JPWO2020043898A5 - - Google Patents

Claims (16)

an array of acoustic elements comprising a non-rectangular perimeter, said plurality of active elements emitting ultrasonic energy and receiving echoes corresponding to said emitted ultrasonic energy; and said non-rectangular array of said acoustic elements. an array of acoustic elements further comprising a plurality of inactive elements surrounding the plurality of active elements at a periphery;
an edge seal comprising an encapsulant material positioned at least partially around the plurality of inactive elements;
including
one inactive element of the plurality of inactive elements is separated from at least one other inactive element by the encapsulant material of the edge seal;
ultrasound imaging device. The ultrasound imaging device of Claim 1, wherein the non-rectangular perimeter includes curved segments. The ultrasound imaging device of Claim 1, wherein the non-rectangular perimeter comprises a polygon. Each inactive element of a first portion of the plurality of inactive elements includes a non-rectangular profile, the first portion of the plurality of inactive elements being at an outer edge of the array of acoustic elements. Item 1. The ultrasonic imaging device according to Item 1. each inactive element of a second portion of the plurality of inactive elements includes a rectangular profile, the second portion of the plurality of inactive elements being spaced from the outer edge of the array of acoustic elements; 5. The ultrasound imaging device of claim 4, wherein The edge seal is
A first encapsulant material in direct contact with the non-rectangular perimeter of the array of acoustic elements, the plurality of sealing materials having the same width and aligned with the spacing between the acoustic elements in the array. a first encapsulant material comprising a kerf;
a second encapsulant material positioned around the first encapsulant material and disposed within the plurality of kerfs of the first encapsulant material;
The ultrasound imaging device of claim 1, comprising: The ultrasound of Claim 1, further comprising a processor chip coupled to a surface of the array of acoustic elements, the processor chip including a non-vertical perimeter aligned with a non-vertical perimeter of the array of acoustic elements. imaging device. The ultrasound imaging device of Claim 1, further comprising a housing, wherein the array of acoustic elements is coupled to the housing. A method of manufacturing an ultrasound imaging device, comprising:
removing material from a perimeter of the acoustic stack such that the acoustic stack includes a non-rectangular perimeter;
forming a first plurality of kerfs in the acoustic stack in a first direction;
depositing a first sealing material on the non-rectangular perimeter of the acoustic stack;
allowing the first encapsulant material to enter the first plurality of kerfs;
curing the first encapsulant;
forming a second plurality of kerfs in the acoustic stack and the first encapsulant material in a second direction to form an array of acoustic elements;
A method, including 10. The method of claim 9, wherein removing material from the perimeter of the acoustic stack comprises forming curved segments. 10. The method of claim 9, wherein removing material from the periphery of the acoustic stack comprises forming polygonal segments. Allowing the first sealing material to enter the first plurality of kerfs includes allowing the first sealing material to penetrate the acoustic stack between about 150 microns and about 250 microns. 10. The method of claim 9, comprising waiting to do. 13. The method of Claim 12, wherein the first encapsulating material comprises an epoxy and curing the first encapsulating material comprises directing ultraviolet light at the epoxy. depositing a second encapsulation material around the first encapsulation material;
allowing the second encapsulant material to enter the second plurality of kerfs;
curing the second encapsulant;
10. The method of claim 9, further comprising: removing material from the processing tip such that the processing tip includes a non-vertical perimeter;
coupling the processing chip to the acoustic stack such that the non-vertical perimeter of the processing chip aligns with the non-vertical perimeter of the acoustic stack;
10. The method of claim 9, further comprising: 10. The method of claim 9, further comprising coupling the array of acoustic elements to a housing.