JPWO2018088511A1 - Release agent for cured product of curable resin, swelling agent for cured product of curable resin, and volume reducer for cured foam of curable resin - Google Patents

Abstract

The present invention is a release agent and swelling agent for a cured product of a curable resin excellent in safety, and a volume reducing agent for a cured foam of a curable resin excellent in safety. CH3) 2 (wherein R1 is an alkyl group having 1 to 4 carbon atoms), and the cured product of the curable resin is removed from the solid substrate to which the cured product of the curable resin is attached. The present invention relates to a release agent for removal, a swelling agent for a cured product of a curable resin, and a volume reducing agent for a cured foam of a curable resin.

Description

  The present invention relates to a release agent for a cured product of a curable resin, a swelling agent for a cured product of a curable resin, and a volume reducing agent for a cured foam of a curable resin.

  In recent years, a wide variety of products combining curable resins with metals, ceramics, and the like have been put on the market. Among them, curable resins such as urethane resins and epoxy resins are widely used in industrial fields such as adhesives, paints, sealing materials for electronic parts, and automobile parts. In addition, a wide variety of industrial products that use adhesives, which are curable resins, have been put on the market. Similarly, it is difficult to reuse processed products that use adhesives, resulting in enormous costs. Was.

  Patent Document 1 proposes a nitrogen-containing heterocyclic amide compound such as N-methyl-2-pyrrolidone (NMP) as a solvent used in a cleaning agent for a cured product obtained by curing a thermoplastic resin such as polyester. Patent Document 2 proposes an α-hydroxyisobutyric acid ester such as methyl 2-hydroxyisobutyrate as a solvent used in the epoxy resin solubilizer. Moreover, the solvent which can melt | dissolve all or one part of the hardened | cured material of curable resin can be used as a volume reducing agent of the hardened | cured material of curable resin (for example, refer patent document 3).

JP 2007-32153 A JP 2001-30882 A JP 2000-169624 A

  NMP described in Patent Document 1 is highly toxic to humans because of the high dissolving power of a cured product of a curable resin. Therefore, NMP falls under the category of priority chemical substances in the “Law Concerning the Examination and Regulation of Chemical Substances” (Chemical Substances Control Law) and falls under the name notification of the Occupational Safety and Health Act from March 1, 2017. Applicable to volatile organic compounds (VOC) in the Air Pollution Control Act. Further, according to the knowledge of the inventors, methyl 2-hydroxyisobutyrate described in Patent Document 2 has an extremely low peelability from a cured product of a curable resin such as an epoxy resin. Therefore, there has been a demand for a release agent that has high releasability from a cured product of a curable resin, has low toxicity and is excellent in safety, and a volume reducing agent for a cured foam of a curable resin using the same.

  An object of the present invention is to provide a release agent and a swelling agent for a cured product of a curable resin excellent in safety, and a volume reducing agent for a cured foam of a curable resin excellent in safety.

  The inventors of the present invention have a specific amide compound and a specific composition containing the amide compound that are excellent in safety, and have a curable resin peelable and swellable, and a curable resin cured foam. Was found to have a high volume-reducing property, leading to the present invention. The present invention has the following configuration.

[1] A release agent for removing the cured product of the curable resin from the solid substrate to which the cured product of the curable resin containing the amide compound (A) represented by the general formula (1) is attached.
^{_{R 1 O-CH 2 CH 2}} CON (CH 3) 2 (1)
[Wherein R ¹ is an alkyl group having 1 to 4 carbon atoms]
[2] The release agent according to [1], comprising the amide compound (A).
[3] The stripping agent according to [1], further comprising at least one organic compound (B) selected from the group consisting of ester compounds, glycol ether compounds, amine compounds and halogenated hydrocarbon compounds.
[4] Any of [1] to [3], wherein the amide compound (A) is at least one of 3-methoxy-N, N-dimethylpropanamide and 3-butoxy-N, N-dimethylpropanamide. Release agent.
[5] The stripping agent according to [3] or [4], wherein the ester compound is at least one of an ester compound having two carbonyl groups and a cyclic ester.
[6] The release agent according to any one of [3] to [5], wherein the component (B) is less than 90 parts by weight relative to 100 parts by weight of the total of the component (A) and the component (B).
[7] Further, silica (C) is contained, and the content of the silica (C) is 3.5 to 23 parts by weight with respect to 100 parts by weight in total of the amide compound (A) and the silica (C). The release agent according to any one of [1] and [3] to [6].
[8] The release agent according to any one of [1] and [3] to [7], further comprising silica (C) and having a viscosity at 20 ° C. of 12 to 2,000,000 mPa · s.
[9] The release agent according to any one of [1] to [8], wherein the curable resin is a urethane resin.
[10] Peeling of any one of [1] to [9] for separating the two or more substrates from an adhesive body in which the two or more substrates are bonded via a cured product of a curable resin Agent.
[11] A volume reducing agent for a cured foam of a curable resin, comprising the amide compound (A) represented by the general formula (1).
^{_{R 1 O-CH 2 CH 2}} CON (CH 3) 2 (1)
[Wherein R ¹ is an alkyl group having 1 to 4 carbon atoms]
[12] A swelling agent for a cured product of a curable resin containing the amide compound (A) represented by the general formula (1).
^{_{R 1 O-CH 2 CH 2}} CON (CH 3) 2 (1)
[Wherein R ¹ is an alkyl group having 1 to 4 carbon atoms]

  The present invention provides a release agent and a swelling agent for a cured product of a curable resin excellent in safety, and a volume reducing agent for a cured foam of a curable resin excellent in safety.

[paint remover]
The release agent contains an amide compound represented by the general formula (1).
^{_{R 1 O-CH 2 CH 2}} CON (CH 3) 2 (1)
[Wherein R ¹ is an alkyl group having 1 to 4 carbon atoms]

  The release agent is used for removing the cured product of the curable resin from the solid substrate to which the cured product of the curable resin is attached. The phenomenon that the cured product of the curable resin attached to the solid substrate is removed by the release agent is considered to be as follows. That is, when the cured product of the curable resin comes into contact with the release agent, all or one of the cured product of the curable resin at the surface of the cured product of the curable resin and / or the interface between the solid substrate and the cured product of the curable resin. The part is considered to be removed by dissolving and / or swelling to soften and reducing the adhesion between the solid substrate and the cured product of the curable resin. In addition, when the cured product of the curable resin is removed by peeling from the interface between the solid substrate and the cured product of the curable resin, the cured product of the curable resin may maintain its shape, A part thereof may be dissolved and / or swollen.

(A) Amide compound represented by the general formula (1) The amide compound represented by the general formula (1) (hereinafter also referred to as “component (A)”) is the Chemical Substances Control Law, Industrial Safety and Health Act, and air pollution. Not applicable to the regulation of the Prevention Law (hereinafter referred to as “Chemical Substance Control Law”). Therefore, the release agent containing the amide compound represented by the general formula (1) has low toxicity and is excellent in safety.

The alkyl group of R ¹ is linear or branched, and includes a methyl group, an ethyl group, a propyl group, an i-propyl group, an n-butyl group, an i-butyl group, a sec-butyl group, and a tert-butyl group. It is done.

