JPWO2020104639A5 - - Google Patents

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JPWO2020104639A5
JPWO2020104639A5 JP2021528990A JP2021528990A JPWO2020104639A5 JP WO2020104639 A5 JPWO2020104639 A5 JP WO2020104639A5 JP 2021528990 A JP2021528990 A JP 2021528990A JP 2021528990 A JP2021528990 A JP 2021528990A JP WO2020104639 A5 JPWO2020104639 A5 JP WO2020104639A5
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Prior art keywords
substrate
end effector
support
relative
support device
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JP2021528990A
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JP7425061B2 (en
JP2022507924A (en
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Priority claimed from EP18208030.9A external-priority patent/EP3657537A1/en
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Claims (15)

基板主平面内に少なくともほぼかつ少なくとも部分的に配置されたリムセクション（５）を有する、スラブ状の基板（２）をクランプするためのエンドエフェクタ（１）であって、
前記エンドエフェクタ（１）は、
少なくとも押圧領域（１１）を提供する少なくとも押圧装置（１０）と、
少なくとも支持領域（２１）を提供する少なくとも支持装置（２０）と、
前記支持装置（２０）に対して相対的に前記押圧装置（１０）を案内するためのガイド（１５）と、を備え、
前記エンドエフェクタ（１）が、前記基板（２）のクランプ状態において、前記基板（２）を第１の表面（３）において前記押圧装置（１０）の前記押圧領域（１１）により前記基板（２）の厚さ方向にクランプし、かつ前記第１の表面（３）に対して前記基板（２）の反対側に配置された第２の表面（４）において前記支持装置（２０）の前記支持領域（２１）によりクランプするように構成されている、エンドエフェクタ（１）において、
前記支持装置（２０）の前記支持領域（２１）が、前記押圧装置（１０）の側から見て、前記基板（２）の外側から前記基板（２）の裏側の位置に前記基板（２）の外縁を少なくとも部分的に横切って移動可能であるように、前記支持装置（２０）が、前記押圧装置（１０）に対して相対的に前記基板主平面に対して平行な方向に移動可能であることを特徴とする、エンドエフェクタ（１）。 An end effector (1) for clamping a slab-shaped substrate (2) having a rim section (5) located at least approximately and at least partially in the main plane of the substrate, the end effector (1) comprising:
The end effector (1) is
at least a pressing device (10) providing at least a pressing area (11);
at least a support device (20) providing at least a support area (21) ;
a guide (15) for guiding said pressing device (10) relative to said supporting device (20) ;
In the clamping state of the substrate (2), the end effector (1) presses the substrate (2) on the first surface (3) by the pressing area (11) of the pressing device (10). 2) of the support device (20) at a second surface (4) located opposite the substrate (2) with respect to the first surface (3). In an end effector (1) configured for clamping by a support area (21),
The support area (21) of the support device (20) is positioned on the back side of the substrate (2) from the outside of the substrate (2) when viewed from the side of the pressing device (10). said support device (20) is movable relative to said pressing device (10) in a direction parallel to said substrate main plane so as to be movable at least partially across the outer edge of the An end effector (1) , characterized in that: 前記ガイド（１５）が、前記ガイド（１５）の相対移動中に前記基板（２）に弾性押圧力を加えるように配設された弾性ガイドを備える、請求項１記載のエンドエフェクタ（１）。 The end effector (1) according to claim 1, wherein said guide (15) comprises a resilient guide arranged to exert a resilient pressing force on said substrate (2) during relative movement of said guide (15) . 前記ガイド（１５）が、ガイド要素としてばね（１２）を備える、請求項２記載のエンドエフェクタ（１）。 End effector (1) according to claim 2, wherein the guide (15) comprises a spring (12) as a guide element. 前記支持装置（２０）を移動させるためのアクチュエータ（３０）を備える、請求項１から３までのいずれか１項記載のエンドエフェクタ（１）。 End effector (1) according to any one of the preceding claims, comprising an actuator (30) for moving the support device (20) . 前記アクチュエータ（３０）が、前記支持装置（２０）を前記基板主平面に対して平行な方向に移動させるように配置されており、
前記エンドエフェクタ（１）が、前記基板主平面に対して垂直に延びる部分と、前記基板主平面に対して平行に延び、かつ前記基板主平面に対して垂直に延びる部分に接続された部分（２４）とを備える爪状部分を備え、
前記爪状部分が、前記アクチュエータ（３０）と前記支持装置（２０）とを備え、かつ前記アクチュエータ（３０）が、前記基板主平面に対して垂直に延びる前記部分に対して相対的に前記支持装置（２０）を移動させるように配置されているか、または前記支持装置（２０）が、前記爪状部分を備える、
請求項４記載のエンドエフェクタ（１）。 said actuator (30) is arranged to move said support device (20) in a direction parallel to said substrate principal plane;
The end effector (1) has a portion extending perpendicular to the substrate main plane and a portion extending parallel to the substrate main plane and connected to a portion extending perpendicular to the substrate main plane ( 24) comprising a claw-like portion comprising
Said claw-like portion comprises said actuator (30) and said support device (20), and said actuator (30) is said support relative to said portion extending perpendicularly to said substrate main plane. arranged to move a device (20) or said support device (20) comprises said pawl-like portion;
