JPWO2020204512A5

JPWO2020204512A5 -

Info

Publication number: JPWO2020204512A5
Application number: JP2021552961A
Authority: JP
Publication date: 2023-04-10

Description

ここで、各ボトムパッドＲ１、Ｇ１、Ｂ１、Ｒ２、Ｇ２、Ｂ２は、それぞれ赤色、緑色及び青色発光素子に連結される各パッドを示すためのものである。但し、赤色、緑色及び青色発光素子の配列は変更されてもよく、これによって、各ボトムパッドＲ１、Ｇ１、Ｂ１、Ｒ２、Ｇ２、Ｂ２が連結される位置も変更され得る。例えば、図４ｄの回路図は、第１発光素子１０ａが青色発光素子で、第２発光素子１０ｂが緑色発光素子で、第３発光素子１０ｃが赤色発光素子であることを想定し、各ボトムパッドを示している。これと異なり、第１発光素子１０ａが赤色発光素子であってもよく、第３発光素子１０ｃが青色発光素子であってもよく、この場合、ボトムパッドＲ１、Ｒ２とボトムパッドＢ１、Ｂ２の位置が互いに変わり得る。
Here, each bottom pad R1, G1, B1, R2, G2, B2 is to indicate each pad connected to the red, green and blue light emitting elements, respectively. However, the arrangement of the red, green, and blue light emitting elements may be changed, and thus the positions where the bottom pads R1, G1, B1, R2, G2, and B2 are connected may also be changed. For example, the circuit diagram of FIG. 4d assumes that the first light emitting element 10a is a blue light emitting element, the second light emitting element 10b is a green light emitting element, and the third light emitting element 10c is a red light emitting element, and each bottom pad is shown. Alternatively, the first light emitting element 10a may be a red light emitting element and the third light emitting element 10c may be a blue light emitting element, in which case bottom pads R1, R2 and bottom pads B1, B2 can change with each other.

図１１を参照すると、本実施例に係るピクセルモジュール１０００ａは、図４ａ及び図４ｂを参照して説明したピクセルモジュール１０００とほぼ類似するが、ユニットピクセル１００ａが各バンプを有していないので、ボンディング材１００５ａが保護層１３１の各開口部１３１ａを充填する点で相違している。ボンディング材１００５ａは、保護層１３１の各開口部１３１ａを完全に又は部分的に充填することができる。ボンディング材１００５ａが保護層１３１の各開口部１３１ａを部分的に充填する場合、各開口部１３１ａ内に空洞が形成され得る。
Referring to FIG. 11, a pixel module 1000a according to this embodiment is substantially similar to the pixel module 1000 described with reference to FIGS. The difference is that the material 1005 a fills each opening 131 a of the protective layer 131 . The bonding material 1005 a can completely or partially fill each opening 131 a of the protective layer 131 . When the bonding material 1005a partially fills each opening 131a of the protective layer 131, a cavity may be formed within each opening 131a.

Claims

substrate ;
a plurality of light emitting elements aligned on the substrate ;
an adhesive layer that adheres each of the light emitting elements to the substrate ;
a step adjustment layer covering the light emitting device and adhered to the adhesive layer; and each connection layer disposed on the step adjustment layer and electrically connected to each of the light emitting devices;
The unit pixel, wherein the step adjustment layer has unevenness in at least a part of the region along the edge.

The plurality of light emitting elements includes at least three light emitting elements that emit light of different colors;
The unit pixel of claim 1, wherein the at least three light emitting elements are arranged in a line.

The unit pixel of claim 1, wherein the plurality of light emitting elements comprises light emitting elements emitting red, green and blue.

Each of the light emitting elements,
a light emitting structure comprising a semiconductor layer of a first conductivity type, a semiconductor layer of a second conductivity type, and an active layer interposed between the semiconductor layer of the first conductivity type and the semiconductor layer of the second conductivity type; and on the light emitting structure disposed first and second electrode pads;
the step adjustment layer has openings exposing the first and second electrode pads;
4. The unit pixel of claim 3, wherein each connection layer is electrically connected to the first and second electrode pads through each opening of the step adjustment layer.

The unit pixel of claim 4, wherein each light emitting device comprises a plurality of connecting chips.

6. The unit pixel of claim 5, wherein a connecting chip of each light emitting device is arranged in a different position from connecting chips of other light emitting devices.

The unit pixel of claim 5, wherein the plurality of connected chips aligned on each light emitting device are asymmetrically arranged with respect to at least one alignment direction.

further comprising a light blocking layer disposed between the adhesive layer and the substrate ;
The unit pixel of claim 1, wherein the light blocking layer has a window through which light generated by the light emitting device is transmitted.

9. The unit pixel of claim 8, wherein the width of the window is narrower than the width of the light emitting element.

further comprising a protective layer covering the step adjustment layer and each connection layer;
2. The unit pixel of claim 1, wherein the protective layer has respective openings located on the respective connecting layers.

further comprising respective bumps disposed within respective openings of the protective layer;
11. The unit pixel of claim 10, wherein each bump is electrically connected to each connection layer.

substrate ;
at least three light emitting devices aligned on the substrate and emitting light of different colors;
an adhesive layer that adheres each of the light emitting elements to the substrate ;
a step adjustment layer covering the light emitting device and adhered to the adhesive layer; and each connection layer disposed on the step adjustment layer and electrically connected to each of the light emitting devices;
A unit pixel, wherein the at least three light emitting elements are arranged in a line.

circuit board;
a plurality of unit pixels arranged on the circuit board; and a cover layer covering each of the plurality of unit pixels;
each of the unit pixels,
substrate ;
a light-emitting element disposed on the substrate ;
an adhesive layer that bonds the light emitting device to the substrate ;
a step adjustment layer covering the light emitting device and adhered to the adhesive layer; and a connection layer disposed on the step adjustment layer and electrically connected to the light emitting device,
The pixel module, wherein the step adjustment layer has unevenness in at least a part of the region along the edge.

The unit pixel is
further comprising a protective layer covering the step adjustment layer and the connection layer;
14. The pixel module of claim 13, wherein the protective layer has an opening located over the connecting layer.

further comprising a bonding material for bonding the light emitting element and the circuit board;
15. The pixel module of claim 14, wherein the bonding material fills at least part of the opening of the protective layer.

further comprising a bonding material for bonding the light emitting element and the circuit board;
the unit pixel further includes a bump disposed within the opening of the protective layer;
The circuit board includes pads exposed on the top surface,
15. The pixel module of claim 14, wherein the bonding material bonds the bumps and the pads .

the circuit board further comprising a bottom pad disposed on the bottom;
17. The pixel module of claim 16, wherein the number of bottom pads is less than the number of pads .

15. The pixel module of claim 14, wherein the light emitting device comprises at least three light emitting devices emitting light of different colors, and wherein the at least three light emitting devices are arranged in a line.

a panel substrate; and a plurality of pixel modules arranged on the panel substrate;
each pixel module includes a circuit board, a plurality of unit pixels disposed on the circuit board, and a cover layer covering the plurality of unit pixels;
each of the unit pixels,
substrate ;
a plurality of light emitting elements aligned on the substrate ;
an adhesive layer that adheres each of the light emitting elements to the substrate ;
a step adjustment layer covering the light emitting device and adhered to the adhesive layer; and each connection layer disposed on the step adjustment layer and electrically connected to each of the light emitting devices;
The display device, wherein the step adjustment layer has unevenness in at least a part of the region along the edge.