  The amide compound represented by the general formula (1) is at least one of 3-methoxy-N, N-dimethylpropanamide and 3-butoxy-N, N-dimethylpropanamide from the viewpoint of easy availability. preferable. The 3-butoxy-N, N-dimethylpropanamide is preferably 3-n-butoxy-N, N-dimethylpropanamide. In addition, the amide compound represented by the general formula (1) is particularly preferably 3-methoxy-N, N-dimethylpropanamide from the viewpoint of further improving the peelability of the curable resin from the cured product.

  The amide compound represented by the general formula (1) may be one type or a combination of two or more types. When the amide compound represented by the general formula (1) is a combination of two or more, it is preferable to include 3-methoxy-N, N-dimethylpropanamide. A commercial item can be used for the amide compound represented by General formula (1).

(B) Organic compound In addition to component (A), the release agent of the present invention comprises at least one organic compound selected from the group consisting of ester compounds, glycol ether compounds, amine compounds and halogenated hydrocarbon compounds. (Hereinafter also referred to as “component (B)”).

  As the ester compound, an ester compound having two carbonyl groups and a cyclic ester are preferable from the viewpoint of peelability, and dibasic acid ester, ethyl acetoacetate, and γ-butyrolactone are more preferable. The dibasic acid ester is also referred to as DBE, and is preferably a mixture of aliphatic dibasic acid esters, such as 10 to 30% by weight of dimethyl succinate, 50 to 70% by weight of dimethyl glutarate and 10 to 30% by weight of dimethyl adipate. A mixture is mentioned.

  Examples of the glycol ether compound include mono- or polyethylene glycol-based ether compounds and mono- or polypropylene glycol-based ether compounds, such as diethylene glycol methyl ether, triethylene glycol methyl ether, diethylene glycol ethyl ether, triethylene glycol ethyl ether, ethylene glycol. Propyl ether, diethylene glycol propyl ether, triethylene glycol propyl ether, ethylene glycol butyl ether, diethylene glycol butyl ether, triethylene glycol butyl ether, propylene glycol methyl ether, dipropylene glycol methyl ether, tripropylene glycol methyl ether, propylene glycol ethyl ether Dipropylene glycol ethyl ether, tripropylene glycol ethyl ether, propylene glycol propyl ether, dipropylene glycol propyl ether, tripropylene glycol propyl ether, propylene glycol butyl ether, dipropylene glycol butyl ether, tripropylene glycol butyl ether, propylene glycol diethylene glycol butyl ether, Ethylene glycol dimethyl ether, diethylene glycol dimethyl ether, ethylene glycol diethyl ether, diethylene glycol diethyl ether, triethylene glycol dimethyl ether, diethylene glycol dibutyl ether, dimethoxytetraethylene glycol, dipropylene glycol dimethyl Ether and the like. Among these, from the viewpoint of peelability, mono- or polyethylene glycol ether compounds are preferable, diethylene glycol ether compounds are more preferable, and diethylene glycol diethyl ether and ethylene glycol dimethyl ether are particularly preferable.

  Examples of the amine compounds include primary amines having secondary substituents such as alkyl, alkoxyalkyl, and aromatic, secondary amines and tertiary amines, and heterocyclic amines. Ethanolamine, propylamine, dipropylamine, butylamine, dibutylamine, tributylamine, isobutylamine, diisobutylamine, sec-butylamine, di-sec-butylamine, N-butyldimethylamine, N-methylbutylamine, triisoamylamine, hexyl Amine, N-methylhexylamine, 2-aminooctane, N, N-dimethyl-2-ethylhexylamine, N, N-diisopropyl-2-ethylhexylamine, di-n-octylamine, tri-n-octylamine, N -Methyldi-n Octylamine, 2-ethylhexylamine, dioctylamine, tris (2-ethylhexyl) amine, allylamine, diallylamine, triallylamine, N, N-dimethylallylamine, N, N-diethylallylamine, 3-aminopentane, isoamylamine, N- Ethyl isoamylamine, N-ethylmethylamine, N, N-diethylmethylamine, N-isopropylmethylamine, N-ethylbutylamine, N-tert-butylethylamine, N-isopropyl-2-methyl-2-propanamine, N , N-diisopropylethylamine, 2-[(hydroxymethyl) amino] ethanol, 2,2 ′-[(2-methylpropyl) imino] bisethanol, DL-2-amino-1-propanol, propanolamine, N, N Dimethylpropanolamine, 4-amino-1-butanol, 4-methylaminobutanol, 3-methoxypropylamine, 3-ethoxypropylamine, 3-propoxypropylamine, 3-isopropoxypropylamine, 3-butoxypropylamine, 3 -Isobutoxypropylamine, 3-aminopropyl octyl ether, 3- (dodecyloxy) propylamine, tetradecyl 3-aminopropyl ether, N, N-dimethylethylenediamine, N-ethylethylenediamine, N, N-diethylethylenediamine, N, N-diisopropylethylenediamine, N, N′-dimethylethylenediamine, N, N, N ′, N′-tetramethylethylenediamine, N, N, N ′, N′-tetraethylethylenediamine, 1,2-diamino Propane, 1,3-diaminopropane, 3-methylaminopropylamine, N, N-dimethyl-1,3-propanediamine, 3-diethylaminopropylamine, N, N-dibutyltrimethylenediamine, N, N, N ′ , N′-tetramethyl-1,3-diaminopropane, N- (2-hydroxyethyl) -1,3-propanediamine, 1,2-butanediamine, 1,4-diaminobutane, N, N, N ′ , N′-tetramethyl-1,6-diaminohexane, N, N′-di-tert-butylethylenediamine, 3,3′-diaminodipropylamine, N- (3-aminopropyl) -N-methyl-1 , 3-propanediamine, piperidine, 2-methylpiperidine, 4-methylpiperidine, 2,6-dimethylpiperidine, 3,5-dimethylpiperidine 1-methyl-2-piperidinemethanol, 1-methyl-3-piperidinemethanol, 4-piperidinemethanol, isonipecotic acid, methyl isonipecotate, 2-formylquinoline, 1-methylpiperidine, 1-ethylpiperidine, 1-formylpiperidine 2- (aminomethyl) piperidine, 4- (aminomethyl) piperidine, 4- (dimethylamino) piperidine, 1-aminopiperidine, 1-methyl-4-piperidone, 1,3-dimethyl-4-piperidone, 4- Piperidinopiperidine, pyrrolidine, 1-methylpyrrolidine, 1-ethylpyrrolidine, 1-butylpyrrolidine, 1-formylpyrrolidine, 3-pyrrolidinol, 1-methyl-3-pyrrolidinol, 1-benzyl-3-pyrrolidone, 1-benzyl -3-pyrrolidinol, Imidazole, pyrimidine, 2-methylpyrimidine, 1-methylpiperazine, N, N′-dimethylpiperazine, benzylamine, N-methylbenzylamine, 2-phenylethylamine, 1,4-bis (3-aminopropyl) Examples include piperazine and 1-methylhomopiperazine. Among these, from the viewpoint of peelability, a secondary amine is preferable, a secondary aromatic amine is more preferable, and dibenzylamine is particularly preferable.

