[0013] 本實施形態之樹脂組成物（以下稱為樹脂組成物）含有
作為（A）成分之丙烯酸樹脂，
作為（B）成分之以通式（1）表示之硫醇化合物，
[0014]
[0015] （式中，R
1、R
2、R
3及R
4分別獨立為氫或C
3H
6SH，且R
1、R
2、R
3及R
4中之至少一者為C
3H
6SH），及
作為（C）成分之潛在性硬化促進劑。
[0016] （A）成分之丙烯酸樹脂可對硬化後之樹脂組成物賦予透明性及適度硬度。該（A）成分係丙烯酸酯單體、甲基丙烯酸單體或該等之寡聚物。作為本實施形態中可使用之丙烯酸酯單體、甲基丙烯酸單體或該等之寡聚物之例，舉例為三（2-羥基乙基）異氰脲酸酯之二丙烯酸酯及二甲基丙烯酸酯、三（2-羥基乙基）異氰脲酸酯之三丙烯酸酯及三甲基丙烯酸酯、三羥甲基丙烷三丙烯酸酯及三甲基丙烯酸酯、季戊四醇之三丙烯酸酯及三甲基丙烯酸酯、以及該等之寡聚物。且作為其他例，舉例為二季戊四醇之聚丙烯酸酯及聚甲基丙烯酸酯、三（丙烯醯氧基乙基）異氰脲酸酯、己內酯改質之三（丙烯醯氧基乙基）異氰脲酸酯、己內酯改質之三（甲基丙烯醯氧基乙基）異氰脲酸酯、烷基改質之二季戊四醇之聚丙烯酸酯及聚甲基丙烯酸酯、及己內酯改質之二季戊四醇之聚丙烯酸酯及聚甲基丙烯酸酯。作為市售之（A）成分之例舉例為東亞合成股份有限公司製聚酯丙烯酸酯（品名：M7100）、共榮社化學股份有限公司製二羥甲基三環癸烷二丙烯酸酯（品名：LIGHT ACRYLATE DCP-A）及DAICEL ALLNEX股份有限公司製聚酯丙烯酸酯（品名：EBECRYL810）。作為（A）成分可使用單獨物質，亦可併用2種以上之物質。
[0017] （B）成分之硫醇化合物係以通式（1）表示，
[0018]
[0019] （式中，R
1、R
2、R
3及R
4分別獨立為氫或C
3H
6SH，且R
1、R
2、R
3及R
4中之至少一者為C
3H
6SH）。基於硬化性之觀點，該硫醇化合物較好具有2~4個巰丙基，基於硬化物之物性及硬化速度之平衡的觀點，最好具有3個巰丙基。（B）成分可為含有不同數之巰丙基的複數種硫醇化合物之混合物。該（B）成分本身具有相當柔軟之骨架。因此，可有效地減低硬化物之彈性率。藉由添加（B）成分，可控制硬化物之彈性率。因此，可提高硬化後之接著強度（尤其是剝離強度），且可抑制硬化後之樹脂組成物之耐濕試驗後的接著強度之降低。（B）成分不含有酯鍵。因此，硬化物具有長期優異之耐濕性。此處，上述專利文獻3揭示之作為硫醇化合物使用之季戊四醇四（3-巰基丙酸酯）、三羥甲基丙烷三（3-巰基丙酸酯）、二季戊四醇六（3-巰基丙酸酯）及季戊四醇六（3-巰基丙酸酯）均具有酯鍵。酯鍵易水解。因此，認為含有該等硫醇化合物之樹脂組成物，根據其用途，而不具有充分之耐濕性。相對於此，（B）成分不具有酯鍵。市售之（B）成分之例舉例為SC有機化學製硫醇化合物（品名：PEPT）。
[0020] 作為可與（B）成分併用之硫醇化合物，舉例為作為（B1）成分之不具有酯鍵之硫醇化合物（（B）成分之硫醇化合物除外）及作為（B2）成分之具有酯鍵之硫醇化合物。
[0021] 作為（B1）成分之例，舉例為以下通式（2）表示之硫醇化合物，
[0022]
[0023] （式中，R
5及R
6分別獨立為氫、碳數1~10之烷基或苯基，n為0~10之整數）。作為較佳之例舉例為以化學式（3）或化學式（4）表示
[0024]
[0025]
[0026] 之具有鍵結至含氮雜環之4個各氮原子上之官能基（-CH
2-CH
2-SH或-CH
2-CH
2-CH
2-SH）之多官能含氮雜環化合物。
