JPWO2019069744A1 - Image display device, manufacturing method of image display device, and component mounting board - Google Patents

Abstract

An image display device including a display panel (102) for displaying an image and a component mounting substrate (109) in which a component (191) which is a light source for illuminating the display panel (102) from the back side is connected to a conductor layer (192). In (10), the component (191) includes a positive electrode (182), a negative electrode (181), and an exposed live part (183), and the conductor layer (192) is a positive electrode (192). 182), the insulating gap (193) arranged between the negative electrode (181), the side of the electrode connected across the insulating gap (193), and the exposed part of the live-acting part (183). It is provided with a recess, which is a recess located in the vicinity.

Description

The present disclosure relates to an image display device including a display panel such as a liquid crystal cell, a method for manufacturing the image display device, and a component mounting substrate.

Patent Document 1 discloses an image display device including a liquid crystal panel, a base plate arranged on the back surface side, and a component mounting substrate having a light source attached to the base plate.

Japanese Unexamined Patent Publication No. 2006-179494

The present disclosure provides an image display device including a component mounting board that avoids a short circuit between an active part that exposes a component and an electrode, a method for manufacturing the image display device, and a component mounting board.

Further, the present invention provides an image display device provided with a component mounting substrate capable of relieving thermal stress between energized and non-energized components, a method for manufacturing the image display device, and a component mounting substrate.

The image display device in the present disclosure is an image display device including a display panel for displaying an image and a component mounting substrate in which a component that is a light source for illuminating the display panel from the back side is connected to a conductor layer. Includes a positive electrode and a negative electrode, which are electrodes connected to the conductor layer by solder, and an exposed live part, and the conductor layer is arranged between the positive electrode and the negative electrode. It is provided with an insulating gap to be formed, and a recess which is a recess located on the side of the electrode of the component connected across the insulating gap and in the vicinity of the exposed portion of the live-acting portion.

Further, the method of manufacturing the image display device in the present disclosure is an image display device including a display panel for displaying an image and a component mounting substrate in which a component which is a light source for illuminating the display panel from the back side is connected to a conductor layer. In a manufacturing method, the component includes a positive electrode and a negative electrode, which are electrodes connected to the conductor layer by solder, and an exposed live part of the positive electrode and the negative electrode. Simultaneously etch the insulating gap arranged between them and the recess that is a recess located on the side of the electrode of the component connected across the insulating gap and in the vicinity of the exposed portion of the live-acting portion. Is formed on the conductor layer.

According to the image display device, the manufacturing method of the image display device, and the component mounting substrate in the present disclosure, it is possible to avoid a short circuit between the electrodes of the components connected by solder and the live part.

It is a perspective view which shows the appearance of the image display device which concerns on Embodiment 1. FIG. It is a perspective view which shows from the rear by disassembling the liquid crystal module which concerns on Embodiment 1. FIG. It is a perspective view which shows from the front by disassembling the liquid crystal module which concerns on Embodiment 1. FIG. It is a top view which shows the component mounting board which concerns on Embodiment 1. FIG. FIG. 5 is an enlarged plan view showing a component portion of the component mounting board according to the first embodiment. It is sectional drawing which shows the component of the component mounting board which concerns on Embodiment 1 in cross section. FIG. 5 is an enlarged plan view showing a component portion of the component mounting board according to the second embodiment. It is sectional drawing which shows the component of the component mounting board which concerns on Embodiment 2 in cross section. It is a top view which shows another example of the recess of the component mounting board. It is a top view which shows another example of the recess of the component mounting board. It is a top view which shows another example of the recess of the component mounting board. It is a top view which shows another example of the insulation gap of a component mounting board. It is a top view which shows another example of the insulation gap of a component mounting board. It is a top view which shows another example of the slit of the component mounting board. It is a top view which shows another example of the slit of the component mounting board. It is a top view which shows another example of the insulation gap of a component mounting board.

The inventor of the present application has found that the following problems occur with respect to the component mounting substrate used in the conventional image display device. Even in conventional image display devices such as LCD TVs, a base plate called a plate-shaped lower plate with high rigidity is arranged on the back surface of the liquid crystal panel, and a component mounting with a light source for a backlight mounted on this base plate. The board is attached. The light source connected to this component mounting board is a relatively large LED (light emitting diode) package or the like in which the live part is not exposed other than the electrodes, and the solder for connecting the component to the conductive layer is in a predetermined position. There was no short circuit with the live-acting part due to the protrusion from the main part.

However, recent LED chips are becoming smaller, such as CSP-LEDs (chip scale package LEDs), and there are cases where live parts other than electrodes are exposed from the package. When soldering a small LED with an exposed live part, the electrode and the live part may be short-circuited due to the protruding solder.

In order to prevent such a short circuit from occurring, it is necessary to strictly control the amount of solder applied and mount the LED chip with high accuracy.

Therefore, as a result of diligent studies by the inventor of the present application, a recess is provided in the conductive layer of the substrate before connection by soldering, and the flow of solder is controlled so that the amount of solder applied and the mounting position of the LED chip are not strictly controlled. However, we have found that it is possible to prevent a short circuit between the electrode and the live part.

The present disclosure has been made based on such findings, and is an image display device provided with a component mounting board on which components without a short circuit between an electrode and an active part are mounted, a method for manufacturing the image display device, and a method for manufacturing the image display device. It provides a component mounting board.

Further, since the CSP-LED has a structure in which the electrode exposed on one surface of the package and the conductive layer of the substrate are directly soldered without using a lead wire, the temperature and non-energization when the CSP-LED is energized. It has been found that thermal stress is generated due to the difference from the temperature at the time, and problems such as electrode peeling from the CSP-LED occur.

Therefore, as a result of diligent studies by the inventor of the present application, it has been found that by providing a through hole in the substrate, thermal stress can be relaxed and damage to the CSP-LED can be prevented.

Hereinafter, embodiments will be described with reference to the drawings as appropriate. However, more detailed explanation than necessary may be omitted. For example, detailed explanations of already well-known matters and duplicate explanations for substantially the same configuration may be omitted. This is to avoid unnecessary redundancy of the following description and to facilitate the understanding of those skilled in the art.

It should be noted that the inventor of the present application provides the accompanying drawings and the following description in order for those skilled in the art to fully understand the present disclosure, and is not intended to limit the subject matter described in the claims by these. Absent.

Further, in the following embodiments, for convenience of explanation, the vertical direction coincides with the Y-axis direction, the front-rear direction coincides with the Z-axis direction, and the left-right direction coincides with the X-axis direction. This does not limit the posture at the time of manufacturing or using the image display device according to the present disclosure. Further, in the following description, for example, the X-axis plus side indicates the arrow direction side of the X-axis, and the X-axis minus side indicates the side opposite to the X-axis plus side. The same applies to the Y-axis direction and the Z-axis direction.

(Embodiment 1)
FIG. 1 is a perspective view showing the appearance of the image display device according to the first embodiment.

As shown in the figure, the image display device 10 according to the first embodiment is a liquid crystal television, and includes a liquid crystal module 100 including a display panel 102, a bezel 120, a back cover 103, and a stand 200. ing.