  As the halogenated hydrocarbon compound, from the viewpoint of releasability, a compound in which a hydrocarbon having 3 to 5 carbon atoms is substituted with halogen is preferable, 1-bromopropane and 2-bromopropane are more preferable, and 1-bromo is particularly preferable. Propane is preferred.

  These organic compounds have good compatibility with the component (A). Moreover, since the ignition point is high, the safety of the component (A) having a low ignition point can be enhanced.

  Among the organic compounds, ester compounds are also used as a viscosity reducing agent for urethane resins, and therefore are considered to affect the swelling and the like of urethane resins. Therefore, it is preferable to use ester compounds. It is particularly preferred to use an ester. Moreover, since both the component (A) and the amine compound are bases, it is considered that a synergistic effect can be achieved. Therefore, it is preferable to use an amine compound.

(C) Silica The release agent of the present invention preferably contains silica (hereinafter also referred to as “component (C)”) in addition to the component (A).

Silica is not particularly limited as long as it is usually used as a thickener. The specific surface area of the silica by the BET method is not particularly limited, and can be 150 to 250 m ² / g. The silica is preferably hydrophobic silica that has been subjected to a hydrophobic treatment with a surface treatment agent. Examples of commercially available silica include AEROSIL RY 200, AEROSIL RX 200, AEROSIL R 202, and AEROSIL R 208 (all manufactured by Nippon Aerosil Co., Ltd.). Silica may be one kind or a combination of two or more kinds.

  Component (C) is a component that increases the viscosity of the release agent. This makes it easier for the release agent to stay on the solid substrate to which the cured product of the curable resin has adhered, and has a peeling effect on the solid substrate to which the cured product of the curable resin that cannot be immersed in the release agent has adhered. Increases efficiently. Moreover, since the release agent containing the component (C) can be used even on a solid substrate that cannot be immersed, it adheres to a structure such as a wall that causes dripping if the liquid has a low viscosity. Efficiently removes the cured product of the curable resin that is attached to the solid substrate with good drainage, such as a finely meshed net that can be passed if the liquid has a low viscosity. Is possible. Moreover, since the release agent tends to stay on the cured product of the curable resin in the object to be peeled, it can exhibit releasability not only to the object to be peeled but also to the peelable object to be dipped.

(Further ingredients)
The release agent can contain further components other than the component (A), the component (B), and the component (C) within a range that does not impair the effects of the present invention, depending on the type of the cured product of the curable resin. . Examples of such components include solvents such as dimethyl sulfoxide and hydrocarbon solvents, and additives such as rust inhibitors, surfactants, ultraviolet absorbers, antioxidants, and thickeners other than silica. These specific examples are known to those skilled in the art as additives for release agents, and commercially available products can be used.

  The release agent containing the component (C) may contain a thickener other than silica (hereinafter also referred to as “component (D)”). Examples of the component (D) include sepiolite, bentonite, montmorillonite, thickening polysaccharide, cellulosic thickener, polyacrylic acid, polyacrylic acid ester, and alkyl amide.

(Composition of release agent)
In the release agent, the content of the amide compound represented by the general formula (1) is more than 10% by weight, 20% by weight or more, 30% by weight or more, 50% by weight or more, 70% by weight or more, 80% by weight or more. It is so preferable that it increases in order, More preferably, it is 90 weight% or more, Especially preferably, it is 100 weight%. If it is such a range, the peelability with respect to the hardened | cured material of curable resin will become higher.

  When the release agent contains the component (A) and the component (B), the component (B) is preferably less than 90 parts by weight with respect to 100 parts by weight of the total of the component (A) and the component (B). 70 parts by weight or less is more preferable, 50 parts by weight or less is more preferable, and 30 parts by weight or less is particularly preferable. If it is such a range, the peelability with respect to the hardened | cured material of curable resin can fully be exhibited.

  When the release agent contains the component (C), the component (C) is preferably 3.5 to 23 parts by weight with respect to 100 parts by weight in total of the component (A) and the component (C). It is particularly preferably 10 to 10 parts by weight. If it is such a range, the peelability with respect to the hardened | cured material of curable resin can fully be exhibited. When the component (C) is 3.5 parts by weight or more with respect to 100 parts by weight of the total of the component (A) and the component (C), the viscosity of the release agent increases, and the release effect is more excellent. Further, when the component (C) is 23 parts by weight or less with respect to 100 parts by weight of the total of the component (A) and the component (C), the adhesion of the first release agent to the object to be peeled increases, and the peeling effect Better.

  When the release agent contains the component (C), the total content of the component (A) and the component (C) in the release agent is preferably 80% by weight or more, and more preferably 90% by weight or more. Preferably, it is more preferably 95% by weight or more, and particularly preferably 100% by weight. If it is such a range, the peelability with respect to the hardened | cured material of curable resin will become higher.

  When the release agent contains the component (C) and the component (D), the content of the component (D) in the release agent is preferably 10% by weight or less in the release agent, and preferably 5% by weight or less. Is more preferable, and it is particularly preferably 1% by weight or less. The content of component (C) with respect to 100 parts by weight of component (C) and component (D) is preferably 60 parts by weight or more, more preferably 80 parts by weight or more, and 100 parts by weight. It is particularly preferred that

  The release agent comprises a release agent comprising component (A), a release agent containing components (A) and (B), a release agent containing component (A) and no component (C), and components (A) and (B). ) And a release agent containing no component (C) or a release agent containing components (A) and (C). Here, the release agent composed of the component (A) is 100% by weight of the release agent of the component (A), or in addition to the component (A), the rust preventive agent, surfactant, ultraviolet absorber and antioxidant. It means a release agent containing only additives such as.

<Viscosity>
When the release agent contains the component (C), the viscosity of the release agent at 20 ° C. is preferably 12 mPa · s or more, more preferably 12 mPa · s to 2,000,000 mPa · s, It is especially preferable that it is -20,000 mPa * s. If it is such a range, the peelability with respect to the hardened | cured material of curable resin can fully be exhibited. When the viscosity is 12 mPa · s or more, the viscosity of the release agent is not too low, and the release effect is excellent even for an object that cannot be immersed. Moreover, although the peeling effect can be maintained when the viscosity is 2,000,000 mPa · s or less, the content of (A) does not become too low with respect to the amount of silica, and the object to be peeled cannot be immersed. Is also superior due to the peeling effect. It is preferable to adjust the contents of the component (A) and the component (C) so as to be in these viscosity ranges.

  In the present specification, the viscosity is a value measured at 20 ° C. using a rotational viscometer (VISCO Cat. No. 6800, manufactured by Atago Co., Ltd.) for a range exceeding 200 mPa · s. The viscosity is a value measured at 20 ° C. using a rotational viscometer (VISCO package B Cat. No. 6811, manufactured by Atago Co., Ltd.) for a range of 200 mPa · s or less. Moreover, the measured value after 30 second passage which started the measurement was used for the viscosity.