End effector (1) according to claim 4 . 前記アクチュエータ（３０）が、真空シリンダを備え、選択的に、前記支持装置（２０）が、前記真空シリンダ内の真空の作用によって前記基板（２）から離れるように移動可能である、請求項４または５記載のエンドエフェクタ。 5. Claim 4 , wherein said actuator (30) comprises a vacuum cylinder , optionally said support device (20) being movable away from said substrate (2) by action of a vacuum in said vacuum cylinder. Or the end effector according to 5 . 前記支持装置（２０）が、互いに間隔を有する複数の支持領域（２１）を有する、請求項１から６までのいずれか１項記載のエンドエフェクタ（１）。 7. The end effector (1) according to any one of claims 1 to 6 , wherein the support device (20) has a plurality of support areas (21) spaced apart from one another. 請求項１から７までのいずれか１項記載の少なくとも１つのエンドエフェクタ（１）を備える把持器具。 Grasping instrument comprising at least one end effector (1) according to any one of claims 1-7 . 前記少なくとも１つのエンドエフェクタ（１）を保持するように配置されたエンドエフェクタホルダ（５０）を備え、前記エンドエフェクタホルダ（５０）が、基板（２）に対して相対的に基板主平面を横切る方向に少なくとも部分的に移動可能である、請求項８記載の把持器具。 an end effector holder (50) arranged to hold said at least one end effector (1), said end effector holder (50) transverse to the substrate principal plane relative to the substrate (2) 9. The grasping device of claim 8 , wherein the grasping device is at least partially movable in a direction. 補助支持体が設けられており、
前記補助支持体に対して前記エンドエフェクタ（１）が所定の相対位置に到達するまでは、前記把持器具が、前記基板（２）に対して相対的に前記エンドエフェクタ（１）を移動させるように構成されている、
請求項８または９記載の把持器具。 Auxiliary supports are provided,
so that the gripping instrument moves the end effector (1) relative to the substrate (2) until the end effector (1) reaches a predetermined relative position with respect to the auxiliary support. configured to
10. Grasping device according to claim 8 or 9 . 前記エンドエフェクタホルダ（５０）が、前記基板（２）の少なくともほぼ反対側に配置された少なくとも２つのエンドエフェクタ（１）を保持している、例えば、それぞれ異なる方向から前記基板（２）を把持するように配置された少なくとも３つのエンドエフェクタ（１）を保持している、請求項９を引用する請求項１０記載の把持器具。 The end effector holder (50) holds at least two end effectors (1) positioned at least approximately opposite sides of the substrate (2), e.g. gripping the substrate (2) from different directions. 11. Grasping instrument according to claim 10, dependent from claim 9 , holding at least three end effectors (1) arranged to do so . 基板（２）をクランプするための方法であって、請求項１から７までのいずれか１項記載の少なくとも１つのエンドエフェクタ（１）が、前記基板（２）をクランプするために使用され、前記エンドエフェクタ（１）が、前記基板（２）に向かって移動させられ、前記エンドエフェクタ（１）が前記基板（２）に向かって移動する間、押圧装置（１０）が、前記基板（２）に接触し、かつ支持装置（２０）に対して相対的に移動させられる、方法。 A method for clamping a substrate (2), wherein at least one end effector (1) according to any one of claims 1 to 7 is used for clamping said substrate (2), Said end effector (1) is moved towards said substrate (2), and while said end effector (1) moves towards said substrate (2), a pressing device (10) pushes against said substrate (2). ) and moved relative to the support device (20). 前記基板（２）の第２の表面（４）の側において、支持領域（２１）が前記基板（２）に対して相対的に配置される所定の位置に到達するまでは、前記基板（２）に向かう前記エンドエフェクタ（１）の移動が実施され、前記所定の位置においては、前記支持領域（２１）が、前記基板（２）の外縁（６）を横切って移動させられる、請求項１２記載の方法。 On the side of the second surface (4) of said substrate (2), until it reaches a predetermined position where the support area (21) is located relative to said substrate (2), said substrate (2) is ), and in said predetermined position said support area (21) is moved across the outer edge (6) of said substrate ( 2 ). described method. 前記支持領域（２１）を前記基板（２）の前記外縁（６）を横切って移動させた後、前記支持領域（２１）が前記基板（２）の前記第２の表面（４）に接触するまでは、前記エンドエフェクタ（１）が、前記基板（２）から離れるように移動させられる、請求項１３記載の方法。 After moving the support area (21) across the outer edge (6) of the substrate (2), the support area (21) contacts the second surface (4) of the substrate (2). 14. A method according to claim 13 , wherein until the end effector (1) is moved away from the substrate (2). 前記エンドエフェクタ（１）が前記基板（２）に向かって移動する間、前記基板（２）がその第２の表面（４）において補助支持体によって支持される、請求項１２から１４までのいずれか１項記載の方法。 15. Any of claims 12 to 14 , wherein the substrate (2) is supported on its second surface (4) by an auxiliary support while the end effector (1) moves towards the substrate (2). or the method according to item 1.
JP2021528990A 2018-11-23 2019-11-22 End effector for slab-like substrates Active JP7425061B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP18208030.9 2018-11-23
EP18208030.9A EP3657537A1 (en) 2018-11-23 2018-11-23 End effector for slab formed substrates
PCT/EP2019/082193 WO2020104639A1 (en) 2018-11-23 2019-11-22 End effector for slab formed substrates

Publications (3)

Publication Number Publication Date
JP2022507924A JP2022507924A (en) 2022-01-18
JPWO2020104639A5 true JPWO2020104639A5 (en) 2022-11-29
JP7425061B2 JP7425061B2 (en) 2024-01-30

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JP2021528990A Active JP7425061B2 (en) 2018-11-23 2019-11-22 End effector for slab-like substrates

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US (1) US20220016787A1 (en)
EP (2) EP3657537A1 (en)
JP (1) JP7425061B2 (en)
KR (1) KR20210094594A (en)
CN (1) CN113169115B (en)
HU (1) HUE062918T2 (en)
PL (1) PL3884514T3 (en)
PT (1) PT3884514T (en)
SI (1) SI3884514T1 (en)
TW (1) TWI833844B (en)
WO (1) WO2020104639A1 (en)

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