In the first embodiment, the display panel 102 is a so-called liquid crystal cell, which is an element in which a liquid crystal is enclosed between a plurality of glass plates. The display panel 102 is controlled based on the video signal input to the image display device 10 to display the video.

The bezel 120 and the back cover 103 are structural members that form the outer shell of the liquid crystal module 100 that houses the display panel 102 and the like. The bezel 120 protects the outer peripheral portion of an element such as the display panel 102 and forms a bezel (picture frame). In the first embodiment, a resin such as polycarbonate (PC) is used as the material of the bezel 120 and the back cover 103.

FIG. 2 is a perspective view showing the liquid crystal module according to the first embodiment disassembled from the rear. FIG. 3 is a perspective view showing the liquid crystal module according to the first embodiment disassembled from the front.

The bezel 120 houses a plurality of parts from the display panel 102 to the base plate 140. In the case of the first embodiment, in the space surrounded by the bezel 120, the back cover 103, and the display panel 102, the mold frame 130, the optical sheet unit 105 including two or three optical sheets, and the diffuser plate The 106, the brightness uniform plate 107, the reflective sheet 108, the component mounting board 109, the relay sheet 110, the base plate 140, and the support pin 112 are arranged.

The mold frame 130 supports the display panel 102 and sandwiches a plurality of components (so-called backlights) from the optical sheet unit 105 to the component mounting substrate 109 and the relay sheet 110 together with the base plate 140.

The optical sheet unit 105 is configured by stacking two or three types of sheets having different optical characteristics. The optical sheet unit 105 includes, for example, a vertical prism sheet, a horizontal prism sheet, a diffusion sheet, and the like.

The diffuser plate 106 diffuses light from components that are a plurality of light sources arranged on the component mounting substrate 109 described later.

The luminance uniform plate 107 homogenizes the light from a plurality of LEDs arranged on the component mounting substrate 109. The luminance uniform plate 107 is a member in which a plurality of holes having different diameters are formed. Specifically, in the luminance uniform plate 107, holes having an extremely small diameter are formed directly above each of the plurality of LEDs, and holes having a large diameter are formed as the distance from the component that is the light source increases. With the above configuration, the luminance uniform plate 107 makes the orientation characteristics of light from each light source component gentle.

The diffuser plate 106 is a member that further diffuses the light from each component whose orientation characteristics are made gentle by the luminance uniform plate 107. The light transmitted through the diffuser plate 106 is emitted as light with less uneven brightness.

The reflective sheet 108 is provided with holes in portions corresponding to LEDs, which are a plurality of light sources arranged on the component mounting substrate 109.

The base plate 140 is a plate-shaped member formed of a thin sheet metal and having a size enough to cover a display panel on which the component mounting substrate 109 and the relay sheet 110 are attached, and is a member called a base plate or the like. Specifically, after the component mounting board 109 and the relay sheet 110 are attached to the base plate 140, the reflective sheet 108 is attached to the base plate 140 so that the component that is the light source is exposed from each of the plurality of holes of the reflective sheet 108. It will be pasted. The light from each component is reflected by the reflective sheet 108 and emitted to the Z-axis plus side.

Each of the plurality of support pins 112 is attached from above the reflective sheet 108 so as to sandwich the reflective sheet 108 together with the base plate 140. The support pin 112 has a tip portion to be inserted into a hole provided in the luminance uniform plate 107, and a flange portion for supporting the luminance uniform plate 107.

The brightness uniform plate 107 is provided with a plurality of holes into which the tips of the support pins 112 are inserted, and the tips of the support pins 112 are inserted into the holes, and the flange portions of the support pins 112 are used to insert the brightness uniform plate 107. It is attached to the base plate 140 while being supported by the base plate 140.

The diffuser plate 106 is supported by the apex (tip of the tip) of the support pin 112, and the peripheral edge of the diffuser plate 106 is supported by the base plate 140.

A notch for suspending the optical sheet unit 105 is formed on one side of the base plate 140, which is the upper part when the image display device 10 is installed. The optical sheet unit 105 is provided with a tab having a rectangular hole for hooking the cut-up.

FIG. 4 is a plan view showing a component mounting substrate according to the first embodiment.

The component mounting board 109 is a board on which the component 191 which is mounted on the display panel 102 side of the base plate 140 and is a light source for illuminating the display panel 102 from the back side is surface-mounted. In the case of the first embodiment, the component mounting substrate 109 includes a base film 190, an insulating gap 193, a conductor layer 192, and a recess 196. In the case of the first embodiment, the component mounting substrate 109 has a metal pin 210 made of metal for electrically connecting to the relay sheet 110 connected to the conductor layer 192.

The component mounting board 109 is attached to the base plate 140 by an adhesive layer such as double-sided tape that can be reattached. If it is misaligned, the component mounting board 109 can be peeled off from the base plate 140 and then reattached.

The base film 190 is a long plate-like flexible resin film having insulating properties. The base film 190 is a substrate on which a conductor layer 192 of a so-called flexible printed circuit board (FPC: Flexible Printed Circuit) is printed.

The conductor layer 192 is a conductive layer attached in a film shape to the main surface of the base film 190. The material constituting the conductor layer 192 is not particularly limited as long as it is conductive, but in the case of the first embodiment, copper foil is adopted as the conductor layer. The conductor layers 192 are arranged on both sides in the longitudinal direction (Y-axis direction in the drawing) with an insulating gap 193 of a predetermined width extending in the lateral direction (X-axis direction in the drawing) of the base film 190, and are arranged on the component 191. Each is connected. The length (width) of the conductor layer 192 to which the component 191 is connected in the lateral direction is set wider than the width of the component 191 and extends in the longitudinal direction with the same width except for the portion of the insulation gap 193. There is. By forming the conductor layer 192 connected to the component 191 into this shape, the heat generated by the component 191 can be efficiently dissipated by the conductor layer 192. Further, the conductor layer 192 has a U-shape as a whole, which is arranged with the separation band 194 in the lateral direction of the base film 190 and connected at one end in the longitudinal direction. This is a series of a plurality of components 191 mounted longitudinally on the base film 190 with power supplied via two metal pins 210 mounted side by side at the other end of the base film 190 in the longitudinal direction. It is a shape for connecting to.

Further, in order to increase the length of the conductor layer 192 in which the component 191 is directly connected in the lateral direction to improve heat dissipation efficiency, the separation band 194 is arranged so as to be offset to one side in the lateral direction. .. A white resist layer is provided in a portion of the conductor layer 192 other than the vicinity to which the component 191 is connected, so that the light radiated from the component 191 can be reflected.

The insulation gap 193 is a gap between the conductor layers 192 arranged side by side in the longitudinal direction of the base film 190. The separation band 194 is a gap between the conductor layers 192 arranged side by side in the lateral direction of the base film 190. These are spaces for insulating adjacent conductor layers 192. The insulation gap 193 and the separation band 194 may be filled with a resin resist. The width of the insulation gap 193 is not particularly limited as long as it is a predetermined width to which the conductor layer 192 forming the insulation gap 193 can be connected to the two electrodes included in the component 191. Further, the width of the insulation gap 193 may be constant, and can be arbitrarily set such that the width is changed between the intersection 195 and other portions.