(Method for preparing release agent)
As the release agent, an amide compound represented by the general formula (1), which is a raw material component, can be used alone. Moreover, when a release agent contains a component (B), a component (C), and / or the said further component, a release agent is further further contained by the amide compound represented by General formula (1) which is a raw material component, and the case. It can be produced by mixing component (B), component (C) and / or said further components.

(Hardened product of curable resin)
The cured product of the curable resin includes a cured product of the curable resin and a cured product of the curable resin composition including an additive blended with the curable resin. In addition, the cured product of the curable resin volatilizes the additive blended in the curable resin such as a reaction diluent in addition to the cured product that is cured by promoting the curing reaction of the curable resin. Also included are solidified products that have solidified as they rise.

<Curable resin>
Examples of the curable resin include urethane resin, epoxy resin, acrylic resin, and styrene resin, and urethane resin is preferable.

  Examples of the urethane resin include reaction products of diisocyanates such as tolylene diisocyanate (TDI) and diphenylmethane diisocyanate (MDI) and polyols such as polypropylene glycol. When the urethane resin is in the form of a foam, any of a flexible foam, a semi-rigid foam, and a rigid foam may be used. Additives blended in urethane resins include curing agents, curing accelerators, emulsifiers, foaming agents, stabilizers, plasticizers, flame retardants, antistatic agents, colorants, peristaltic modifiers, and impact resistance improvements. Agents.

  Examples of the epoxy resin include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AD type epoxy resin, polyglycidyl ether of polyhydric alcohol, polyglycidyl ester of polybasic acid, 3,4-epoxycyclohexyl-3 ′, 4 Examples include '-epoxycyclohexanecarboxylate, vinylcyclohexene diepoxide, cresol novolac type epoxy resin, and epoxy resin having a hydantoin ring. Additives blended in the epoxy resin include curing agents, curing accelerators, fillers, stabilizers, plasticizers, lubricants, flame retardants, flame retardant aids, antistatic agents, colorants, charge imparting agents, cocoons Examples thereof include additives such as a mobility improver, an impact resistance improver, and a reaction diluent.

  The epoxy resin curing agent may be any one as long as it is usually used as a curing agent for epoxy resins. For example, novolak such as phenol novolak, biphenol type novolak, and bisphenol A type novolak, phthalic anhydride, Examples thereof include acid anhydrides such as pyromellitic anhydride and benzophenone tetracarboxylic anhydride, amines such as diaminodiphenylmethane, diaminodiphenylsulfone, metaphenylenediamine, and hexamethylenetetramine, and amide resins such as polyamideamine. Examples of the curing accelerator include tertiary amines or organic phosphorus compounds.

  As an acrylic resin, the compound which has an acryloyl group and / or a methacryloyl group is mentioned, Specifically, methyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, etc. are mentioned. Here, (meth) acrylate means at least one of acrylate and methacrylate. Additives blended in the acrylic resin include curing agents, curing accelerators, fillers, stabilizers, plasticizers, lubricants, flame retardants, flame retardant aids, antistatic agents, colorants, charge imparting agents, cocoons Examples thereof include additives such as a mobility improver, an impact resistance improver, and a reaction diluent.

  The styrene resin is a polymer having styrene as a monomer, and the cured product is also called polystyrene. When the polystyrene resin is in the form of a foam, the cured foam of the polystyrene resin is also called a foamed polystyrene. Additives blended in styrene resin include foaming agents, curing agents, curing accelerators, fillers, stabilizers, plasticizers, lubricants, flame retardants, flame retardant aids, antistatic agents, colorants, and charging properties. And additives such as agents, peristaltic modifiers, impact modifiers, and reaction diluents.

(Solid substrate)
Examples of solid substrates include organic substrates, inorganic substrates, and combinations thereof, such as metals (eg, copper, iron, stainless steel, aluminum, etc.), glass, ceramics (eg, tiles, bricks, stones, etc.) ), Plastic (for example, a silicone substrate) or a combination thereof.

  Equipment used for handling curable resins, for example, containers, mixers, molding machines, storage tanks, processing machines, mixing tanks, casting machines, curable resin discharge processing equipment, injection machines, curable resin application Apparatus and sealing machine; and curable resin workpieces, such as urethane resin workpieces (for example, automobile parts, electronic parts and electric wires), acrylic resin workpieces (for example, electronic parts, piping parts, automobile parts, optical parts) Etc.) and processed products of epoxy resin (for example, electronic parts, piping parts, automobile parts, etc.).

  For curable resin processed products, such as urethane resin processed products, acrylic resin processed products, and epoxy resin processed products, materials other than the urethane resin, acrylic resin, and epoxy resin used in the molding of the processed products are reused. The thing used for the purpose of utilization is included. Examples of the material include a base material in an adhesive body in which two or more base materials are bonded via a cured product of a curable resin. Specifically, when defects occur in these urethane resin processed products, acrylic resin processed products, and epoxy resin processed products, materials other than urethane resins, acrylic resins, and epoxy resins can be used as hardened urethane resins, acrylic resins. It is separated from the cured product of the resin and the cured product of the epoxy resin and reused again by the cured product of the curable resin.

  The cured product of the curable resin may be attached to a further solid substrate. In this case, there is an adhesive body in which a solid substrate is bonded to two or more substrates through a cured product of a curable resin. In this case, the release agent can be used to separate the two or more substrates from an adhesive body in which the two or more substrates are bonded via a cured product of a curable resin. The phenomenon in which the adhesive is separated into two or more substrates by the release agent is that when the release agent and the adhesive are in contact, the surface of the cured product of the curable resin and / or the cured product of the substrate and the curable resin It is considered that all or part of the cured product of the curable resin is softened by dissolution and / or swelling at the interface, and the adhesion between two or more substrates is reduced. Here, what is necessary is just to isolate | separate an adhesive body into two or more base materials with a peeling agent, and the hardened | cured material of curable resin may adhere to the separated at least one base material. Further, the cured product of the curable resin attached to at least one of the separated substrates may maintain its shape, and a part thereof may be dissolved and / or swollen. The cured product of the curable resin adhering to the separated at least one substrate can be removed from the substrate by further contacting with a release agent.

  The release agent is a cured product of a curable resin composed of the amide compound (A) represented by the general formula (1), or composed of the amide compound (A) and the organic compound (B) represented by the general formula (1). A release agent for removing the cured product of the curable resin from the solid substrate to which the resin adheres; and an amide compound represented by the general formula (1) or represented by the general formula (1) A release agent for separating the two or more base materials from an adhesive body in which the two or more base materials are bonded together through a cured product of the curable resin composed of (A) and the organic compound (B) is particularly preferable. . As the release agent, a release agent for removing a cured product of the curable resin containing the amide compound (A) and the silica (C) represented by the general formula (1) is also preferable.

(How to use release agent)
The method for removing the cured product of the curable resin from the solid substrate to which the cured product of the curable resin is attached includes a step of bringing a release agent into contact with the solid substrate. In the present invention, in the step of bringing the release agent into contact with the substrate, the cured product of the curable resin attached to the solid substrate is removed from the solid substrate.

