JPWO2020262288A1 - - Google Patents

Info

Publication number
JPWO2020262288A1
JPWO2020262288A1 JP2021526967A JP2021526967A JPWO2020262288A1 JP WO2020262288 A1 JPWO2020262288 A1 JP WO2020262288A1 JP 2021526967 A JP2021526967 A JP 2021526967A JP 2021526967 A JP2021526967 A JP 2021526967A JP WO2020262288 A1 JPWO2020262288 A1 JP WO2020262288A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021526967A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020262288A1 publication Critical patent/JPWO2020262288A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
JP2021526967A 2019-06-27 2020-06-22 Pending JPWO2020262288A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019120080 2019-06-27
PCT/JP2020/024350 WO2020262288A1 (ja) 2019-06-27 2020-06-22 伸縮性回路基板、及び伸縮性回路実装品

Publications (1)

Publication Number Publication Date
JPWO2020262288A1 true JPWO2020262288A1 (zh) 2020-12-30

Family

ID=74060571

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021526967A Pending JPWO2020262288A1 (zh) 2019-06-27 2020-06-22

Country Status (2)

Country Link
JP (1) JPWO2020262288A1 (zh)
WO (1) WO2020262288A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022260014A1 (ja) * 2021-06-11 2022-12-15 パナソニックＩｐマネジメント株式会社 導電性パターン付き基板の製造方法
WO2023089897A1 (ja) * 2021-11-19 2023-05-25 株式会社村田製作所 伸縮デバイス
WO2023238754A1 (ja) * 2022-06-08 2023-12-14 株式会社村田製作所 伸縮性デバイス

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003008151A (ja) * 2001-06-21 2003-01-10 Optrex Corp フレキシブル配線基板およびその製造方法
JP4434898B2 (ja) * 2004-09-27 2010-03-17 株式会社フジクラ フレキシブルプリント基板の設置構造
US8520399B2 (en) * 2010-10-29 2013-08-27 Palo Alto Research Center Incorporated Stretchable electronics modules and circuits
US9513666B2 (en) * 2014-07-25 2016-12-06 VivaLnk, Inc. Highly compliant wearable wireless patch having stress-relief capability
WO2016114298A1 (ja) * 2015-01-14 2016-07-21 東洋紡株式会社 伸縮性電極および配線シート、生体情報計測用インターフェス
US20170181276A1 (en) * 2015-12-21 2017-06-22 Panasonic Intellectual Property Management Co., Ltd. Substrate including stretchable sheet
US20180028069A1 (en) * 2016-07-29 2018-02-01 VivaLnk Inc. Wearable thermometer patch for accurate measurement of human skin temperature

Also Published As

Publication number Publication date
WO2020262288A1 (ja) 2020-12-30

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