JPWO2020234987A1 - - Google Patents

Info

Publication number
JPWO2020234987A1
JPWO2020234987A1 JP2021519929A JP2021519929A JPWO2020234987A1 JP WO2020234987 A1 JPWO2020234987 A1 JP WO2020234987A1 JP 2021519929 A JP2021519929 A JP 2021519929A JP 2021519929 A JP2021519929 A JP 2021519929A JP WO2020234987 A1 JPWO2020234987 A1 JP WO2020234987A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021519929A
Other languages
Japanese (ja)
Other versions
JP7108788B2 (ja
JPWO2020234987A5 (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020234987A1 publication Critical patent/JPWO2020234987A1/ja
Publication of JPWO2020234987A5 publication Critical patent/JPWO2020234987A5/ja
Application granted granted Critical
Publication of JP7108788B2 publication Critical patent/JP7108788B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/22Optical, image processing or photographic arrangements associated with the tube
    • H01J37/226Optical arrangements for illuminating the object; optical arrangements for collecting light from the object
    • H01J37/228Optical arrangements for illuminating the object; optical arrangements for collecting light from the object whereby illumination or light collection take place in the same area of the discharge
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/22Optical, image processing or photographic arrangements associated with the tube
    • H01J37/222Image processing arrangements associated with the tube
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/22Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
    • G01N23/225Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
    • G01N23/2251Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion using incident electron beams, e.g. scanning electron microscopy [SEM]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/04Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
    • H01J37/05Electron or ion-optical arrangements for separating electrons or ions according to their energy or mass
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/22Optical, image processing or photographic arrangements associated with the tube
    • H01J37/226Optical arrangements for illuminating the object; optical arrangements for collecting light from the object
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/244Detectors; Associated components or circuits therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/26Electron or ion microscopes; Electron or ion diffraction tubes
    • H01J37/28Electron or ion microscopes; Electron or ion diffraction tubes with scanning beams
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/248Components associated with the control of the tube
    • H01J2237/2482Optical means
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
JP2021519929A 2019-05-21 2019-05-21 荷電粒子線装置 Active JP7108788B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/020065 WO2020234987A1 (ja) 2019-05-21 2019-05-21 荷電粒子線装置

Publications (3)

Publication Number Publication Date
JPWO2020234987A1 true JPWO2020234987A1 (enExample) 2020-11-26
JPWO2020234987A5 JPWO2020234987A5 (enExample) 2022-01-18
JP7108788B2 JP7108788B2 (ja) 2022-07-28

Family

ID=73459313

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021519929A Active JP7108788B2 (ja) 2019-05-21 2019-05-21 荷電粒子線装置

Country Status (6)

Country Link
US (2) US20220216032A1 (enExample)
JP (1) JP7108788B2 (enExample)
KR (1) KR102640025B1 (enExample)
DE (1) DE112019007206B4 (enExample)
TW (1) TWI748404B (enExample)
WO (1) WO2020234987A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7686797B2 (ja) * 2022-01-28 2025-06-02 株式会社日立ハイテク 検査装置および膜質検査方法
KR20240170944A (ko) * 2022-09-27 2024-12-05 주식회사 히타치하이테크 검사 방법 및 하전 입자선 장치
KR20250090336A (ko) * 2022-12-20 2025-06-19 주식회사 히타치하이테크 시료의 특징량 도출 방법, 신호 처리 시스템을 조정하는 조정 방법 및 계측 시스템
JP2024173322A (ja) * 2023-06-02 2024-12-12 国立研究開発法人産業技術総合研究所 観察装置及び観察方法
WO2025069195A1 (ja) * 2023-09-26 2025-04-03 株式会社日立ハイテク 荷電粒子ビーム装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003151483A (ja) * 2001-11-19 2003-05-23 Hitachi Ltd 荷電粒子線を用いた回路パターン用基板検査装置および基板検査方法
JP2006352026A (ja) * 2005-06-20 2006-12-28 Sony Corp 半導体レーザ装置及び半導体レーザ装置の製造方法
JP2012009247A (ja) * 2010-06-24 2012-01-12 Topcon Corp 電子顕微鏡装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3805565B2 (ja) * 1999-06-11 2006-08-02 株式会社日立製作所 電子線画像に基づく検査または計測方法およびその装置
JP2007531876A (ja) * 2004-04-02 2007-11-08 カリフォルニア インスティテュート オブ テクノロジー 超高速光電子顕微鏡のための方法およびシステム
DE102007041496B3 (de) 2007-08-31 2009-02-26 Johnson Controls Gmbh Kopfstütze für ein Fahrzeug
JP5744629B2 (ja) * 2011-06-03 2015-07-08 株式会社日立ハイテクノロジーズ 電子顕微鏡及び電子線を用いた撮像方法
JP6289339B2 (ja) * 2014-10-28 2018-03-07 株式会社日立ハイテクノロジーズ 荷電粒子線装置及び情報処理装置
WO2016143450A1 (ja) * 2015-03-10 2016-09-15 株式会社荏原製作所 検査装置
JP6788660B2 (ja) * 2016-03-16 2020-11-25 株式会社日立ハイテク 欠陥検査装置
WO2019102603A1 (ja) * 2017-11-27 2019-05-31 株式会社日立ハイテクノロジーズ 荷電粒子線装置およびそれを用いた試料観察方法
JP6998469B2 (ja) * 2018-09-11 2022-01-18 株式会社日立ハイテク 電子線装置
JP7105368B2 (ja) * 2019-03-27 2022-07-22 株式会社日立ハイテク 荷電粒子線装置
JP7148467B2 (ja) * 2019-08-30 2022-10-05 株式会社日立ハイテク 荷電粒子線装置
JP7189103B2 (ja) * 2019-08-30 2022-12-13 株式会社日立ハイテク 荷電粒子線装置
US20230274909A1 (en) * 2020-09-28 2023-08-31 Hitachi High-Tech Corporation Charged Particle Beam Device
US12196802B2 (en) * 2020-09-29 2025-01-14 Hitachi High-Tech Corporation Semiconductor inspection device and method for inspecting semiconductor sample

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003151483A (ja) * 2001-11-19 2003-05-23 Hitachi Ltd 荷電粒子線を用いた回路パターン用基板検査装置および基板検査方法
JP2006352026A (ja) * 2005-06-20 2006-12-28 Sony Corp 半導体レーザ装置及び半導体レーザ装置の製造方法
JP2012009247A (ja) * 2010-06-24 2012-01-12 Topcon Corp 電子顕微鏡装置

Also Published As

Publication number Publication date
DE112019007206T5 (de) 2022-01-05
TWI748404B (zh) 2021-12-01
US20220216032A1 (en) 2022-07-07
US20240363306A1 (en) 2024-10-31
KR102640025B1 (ko) 2024-02-27
DE112019007206B4 (de) 2026-01-22
TW202044311A (zh) 2020-12-01
JP7108788B2 (ja) 2022-07-28
WO2020234987A1 (ja) 2020-11-26
KR20210142703A (ko) 2021-11-25

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