The insulation gap 193 extends in an intersecting state with respect to the virtual line 199 (the line virtually extending in the X-axis direction in the figure) that virtually connects one end to the other end in the lateral direction of the component mounting board 109. It has an existing intersection 195. That is, the wiring pattern at the end of the conductor layer 192 at the portion to which the component 191 is connected is made into a staircase shape or an uneven shape. As a result, when the component mounting substrate 109 bends in the longitudinal direction (Y-axis direction in the drawing) with respect to the conventional insulation gap arranged in a straight line along the virtual line 199, the conductor layer is a relatively hard portion. Between 192, the stress concentrated in the insulating gap 193 where the relatively soft base film 190 is exposed can be dispersed. Therefore, the radius of curvature of the deflection due to stress in the vicinity of the component 191 surface-mounted across the insulation gap 193 becomes relatively large, and it is possible to prevent the component 191 from falling off due to the deflection.

Further, in the case of the first embodiment, the intersection 195 of the insulation gap 193 is arranged in a state orthogonal to the virtual line 199. As a result, the intersection 195 extending in the longitudinal direction of the component mounting substrate 109 can effectively counter the stress due to the deflection in the longitudinal direction.

Further, the insulation gap 193 includes a plurality of intersections 195. As a result, the stress concentrated in the insulation gap 193 can be effectively dispersed, and the bending in the vicinity of the insulation gap 193 can be made gentle.

Further, the plurality of intersections 195 are arranged rotationally symmetrically with respect to the component 191 mounted so as to straddle the insulation gap 193. As a result, the component mounting substrate 109 flexes evenly in the vicinity of the component 191 and can prevent the component 191 from falling off.

FIG. 5 is an enlarged plan view showing a component portion of the component mounting board according to the first embodiment. FIG. 6 is a cross-sectional view showing a component of the component mounting substrate along the line I-I of FIG. 5 in cross section. Note that in FIG. 5, solder 197 is omitted for explanation.

The component 191 is not particularly limited as long as it is an electronic component or an electrical component mounted on the component mounting board 109. In the case of the first embodiment, since the component mounting substrate 109 functions as the backlight of the liquid crystal module 100, the component 191 is a component that emits white light, and is a so-called CSP-LED.

The component 191 which is a CSP-LED is covered with an insulating package 189, and the negative electrode 181 which is an electrode connected by the conductor layer 192 and the solder 197 and the positive electrode 182 are exposed on the surface on the conductor layer 192 side. are doing. Further, the component 191 includes an active portion 183 exposed from a surface intersecting the surface on which the electrode is exposed.

In the case of the first embodiment, the live power unit 183 is exposed at a position above the negative electrode 181 side. The exposed portion of the live power unit 183 extends in the lateral direction (X-axis direction in the drawing) of the component mounting substrate 109. Further, when the surface of the component 191 facing the component mounting substrate 109 is the bottom surface and the surface intersecting the bottom surface is the side surface, the live power unit 183 is only exposed from one side surface of the component 191.

The recess 196 is a recess provided in the conductor layer 192, and is located on the side of the negative electrode 181 of the component 191 connected across the insulating gap 193 and in the vicinity of the live power unit 183. In the case of the first embodiment, the recess 196 is recessed including a portion where a virtual perpendicular line is drawn from the portion exposed from the package 189 of the live power unit 183 to the conductor layer 192. By providing the recess 196 at the relevant location, the solder 197 that protrudes when the solder 197 melts flows into the recess 196, and a short circuit between the electrode and the exposed portion of the live electric unit 183 can be avoided. In the case of the first embodiment, the recess 196 penetrates the conductor layer 192 in the thickness direction. As a result, the recess 196 can be formed together with the insulating gap 193 at the same time in the same etching process. The shape of the recess 196 is a groove extending in a direction (X-axis direction in the figure) intersecting the alignment direction (Y-axis direction in the figure) of the positive electrode 182 and the negative electrode 181. The width is narrower than the insulation gap 193.

The shape of the recess 196 in a plan view is not particularly limited, and examples thereof include a circular shape, an elliptical shape, and a rectangular shape. Further, the number of recesses 196 is not limited, and a plurality of relatively small circular recesses may be arranged in a dispersed manner, or may be one relatively large recess.

In the case of the first embodiment, the shape of the recess 196 in the plan view is a size corresponding to the shape of the exposed portion of the live power unit 183, and includes the exposed part of the live power unit 183 in the plan view. It is placed in a position. Further, the shape of the recess 196 is a groove shape extending along the exposed portion.

The relay sheet 110 includes a connector (metal pin on the female side) connected to the metal pin 210 on the male side of the component mounting board 109, and is an electric path for sending electric power, control signals, and the like to the component 191 which is a plurality of light sources. Is the formed FPC. The relay sheet 110 is also attached to the base plate 140 in the same manner as the component mounting board 109. A reflective layer that reflects the light from the component 191 toward the display panel 102 may be formed on at least one of the relay sheet 110 and the component mounting substrate 109.

(Embodiment 2)
Subsequently, other embodiments will be described. In addition, the same reference numerals may be given to those having the same actions and functions as those in the first embodiment, and the same shapes, mechanisms and structures, and the description thereof may be omitted. Further, in the following, the points different from those of the first embodiment will be mainly described, and the description of the same contents may be omitted.

FIG. 7 is an enlarged plan view showing a component portion of the component mounting board according to the second embodiment. FIG. 8 is a cross-sectional view showing a component of the component mounting substrate in line II-II of FIG. 7 in cross section. In FIG. 7, solder 197 is omitted for explanation.

As shown in these figures, the component mounting substrate 109 according to the second embodiment has a slit 150 that penetrates the base film 190, which is a substrate in the thickness direction, together with the conductor layer 192 at a position farther than the recess 196 with respect to the component 191. Is provided.

In the case of the second embodiment, the slit 150 extends along the insulating gap 193 over which the component 191 straddles, and is longer than the recess 196. Further, the slits 150 are provided at two locations with the component 191 interposed therebetween. The shape of the slit 150, the distance from the component 191 and the posture are not particularly limited, but if the slit 150 is provided at a position far from the component 191, the effect of relaxing the thermal stress cannot be expected. Specifically, it is preferably provided within 5 mm from the component 191. On the other hand, if it is too close to the component 191, the heat dissipation effect of the conductor layer 192 will be hindered.

By providing the slits 150 so as to penetrate in the thickness direction of the component mounting substrate 109 in this way, the thermal stress generated by the expansion and contraction of the base film 190 based on the heat generated by the component 191 can be relaxed, and the thermal stress generated by the component 191 can be relaxed. It is possible to prevent damage.

Next, a method of manufacturing the image display device 10 will be briefly described. The component mounting substrate 109 constituting the backlight attached to the base plate 140 of the image display device 10 is etched so that the conductor layer 192, which is arranged so as to spread in a layer on one surface of the base film 190, has a desired pattern. In the etching step, the positive electrode 182 of the component 191 and the insulating gap 193 arranged between the negative electrodes 181 and the side of the electrode of the component 191 connected across the insulating gap 193 and the live part A recess 196, which is a recess located in the vicinity of the exposed portion of 183, is simultaneously formed in the conductor layer 192. Since the insulation gap 193 needs to completely divide the conductor layer, the conductor layer 192 is penetrated by etching in the thickness direction. Along with this, the recess 196 also penetrates in the thickness direction of the conductor layer 192.

