JPWO2020109120A5 - - Google Patents
Download PDFInfo
- Publication number
- JPWO2020109120A5 JPWO2020109120A5 JP2021530077A JP2021530077A JPWO2020109120A5 JP WO2020109120 A5 JPWO2020109120 A5 JP WO2020109120A5 JP 2021530077 A JP2021530077 A JP 2021530077A JP 2021530077 A JP2021530077 A JP 2021530077A JP WO2020109120 A5 JPWO2020109120 A5 JP WO2020109120A5
- Authority
- JP
- Japan
- Prior art keywords
- optical
- ray
- scintillator
- array
- imaging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003287 optical Effects 0.000 claims 50
- 238000003384 imaging method Methods 0.000 claims 24
- 239000000463 material Substances 0.000 claims 7
- 238000006243 chemical reaction Methods 0.000 claims 5
- 239000000758 substrate Substances 0.000 claims 4
- 239000000203 mixture Substances 0.000 claims 3
- 239000002131 composite material Substances 0.000 claims 2
- 238000007598 dipping method Methods 0.000 claims 1
- 239000006185 dispersion Substances 0.000 claims 1
- 239000011888 foil Substances 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 238000009828 non-uniform distribution Methods 0.000 claims 1
- 229920000642 polymer Polymers 0.000 claims 1
- 230000001568 sexual Effects 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
Claims (15)
- 基板と、
- 感光センサと、
- X線シンチレータと、
- 光学部品構成のアレイとを含み、
前記感光センサは、当該撮像検出器に亘って分配されるセンサピクセルを含み、
前記X線シンチレータは、入射X線放射のエネルギを光学光子に変換するように構成され、
当該撮像検出器は、
各光学部品構成は、入射光放射を前記感光センサに向かって方向付けるように構成される少なくとも1つの光学部品を含み、
前記センサピクセルは、光学ピクセルを含み、各光学ピクセルは、前記入射光放射を受け取り、それによって、前記光学撮像データを生成するよう、それぞれの光学部品構成と連結され、
前記センサピクセルは、前記変換される光学光子を受け取り、それによって、前記X線撮像データを生成するよう、前記X線シンチレータと連結される、X線ピクセルを含むことを特徴とする、
撮像検出器。 An imaging detector for capturing optical imaging data and X-ray imaging data.
-With the board
-The photosensitive sensor and
-X-ray scintillator and
-Including an array of optical component configurations
The photosensitive sensor comprises sensor pixels distributed across the image detector.
The X-ray scintillator is configured to convert the energy of incident X-ray radiation into optical photons.
The image detector is
Each optical component configuration comprises at least one optical component configured to direct incident light radiation towards the photosensitive sensor.
The sensor pixels include optical pixels, and each optical pixel is coupled with its respective optical component configuration to receive the incident light emission, thereby producing the optical imaging data.
The sensor pixel comprises an X-ray pixel that receives the converted optical photon and thereby is coupled with the X-ray scintillator to generate the X-ray imaging data.
Imaging detector.
前記光集束コンポーネントは、マイクロレンズ及び光学コリメータから選択される少なくとも1つである、
請求項1に記載の撮像検出器。 The at least one optical component configuration includes a light focusing component for focusing or narrowing the incident light radiation to the photosensitive sensor.
The light focusing component is at least one selected from microlenses and optical collimators.
The imaging detector according to claim 1.
前記光学部品構成のアレイ及び前記シンチレータ素子のアレイは、前記入射光放射を
i)前記シンチレータ素子間のギャップ内の前記センサピクセルに導き、それによって、別個の光学ピクセル及びX線ピクセルを形成するよう、或いは
ii)前記X線シンチレータと連結される前記センサピクセルに導き、それによって、共通の光学ピクセル及びX線ピクセルを形成するよう、
互いに対して位置付けられる、
請求項1又は2に記載の撮像検出器。 The X-ray scintillator is a pixelated scintillator that includes an array of scintillator elements.
