JPWO2020262198A1 - - Google Patents

Info

Publication number
JPWO2020262198A1
JPWO2020262198A1 JP2021526883A JP2021526883A JPWO2020262198A1 JP WO2020262198 A1 JPWO2020262198 A1 JP WO2020262198A1 JP 2021526883 A JP2021526883 A JP 2021526883A JP 2021526883 A JP2021526883 A JP 2021526883A JP WO2020262198 A1 JPWO2020262198 A1 JP WO2020262198A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021526883A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020262198A1 publication Critical patent/JPWO2020262198A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
JP2021526883A 2019-06-28 2020-06-18 Pending JPWO2020262198A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019122064 2019-06-28
PCT/JP2020/024006 WO2020262198A1 (ja) 2019-06-28 2020-06-18 セラミックス基板及びその製造方法、複合基板、回路基板及びその製造方法、並びに回路基板の検査方法

Publications (1)

Publication Number Publication Date
JPWO2020262198A1 true JPWO2020262198A1 (ja) 2020-12-30

Family

ID=74059754

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021526883A Pending JPWO2020262198A1 (ja) 2019-06-28 2020-06-18

Country Status (2)

Country Link
JP (1) JPWO2020262198A1 (ja)
WO (1) WO2020262198A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4290570A1 (en) * 2021-02-18 2023-12-13 Denka Company Limited Ceramic plate and method for manufacturing ceramic plate

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3707357B2 (ja) * 2000-06-13 2005-10-19 いわき電子株式会社 電子部品モジュールの不良検出方法
JP4709432B2 (ja) * 2001-06-27 2011-06-22 日本特殊陶業株式会社 基板の検査方法及び検査装置並びに電子機器用製品の製造方法
JP4497354B2 (ja) * 2004-04-20 2010-07-07 ヤマハファインテック株式会社 プリント基板における導電パターンの製造方法および製造装置
JP2005337900A (ja) * 2004-05-27 2005-12-08 Fujitsu Ltd スルーホールの欠陥検出方法及び装置
JP2011176075A (ja) * 2010-02-24 2011-09-08 Nitto Denko Corp 配線回路基板集合体シートおよびその製造方法
JP2012235027A (ja) * 2011-05-06 2012-11-29 Koa Corp セラミック基板及びセラミック基板の製造方法
JP6446791B2 (ja) * 2014-02-25 2019-01-09 日本電産リード株式会社 基板検査方法、基板検査装置、検査治具、及び検査治具セット

Also Published As

Publication number Publication date
WO2020262198A1 (ja) 2020-12-30

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