  A method for separating two or more base materials from an adhesive body in which two or more base materials are bonded via a cured product of a curable resin includes a step of bringing the adhesive body and a release agent into contact with each other. In the present invention, in the step of contacting the adhesive and the release agent, the adhesive is separated into two or more substrates. In addition, when the hardened | cured material of curable resin has adhered to the isolate | separated base material, Furthermore, by the method of removing the hardened | cured material of curable resin from the solid base material to which the hardened | cured material of the said curable resin adhered. The cured product of the curable resin may be removed.

  As a method for bringing the release agent into contact with a solid substrate to which a cured product of a curable resin is attached, or an adhesive body in which two or more substrates are bonded via a cured product of a curable resin, There is no restriction | limiting in particular, Immersion, spraying, etc. are mentioned. Moreover, in the method by immersion, in order to enhance the removal effect, means such as stirring, rocking, ultrasonic vibration, air bubbling or the like may be combined simultaneously with immersion. In order to promote the removal of the cured product of the curable resin from the solid substrate, the cured product of the curable resin and the solid group may be used simultaneously with and / or after the contact between the release agent and the cured product of the curable resin. A physical force such as putting a spatula at the interface with the material may be applied, and the cured product of the swelled curable resin may be removed by wiping. If the solid substrate to which the cured product of the curable resin has adhered cannot be immersed, the curing of the curable resin from the solid substrate to which the cured product of the curable resin has adhered can be performed by continuously spraying a release agent. Things can be removed. Moreover, when the adhesive body by which two or more base materials were bonded together through the hardened | cured material of curable resin cannot be immersed, it is 2 through the hardened | cured material of curable resin by spraying a release agent continuously. The two or more substrates can be separated from the bonded body on which the above substrates are bonded.

  The contact time between the release agent and the solid substrate to which the cured product of the curable resin is adhered, or the bonded body in which two or more substrates are bonded via the cured product of the curable resin, is a desired effect ( The cured product of the curable resin attached to the solid substrate is removed, or the substrate can be separated from the adhesive), and the time is not particularly limited. The contact time is preferably 1 minute to 10 hours, and particularly preferably 30 minutes to 2 hours. When the time is within the above range, the cured curable resin can be sufficiently removed from the solid substrate.

  The temperature of the release agent when the release agent is brought into contact with the solid substrate to which the cured product of the curable resin is attached or the bonded body in which two or more substrates are bonded via the cured product of the curable resin. Is preferably 5 to 120 ° C, more preferably 20 to 100 ° C.

[Volume reducing agent for curable resin cured foam]
A volume reducing agent contains the amide compound (A) represented by General formula (1). The volume reducing agent is used to reduce the volume of a cured product of a curable resin in the form of a foam, that is, a cured foam. Here, volume reduction means that a part of the cured foam of the curable resin is dissolved and / or swelled, so that the shape cannot be maintained, and the volume of the cured foam is reduced. In the present invention, since the release agent can dissolve and / or swell all or part of the cured product of the curable resin, the solvent composition containing the amide compound represented by the general formula (1) is a curable resin. It can be used as a volume reducing agent for cured foams. When the amount of the cured foam to be dissolved exceeds the saturated dissolution amount of the cured foam volume reducing agent of the curable resin, a part of the cured foam may remain undissolved.

  The amide compound represented by the general formula (1) used for the volume reducing agent is as described above for the release agent, including the preferred range. The volume reducing agent may comprise the component (B), component (C) and the further component described above in the release agent. The composition of the volume reducing agent is the same as the composition of the release agent, including the preferred range.

  Examples of the cured foam of the curable resin include a cured foam of a urethane resin and a cured foam of a styrene resin, and a cured foam of a urethane resin (also referred to as a polyurethane foam) is preferable. About the hardening foam of urethane resin and the hardening foam of styrene resin, the additive mentioned above may be included in urethane resin and styrene resin.

  Accordingly, the volume reducing agent is a curable resin cured foam comprising the amide compound represented by the general formula (1), or comprising the amide compound (A) and the organic compound (B) represented by the general formula (1). A urethane resin cured foam comprising the amide compound represented by the general formula (1), or comprising the amide compound (A) and the organic compound (B) represented by the general formula (1) And / or a styrene resin cured foam volume reducing agent is particularly preferred.

(How to use volume reducer)
A method of reducing the volume of a curable resin-cured foam using a volume-reducing agent includes contacting the volume-reducing agent with a curable resin-cured foam. When the volume reducing agent comes into contact with the cured foam of the curable resin, all or a part of the cured foam of the curable resin is dissolved and / or swelled, and the cured foam of the curable resin is reduced in volume. The conditions for bringing the volume reducing agent into contact with the cured foam include the conditions described above in the method of using the release agent.

[Swelling agent of cured product of curable resin]
A swelling agent contains the amide compound (A) represented by General formula (1). In the present invention, since the release agent can swell all or part of the cured product of the curable resin, the solvent composition containing the amide compound represented by the general formula (1) can swell the cured product of the curable resin. It can be used as an agent.

  The amide compound represented by the general formula (1) used for the swelling agent is as described above for the release agent, including a preferred range. The swelling agent can comprise the component (B), component (C) and the further component described above in the release agent. The composition of the swelling agent is the same as the composition of the release agent, including a preferred range.

(How to use swelling agent)
The method of swelling the cured product of the curable resin using the swelling agent includes a step of bringing the swelling agent into contact with the cured product of the curable resin. When the swelling agent comes into contact with the cured product of the curable resin, all or part of the cured product of the curable resin swells, and thereby the cured product of the curable resin can be softened. For example, when the hardened | cured material of curable resin has adhered to the solid base material, all or one part of hardened | cured material can be swollen and softened by using a swelling agent. Thereby, the hardened | cured material of curable resin can be removed from a base material by reducing the adhesive force of the hardened | cured material of curable resin, and a base material. In addition, since the swelling agent can swell all or part of the cured product of the curable resin, the swelling agent is applied to a molded product composed only of the cured product of the curable resin, and only a part thereof is swollen. Can also be removed. The conditions for bringing the swelling agent and the cured product of the curable resin into contact with each other include the conditions described above in the method of using the release agent.

(About further specific aspects)
In the volume reducing agent, the component (B) is a dibasic acid ester, and the release agent separates the two or more substrates from the bonded body in which two or more substrates are bonded via a cured epoxy resin. When used in the method for the above, the content of the dibasic acid ester as the component (B) is 90% by weight of the component (B) with respect to 100 parts by weight of the total of the component (A) and the component (B). The amount is preferably less than 70 parts by weight, more preferably 70 parts by weight or less, still more preferably 50 parts by weight or less, and particularly preferably 30 parts by weight or less.

  In the release agent, when the component (B) is a dibasic acid ester and the cured foam of the curable resin is a urethane resin cured foam, the content of the dibasic acid ester as the component (B) Component (B) is preferably less than 90 parts by weight, more preferably 70 parts by weight or less, still more preferably 50 parts by weight or less, and 30 parts by weight with respect to 100 parts by weight of the total of (A) and component (B). Part or less is particularly preferable.