Next, the surface of the conductor layer 192 is coated with a white resist in a predetermined pattern. The resist is not coated on at least the portion of component 191 that connects to the electrodes and the region that includes the recess 196.

Next, cream solder is applied to a portion of the conductor layer 192 that is in contact with the electrode and is not coated with the resist. The coating method follows a well-known method.

Next, the component 191 is placed on the cream solder using a mounter or the like. Next, the substrate in which the component 191 is arranged is introduced into a reflow furnace or the like to melt the cream solder. At this time, excess solder that melts and protrudes from the electrode is guided to the recess 196 as shown in FIG.

As described above, the negative electrode 181 and the exposed portion of the active portion 183 are not short-circuited by the solder 197, and the component mounting substrate 109 can be manufactured with a high yield.

Next, the component mounting substrate 109 is attached to the surface of the base plate 140 by an adhesive means such as double-sided tape. Since the pasting work is performed manually by the operator, an error may occur in the pasting position. In this case, the component mounting board 109 is reattached, but since the intersection 195 exists in the insulation gap 193, the stress is concentrated only in the insulation gap 193 even when the entire component mounting board 109 is curved. Can be avoided. Therefore, only the portion of the insulating gap 193 is not strongly bent, and the component 191 connected across the insulating gap 193 can be prevented from falling off.

As described above, it is possible to easily manufacture the image display device 10 provided with the component mounting board 109 manufactured with a high yield.

The invention of the present application is not limited to the above-described embodiment. For example, another embodiment realized by arbitrarily combining the components described in the present specification and excluding some of the components may be the embodiment of the present invention. In addition, the present invention also includes modifications obtained by making various modifications that can be conceived by those skilled in the art without departing from the gist of the present invention, that is, the meaning indicated by the wording described in the claims. Is done.

For example, the shape of the recess 196 is not only linear, but as shown in FIG. 9, when the active portion 183 is exposed not only on one side surface but also on the side surface following the side surface, the active portion 183. The recess 196 may be bent into an L-shape, a C-shape, or the like depending on the exposed shape of. In this case, in order to ensure continuity between the portion of the conductor layer 192 to which the electrodes of the component 191 are connected and the other conductor layers 192, the conductor layer 192 to which the electrodes are connected to a part of the recess 196. It is preferable to provide a bridge portion 184 that connects the portion and the other portion of the conductor layer 192.

Further, the live power unit 183 may not only be exposed to only one electrode side, but may also be exposed to both electrode sides. In this case, as shown in FIGS. 10 and 11, recesses 196 may be provided on both sides of the insulating gap 193.

Further, as shown in FIG. 12, the entire insulation gap 193 may be a straight intersection 195. Further, as shown in FIG. 13, the component 191 may be mounted so as to straddle the intersection 195. In this way, when the component 191 is straddled and connected to the intersection 195 orthogonal to the virtual line 199, the arrangement direction of the contact points between the component 191 and the conductor layer 192 can be made parallel to the virtual line 199. Even when the component mounting board 109 is bent in the longitudinal direction, the component 191 is less likely to fall off.

Further, the insulation gap 193 may be formed not only by a straight line but also by a curved line.

Further, in the first embodiment, the image display device 10 is provided as a device for displaying a still image and a moving image in the image display device 10. However, the configuration of the image display device 10 may be applied to, for example, a monitor display for a personal computer, a mobile terminal such as a tablet terminal or a smartphone, and the like.

Further, in the first embodiment, each of the bezel 120 and the mold frame 130 uses a resin such as PC. However, a metal such as SUS may be used as the material. When metal is used for the four side portions (straight portions) of the mold frame 130, it is better to form the four corner portions with resin.

Further, as shown in FIG. 14, the slit 150 may be provided in a median strip 194 or the like in which the conductor layer 192 does not exist. Further, the slit 150 may be arranged so as to straddle the insulating gap 193.

Further, as shown in FIG. 15, the slit 150 may be provided so as to intersect (orthogonally) the insulating gap 193 straddling the component 191.

Further, in the first embodiment and the second embodiment, the configuration of the insulation gap 193 as narrow as possible over the entire width of the conductor layer 192 is adopted. However, as shown in FIG. 16, some gaps may be widened. Specifically, in FIG. 16, the insulation gap 193 includes a first insulation gap portion 193a in the vicinity of the component 191 and a second insulation gap portion 193b extending from the first insulation gap portion 193a to the end portion of the conductor layer 192. And have. The first insulation gap portion 193a has a width of about several hundred μm, and the second insulation gap portion 193b has a width of about several mm, as in the first and second embodiments. ..

With the above configuration, even if the base film 190 is blackened by heat generated from the component 191 but the heat is not locally concentrated by the second insulating gap portion 193b, the expansion of the blackening is suppressed. Further, it is more effective to provide the through hole 152 in the second insulating gap portion 193b.

The present disclosure is applicable to, for example, a television receiver, a monitor display, a digital signage, a tablet terminal, a smartphone, a table type display device, or the like.

10 Image display device 100 Liquid crystal module 102 Display panel 103 Back cover 105 Optical sheet unit 106 Diffuse plate 107 Brightness uniform plate 108 Reflective sheet 109 Parts mounting board 110 Relay sheet 112 Support pin 120 Bezel 130 Mold frame 140 Base plate 150 Slit 152 Through hole 181 Negative electrode 182 Positive electrode 183 Active part 184 Bridge part 189 Package 190 Base film 191 Parts 192 Conductor layer 193 Insulation gap 193a First insulation gap part 193b Second insulation gap part 194 Separation zone 195 Intersection 196 Recess 197 Handa 199 Virtual Wire 200 Stand 210 Metal Pin

The present disclosure relates to an image display device including a display panel such as a liquid crystal cell, a method for manufacturing the image display device, and a component mounting substrate.

Patent Document 1 discloses an image display device including a liquid crystal panel, a base plate arranged on the back surface side, and a component mounting substrate having a light source attached to the base plate.

Japanese Unexamined Patent Publication No. 2006-179494

The present disclosure provides an image display device including a component mounting board that avoids a short circuit between an active part that exposes a component and an electrode, a method for manufacturing the image display device, and a component mounting board.

Further, the present invention provides an image display device provided with a component mounting substrate capable of relieving thermal stress between energized and non-energized components, a method for manufacturing the image display device, and a component mounting substrate.

The image display device in the present disclosure is an image display device including a display panel for displaying an image and a component mounting substrate in which a component that is a light source for illuminating the display panel from the back side is connected to a conductor layer. Includes a positive electrode and a negative electrode, which are electrodes connected to the conductor layer by solder, and an exposed live part, and the conductor layer is arranged between the positive electrode and the negative electrode. It is provided with an insulating gap to be formed, and a recess which is a recess located on the side of the electrode of the component connected across the insulating gap and in the vicinity of the exposed portion of the live-acting portion.