The array of optical components and the array of scintillator elements i) direct the incident light radiation to the sensor pixels in the gap between the scintillator elements, thereby forming separate optical and x-ray pixels. Or ii) to guide to the sensor pixel coupled with the X-ray scintillator, thereby forming a common optical pixel and X-ray pixel.
Positioned against each other,
The imaging detector according to claim 1 or 2.
前記光ガイドは、前記入射光放射を前記シンチレータ素子間の前記ギャップ内の前記センサピクセルに向かって案内するために、それぞれの光集束コンポーネントと連結される、請求項3に記載の撮像検出器。 The at least one optical component configuration comprises an optical guide located inside the gap between the scintillator elements and optionally coupled with an optical filter and / or a light source.
The imaging detector of claim 3, wherein the optical guide is coupled with a respective light focusing component to guide the incident light radiation towards the sensor pixel in the gap between the scintillator elements.
前記マイクロレンズは、以下の形状及び位置、すなわち、
i)それぞれの光ガイドに対して対称的な位置において対称的に成形されたマイクロレンズ、
ii)それぞれの光ガイドに対して非対称的な位置において対称的に成形されたマイクロレンズ、及び
iii)非対称的に成形されたマイクロレンズ
のうちの少なくとも1つを有する、
請求項4に記載の撮像検出器。 The light focusing component is a microlens and
The microlens has the following shape and position, that is,
i) Microlenses shaped symmetrically at positions symmetrical with respect to each optical guide,
ii) having at least one of asymmetrically shaped microlenses at asymmetric positions with respect to each optical guide, and ii) asymmetrically shaped microlenses.
The imaging detector according to claim 4.
前記複合マイクロレンズの位置が、
i)シンチレータ素子間のギャップの内側、
ii)台形のシンチレータ素子間の内側、及び
iii)台形のシンチレータ素子間のギャップの上
のうちの少なくとも1つである、
請求項3に記載の撮像検出器。 The microlens is a composite microlens and
The position of the composite microlens is
i) Inside the gap between scintillator elements,
ii) at least one of the inside between the trapezoidal scintillator elements and ii) above the gap between the trapezoidal scintillator elements.
The imaging detector according to claim 3.
前記光学部品構成のアレイ及び前記シンチレータ素子のアレイは、感光センサの同じ側に配置され、各光学部品構成は、それぞれのシンチレータ素子を通過する前記入射光放射を1つ以上のX線ピクセルに向かって方向付けるように構成され、或いは、
前記少なくとも1つのシンチレータ素子は、前記少なくとも1つのシンチレータ素子自体が光学撮像のためのマイクロレンズとして作用するような方法において構成される表面形状を有する、
請求項3に記載の撮像検出器。 The array of optical components and the array of scintillator elements are arranged on opposite sides of the photosensitive sensor, the photosensitive sensors are photosensitive on both sides, and each optical component configuration emits the incident light to its respective scintillator. It is configured to orient towards one or more X-ray pixels associated with the element, or
The array of optical components and the array of scintillator elements are located on the same side of the photosensitive sensor, and each optical component configuration directs the incident light radiation through each scintillator element to one or more X-ray pixels. Configured to orient
The at least one scintillator element has a surface shape configured in such a way that the at least one scintillator element itself acts as a microlens for optical imaging.
The imaging detector according to claim 3.
i)異なる厚さ、
ii)シンチレータ素子間の異なるサイズ、
iii)前記センサピクセルのサイズと比べて異なるサイズ、
iv)異なる距離ギャップ、
v)不均一な分散、
vi)異なる放射線変換材料、及び/又は
vii)放射線変換材料の異なる組成
を備えるシンチレータ素子を含み、
前記放射線変換材料の前記組成は、
- 前記放射線変換材料のドープレベル、
- ドープ材料、及び
- ドープ材料の組み合わせ
のうちの少なくとも1つにおいて異なる、
請求項3~7のうちのいずれか1項に記載の撮像検出器。 The array of scintillator elements
i) Different thickness,
ii) Different sizes between scintillator elements,
iii) A size different from the size of the sensor pixel,
iv) Different distance gaps,
v) Non-uniform dispersion,
vi) containing different radiation conversion materials and / or vi) scintillator elements with different compositions of radiation conversion materials.
