JPWO2021010207A1 - - Google Patents
Info
- Publication number
- JPWO2021010207A1 JPWO2021010207A1 JP2021532795A JP2021532795A JPWO2021010207A1 JP WO2021010207 A1 JPWO2021010207 A1 JP WO2021010207A1 JP 2021532795 A JP2021532795 A JP 2021532795A JP 2021532795 A JP2021532795 A JP 2021532795A JP WO2021010207 A1 JPWO2021010207 A1 JP WO2021010207A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
- H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
- H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/01—Manufacture or treatment
- H10W74/014—Manufacture or treatment using batch processing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
- C08J2363/02—Polyglycidyl ethers of bis-phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2433/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/16—Solid spheres
- C08K7/18—Solid spheres inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019130201 | 2019-07-12 | ||
| PCT/JP2020/026419 WO2021010207A1 (ja) | 2019-07-12 | 2020-07-06 | 封止用樹脂シート |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2021010207A1 true JPWO2021010207A1 (https=) | 2021-01-21 |
Family
ID=74209814
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021532795A Pending JPWO2021010207A1 (https=) | 2019-07-12 | 2020-07-06 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2021010207A1 (https=) |
| KR (1) | KR102931429B1 (https=) |
| CN (1) | CN114174424B (https=) |
| TW (1) | TWI855105B (https=) |
| WO (1) | WO2021010207A1 (https=) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005133055A (ja) * | 2003-02-03 | 2005-05-26 | Sekisui Chem Co Ltd | 樹脂組成物、基板用材料及び基板用フィルム |
| JP2008189858A (ja) * | 2007-02-07 | 2008-08-21 | Nitto Denko Corp | 感圧性粘着テープ |
| WO2010035452A1 (ja) * | 2008-09-24 | 2010-04-01 | 積水化学工業株式会社 | 樹脂組成物、硬化体及び積層体 |
| WO2015025701A1 (ja) * | 2013-08-20 | 2015-02-26 | 株式会社Adeka | 難燃性合成樹脂組成物 |
| JP2018162418A (ja) * | 2017-03-27 | 2018-10-18 | 味の素株式会社 | 封止用樹脂組成物および封止用シート |
| JP2019081893A (ja) * | 2017-10-27 | 2019-05-30 | 積水化学工業株式会社 | 硬化性樹脂組成物、硬化物、接着剤、及び、接着フィルム |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201522591A (zh) * | 2013-11-28 | 2015-06-16 | 日東電工股份有限公司 | 密封用熱硬化性樹脂薄片及中空封裝（ｈｏｌｌｏｗ ｐａｃｋａｇｅ）之製造方法 |
| JP6422370B2 (ja) | 2015-03-03 | 2018-11-14 | 日東電工株式会社 | 中空型電子デバイス封止用シート、及び、中空型電子デバイスパッケージの製造方法 |
| CN111263782A (zh) * | 2017-10-27 | 2020-06-09 | 积水化学工业株式会社 | 固化性树脂组合物、固化物、粘接剂和粘接膜 |
-
2020
- 2020-07-06 WO PCT/JP2020/026419 patent/WO2021010207A1/ja not_active Ceased
- 2020-07-06 KR KR1020227000270A patent/KR102931429B1/ko active Active
- 2020-07-06 JP JP2021532795A patent/JPWO2021010207A1/ja active Pending
- 2020-07-06 CN CN202080050017.1A patent/CN114174424B/zh active Active
- 2020-07-10 TW TW109123359A patent/TWI855105B/zh active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005133055A (ja) * | 2003-02-03 | 2005-05-26 | Sekisui Chem Co Ltd | 樹脂組成物、基板用材料及び基板用フィルム |
| JP2008189858A (ja) * | 2007-02-07 | 2008-08-21 | Nitto Denko Corp | 感圧性粘着テープ |
| WO2010035452A1 (ja) * | 2008-09-24 | 2010-04-01 | 積水化学工業株式会社 | 樹脂組成物、硬化体及び積層体 |
| WO2015025701A1 (ja) * | 2013-08-20 | 2015-02-26 | 株式会社Adeka | 難燃性合成樹脂組成物 |
| JP2018162418A (ja) * | 2017-03-27 | 2018-10-18 | 味の素株式会社 | 封止用樹脂組成物および封止用シート |
| JP2019081893A (ja) * | 2017-10-27 | 2019-05-30 | 積水化学工業株式会社 | 硬化性樹脂組成物、硬化物、接着剤、及び、接着フィルム |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102931429B1 (ko) | 2026-02-25 |
| CN114174424B (zh) | 2024-12-24 |
| CN114174424A (zh) | 2022-03-11 |
| WO2021010207A1 (ja) | 2021-01-21 |
| KR20220035094A (ko) | 2022-03-21 |
| TWI855105B (zh) | 2024-09-11 |
| TW202111074A (zh) | 2021-03-16 |
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