Further, the method of manufacturing the image display device in the present disclosure is an image display device including a display panel for displaying an image and a component mounting substrate in which a component which is a light source for illuminating the display panel from the back side is connected to a conductor layer. In a manufacturing method, the component includes a positive electrode and a negative electrode, which are electrodes connected to the conductor layer by solder, and an exposed live part of the positive electrode and the negative electrode. Simultaneously etch the insulating gap arranged between them and the recess that is a recess located on the side of the electrode of the component connected across the insulating gap and in the vicinity of the exposed portion of the live-acting portion. Is formed on the conductor layer.

According to the image display device, the manufacturing method of the image display device, and the component mounting substrate in the present disclosure, it is possible to avoid a short circuit between the electrodes of the components connected by solder and the live part.

It is a perspective view which shows the appearance of the image display device which concerns on Embodiment 1. FIG. It is a perspective view which shows from the rear by disassembling the liquid crystal module which concerns on Embodiment 1. FIG. It is a perspective view which shows from the front by disassembling the liquid crystal module which concerns on Embodiment 1. FIG. It is a top view which shows the component mounting board which concerns on Embodiment 1. FIG. FIG. 5 is an enlarged plan view showing a component portion of the component mounting board according to the first embodiment. It is sectional drawing which shows the component of the component mounting board which concerns on Embodiment 1 in cross section. FIG. 5 is an enlarged plan view showing a component portion of the component mounting board according to the second embodiment. It is sectional drawing which shows the component of the component mounting board which concerns on Embodiment 2 in cross section. It is a top view which shows another example of the recess of the component mounting board. It is a top view which shows another example of the recess of the component mounting board. It is a top view which shows another example of the recess of the component mounting board. It is a top view which shows another example of the insulation gap of a component mounting board. It is a top view which shows another example of the insulation gap of a component mounting board. It is a top view which shows another example of the slit of the component mounting board. It is a top view which shows another example of the slit of the component mounting board. It is a top view which shows another example of the insulation gap of a component mounting board.

The inventor of the present application has found that the following problems occur with respect to the component mounting substrate used in the conventional image display device. Even in conventional image display devices such as LCD TVs, a base plate called a plate-shaped lower plate with high rigidity is arranged on the back surface of the liquid crystal panel, and a component mounting with a light source for a backlight mounted on this base plate. The board is attached. The light source connected to this component mounting board is a relatively large LED (light emitting diode) package or the like in which the live part is not exposed other than the electrodes, and the solder for connecting the component to the conductive layer is in a predetermined position. There was no short circuit with the live-acting part due to the protrusion from the main part.

However, recent LED chips are becoming smaller, such as CSP-LEDs (chip scale package LEDs), and there are cases where live parts other than electrodes are exposed from the package. When soldering a small LED with an exposed live part, the electrode and the live part may be short-circuited due to the protruding solder.

In order to prevent such a short circuit from occurring, it is necessary to strictly control the amount of solder applied and mount the LED chip with high accuracy.

Therefore, as a result of diligent studies by the inventor of the present application, a recess is provided in the conductive layer of the substrate before connection by soldering, and the flow of solder is controlled so that the amount of solder applied and the mounting position of the LED chip are not strictly controlled. However, we have found that it is possible to prevent a short circuit between the electrode and the live part.

The present disclosure has been made based on such findings, and is an image display device provided with a component mounting board on which components without a short circuit between an electrode and an active part are mounted, a method for manufacturing the image display device, and It provides a component mounting board.

Further, since the CSP-LED has a structure in which the electrode exposed on one surface of the package and the conductive layer of the substrate are directly soldered without using a lead wire, the temperature and non-energization when the CSP-LED is energized. It has been found that thermal stress is generated due to the difference from the temperature at the time, and problems such as electrode peeling from the CSP-LED occur.

Therefore, as a result of diligent studies by the inventor of the present application, it has been found that by providing a through hole in the substrate, thermal stress can be relaxed and damage to the CSP-LED can be prevented.

Hereinafter, embodiments will be described with reference to the drawings as appropriate. However, more detailed explanation than necessary may be omitted. For example, detailed explanations of already well-known matters and duplicate explanations for substantially the same configuration may be omitted. This is to avoid unnecessary redundancy of the following description and to facilitate the understanding of those skilled in the art.

It should be noted that the inventor of the present application provides the accompanying drawings and the following description in order for those skilled in the art to fully understand the present disclosure, and is not intended to limit the subject matter described in the claims by these. Absent.

Further, in the following embodiments, for convenience of explanation, the vertical direction coincides with the Y-axis direction, the front-rear direction coincides with the Z-axis direction, and the left-right direction coincides with the X-axis direction. This does not limit the posture at the time of manufacturing or using the image display device according to the present disclosure. Further, in the following description, for example, the X-axis plus side indicates the arrow direction side of the X-axis, and the X-axis minus side indicates the side opposite to the X-axis plus side. The same applies to the Y-axis direction and the Z-axis direction.

(Embodiment 1)
FIG. 1 is a perspective view showing the appearance of the image display device according to the first embodiment.

As shown in the figure, the image display device 10 according to the first embodiment is a liquid crystal television, and includes a liquid crystal module 100 including a display panel 102, a bezel 120, a back cover 103, and a stand 200. ing.

In the first embodiment, the display panel 102 is a so-called liquid crystal cell, which is an element in which a liquid crystal is enclosed between a plurality of glass plates. The display panel 102 is controlled based on the video signal input to the image display device 10 to display the video.

The bezel 120 and the back cover 103 are structural members that form the outer shell of the liquid crystal module 100 that houses the display panel 102 and the like. The bezel 120 protects the outer peripheral portion of an element such as the display panel 102 and forms a bezel (picture frame). In the first embodiment, a resin such as polycarbonate (PC) is used as the material of the bezel 120 and the back cover 103.

FIG. 2 is a perspective view showing the liquid crystal module according to the first embodiment disassembled from the rear. FIG. 3 is a perspective view showing the liquid crystal module according to the first embodiment disassembled from the front.

The bezel 120 houses a plurality of parts from the display panel 102 to the base plate 140. In the case of the first embodiment, in the space surrounded by the bezel 120, the back cover 103, and the display panel 102, the mold frame 130, the optical sheet unit 105 including two or three optical sheets, and the diffuser plate The 106, the brightness uniform plate 107, the reflective sheet 108, the component mounting board 109, the relay sheet 110, the base plate 140, and the support pin 112 are arranged.

The mold frame 130 supports the display panel 102 and sandwiches a plurality of components (so-called backlights) from the optical sheet unit 105 to the component mounting substrate 109 and the relay sheet 110 together with the base plate 140.

The optical sheet unit 105 is configured by stacking two or three types of sheets having different optical characteristics. The optical sheet unit 105 includes, for example, a vertical prism sheet, a horizontal prism sheet, a diffusion sheet, and the like.

The diffuser plate 106 diffuses light from components that are a plurality of light sources arranged on the component mounting substrate 109 described later.