The composition of the radiation conversion material is
-The dope level of the radiation conversion material,
-Dipping material, and-Different in at least one of the dope material combinations,
The imaging detector according to any one of claims 3 to 7.
前記光ガイドは、異なる波長の光を選択的に透過するための光学フィルタであるように構成される、
請求項2~9のうちのいずれか1項に記載の撮像検出器。 The at least one microlens is configured to be an optical filter for selectively transmitting light of different wavelengths and / or
The optical guide is configured to be an optical filter for selectively transmitting light of different wavelengths.
The imaging detector according to any one of claims 2 to 9.
前記半透過性光学ミラーは、光フィルタのアレイとして提供され、各光フィルタは、1つ以上のX線ピクセルが前記入射光放射を受け取るのを阻止するように構成され、且つ/或いは
前記半透過性光学ミラーは、光学スイッチのアレイとして提供され、各光学スイッチは、1つ以上のX線ピクセルによって受け取られる前記入射光放射が、時間インターリーブされるX線撮像及び光学撮像と同期して、選択的にオンオフ切り替えられることを可能にするように構成される、
請求項1~10のうちのいずれか1項に記載の撮像検出器。 Semi-transmissive optical mirrors are provided,
The semi-transmissive optical mirrors are provided as an array of optical filters, each optical filter configured to prevent one or more X-ray pixels from receiving the incident light radiation and / or the semi-transmissive. Sexual optical mirrors are provided as an array of optical switches, where each optical switch selects the incident light radiation received by one or more X-ray pixels in synchronization with time-interleaved X-ray and optical imaging. Configured to allow on / off switching
The imaging detector according to any one of claims 1 to 10.
i)異なる焦点距離、
ii)異なる距離ギャップ、
iii)不均一な分布、
iv)マイクロレンズ間の異なるサイズ、及び/又は
v)センサピクセルのサイズと比べて異なるサイズ
を備える、マイクロレンズを含む、
請求項3~11のうちのいずれか1項に記載の撮像検出器。 The array of the optical component configuration is
i) Different focal lengths,
ii) Different distance gaps,
iii) Non-uniform distribution,
iv) different sizes between microlenses and / or v) different sizes compared to the size of the sensor pixels, including microlenses,
The imaging detector according to any one of claims 3 to 11.
前記基板は、シリコン、ガラス又はポリマ箔を含む、
請求項1~12のうちのいずれか1項に記載の撮像検出器。 The substrate comprises a flat or substantially flat or curved shape and
The substrate comprises silicon, glass or polymer foil.
The imaging detector according to any one of claims 1 to 12.
X線源と、
光学源とを含み、
前記X線源は、X線放射を提供するように構成され、
前記光学源は、光放射を提供するように構成され、
前記撮像検出器は、前記X線放射を検出してX線撮像データを生成し、前記光放射を検出して光学撮像データを生成する、ように構成される、
撮像システム。 The imaging detector according to claim 1 and
X-ray source and
Including optical sources
The X-ray source is configured to provide X-ray radiation.
The optical source is configured to provide light radiation.
The image pickup detector is configured to detect the X-ray radiation and generate X-ray image pickup data, and detect the light radiation to generate optical image pickup data.
