A1
JPWO2021014760A1 JP2021534574A JP2021534574A JPWO2021014760A1 JP WO2021014760 A1 JPWO2021014760 A1 JP WO2021014760A1 JP 2021534574 A JP2021534574 A JP 2021534574A JP 2021534574 A JP2021534574 A JP 2021534574A JP WO2021014760 A1 JPWO2021014760 A1 JP WO2021014760A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021534574A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021014760A1 publication Critical patent/JPWO2021014760A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00—Thin magnetic films, e.g. of one-domain structure
    • H01F10/26—Thin magnetic films, e.g. of one-domain structure characterised by the substrate or intermediate layers
    • H01F10/30—Thin magnetic films, e.g. of one-domain structure characterised by the substrate or intermediate layers characterised by the composition of the intermediate layers, e.g. seed, buffer, template, diffusion preventing, cap layers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
JP2021534574A 2019-07-23 2020-05-29 Pending JPWO2021014760A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019135709 2019-07-23
PCT/JP2020/021448 WO2021014760A1 (ja) 2019-07-23 2020-05-29 非磁性層形成用スパッタリングターゲット部材

Publications (1)

Publication Number Publication Date
JPWO2021014760A1 true JPWO2021014760A1 (ja) 2021-01-28

Family

ID=74193294

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021534574A Pending JPWO2021014760A1 (ja) 2019-07-23 2020-05-29

Country Status (3)

Country Link
JP (1) JPWO2021014760A1 (ja)
TW (1) TWI742740B (ja)
WO (1) WO2021014760A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023079856A1 (ja) * 2021-11-05 2023-05-11 Ｊｘ金属株式会社 スパッタリングターゲット部材、スパッタリングターゲット組立品、及び成膜方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0677805B2 (ja) * 1986-07-10 1994-10-05 株式会社神戸製鋼所 スパツタリング用タ−ゲツトのボンデイング方法
US20070099032A1 (en) * 2005-11-02 2007-05-03 Heraeus, Inc., A Corporation Of The State Of Arizona Deposition of enhanced seed layer using tantalum alloy based sputter target
JP2011003260A (ja) * 2009-06-22 2011-01-06 Showa Denko Kk 磁気記録媒体及び磁気記録再生装置
MY149640A (en) * 2009-12-11 2013-09-13 Jx Nippon Mining & Metals Corp Sputtering target comprising oxide phase dispersed in co or co alloy phase, magnetic thin film made of co or co alloy phase and oxide phase, and magnetic recording medium using the said thin film
JP5775720B2 (ja) * 2011-03-30 2015-09-09 昭和電工株式会社 磁気記録媒体の製造方法及び磁気記録再生装置
WO2014046040A1 (ja) * 2012-09-18 2014-03-27 Jx日鉱日石金属株式会社 スパッタリングターゲット
JP6320154B2 (ja) 2014-04-25 2018-05-09 キヤノン株式会社 撮像装置及び撮像装置の駆動方法
JP6713489B2 (ja) * 2016-02-19 2020-06-24 Ｊｘ金属株式会社 磁気記録媒体用スパッタリングターゲット及び磁性薄膜

Also Published As

Publication number Publication date
TW202106909A (zh) 2021-02-16
TWI742740B (zh) 2021-10-11
WO2021014760A1 (ja) 2021-01-28

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