  EXAMPLES Hereinafter, although an Example and a comparative example demonstrate this invention further in detail, this invention is not limited by these Examples. The spatula used in Test Examples 1 to 5 is an accessory of Cemedine Super (manufactured by Cemedine Co., Ltd.). Commercially available products were used as they were for the amide compounds and the like used in the solvent compositions of Examples and Comparative Examples. The solvent composition of an Example and a comparative example prepared the solvent composition of 100g by mixing each component with the composition shown by Tables 2-11. In addition, the quantity of each component in Tables 2-11 is a weight part. Moreover, since the solvent composition of an Example does not contain components other than the component as described in a table | surface, the quantity of each component in Tables 2-11 is also a weight%.

[Test Example 1: Swelling and removal of cured urethane resin]
(Production of solid substrate with cured urethane resin)
An optical SUS430 plate was cut into 10 mm × 40 mm × thickness 0.5 mm, dipped in 1-bromopropane for 1 hour for degreasing and then taken out and dried for 1 hour. A urethane adhesive (Henkel's Loctite Super Clear DSC-050) is hung on the surface of the plate so as to be about 10 mm × 30 mm, and is cured to obtain a test piece 1 (a solid substrate to which a cured product of urethane resin is adhered). Material). Furthermore, what was left to stand for 2 days was used. The cured product of the urethane resin was white.
(Swelling and removal test)
20 g of the solvent composition was placed in a PP cup (Asahi Kasei Packs Co., Ltd., 230 ml). Then, the test piece 1 was put and it was left to stand at room temperature (25 degreeC) for 1 hour. The test piece 1 was taken out and evaluated according to the following criteria.
<Evaluation of Examples 1 and 2 and Comparative Examples 1 and 2>
A: The cured product of the urethane resin was adhered to the substrate, but it was swollen and transparent, and the cured product of the urethane resin could be removed by wiping with a tissue.
○: The cured urethane resin was adhered to the base material while maintaining its shape, and when the spatula was inserted at the interface between the base material and the cured urethane resin, the cured urethane resin could be peeled off. Further, when the cured cured product of the urethane resin was wiped with a tissue, the swollen cured product of the urethane resin adhered to the tissue.
×: The cured urethane resin is adhered to the base material while maintaining its shape, and even when the spatula is put on the interface between the base material and the cured urethane resin, the urethane resin is cured. Things could not be peeled off. Further, when the cured urethane resin was wiped with a tissue, the swollen cured urethane resin was not attached to the tissue.
<Evaluation of Examples 3-27 and Comparative Examples 3-7>
A: The cured product of the urethane resin was adhered to the substrate, but it was swollen and transparent, and all the cured product of the urethane resin could be removed by wiping with a tissue.
○: The cured product of the urethane resin was adhered to the base material, and most of the cured product was swollen and transparent, but some white portions remained. The cured urethane resin was wiped with a tissue.
(Triangle | delta): The hardened | cured material of the urethane resin was adhering to the base material, and one part swelled and became transparent, but many white parts remained. Even when the cured urethane resin was wiped with a tissue, it could not be wiped off.
X: The cured product of the urethane resin was adhered to the substrate while maintaining its shape, and the color remained white and was not swollen. Even when the cured urethane resin was wiped with a tissue, it could not be wiped off.

[Test Example 2: Separation of an adhesive body in which two substrates are bonded via a cured urethane resin]
(Preparation of an adhesive body in which two substrates are bonded via a cured urethane resin)
Two plates were prepared by cutting an optical SUS430 plate into 10 mm × 40 mm × thickness 0.5 mm. The two prepared plates were immersed in 1-bromopropane for 1 hour for degreasing and then taken out and dried for 1 hour. A urethane adhesive (Henkel Loctite Super Clear DSC-050) is hung on the surface of the plate so as to be about 10 mm × 40 mm, the two plates are bonded together, and test piece 2 (2 through the cured urethane resin) An adhesive body in which two base materials were bonded together was obtained. Furthermore, what was left to stand for 2 days was used.
(Separation test)
20 g of the solvent composition was placed in a PP cup (Asahi Kasei Packs Co., Ltd., 230 ml). Then, the test piece 2 was put and it was left to stand at room temperature for 2 hours. The test piece 2 was taken out and evaluated according to the following criteria.
(Circle): When the spatula was put into the interface of a base material and the hardened | cured material of a urethane resin, two board | plates were able to be isolate | separated.
X: Even when a spatula was put in the interface between the base material and the cured product of the urethane resin, the two plates could not be peeled off.

[Test Example 3: Swelling and removal of cured epoxy resin]
(Production of target)
An optical SUS430 plate was cut into 10 mm × 40 mm × thickness 0.5 mm, dipped in 1-bromopropane for 1 hour for degreasing and then taken out and dried for 1 hour. An epoxy adhesive (Araldite ST170 manufactured by Huntsman Japan) was applied to the surface of the SUS plate using a spatula so as to be about 10 mm × 30 mm, and cured to give a specimen 3 (hardened epoxy resin adhered). Substrate). Furthermore, what was left to stand for 2 days was used. The cured epoxy resin is hard and difficult to bend by hand.
(Dissolution test)
20 g of the solvent composition was put into a 100 ml beaker, and the test piece 3 was put. The lid was covered with aluminum foil, and in Examples 21 to 24 and Comparative Example 7, it was left at a liquid temperature of 60 ° C., and in other Examples and Comparative Examples, it was left at a liquid temperature of about 70 ° C. The test piece 3 was taken out every hour until 5 hours passed, and evaluated according to the following criteria, and the time when it became ◎ or ○ was described.
(Double-circle): The hardened | cured material of the epoxy resin was removed from the base material. The cured epoxy resin was swollen in the solvent composition.
○: The cured epoxy resin was kept in shape, and when the spatula was put on the interface between the substrate and the cured epoxy resin, the cured epoxy resin could be peeled off. The cured cured epoxy resin was soft enough to be bent by hand.
X: The cured product of the epoxy resin maintained the shape, and even when a spatula was inserted at the interface between the substrate and the cured product of the epoxy resin, the cured product of the epoxy resin could not be peeled off.

[Test Example 4: Volume reduction of urethane foam]
(Production of urethane resin cured foam)
Urethane foam (manufactured by Henkel, du fi x foamed urethane green foam) was placed in a PP (polypropylene) plastic cup (manufactured by Asahi Kasei Packs Co., Ltd., 230 ml) and allowed to stand for 1 week or longer to cure the urethane resin foam. Furthermore, it was left to stand for 6 months to obtain a urethane resin cured foam. The cured foam of urethane resin was taken out from the plastic cup and cut into ¼ to obtain a test piece 4 of 1 g (± 0.3 g) (size of 3 cm × 3 cm × 4.5 cm).