The luminance uniform plate 107 homogenizes the light from a plurality of LEDs arranged on the component mounting substrate 109. The luminance uniform plate 107 is a member in which a plurality of holes having different diameters are formed. Specifically, in the luminance uniform plate 107, holes having an extremely small diameter are formed directly above each of the plurality of LEDs, and holes having a large diameter are formed as the distance from the component that is the light source increases. With the above configuration, the luminance uniform plate 107 makes the orientation characteristics of light from each light source component gentle.

The diffuser plate 106 is a member that further diffuses the light from each component whose orientation characteristics are made gentle by the luminance uniform plate 107. The light transmitted through the diffuser plate 106 is emitted as light with less uneven brightness.

The reflective sheet 108 is provided with holes in portions corresponding to LEDs, which are a plurality of light sources arranged on the component mounting substrate 109.

The base plate 140 is a plate-shaped member formed of a thin sheet metal and having a size enough to cover a display panel on which the component mounting substrate 109 and the relay sheet 110 are attached, and is a member called a base plate or the like. Specifically, after the component mounting board 109 and the relay sheet 110 are attached to the base plate 140, the reflective sheet 108 is attached to the base plate 140 so that the component that is the light source is exposed from each of the plurality of holes of the reflective sheet 108. It will be pasted. The light from each component is reflected by the reflective sheet 108 and emitted to the Z-axis plus side.

Each of the plurality of support pins 112 is attached from above the reflective sheet 108 so as to sandwich the reflective sheet 108 together with the base plate 140. The support pin 112 has a tip portion to be inserted into a hole provided in the luminance uniform plate 107, and a flange portion for supporting the luminance uniform plate 107.

The brightness uniform plate 107 is provided with a plurality of holes into which the tips of the support pins 112 are inserted, and the tips of the support pins 112 are inserted into the holes, and the flange portions of the support pins 112 are used to insert the brightness uniform plate 107. It is attached to the base plate 140 while being supported by the base plate 140.

The diffuser plate 106 is supported by the apex (tip of the tip) of the support pin 112, and the peripheral edge of the diffuser plate 106 is supported by the base plate 140.

A notch for suspending the optical sheet unit 105 is formed on one side of the base plate 140, which is the upper part when the image display device 10 is installed. The optical sheet unit 105 is provided with a tab having a rectangular hole for hooking the cut-up.

FIG. 4 is a plan view showing a component mounting substrate according to the first embodiment.

The component mounting board 109 is a board on which the component 191 which is mounted on the display panel 102 side of the base plate 140 and is a light source for illuminating the display panel 102 from the back side is surface-mounted. In the case of the first embodiment, the component mounting substrate 109 includes a base film 190, an insulating gap 193, a conductor layer 192, and a recess 196. In the case of the first embodiment, the component mounting substrate 109 has a metal pin 210 made of metal for electrically connecting to the relay sheet 110 connected to the conductor layer 192.

The component mounting board 109 is attached to the base plate 140 by an adhesive layer such as double-sided tape that can be reattached. If it is misaligned, the component mounting board 109 can be peeled off from the base plate 140 and then reattached.

The base film 190 is a long plate-like flexible resin film having insulating properties. The base film 190 is a substrate on which a conductor layer 192 of a so-called flexible printed circuit board (FPC: Flexible Printed Circuit) is printed.

The conductor layer 192 is a conductive layer attached in a film shape to the main surface of the base film 190. The material constituting the conductor layer 192 is not particularly limited as long as it is conductive, but in the case of the first embodiment, copper foil is adopted as the conductor layer. The conductor layers 192 are arranged on both sides in the longitudinal direction (Y-axis direction in the drawing) with an insulating gap 193 of a predetermined width extending in the lateral direction (X-axis direction in the drawing) of the base film 190, and are arranged on the component 191. Each is connected. The length (width) of the conductor layer 192 to which the component 191 is connected in the lateral direction is set wider than the width of the component 191 and extends in the longitudinal direction with the same width except for the portion of the insulation gap 193. There is. By forming the conductor layer 192 connected to the component 191 into this shape, the heat generated by the component 191 can be efficiently dissipated by the conductor layer 192. Further, the conductor layer 192 has a U-shape as a whole, which is arranged with the separation band 194 in the lateral direction of the base film 190 and connected at one end in the longitudinal direction. This is a series of a plurality of components 191 mounted longitudinally on the base film 190 with power supplied via two metal pins 210 mounted side by side at the other end of the base film 190 in the longitudinal direction. It is a shape for connecting to.

Further, in order to increase the length of the conductor layer 192 in which the component 191 is directly connected in the lateral direction to improve heat dissipation efficiency, the separation band 194 is arranged so as to be offset to one side in the lateral direction. .. A white resist layer is provided in a portion of the conductor layer 192 other than the vicinity to which the component 191 is connected, so that the light radiated from the component 191 can be reflected.

The insulation gap 193 is a gap between the conductor layers 192 arranged side by side in the longitudinal direction of the base film 190. The separation band 194 is a gap between the conductor layers 192 arranged side by side in the lateral direction of the base film 190. These are spaces for insulating adjacent conductor layers 192. The insulation gap 193 and the separation band 194 may be filled with a resin resist. The width of the insulation gap 193 is not particularly limited as long as it is a predetermined width to which the conductor layer 192 forming the insulation gap 193 can be connected to the two electrodes included in the component 191. Further, the width of the insulation gap 193 may be constant, and can be arbitrarily set such that the width is changed between the intersection 195 and other portions.

The insulation gap 193 extends in an intersecting state with respect to the virtual line 199 (the line virtually extending in the X-axis direction in the figure) that virtually connects one end to the other end in the lateral direction of the component mounting board 109. It has an existing intersection 195. That is, the wiring pattern at the end of the conductor layer 192 at the portion to which the component 191 is connected is made into a staircase shape or an uneven shape. As a result, when the component mounting substrate 109 bends in the longitudinal direction (Y-axis direction in the drawing) with respect to the conventional insulation gap arranged in a straight line along the virtual line 199, the conductor layer is a relatively hard portion. Between 192, the stress concentrated in the insulating gap 193 where the relatively soft base film 190 is exposed can be dispersed. Therefore, the radius of curvature of the deflection due to stress in the vicinity of the component 191 surface-mounted across the insulation gap 193 becomes relatively large, and it is possible to prevent the component 191 from falling off due to the deflection.

Further, in the case of the first embodiment, the intersection 195 of the insulation gap 193 is arranged in a state orthogonal to the virtual line 199. As a result, the intersection 195 extending in the longitudinal direction of the component mounting substrate 109 can effectively counter the stress due to the deflection in the longitudinal direction.

Further, the insulation gap 193 includes a plurality of intersections 195. As a result, the stress concentrated in the insulation gap 193 can be effectively dispersed, and the bending in the vicinity of the insulation gap 193 can be made gentle.

Further, the plurality of intersections 195 are arranged rotationally symmetrically with respect to the component 191 mounted so as to straddle the insulation gap 193. As a result, the component mounting substrate 109 flexes evenly in the vicinity of the component 191 and can prevent the component 191 from falling off.

