JPWO2020196369A1 - - Google Patents

Info

Publication number
JPWO2020196369A1
JPWO2020196369A1 JP2021509368A JP2021509368A JPWO2020196369A1 JP WO2020196369 A1 JPWO2020196369 A1 JP WO2020196369A1 JP 2021509368 A JP2021509368 A JP 2021509368A JP 2021509368 A JP2021509368 A JP 2021509368A JP WO2020196369 A1 JPWO2020196369 A1 JP WO2020196369A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021509368A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020196369A1 publication Critical patent/JPWO2020196369A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02024—Mirror polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se
JP2021509368A 2019-03-26 2020-03-23 Pending JPWO2020196369A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019058620 2019-03-26
PCT/JP2020/012622 WO2020196369A1 (en) 2019-03-26 2020-03-23 Polishing composition

Publications (1)

Publication Number Publication Date
JPWO2020196369A1 true JPWO2020196369A1 (en) 2020-10-01

Family

ID=72610948

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021509368A Pending JPWO2020196369A1 (en) 2019-03-26 2020-03-23

Country Status (7)

Country Link
US (1) US20220162477A1 (en)
EP (1) EP3950876A4 (en)
JP (1) JPWO2020196369A1 (en)
KR (1) KR20210143847A (en)
CN (1) CN113631679B (en)
TW (1) TW202043425A (en)
WO (1) WO2020196369A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113930165B (en) * 2021-11-23 2022-12-30 浙江奥首材料科技有限公司 Grinding aid, preparation method and application thereof, grinding fluid and grinding method

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT348360B (en) 1977-07-15 1979-02-12 Lim Holding Sa DEVICE FOR MANUFACTURING VEHICLE TIRES BY CASTING OR. SYRINGE
JPS6029895B2 (en) 1977-12-19 1985-07-13 富士通株式会社 surface inspection equipment
JPH11140427A (en) 1997-11-13 1999-05-25 Kobe Steel Ltd Polishing liquid and polishing
JP2003086546A (en) * 2001-09-10 2003-03-20 Sumitomo Bakelite Co Ltd Polishing composition
US7553345B2 (en) * 2002-12-26 2009-06-30 Kao Corporation Polishing composition
JP5474400B2 (en) 2008-07-03 2014-04-16 株式会社フジミインコーポレーテッド Semiconductor wetting agent, polishing composition and polishing method using the same
CN103403123B (en) 2011-01-26 2015-04-08 福吉米株式会社 Polishing composition, polishing method using same, and substrate production method
JP5798450B2 (en) * 2011-11-15 2015-10-21 花王株式会社 Polishing liquid composition for silicon wafer
CN102786879B (en) * 2012-07-17 2014-04-23 清华大学 Barium titanate chemico-mechanical polishing aqueous composition and its application
JP6029895B2 (en) 2012-08-31 2016-11-24 株式会社フジミインコーポレーテッド Polishing composition and method for producing substrate
WO2014148399A1 (en) * 2013-03-19 2014-09-25 株式会社フジミインコーポレーテッド Polishing composition, method for producing polishing composition, and kit for preparing polishing composition
CN104559796B (en) * 2013-10-14 2018-01-26 天津西美半导体材料有限公司 Preparation method applied to the modified aluminum oxide polishing fluid of superhard surfaces
KR102515826B1 (en) * 2015-02-19 2023-03-30 가부시키가이샤 후지미인코퍼레이티드 Polishing composition for silicon wafer and polishing method
CN108239484B (en) * 2016-12-23 2020-09-25 蓝思科技（长沙）有限公司 Alumina polishing solution for sapphire polishing and preparation method thereof
JP2017101248A (en) * 2017-01-13 2017-06-08 株式会社フジミインコーポレーテッド Polishing composition, manufacturing method of polishing composition and manufacturing method of polished article
EP3584823A4 (en) * 2017-02-20 2020-12-23 Fujimi Incorporated Silicon substrate intermediate polishing composition and silicon substrate polishing composition set
JP6941532B2 (en) 2017-09-22 2021-09-29 務 下原 Railroad model control device with external input function

Also Published As

Publication number Publication date
EP3950876A4 (en) 2022-11-02
US20220162477A1 (en) 2022-05-26
CN113631679A (en) 2021-11-09
CN113631679B (en) 2023-08-08
EP3950876A1 (en) 2022-02-09
TW202043425A (en) 2020-12-01
KR20210143847A (en) 2021-11-29
WO2020196369A1 (en) 2020-10-01

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