[0027] 作為（B1）成分之市售品舉例為四國化成工業製硫醇二醇脲衍生物（商品名：TS-G）。作為（B1）成分可使用單獨物質，亦可併用2種以上物質。併用（B1）時，以重量比計，較好滿足（B1）：（B）=15：85~95：5，更好為20：80~90：10之關係。藉由併用（B）成分與（B1）成分，可保持耐濕性且可調整硬化後之彈性率。結果可進一步提高接著強度（剝離強度）。
[0028] 作為（B2）成分之例，季戊四醇四（3-巰基丙酸酯）、三羥甲基丙烷四（3-巰基丙酸酯）、二季戊四醇六（3-巰基丙酸酯）、季戊四醇四（3-巰基丙酸酯）、三-［（3-巰基丙醯氧基）-乙基］-異氰脲酸酯、季戊四醇四（3-巰基丁酸酯）、1,4-雙（3-巰基丁醯氧基）丁烷、1,3,5-三（3-巰基丁醯氧基乙基）-1,3,5-三嗪-2,4,6（1H,3H,5H）-三酮、三羥甲基丙烷三（3-巰基丁酸酯）及三羥甲基乙烷三（3-巰基丁酸酯）。該等成分之酯鍵易水解。因此有其硬化物不具有充分耐濕性之可能性。因此，併用（B2）時，（B2）之重量，於將（B）成分設為100質量份時，較好為200質量份以下，更好為100質量份以下。且，基於剝離強度之觀點，（B2）之重量，於將（B）成分設為100質量份時，較好為25質量份以上。
[0029] （C）成份之潛在性硬化促進劑係於室溫處於不活性狀態，且藉由加熱而活性化，而作為硬化促進劑發揮功能之化合物。作為（C）成分之例舉例為常溫為固體之咪唑化合物、胺化合物與環氧化合物之反應生成物（胺-環氧加成物系）等之固體分散型胺加成物系潛在性硬化促進劑、及胺化合物與異氰脲酸酯化合物或脲化合物之反應生成物（脲型加成物系）。
[0030] 作為常溫為固體之咪唑化合物之例，舉例為2-十七烷基咪唑、2-苯基-4,5-二羥基甲基咪唑、2-十一烷基咪唑、2-苯基-4-甲基-5-羥基甲基咪唑、2-苯基-4-苄基-5-羥基甲基咪唑、2,4-二胺基-6-（2-甲基咪唑基-（1））-乙基-S-三嗪、2,4-二胺基-6-（2’-甲基咪唑基-（1）’）-乙基-S-三嗪．異氰脲酸加成物、2-甲基咪唑、2-苯基咪唑、2-苯基-4-甲基咪唑、1-氰基乙基-2-苯基咪唑、1-氰基乙基-2-甲基咪唑-苯偏三酸酯、1-氰基乙基-2-苯基咪唑-苯偏三酸酯、N-（2-甲基咪唑基-1-乙基）-脲及N,N’-（2-甲基咪唑基-（1）-乙基）-己二醯二醯胺。惟，上述咪唑化合物並不限於該等化合物。
[0031] 作為固體分散型胺加成物系潛在性硬化促進劑（胺-環氧加成物系）之製造原料之一使用之環氧化合物之例，舉例為如雙酚A、雙酚F、兒茶酚或間苯二酚之多元酚與表氯醇反應而得之聚縮水甘油醚，及如甘油或聚乙二醇之多元醇與表氯醇反應所得之聚縮水甘油醚。且，作為其他例舉例為如對-羥基苯甲酸或β-羥基萘甲酸之羥基羧酸與表氯醇反應所得之聚縮水甘油醚酯、如鄰苯二甲酸或對苯二甲酸之聚羧酸與表氯醇反應所得之聚縮水甘油醚酯、或如4,4’-二胺基二苯基甲烷或間-胺基苯酚之胺化合物與表氯醇反應所得之聚縮水甘油胺化合物。再者，作為其他例，舉例為如環氧化苯酚酚醛清漆樹脂、環氧化甲酚酚醛清漆樹脂或環氧化聚烯烴之多官能性環氧化合物及如丁基縮水甘油醚、苯基縮水甘油醚或甲基丙烯酸縮水甘油酯之單官能性環氧化合物。惟，上述環氧化合物不限定於該等化合物。
[0032] 作為固體分散型胺加成物系潛在性硬化促進劑之另一製造原料使用之胺化合物只要為分子內具有1個以上能與環氧基加成反應之活性氫且至少於分子內具有1個以上選自由1級胺基、2級胺基及3級胺基中之官能基之化合物即可。該等中，胺化合物之例示於以下。惟，上述胺化合物不限定於該等化合物。作為其例，舉例為如二伸乙基三胺、三伸乙基四胺、正丙胺、2-羥基乙胺基丙胺、環己基胺及4,4’-二胺基-二環己基甲烷之脂肪族胺類，如4,4’-二胺基二苯基甲烷或2-甲基苯胺之芳香族胺化合物，及如2-乙基-4-甲基咪唑、2-乙基-4-甲基咪唑啉、2,4-二甲基咪唑啉、哌啶或哌嗪之含有氮原子之雜環化合物。惟，上述胺化合物不限定於該等化合物。
