JPWO2020235438A1 - - Google Patents

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Publication number
JPWO2020235438A1
JPWO2020235438A1 JP2021520742A JP2021520742A JPWO2020235438A1 JP WO2020235438 A1 JPWO2020235438 A1 JP WO2020235438A1 JP 2021520742 A JP2021520742 A JP 2021520742A JP 2021520742 A JP2021520742 A JP 2021520742A JP WO2020235438 A1 JPWO2020235438 A1 JP WO2020235438A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2021520742A
Other languages
Japanese (ja)
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JP7191216B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Publication of JPWO2020235438A1 publication Critical patent/JPWO2020235438A1/ja
Application granted granted Critical
Publication of JP7191216B2 publication Critical patent/JP7191216B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2021520742A 2019-05-23 2020-05-14 Substrate processing method Active JP7191216B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019097157 2019-05-23
JP2019097157 2019-05-23
PCT/JP2020/019246 WO2020235438A1 (en) 2019-05-23 2020-05-14 Substrate processing method

Publications (2)

Publication Number Publication Date
JPWO2020235438A1 true JPWO2020235438A1 (en) 2020-11-26
JP7191216B2 JP7191216B2 (en) 2022-12-16

Family

ID=73458856

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021520742A Active JP7191216B2 (en) 2019-05-23 2020-05-14 Substrate processing method

Country Status (3)

Country Link
JP (1) JP7191216B2 (en)
TW (1) TW202105495A (en)
WO (1) WO2020235438A1 (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6384119A (en) * 1986-09-29 1988-04-14 Tokyo Electron Ltd Cleaning of substrate
JP2007134673A (en) * 2005-10-14 2007-05-31 Sony Corp Processing method of substrate
JP2009200365A (en) * 2008-02-23 2009-09-03 Sony Corp Processing method for substrate
JP2012054269A (en) * 2010-08-31 2012-03-15 Elpida Memory Inc Semiconductor cleaning method and semiconductor cleaning apparatus
JP2016086072A (en) * 2014-10-24 2016-05-19 東京エレクトロン株式会社 Substrate processing method, substrate processing device and storage medium
JP2018056206A (en) * 2016-09-26 2018-04-05 東京エレクトロン株式会社 Substrate processing apparatus and substrate processing method
JP2018056223A (en) * 2016-09-27 2018-04-05 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing apparatus

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004349501A (en) * 2003-05-22 2004-12-09 Dainippon Screen Mfg Co Ltd Substrate processing method and substrate processing apparatus
JP4176779B2 (en) * 2006-03-29 2008-11-05 東京エレクトロン株式会社 Substrate processing method, recording medium, and substrate processing apparatus
JP2008108830A (en) 2006-10-24 2008-05-08 Dainippon Screen Mfg Co Ltd Two-fluid nozzle unit and substrate processing apparatus employing the same
JP4991668B2 (en) * 2008-09-29 2012-08-01 株式会社東芝 Computer system and patch confirmation / application method
JP5813495B2 (en) * 2011-04-15 2015-11-17 東京エレクトロン株式会社 Liquid processing method, liquid processing apparatus, and storage medium
JP2017157800A (en) * 2016-03-04 2017-09-07 東京エレクトロン株式会社 Liquid-processing method, substrate processing device, and storage medium

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6384119A (en) * 1986-09-29 1988-04-14 Tokyo Electron Ltd Cleaning of substrate
JP2007134673A (en) * 2005-10-14 2007-05-31 Sony Corp Processing method of substrate
JP2009200365A (en) * 2008-02-23 2009-09-03 Sony Corp Processing method for substrate
JP2012054269A (en) * 2010-08-31 2012-03-15 Elpida Memory Inc Semiconductor cleaning method and semiconductor cleaning apparatus
JP2016086072A (en) * 2014-10-24 2016-05-19 東京エレクトロン株式会社 Substrate processing method, substrate processing device and storage medium
JP2018056206A (en) * 2016-09-26 2018-04-05 東京エレクトロン株式会社 Substrate processing apparatus and substrate processing method
JP2018056223A (en) * 2016-09-27 2018-04-05 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing apparatus

Also Published As

Publication number Publication date
TW202105495A (en) 2021-02-01
WO2020235438A1 (en) 2020-11-26
JP7191216B2 (en) 2022-12-16

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