(Volume reduction test)
A PP plastic cup (Asahi Kasei Packs Co., Ltd., 230 ml) was charged with 20 g of the solvent composition, one test piece 4 was put, covered with a wrap (Riken Fabro Co., Ltd.), and allowed to stand at room temperature. I struck with a glass rod every 0.5 hour to check the condition. The test was terminated by visually confirming that the test piece swelled and became a jelly state. The time until the specimen became jelly was measured. In Tables 3-8, when the test piece is in a jelly state within 6 hours, the time is indicated, and when the test piece is in a jelly state within 6-24 hours, it is marked with * and 24 hours have passed. Even if the test piece did not become a jelly state, it was set as x.
[Test Example 5: Separation of an adhesive body in which two substrates are bonded via a cured epoxy resin]
(Production of an adhesive body in which two substrates are bonded via a cured epoxy resin)
Two plates were prepared by cutting an optical SUS430 plate into 10 mm × 40 mm × thickness 0.5 mm. The two prepared plates were immersed in 1-bromopropane for 1 hour for degreasing and then taken out and dried for 1 hour. An epoxy adhesive (Araldite ST170 manufactured by Huntsman Japan) is hung on the surface of the plate so as to have a size of about 10 mm × 40 mm, and the two plates are bonded to each other. An adhesive body on which a base material was bonded was obtained. Furthermore, what was left to stand for 2 days was used.
(Separation test)
20 g of the solvent composition was put into a 100 ml beaker, and the test piece 5 was put. The lid was covered with aluminum foil, and in Examples 21 to 24 and Comparative Example 7, it was left at a liquid temperature of 60 ° C., and in other Examples and Comparative Examples, it was left at a liquid temperature of about 70 ° C. The test piece 5 was taken out every hour until 5 hours passed, and evaluated according to the following criteria, and the time when it became ◎ or ○ was described.
(Double-circle): The base material and the hardened | cured material of the epoxy resin separated even if it did not put a spatula in an interface.
(Circle): When the spatula was put in the interface of a base material and the hardened | cured material of an epoxy resin, two board | plates were able to be isolate | separated.
X: Even when a spatula was put in the interface between the base material and the cured epoxy resin, the two plates could not be peeled off.

[Test Example 6: Removal of urethane resin coating from copper wire]
A test piece 6 obtained by cutting a copper wire coated with a cured urethane resin (magnet wire manufactured by Kashiwa Denki Co., Ltd., red of UEW 0.30MM color 300G (2 types), diameter 0.30 mm) into 80 mm is used. A solid substrate to which a cured product of a urethane resin was attached.

(Swelling and removal test)
10 g of the solvent composition was placed in a standard bottle (37.5 ml of wide mouth No. 4 manufactured by ASONE). Thereafter, the test piece 6 was put so that the tip 40 mm was in contact with the solvent composition, and left at room temperature (25 ° C.) for 0.5 hour. The test piece 6 was taken out and evaluated according to the following criteria.
(Double-circle): All the coating of the hardened | cured material of the urethane resin which was in contact with the solvent composition was removed.
○: A part of the coating of the cured urethane resin that had been in contact with the solvent composition was removed.
X: The coating of the cured product of the urethane resin that had been in contact with the solvent composition could not be removed. Further, even when the tissue was wiped with a tissue, the coating of the cured urethane resin that had been in contact with the solvent composition could not be removed.

[Test Example 7: Removal of cured urethane resin]
In Test Example 7, the peeling effect of the release agent containing silica on the object to be peeled was tested.

(Measurement of viscosity of release agent)
The viscosity was measured using a rotational viscometer (VISCO Cat. No. 6800, manufactured by Atago Co., Ltd.) at the temperatures and measurement conditions shown in Table 11. In Table 11, “impossible to measure” means that the viscosity of the release agent is more than 2,000,000 mPa · s.

(Production of solid substrate with cured urethane resin)
An optical SUS430 plate was cut into a length of 30 mm, a width of 50 mm and a thickness of 0.5 mm, immersed in 1-bromopropane for 1 hour for degreasing, and then taken out and dried for 1 hour. Test piece 7 (urethane resin) 0.5 g of urethane adhesive (Loctite Super Clear DSC-050 (manufactured by Henkel Japan Co., Ltd.)) was dropped on the surface of the stainless steel plate to be about 10 mm x 30 mm and cured. The solid substrate to which the cured product was attached was obtained. Furthermore, what was left to stand for 2 days was used. The cured product of the urethane resin was white.

(Peel test)
A 0.5 g release agent was applied to the test piece 7 with a spatula portion of a Pasteur pipette and a spatula. A spacer with a split chopstick having a height of 3 mm was placed under one vertical end of the test piece 7 and stood so that the test piece 7 was inclined. That is, the test piece 7 has a gradient with a vertical distance of 3 mm with respect to the hypotenuse distance of 50 mm. After leaving at room temperature (25 ° C.) for 1 hour, the test piece 7 was evaluated according to the following criteria.

<Evaluation of peelability by spatula>
The spatula used was a stainless steel spatula (Daisou Sangyo Co., Ltd., spatula width 25 mm).
○: The cured urethane resin was adhered to the base material while maintaining its shape, and when the spatula was inserted at the interface between the base material and the cured urethane resin, the cured urethane resin could be peeled off.
×: The cured urethane resin is adhered to the base material while maintaining its shape, and even when the spatula is put on the interface between the base material and the cured urethane resin, the urethane resin is cured. Things could not be peeled off.

<Evaluation of peelability by tissue>
As the tissue, Napier tissue 200W (manufactured by Oji Napier Co., Ltd.) was used.
○: The cured product of the urethane resin was adhered to the base material, but it was swollen and transparent, and all the cured product of the urethane resin could be removed by wiping with a tissue folded in 1/8.
X: The cured product of the urethane resin was adhered to the substrate while maintaining its shape, and the color remained white and was not swollen. Even when the cured urethane resin was wiped with a tissue folded in 1/8, it could not be wiped off.

  The results are shown in Tables 1-11.

3-methoxy-N, N-dimethylpropanamide: 3-butoxy-N, N-dimethylpropanamide manufactured by KJ Chemicals Co., Ltd .: N-methyl-2-pyrrolidone manufactured by KJ Chemicals Co., Ltd .: 2-hydroxyisobutyric acid manufactured by BASF Methyl: Mitsubishi Gas Chemical Co., Ltd. dibasic acid ester: Sankyo Chemical Co., Ltd. 23 ester (mixture of 21.6% by weight dimethyl succinate, 59.3% by weight dimethyl glutarate and 18.3% by weight dimethyl adipate)
γ-butyrolactone: diethylene glycol diethyl ether manufactured by BASF: dibenzylamine manufactured by Kanto Chemical Co., Ltd .: ethyl acetoacetate manufactured by Guangei Chemical Co., Ltd .: ethylene glycol dimethyl ether manufactured by Kanto Chemical Co., Ltd .: silica manufactured by Sankyo Chemical Co., Ltd .: AEROSIL RY 200 (Nippon Aerosil Co., Ltd., hydrophobic silica, BET specific surface area 100 ± 20 m ² / g)