[0033] 又，該等中，尤其於分子內具有3級胺基之化合物係具有優異硬化促進能而賦予潛在性硬化促進劑之原料。作為此等化合物之例，舉例為如二甲胺基丙胺、二乙胺基丙胺、二正丙胺基丙胺、二丁胺基丙胺、二甲胺基乙胺、二乙胺基乙胺或N-甲基哌嗪之胺化合物，及如2-甲基咪唑、2-乙基咪唑、2-乙基-4-甲基咪唑或2-苯基咪唑之咪唑化合物之分子內具有3級胺基之1級或2級胺類。且，作為其他例舉例惟如2-二甲胺基乙醇、1-甲基-2-二甲胺基乙醇、1-苯氧基甲基-2-二甲胺基乙醇、2-二乙胺基乙醇、1-丁氧基甲基-2-二甲胺基乙醇、1-（2-羥基-3-苯氧基丙基）-2-甲基咪唑、1-（2-羥基-3-苯氧基丙基）-2-乙基-4-甲基咪唑、1-（2-羥基-3-丁氧基丙基）-2-甲基咪唑、1-（2-羥基-3-丁氧基丙基）-2-乙基-4-甲基咪唑啉、1-（2-羥基-3-苯氧基丙基）-2-苯基咪唑、1-（2-羥基-3-丁氧基丙基）-2-幾家咪唑啉、2-（二甲胺基甲基）苯酚、2,4,6-三（二甲胺基甲基）苯酚、N-β-羥基乙基嗎啉、2-二甲胺基乙烷硫醇、2-巰基吡啶、2-苯并咪唑、2-巰基苯并咪唑、2-巰基苯并噻唑、4-巰基吡啶、N,N-二甲基胺基苯甲酸、N,N-二甲基甘胺酸、菸鹼酸、異菸鹼酸、吡啶甲酸、N,N-二甲基甘胺酸醯肼、N,N-二甲基丙酸醯肼、菸鹼酸醯肼及異菸鹼酸醯肼等之分子內具有3級胺基之醇類，酚類、硫醇類、羧酸類及醯肼類等。惟，上述分子內具有3級胺基之化合物不限於該等化合物。
[0034] 作為固體分散型胺加成物系潛在性硬化促進劑之進而另一製造原料使用之異氰酸酯化合物之例舉例為如正丁基異氰酸酯、異丙基異氰酸酯、苯基異氰酸酯或苄基異氰酸酯之單官能異氰酸酯化合物，及如六亞甲基二異氰酸酯、甲苯基二異氰酸酯、1,5-萘二異氰酸酯、二苯基甲烷-4,4’-二異氰酸酯、異佛爾酮二異氰酸酯、二甲苯二異氰酸酯、對伸苯基二異氰酸酯、1,3,6-六甲亞基三異氰酸酯或雙環庚烷三異氰酸酯之多官能異氰酸酯化合物。再者，亦可使用由該等多官能異氰酸酯化合物與活性氫化合物反應所得之末端含異氰酸酯基之化合物等。該等末端具有異氰酸酯基之化合物之例舉例為藉由甲苯基二異氰酸酯與三羥甲基丙烷反應而得之末端具有異氰酸酯基之加成化合物，及甲苯二異氰酸酯與季戊四醇反應所得之末端具有異氰酸酯基之加成化合物。惟，末端具有異氰酸酯基之加成化合物不限定於該等化合物。
[0035] 又，作為脲化合物舉例為脲及硫脲。惟，脲化合物不限定於該等化合物。
[0036] 本實施形態可使用之固體分散型潛在性硬化促進劑可例如如下述般容易調製。以成為上述之胺化合物與環氧化合物之2成分、該等2成分與活性氫化合物之3成分；或胺化合物與異氰酸酯化合物及/或脲化合物之2成分或3成份之組合之方式將採取之各成分混合。接著，該等成分於自室溫至200℃之溫度反應。隨後，將冷卻固化之反應物粉碎。或者於甲基乙基酮、二噁烷或四氫呋喃等溶劑中使上述各成分反應。接著，脫溶劑後，將其固形分粉碎。