Imaging system.
a)基板を形成するステップと、
b)前記基板上に感光センサを形成するステップと、
c)ピックアンドプレースアセンブリ移転プロセスによって前記感光センサ上にX線シンチレータ及び光学部品構成のアレイを配置するステップとを含み、
前記感光センサは、前記撮像検出器に亘って分配されるセンサピクセルを含み、
前記X線シンチレータは、入射X線放射のエネルギを光学光子に変換するように構成され、
各光学部品構成は、入射光放射を前記感光センサに向かって方向付けるように構成される少なくとも1つの光学部品を含み、
前記センサピクセルは、光学ピクセルを含み、各光学ピクセルは、前記入射光放射を受け取り、それによって、前記光学撮像データを生成するよう、それぞれの光学部品構成と連結され、
前記センサピクセルは、前記変換される光学光子を受け取り、それによって、前記X線撮像データを生成するよう、前記X線シンチレータと連結される、X線ピクセルを含む、
方法。 A method for manufacturing an image pickup detector for capturing the optical image pickup data and the X-ray image pickup data according to any one of claims 1 to 13 .
a) Steps to form the substrate and
b) The step of forming the photosensitive sensor on the substrate and
c) Including the step of placing an array of X-ray scintillators and optics configurations on the photosensitive sensor by a pick-and-place assembly transfer process.
The photosensitive sensor comprises sensor pixels distributed across the image detector.
The X-ray scintillator is configured to convert the energy of incident X-ray radiation into optical photons.
Each optical component configuration comprises at least one optical component configured to direct incident light radiation towards the photosensitive sensor.
The sensor pixels include optical pixels, and each optical pixel is coupled with its respective optical component configuration to receive the incident light emission, thereby producing the optical imaging data.
The sensor pixel comprises an X-ray pixel that receives the converted optical photon and thereby is coupled with the X-ray scintillator to generate the X-ray imaging data.
Method.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP18209079.5 | 2018-11-29 | ||
EP18209079.5A EP3660542A1 (en) | 2018-11-29 | 2018-11-29 | Hybrid x-ray and optical detector |
PCT/EP2019/082004 WO2020109120A1 (en) | 2018-11-29 | 2019-11-21 | Hybrid x-ray and optical detector |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2022509219A JP2022509219A (en) | 2022-01-20 |
JPWO2020109120A5 true JPWO2020109120A5 (en) | 2022-03-02 |
JP7185041B2 JP7185041B2 (en) | 2022-12-06 |
Family
ID=64559499
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021530077A Active JP7185041B2 (en) | 2018-11-29 | 2019-11-21 | Hybrid X-ray and photodetector |
Country Status (5)
Country | Link |
---|---|
US (1) | US20210396891A1 (en) |
EP (2) | EP3660542A1 (en) |
JP (1) | JP7185041B2 (en) |
CN (1) | CN113167912A (en) |
WO (1) | WO2020109120A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20200133112A (en) * | 2019-05-17 | 2020-11-26 | 삼성전자주식회사 | Vital signal measuring device |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6415049B1 (en) * | 1998-04-20 | 2002-07-02 | Konica Corporation | Apparatus for detecting and processing a radiation image |
US6935779B2 (en) * | 2002-11-29 | 2005-08-30 | Ge Medical Systems Global Technology Company, Llc | Method and apparatus for aligning an X-ray source and detector at various source to image distances |
EP1641390A4 (en) * | 2003-06-26 | 2008-06-04 | Given Imaging Ltd | Methods, device and system for in vivo detection |
EP1715361B1 (en) * | 2005-04-19 | 2015-02-25 | Deutsches Krebsforschungszentrum Stiftung des öffentlichen Rechts | Dual-modality imaging using a PET scanner and an optical detector |
US10064584B2 (en) * | 2005-12-22 | 2018-09-04 | Visen Medical, Inc. | Combined x-ray and optical tomographic imaging system |
JP5143471B2 (en) * | 2007-05-08 | 2013-02-13 | 株式会社日立製作所 | Imaging device |
CN102033239B (en) * | 2009-09-28 | 2013-07-10 | 同方威视技术股份有限公司 | X-ray energy measuring system for accelerator |
US8634516B2 (en) * | 2010-03-07 | 2014-01-21 | Hironori Tsukamoto | Energy subtraction imaging system, X-ray imaging apparatus, and computer readable recording medium |
