JPWO2020213569A1 - - Google Patents
Info
- Publication number
- JPWO2020213569A1 JPWO2020213569A1 JP2021514150A JP2021514150A JPWO2020213569A1 JP WO2020213569 A1 JPWO2020213569 A1 JP WO2020213569A1 JP 2021514150 A JP2021514150 A JP 2021514150A JP 2021514150 A JP2021514150 A JP 2021514150A JP WO2020213569 A1 JPWO2020213569 A1 JP WO2020213569A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J5/12—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using thermoelectric elements, e.g. thermocouples
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/02—Details
- G01J1/0252—Constructional arrangements for compensating for fluctuations caused by, e.g. temperature, or using cooling or temperature stabilization of parts of the device; Controlling the atmosphere inside a photometer; Purge systems, cleaning devices
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
- H10N10/851—Thermoelectric active materials comprising inorganic compositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N15/00—Thermoelectric devices without a junction of dissimilar materials; Thermomagnetic devices, e.g. using the Nernst-Ettingshausen effect
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Electromagnetism (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019077558 | 2019-04-16 | ||
JP2019077558 | 2019-04-16 | ||
PCT/JP2020/016303 WO2020213569A1 (ja) | 2019-04-16 | 2020-04-13 | 光センサ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2020213569A1 true JPWO2020213569A1 (ja) | 2020-10-22 |
JP7327470B2 JP7327470B2 (ja) | 2023-08-16 |
Family
ID=72837534
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021514150A Active JP7327470B2 (ja) | 2019-04-16 | 2020-04-13 | 光センサ |
Country Status (3)
Country | Link |
---|---|
US (1) | US11898903B2 (ja) |
JP (1) | JP7327470B2 (ja) |
WO (1) | WO2020213569A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
LV15536A (lv) * | 2019-04-26 | 2020-11-20 | Latvijas Universitātes Cietvielu Fizikas Institūts | Ātrdarbīgs redzamās gaismas un infrasarkanā starojuma sensors, tā izgatavošanas paņēmiens |
WO2023013148A1 (ja) * | 2021-08-03 | 2023-02-09 | 住友電気工業株式会社 | 光センサ |
CN116963574B (zh) * | 2023-09-18 | 2023-12-15 | 上海芯龙半导体技术股份有限公司 | 一种红外热电堆传感器及其制造方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03276772A (ja) * | 1990-03-27 | 1991-12-06 | Nec Corp | サーモパイル型赤外線センサ |
JP2000340848A (ja) * | 1999-03-24 | 2000-12-08 | Ishizuka Electronics Corp | サーモパイル型赤外線センサ及びその製造方法 |
US6305840B1 (en) * | 1998-02-28 | 2001-10-23 | Lg Electronics Inc. | Thermopile detector and method for fabricating the same |
WO2017002514A1 (ja) * | 2015-06-30 | 2017-01-05 | 住友電気工業株式会社 | 熱電材料、熱電素子、光センサおよび熱電材料の製造方法 |
WO2017086271A1 (ja) * | 2015-11-17 | 2017-05-26 | 富士フイルム株式会社 | 熱電変換素子および熱電変換モジュール |
US9929333B1 (en) * | 2015-07-10 | 2018-03-27 | Maxim Integrated Products, Inc. | IR thermopile sensor with temperature reference formed in front-end process |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6348650B1 (en) | 1999-03-24 | 2002-02-19 | Ishizuka Electronics Corporation | Thermopile infrared sensor and process for producing the same |
-
2020
- 2020-04-13 JP JP2021514150A patent/JP7327470B2/ja active Active
- 2020-04-13 WO PCT/JP2020/016303 patent/WO2020213569A1/ja active Application Filing
- 2020-04-13 US US17/437,839 patent/US11898903B2/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03276772A (ja) * | 1990-03-27 | 1991-12-06 | Nec Corp | サーモパイル型赤外線センサ |
US6305840B1 (en) * | 1998-02-28 | 2001-10-23 | Lg Electronics Inc. | Thermopile detector and method for fabricating the same |
JP2000340848A (ja) * | 1999-03-24 | 2000-12-08 | Ishizuka Electronics Corp | サーモパイル型赤外線センサ及びその製造方法 |
WO2017002514A1 (ja) * | 2015-06-30 | 2017-01-05 | 住友電気工業株式会社 | 熱電材料、熱電素子、光センサおよび熱電材料の製造方法 |
US9929333B1 (en) * | 2015-07-10 | 2018-03-27 | Maxim Integrated Products, Inc. | IR thermopile sensor with temperature reference formed in front-end process |
WO2017086271A1 (ja) * | 2015-11-17 | 2017-05-26 | 富士フイルム株式会社 | 熱電変換素子および熱電変換モジュール |
Also Published As
Publication number | Publication date |
---|---|
WO2020213569A1 (ja) | 2020-10-22 |
US11898903B2 (en) | 2024-02-13 |
JP7327470B2 (ja) | 2023-08-16 |
US20220155141A1 (en) | 2022-05-19 |
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