[0037] 上述之固體分散型潛在性硬化促進劑之市售品之代表例中，作為胺-環氧加成系（胺加成系）之例舉例為「AMICURE PN-23」（味之素精密技術（股）商品名）、「AMICURE PN-40」（味之素精密技術（股）商品名）、「AMICURE PN-50」（味之素精密技術（股）商品名）、「HARDNER X-3661S」（ACR（股）商品名）、「HARDNER X-3670S」（ACR（股）商品名）、「NOVACURE HX-3742」（旭化成E MATERIALS（股）商品名）、「NOVACURE HX-3721」（旭化成E MATERIALS（股）商品名）及「NOVACURE HXA9322HP」（旭化成E MATERIALS（股）商品名）、「FXR1121」（T&KTOKA（股）商品名）。且，作為脲型加成系之例舉例為「FUJICURE FXE-1000」（T&KTOKA（股）商品名）及「FUJICURE FXR-1030」（T&KTOKA（股）商品名）。惟，上述市售品不限定於該等。作為（C）成分可使用單獨物質，亦可併用2種以上物質。作為（C）成分之潛在性硬化促進劑，基於有效期及硬化性之觀點，較好為固體分散型胺加成系潛在性硬化促進劑。
[0038] 樹脂組成物之［（B）成分之硫醇當量］/［（A）成分之丙烯酸當量］較好為0.5~2.0。（B）成分之硫醇當量係（B）成分之分子量除以1分子中之硫醇基數所得之數值。實際之硫醇當量例如可藉由電位差測定求出硫醇價而決定。丙烯酸樹脂之當量等於將丙烯酸樹脂之分子量除以1分子中之丙烯酸基（或甲基丙烯酸基）之數所得之數值。實際之丙烯酸當量可藉由例如NMR測定。藉由將［（B）成分之硫醇當量］/［（A）成分之丙烯酸當量］設定為0.5~2.0之範圍，可使丙烯酸與硫醇反應一定量以上，可更確實形成高聚合物。因此，可更易於展現高的接著強度。當量未達0.5或超過2.0時，無法充分形成分子交聯。因此，會發生於硬化物表面易發生滲出，或者剝離強度易降低之虞。
[0039] 基於樹脂組成物之接著強度之觀點，（A）成分較好相對於樹脂組成物100質量份為10~90質量份。
[0040] 基於樹脂組成物之硬化速度及有效期之觀點，（C）成分較好相對於樹脂組成物100質量份為0.1~40質量份。
[0041] 樹脂組成物較好進而含有作為（D）成分之自由基聚合抑制劑。（D）成分之自由基聚合抑制劑係為了提高樹脂組成物之保存時安定性而添加。亦即，為了抑制非刻意之自由基聚合反應之進行，而添加（D）成分之自由基聚合抑制劑。（A）成分之丙烯酸樹脂雖概率極低但有自本身發生自由基之情況。因此，有以該自由基為基點，進行非刻意之自由基聚合反應之情況。藉由添加自由基聚合抑制劑，可抑制此種非刻意之（A）成分之自由基聚合反應進行。
[0042] 作為（D）成分可使用習知之自由基聚合抑制劑。較佳使用例如選自由N-亞硝基-N-苯基羥基胺鋁、三苯基膦、對-甲氧基酚及對苯二酚所成之群中之至少一種化合物。且，亦可使用日本特開2010-117545號公報及日本特開2008-184514號公報等中揭示之習知自由基聚合抑制劑。作為（D）成分可使用單獨物質，亦可併用2種以上物質。
[0043] 樹脂組成物較好進而含有作為（E）成分之陰離子聚合抑制劑。（E）成分之陰離子聚合抑制劑對樹脂組成物賦予保存時之安定性。亦即，為了抑制（C）成分所含之胺基與（B）成分之非刻意反應，而添加（E）成分之陰離子聚合抑制劑。（C）成分中可含有之咪唑及3級胺具有胺基。該胺基與（B）成分反應而開始聚合。潛在性硬化促進劑係設計為於室溫不易引起胺基之反應。然而，仍稍有胺基於室溫下會與（B）成分反應之可能性。（E）成分係在胺基與（B）成分反應之前，藉由與該胺基反應，而具有抑制非刻意之胺基與（B）成分之反應的作用。
[0044] 作為（E）成分可使用習知之陰離子聚合抑制劑。較佳使用選自由硼酸酯、鋁螯合物及有機酸所成之群中之至少一種化合物。作為硼酸酯可使用例如日本特開2011-026539號公報及日本再表2005/070991號公報中揭示之硼酸酯。作為鋁螯合物可使用例如日本再表2005/070991號公報中揭示之鋁螯合物。作為有機酸可使用例如日本特表2002-509178號公報中揭示之有機酸。作為市售之（E）成分舉例為硼酸三異丙酯及巴比妥酸。作為（E）成分可使用單獨物質，亦可併用2種以上物質。