WO2012107870A2 (en) * | 2011-02-11 | 2012-08-16 | Koninklijke Philips Electronics N.V. | Detection apparatus for detecting radiation |
US9031195B2 (en) * | 2011-05-20 | 2015-05-12 | General Electric Company | Imaging detector and methods for image detection |
JP6182840B2 (en) | 2012-06-25 | 2017-08-23 | ソニー株式会社 | Manufacturing method of radiation detector |
JP2014035296A (en) * | 2012-08-09 | 2014-02-24 | Canon Inc | Radiographic device and radiographic system |
WO2014203783A1 (en) * | 2013-06-20 | 2014-12-24 | 株式会社東芝 | X-ray ct device and diagnostic medical imaging device |
JP6574419B2 (en) * | 2013-11-15 | 2019-09-11 | コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. | Double-sided organic photodetector on flexible substrate |
WO2016076824A1 (en) * | 2014-11-10 | 2016-05-19 | Halliburton Energy Services, Inc. | Energy detection apparatus, methods, and systems |
WO2016131647A1 (en) | 2015-02-17 | 2016-08-25 | Koninklijke Philips N.V. | Medical imaging detector |
EP3365704A1 (en) * | 2015-10-21 | 2018-08-29 | Koninklijke Philips N.V. | Radiation detector for combined detection of low-energy radiation quanta and high-energy radiation quanta |
US10417747B2 (en) * | 2017-11-22 | 2019-09-17 | Varex Imaging Corporation | Aberrant pixel detection and correction |
EP3620826A1 (en) * | 2018-09-10 | 2020-03-11 | Koninklijke Philips N.V. | Multi-piece mono-layer radiation detector |
-
2018
- 2018-11-29 EP EP18209079.5A patent/EP3660542A1/en not_active Withdrawn
-
2019
- 2019-11-21 WO PCT/EP2019/082004 patent/WO2020109120A1/en unknown
- 2019-11-21 CN CN201980078557.8A patent/CN113167912A/en active Pending
- 2019-11-21 US US17/296,581 patent/US20210396891A1/en active Pending
- 2019-11-21 JP JP2021530077A patent/JP7185041B2/en active Active
- 2019-11-21 EP EP19828566.0A patent/EP3887864B1/en active Active
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9165964B2 (en) | Image sensor and image capture apparatus | |
US9888194B2 (en) | Array camera architecture implementing quantum film image sensors | |
US7068432B2 (en) | Controlling lens shape in a microlens array | |
US9609208B2 (en) | Image generation method, image generation apparatus, program, and storage medium | |
US10566365B2 (en) | Image sensor | |
JP6174940B2 (en) | Imaging device and imaging apparatus | |
US8902347B2 (en) | Solid-state image sensing device and electronic apparatus | |
JP6016396B2 (en) | Imaging device and imaging apparatus | |
TWI591813B (en) | Image sensor having yellow filter units | |
TW201225270A (en) | Imaging device and imaging apparatus | |
JP5956718B2 (en) | Imaging device and imaging apparatus | |
WO2011063347A3 (en) | Capturing and processing of images using monolithic camera array with heterogeneous imagers | |
US20120050554A1 (en) | Night vision cmos imager with optical pixel cavity | |
JP2013145981A5 (en) | ||
US20160363673A1 (en) | Method of fabricating integrated digital x-ray image sensor, and integrated digital x-ray image sensor using the same | |
JP2009212465A5 (en) | ||
KR20150067005A (en) | Solid-state imaging device | |
US8860814B2 (en) | Solid-state imaging element and imaging device | |
US7285786B2 (en) | High-resolution scintillation screen for digital imaging | |
JPWO2020109120A5 (en) | ||
JP2016178341A (en) | Imaging element and imaging device | |
JP2014011239A (en) | Solid state image pickup device and method for manufacturing the same | |
JP2019097058A (en) | Solid-state imaging apparatus, manufacturing method of solid-state imaging apparatus, and electronic apparatus | |
WO2017051749A1 (en) | Radiographic image-capturing device | |
JP2022509219A (en) | Hybrid x-ray and photodetector |