JPWO2020183881A1 - - Google Patents

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Publication number
JPWO2020183881A1
JPWO2020183881A1 JP2021505540A JP2021505540A JPWO2020183881A1 JP WO2020183881 A1 JPWO2020183881 A1 JP WO2020183881A1 JP 2021505540 A JP2021505540 A JP 2021505540A JP 2021505540 A JP2021505540 A JP 2021505540A JP WO2020183881 A1 JPWO2020183881 A1 JP WO2020183881A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021505540A
Other versions
JP7449920B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020183881A1 publication Critical patent/JPWO2020183881A1/ja
Application granted granted Critical
Publication of JP7449920B2 publication Critical patent/JP7449920B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H01L27/14627—Microlenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/1462—Coatings
    • H01L27/14623—Optical shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Solid State Image Pick-Up Elements (AREA)
JP2021505540A 2019-03-12 2020-01-09 半導体装置 Active JP7449920B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019045052 2019-03-12
JP2019045052 2019-03-12
PCT/JP2020/000408 WO2020183881A1 (ja) 2019-03-12 2020-01-09 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2020183881A1 true JPWO2020183881A1 (ja) 2020-09-17
JP7449920B2 JP7449920B2 (ja) 2024-03-14

Family

ID=72427431

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021505540A Active JP7449920B2 (ja) 2019-03-12 2020-01-09 半導体装置

Country Status (4)

Country Link
US (1) US20220149099A1 (ja)
JP (1) JP7449920B2 (ja)
CN (1) CN113519058A (ja)
WO (1) WO2020183881A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220216171A1 (en) * 2021-01-06 2022-07-07 Huawei Technologies Co., Ltd. Chip package structure, preparation method, and electronic device
WO2023058413A1 (ja) * 2021-10-07 2023-04-13 ソニーセミコンダクタソリューションズ株式会社 半導体装置および電子機器

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040217451A1 (en) * 2002-11-14 2004-11-04 Sai-Mun Lee Semiconductor packaging structure
JP4304163B2 (ja) 2005-03-09 2009-07-29 パナソニック株式会社 撮像モジュールおよびその製造方法
JP5964858B2 (ja) 2011-11-30 2016-08-03 京セラ株式会社 撮像素子収納用パッケージおよび撮像装置
JP2014216394A (ja) * 2013-04-23 2014-11-17 株式会社ニコン 固体撮像装置及び電子カメラ
JP2015015529A (ja) * 2013-07-03 2015-01-22 株式会社ニコン 撮像ユニット及び撮像装置
JP6308007B2 (ja) * 2013-07-16 2018-04-11 ソニー株式会社 配線基板および配線基板の製造方法
US9980372B2 (en) * 2014-08-26 2018-05-22 Sharp Kabushiki Kaisha Camera module
CN105187697B (zh) * 2015-08-04 2019-12-31 宁波舜宇光电信息有限公司 多镜头摄像模组连体支架和多镜头摄像模组及其应用
JP6571447B2 (ja) * 2015-08-18 2019-09-04 株式会社フジクラ 車載用カメラ
WO2019044172A1 (ja) * 2017-08-29 2019-03-07 ソニーセミコンダクタソリューションズ株式会社 撮像装置、および、撮像装置の製造方法

Also Published As

Publication number Publication date
CN113519058A (zh) 2021-10-19
JP7449920B2 (ja) 2024-03-14
US20220149099A1 (en) 2022-05-12
WO2020183881A1 (ja) 2020-09-17

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