The solvents of Examples 1 and 2 do not fall under the Chemical Substances Control Law and the like, and all are release agents, swelling agents and volume reducing agents that are excellent in safety. By comparison between Examples 1 and 2, when the amide compound represented by the general formula (1) is 3-methoxy-N, N-dimethylpropanamide, the peelability and swelling property of the cured product of the curable resin, and The volume reduction of the cured foam of the curable resin was equivalent to that of NMP, and was superior in the peelability and swelling of the cured product of the curable resin and the volume reduction of the cured foam of the curable resin.
Further, according to the results of Test Examples 1 and 3 in Table 1, 3-methoxy-N, N-dimethylpropanamide can swell all the cured products of urethane resin and epoxy resin, and 3-butoxy-N, N-dimethylpropanamide was able to swell all or part of the cured product of urethane resin and epoxy resin. Therefore, the amide compound represented by the general formula (1) is a swelling agent for a cured product of a curable resin excellent in the swellability of the curable resin.
On the other hand, Comparative Example 2 is inferior in peelability and swellability to a cured product of urethane resin and epoxy resin, and when brought into contact with a cured foam of urethane resin, a volume reducer for urethane foam even after 24 hours. Could not be used.
From Tables 2-8, the composition which added dibasic acid ester, diethylene glycol diethyl ether, (gamma) -butyrolactone, dibenzylamine, ethyl acetoacetate, or 1-bromopropane to 3-methoxy-N, N- dimethylpropanamide is It can be seen that the effect of the peelability and swelling of the cured product of the curable resin and the volume reduction of the cured foam of the curable resin are exhibited. In particular, these effects are sufficiently effective when the total of dibasic acid ester, diethylene glycol diethyl ether, γ-butyrolactone, dibenzylamine, ethyl acetoacetate and 1-bromopropane is less than 90 parts by weight. It can be said.
From Table 2, it can be seen that the composition to which the dibasic acid ester is added is an example in which the dibasic acid ester is 30 parts by weight or less, and exhibits good peelability and swelling of the cured product of the curable resin. If the dibasic acid ester is less than 90 parts by weight, it can be seen that the effects of peeling and swelling of the cured product of the curable resin and volume reduction of the cured foam of the curable resin are sufficiently exhibited.
From Table 3, in the composition to which γ-butyrolactone was added, the basicity of 3-methoxy-N, N-dimethylpropanamide and the acidity of γ-butyrolactone did not act strongly unless γ-butyrolactone was near 50 parts by weight. It can be seen that the effects of peeling and swelling of the cured product of the curable resin and volume reduction of the cured foam of the curable resin are sufficiently exhibited. In particular, in Examples where γ-butyrolactone is 10 parts by weight or less, it can be seen that the effect of good peelability and swelling of a cured product of a curable resin and volume reduction of a cured foam of a curable resin are exhibited.
From Table 4, it can be seen that the composition to which diethylene glycol diethyl ether is added exhibits the effects of the peelability and swelling of the cured product of the curable resin and the volume reduction of the cured foam of the curable resin. The composition to which benzylamine is added has good peelability and swellability of the cured product of the curable resin. Further, when dibenzylamine is 20 parts by weight or less, 3-methoxy-N, N-dimethylpropane It can be seen that the effect of volume reduction of the cured foam of the curable resin superior to that of Example 1 of the amide alone is exhibited. Since 3-methoxy-N, N-dimethylpropanamide and dibenzylamine are both bases, it is considered that a synergistic effect can be achieved. From Table 6, the composition to which ethyl acetoacetate was added was an excellent epoxy resin. It turns out that there exists peelability and swelling property.
From Table 7, the composition to which 1-bromopropane was added had the effect of reducing the volume of the cured foam of a good curable resin in an example in which 1-bromopropane was 70 parts by weight or less, and the curable resin was cured. It can be seen that the peelability and swelling property of the product are also good.
From Table 8, a composition obtained by adding two kinds selected from the group consisting of dibasic acid ester, diethylene glycol diethyl ether and dibenzylamine to 3-methoxy-N, N-dimethylpropanamide is also a cured product of a curable resin. It can be seen that there are effects of peeling and swelling of the resin and volume reduction of the cured foam of the curable resin.
From Table 9, it can be seen that a composition in which ethylene glycol dimethyl ether is added to 3-methoxy-N, N-dimethylpropanamide also has an effect of removing the cured product of the curable resin.
From Tables 10 and 11, it can be seen that the composition obtained by adding silica to 3-methoxy-N, N-dimethylpropanamide also has the effect of removing the cured product of the curable resin. Moreover, when the content of the amide compound and the viscosity of the release agent were within the preferable ranges, the cured product of the urethane resin could be released with the stainless spatula. Thus, in the case of hand wiping with a tissue, the removal range is limited to a reachable part, but if a spatula or the like can be used, it is possible to widen the removal range by attaching a spatula to a long stick. In addition, the viscosities of the release agents of Examples 29 to 35 were all measured at 20 ° C. or higher, but the viscosities of the release agents of Examples 29 to 35 at 20 ° C. were all 12 mPa · s or higher. It was.

  The release agent, swelling agent and volume-reducing agent containing the amide compound represented by the general formula (1) of the present invention are excellent in safety, and peelability and swelling property of a cured product of a curable resin, and a curable resin. Since the cured foam is excellent in volume reduction, it is extremely useful industrially.

Claims (12)

A release agent for removing the cured product of the curable resin from the solid substrate to which the cured product of the curable resin containing the amide compound (A) represented by the general formula (1) is attached.
^{_{R 1 O-CH 2 CH 2}} CON (CH 3) 2 (1)
[Wherein R ¹ is an alkyl group having 1 to 4 carbon atoms]   The release agent according to claim 1, comprising the amide compound (A).   The release agent according to claim 1, further comprising at least one organic compound (B) selected from the group consisting of ester compounds, glycol ether compounds, amine compounds and halogenated hydrocarbon compounds.   The amide compound (A) according to any one of claims 1 to 3, wherein the amide compound (A) is at least one of 3-methoxy-N, N-dimethylpropanamide and 3-butoxy-N, N-dimethylpropanamide. paint remover.   The stripping agent according to claim 3 or 4, wherein the ester compound is at least one of an ester compound having two carbonyl groups and a cyclic ester.   The release agent according to any one of claims 3 to 5, wherein the component (B) is less than 90 parts by weight relative to 100 parts by weight of the total of the component (A) and the component (B).   Furthermore, it contains silica (C), and the content of the silica (C) is 3.5 to 23 parts by weight with respect to a total of 100 parts by weight of the amide compound (A) and the silica (C). Item 7. A release agent according to any one of items 3 to 6.   Furthermore, the release agent as described in any one of Claims 1 and 3-7 which contains a silica (C) and whose viscosity in 20 degreeC is 12-2,000,000 mPa * s.   The release agent according to any one of claims 1 to 8, wherein the curable resin is a urethane resin.   The release agent according to any one of claims 1 to 9, for separating the two or more substrates from an adhesive body in which the two or more substrates are bonded via a cured product of a curable resin. A volume reducing agent for a cured foam of a curable resin, comprising the amide compound (A) represented by the general formula (1).
^{_{R 1 O-CH 2 CH 2}} CON (CH 3) 2 (1)
[Wherein R ¹ is an alkyl group having 1 to 4 carbon atoms] The swelling agent of the hardened | cured material of curable resin containing the amide compound (A) represented by General formula (1).
^{_{R 1 O-CH 2 CH 2}} CON (CH 3) 2 (1)
[Wherein R ¹ is an alkyl group having 1 to 4 carbon atoms]