FIG. 5 is an enlarged plan view showing a component portion of the component mounting board according to the first embodiment. FIG. 6 is a cross-sectional view showing a component of the component mounting substrate along the line I-I of FIG. 5 in cross section. Note that in FIG. 5, solder 197 is omitted for explanation.

The component 191 is not particularly limited as long as it is an electronic component or an electrical component mounted on the component mounting board 109. In the case of the first embodiment, since the component mounting substrate 109 functions as the backlight of the liquid crystal module 100, the component 191 is a component that emits white light, and is a so-called CSP-LED.

The component 191 which is a CSP-LED is covered with an insulating package 189, and the negative electrode 181 which is an electrode connected by the conductor layer 192 and the solder 197 and the positive electrode 182 are exposed on the surface on the conductor layer 192 side. are doing. Further, the component 191 includes an active portion 183 exposed from a surface intersecting the surface on which the electrode is exposed.

In the case of the first embodiment, the live power unit 183 is exposed at a position above the negative electrode 181 side. The exposed portion of the live power unit 183 extends in the lateral direction (X-axis direction in the drawing) of the component mounting substrate 109. Further, when the surface of the component 191 facing the component mounting substrate 109 is the bottom surface and the surface intersecting the bottom surface is the side surface, the live power unit 183 is only exposed from one side surface of the component 191.

The recess 196 is a recess provided in the conductor layer 192, and is located on the side of the negative electrode 181 of the component 191 connected across the insulating gap 193 and in the vicinity of the live power unit 183. In the case of the first embodiment, the recess 196 is recessed including a portion where a virtual perpendicular line is drawn from the portion exposed from the package 189 of the live power unit 183 to the conductor layer 192. By providing the recess 196 at the relevant location, the solder 197 that protrudes when the solder 197 melts flows into the recess 196, and a short circuit between the electrode and the exposed portion of the live electric unit 183 can be avoided. In the case of the first embodiment, the recess 196 penetrates the conductor layer 192 in the thickness direction. As a result, the recess 196 can be formed together with the insulating gap 193 at the same time in the same etching process. The shape of the recess 196 is a groove extending in a direction (X-axis direction in the figure) intersecting the alignment direction (Y-axis direction in the figure) of the positive electrode 182 and the negative electrode 181. The width is narrower than the insulation gap 193.

The shape of the recess 196 in a plan view is not particularly limited, and examples thereof include a circular shape, an elliptical shape, and a rectangular shape. Further, the number of recesses 196 is not limited, and a plurality of relatively small circular recesses may be arranged in a dispersed manner, or may be one relatively large recess.

In the case of the first embodiment, the shape of the recess 196 in the plan view is a size corresponding to the shape of the exposed portion of the live power unit 183, and includes the exposed part of the live power unit 183 in the plan view. It is placed in a position. Further, the shape of the recess 196 is a groove shape extending along the exposed portion.

The relay sheet 110 includes a connector (metal pin on the female side) connected to the metal pin 210 on the male side of the component mounting board 109, and is an electric path for sending electric power, control signals, and the like to the component 191 which is a plurality of light sources. Is the formed FPC. The relay sheet 110 is also attached to the base plate 140 in the same manner as the component mounting board 109. A reflective layer that reflects the light from the component 191 toward the display panel 102 may be formed on at least one of the relay sheet 110 and the component mounting substrate 109.

(Embodiment 2)
Subsequently, other embodiments will be described. In addition, the same reference numerals may be given to those having the same actions and functions as those in the first embodiment, and the same shapes, mechanisms and structures, and the description thereof may be omitted. Further, in the following, the points different from those of the first embodiment will be mainly described, and the description of the same contents may be omitted.

FIG. 7 is an enlarged plan view showing a component portion of the component mounting board according to the second embodiment. FIG. 8 is a cross-sectional view showing a component of the component mounting substrate in line II-II of FIG. 7 in cross section. In FIG. 7, solder 197 is omitted for explanation.

As shown in these figures, the component mounting substrate 109 according to the second embodiment has a slit 150 that penetrates the base film 190, which is a substrate in the thickness direction, together with the conductor layer 192 at a position farther than the recess 196 with respect to the component 191. Is provided.

In the case of the second embodiment, the slit 150 extends along the insulating gap 193 over which the component 191 straddles, and is longer than the recess 196. Further, the slits 150 are provided at two locations with the component 191 interposed therebetween. The shape of the slit 150, the distance from the component 191 and the posture are not particularly limited, but if the slit 150 is provided at a position far from the component 191, the effect of relaxing the thermal stress cannot be expected. Specifically, it is preferably provided within 5 mm from the component 191. On the other hand, if it is too close to the component 191, the heat dissipation effect of the conductor layer 192 will be hindered.

By providing the slits 150 so as to penetrate in the thickness direction of the component mounting substrate 109 in this way, the thermal stress generated by the expansion and contraction of the base film 190 based on the heat generated by the component 191 can be relaxed, and the thermal stress generated by the component 191 can be relaxed. It is possible to prevent damage.

Next, a method of manufacturing the image display device 10 will be briefly described. The component mounting substrate 109 constituting the backlight attached to the base plate 140 of the image display device 10 is etched so that the conductor layer 192, which is arranged so as to spread in a layer on one surface of the base film 190, has a desired pattern. In the etching step, the positive electrode 182 of the component 191 and the insulating gap 193 arranged between the negative electrodes 181 and the side of the electrode of the component 191 connected across the insulating gap 193 and the live part A recess 196, which is a recess located in the vicinity of the exposed portion of 183, is simultaneously formed in the conductor layer 192. Since the insulation gap 193 needs to completely divide the conductor layer, the conductor layer 192 is penetrated by etching in the thickness direction. Along with this, the recess 196 also penetrates in the thickness direction of the conductor layer 192.

Next, the surface of the conductor layer 192 is coated with a white resist in a predetermined pattern. The resist is not coated on at least the portion of component 191 that connects to the electrodes and the region that includes the recess 196.

Next, cream solder is applied to a portion of the conductor layer 192 that is in contact with the electrode and is not coated with the resist. The coating method follows a well-known method.

Next, the component 191 is placed on the cream solder using a mounter or the like. Next, the substrate in which the component 191 is arranged is introduced into a reflow furnace or the like to melt the cream solder. At this time, excess solder that melts and protrudes from the electrode is guided to the recess 196 as shown in FIG.

As described above, the negative electrode 181 and the exposed portion of the active portion 183 are not short-circuited by the solder 197, and the component mounting substrate 109 can be manufactured with a high yield.

Next, the component mounting substrate 109 is attached to the surface of the base plate 140 by an adhesive means such as double-sided tape. Since the pasting work is performed manually by the operator, an error may occur in the pasting position. In this case, the component mounting board 109 is reattached, but since the intersection 195 exists in the insulation gap 193, the stress is concentrated only in the insulation gap 193 even when the entire component mounting board 109 is curved. Can be avoided. Therefore, only the portion of the insulating gap 193 is not strongly bent, and the component 191 connected across the insulating gap 193 can be prevented from falling off.

As described above, it is possible to easily manufacture the image display device 10 provided with the component mounting board 109 manufactured with a high yield.

The invention of the present application is not limited to the above-described embodiment. For example, another embodiment realized by arbitrarily combining the components described in the present specification and excluding some of the components may be the embodiment of the present invention. In addition, the present invention also includes modifications obtained by making various modifications that can be conceived by those skilled in the art without departing from the gist of the present invention, that is, the meaning indicated by the wording described in the claims. Is done.

For example, the shape of the recess 196 is not only linear, but as shown in FIG. 9, when the active portion 183 is exposed not only on one side surface but also on the side surface following the side surface, the active portion 183. The recess 196 may be bent into an L-shape, a C-shape, or the like depending on the exposed shape of. In this case, in order to ensure continuity between the portion of the conductor layer 192 to which the electrodes of the component 191 are connected and the other conductor layers 192, the conductor layer 192 to which the electrodes are connected to a part of the recess 196. It is preferable to provide a bridge portion 184 that connects the portion and the other portion of the conductor layer 192.

Further, the live power unit 183 may not only be exposed to only one electrode side, but may also be exposed to both electrode sides. In this case, as shown in FIGS. 10 and 11, recesses 196 may be provided on both sides of the insulating gap 193.

Further, as shown in FIG. 12, the entire insulation gap 193 may be a straight intersection 195. Further, as shown in FIG. 13, the component 191 may be mounted so as to straddle the intersection 195. In this way, when the component 191 is straddled and connected to the intersection 195 orthogonal to the virtual line 199, the arrangement direction of the contact points between the component 191 and the conductor layer 192 can be made parallel to the virtual line 199. Even when the component mounting board 109 is bent in the longitudinal direction, the component 191 is less likely to fall off.

Further, the insulation gap 193 may be formed not only by a straight line but also by a curved line.

Further, in the first embodiment, the image display device 10 is provided as a device for displaying a still image and a moving image in the image display device 10. However, the configuration of the image display device 10 may be applied to, for example, a monitor display for a personal computer, a mobile terminal such as a tablet terminal or a smartphone, and the like.

Further, in the first embodiment, each of the bezel 120 and the mold frame 130 uses a resin such as PC. However, a metal such as SUS may be used as the material. When metal is used for the four side portions (straight portions) of the mold frame 130, it is better to form the four corner portions with resin.

Further, as shown in FIG. 14, the slit 150 may be provided in a median strip 194 or the like in which the conductor layer 192 does not exist. Further, the slit 150 may be arranged so as to straddle the insulating gap 193.

Further, as shown in FIG. 15, the slit 150 may be provided so as to intersect (orthogonally) the insulating gap 193 straddling the component 191.

Further, in the first embodiment and the second embodiment, the configuration of the insulation gap 193 as narrow as possible over the entire width of the conductor layer 192 is adopted. However, as shown in FIG. 16, some gaps may be widened. Specifically, in FIG. 16, the insulation gap 193 includes a first insulation gap portion 193a in the vicinity of the component 191 and a second insulation gap portion 193b extending from the first insulation gap portion 193a to the end portion of the conductor layer 192. And have. The first insulation gap portion 193a has a width of about several hundred μm, and the second insulation gap portion 193b has a width of about several mm, as in the first and second embodiments. ..

With the above configuration, even if the base film 190 is blackened by heat generated from the component 191 but the heat is not locally concentrated by the second insulating gap portion 193b, the expansion of the blackening is suppressed. Further, it is more effective to provide the through hole 152 in the second insulating gap portion 193b.

The present disclosure is applicable to, for example, a television receiver, a monitor display, a digital signage, a tablet terminal, a smartphone, a table type display device, or the like.

10 Image display device 100 Liquid crystal module 102 Display panel 103 Back cover 105 Optical sheet unit 106 Diffuse plate 107 Brightness uniform plate 108 Reflective sheet 109 Parts mounting board 110 Relay sheet 112 Support pin 120 Bezel 130 Mold frame 140 Base plate 150 Slit 152 Through hole 181 Negative electrode 182 Positive electrode 183 Active part 184 Bridge part 189 Package 190 Base film 191 Parts 192 Conductor layer 193 Insulation gap 193a First insulation gap part 193b Second insulation gap part 194 Separation zone 195 Intersection 196 Recess 197 Handa 199 Virtual Wire 200 Stand 210 Metal Pin

Claims (13)

An image display device including a display panel for displaying an image and a component mounting board in which a component that is a light source that illuminates the display panel from the back side is connected to a conductor layer.
The parts are
The positive electrode and the negative electrode, which are electrodes connected to the conductor layer by solder,
Equipped with an exposed live part,
The conductor layer is
An insulating gap arranged between the positive electrode and the negative electrode,
An image display device including a recess, which is a recess located on the side of the electrode of the component connected across the insulation gap and in the vicinity of the exposed portion of the active portion. The image display device according to claim 1, wherein the recess penetrates the conductor layer in the thickness direction. The image display device according to claim 1 or 2, wherein the recess is groove-shaped, and the width of the recess is narrower than the insulation gap. The image display device according to claim 3, wherein the recess extends in a direction intersecting the alignment direction of the positive electrode and the negative electrode. The component mounting board is
Equipped with a long plate-like flexible substrate,
The insulation gap is
The image display according to any one of claims 1 to 4, further comprising an intersection extending in an intersecting state with respect to a virtual line that virtually connects one end to the other end in the lateral direction of the component mounting board. apparatus. The component mounting board is
The image display device according to any one of claims 1 to 5, further comprising a substrate having a slit penetrating in the thickness direction together with the conductor layer at a position farther than the recess with respect to the component. The image display device according to claim 6, wherein the slit extends along the insulating gap and is longer than the recess. The image display device according to claim 6 or 7, wherein the slits are provided at two locations with the component in between. The image display device according to any one of claims 1 to 8, wherein the insulation gap includes a first insulation gap portion and a second insulation gap portion wider than the first insulation gap portion. The image display device according to claim 9, further comprising a through hole in the region of the component mounting substrate on which the second insulation gap is arranged. A method of manufacturing an image display device including a display panel for displaying an image and a component mounting substrate in which a component that is a light source that illuminates the display panel from the back side is connected to a conductor layer.
The component includes a positive electrode and a negative electrode, which are electrodes connected to the conductor layer by solder, and an exposed live part.
It is located on the side of the positive electrode, the insulating gap arranged between the negative electrodes, and the electrode of the component connected across the insulating gap, and in the vicinity of the exposed portion of the active part. A recess, which is a recess, is formed in the conductor layer by etching at the same time.
A method for manufacturing an image display device that guides excess solder into the recess when the electrode and the conductor layer are connected by solder. A component mounting board in which components are connected to a conductor layer.
The parts are
The positive electrode and the negative electrode, which are electrodes connected to the conductor layer by solder,
Equipped with an exposed live part,
The conductor layer is
An insulating gap arranged between the positive electrode and the negative electrode,
A component mounting substrate including a recess, which is a recess located on the side of the electrode of the component connected across the insulation gap and in the vicinity of the exposed portion of the active portion. The component mounting substrate according to claim 12, further comprising a substrate having a slit penetrating in the thickness direction together with the conductor layer at a distance farther than the recess with respect to the component.

Images