[0045] （D）成分之含量較好相對於樹脂組成物100質量份為0.0001~1.0質量份。（D）成分之含量落於該範圍時，由於可更提高樹脂組成物之保存時安定性，故可更延長樹脂組成物之有效期。
[0046] （E）成分之含量較好相對於（C）成分1質量份為0.0001~1.0質量份。（E）成分之含量落於該範圍時，可更提高樹脂組成物之保存時安定性。其結果，可更延長樹脂組成物之有效期。
[0047] 本實施形態之樹脂組成物較好進而含有（F）具有縮水甘油基之丙烯酸樹脂以外之含縮水甘油基之化合物。（F）成分之藉由加熱與（B）成分之反應性，相較於（A）成分與（B）成分之反應性較低。因此，與（E）成分之陰離子聚合抑制劑同樣，（F）成分有助於提高樹脂組成物之保存時安定性。
[0048] 作為（F）成分，基於與（B）成分之反應性之觀點，較好為環氧樹脂、具有至少一個縮水甘油基之乙烯基化合物及具有至少一個縮水甘油基之聚丁二烯。作為環氧樹脂之市售品舉例為DIC製環氧樹脂（品名：EXA835LV）及新日鐵住金製環氧樹脂（品名：YDF8170）。作為具有至少一個縮水甘油基之聚丁二烯之市售品舉例為ADEKA製環氧化1,2-聚丁二烯。作為（F）成分，可使用單獨物質，亦可併用2種以上物質。
[0049] （F）成分之含量，基於樹脂組成物之有效期及UV硬化性之觀點，相對於樹脂組成物100質量份，為1~50質量份。又，使用環氧樹脂時，（硫醇當量）/［（丙烯酸當量）+（環氧當量）］之值較好為0.5~2.0。
[0050] 樹脂組成物較好進而含有自由基聚合起始劑。藉由於樹脂組成物中含有自由基聚合起始劑，可藉由短時間加熱即UV照射使樹脂組成物硬化。可使用之自由基聚合起始劑並未特別限制。可使用習知材料。作為自由基聚合起始劑之具體例舉例為如二異丙苯過氧化物、第三丁基異丙苯過氧化物、1,3-雙（2-第三丁基過氧異丙基）苯或2,5-二甲基-2,5-雙（第三丁基過氧基）己烷之二烷基過氧化物，如1,1-雙（第三丁基過氧基）環己烷、1,1-雙（第三丁基過氧基）-3,3,5-三甲基環己烷、1,1-雙（第三戊基過氧基）環己烷、2,2-雙（第三丁基過氧基）丁烷、4,4-雙（第三丁基過氧基）戊酸正丁酯或3,3-（第三丁基過氧基）丁酸乙酯之過氧縮醛，及如第三丁基過氧基2-乙基己酸酯、1,1,3,3-四甲基丁基過氧基2-乙基己酸酯、第三丁基過氧基異丁酸酯、第三丁基過氧基戊酸酯、或第三丁基過氧基苯甲酸酯之烷基過氧基酯。且，作為其他例舉例為1-羥基環己基苯基酮、2-羥基-2-甲基-1-苯基丙烷-1-酮、二乙氧基二苯甲酮、1-（4-異丙基苯基）-2-羥基-2-甲基丙烷-1-酮、1-（4-十二烷基苯基）-2-羥基-2-甲基丙烷-1-酮、4-（2-羥基乙氧基）-苯基（2-羥基-2-丙基）酮、2-甲基-1-［4-（甲硫基）苯基］-2-嗎啉基丙烷-1、安息香、安息香甲醚、安息香乙醚、安息香異丙醚、安息香正丁醚、安息香苯醚、安息香二甲基縮醛、二苯甲酮、苯甲醯基安息香酸、苯甲醯基安息香酸甲酯、4-苯基二苯甲酮、羥基二苯甲酮、丙烯酸化二苯甲酮、4-苯甲醯基-4’-甲基二苯基硫醚、3,3’-二甲基-4-甲氧基二苯甲酮、噻噸酮、2-氯噻噸酮、2-甲基噻噸酮、2,4-二甲基噻噸酮、異丙基噻噸酮、2,4-二氯噻噸酮、2,4-二乙基噻噸酮、2,4-二異丙基噻噸酮、2,4,6-三甲基苯甲醯基二苯基氧化膦、甲基苯基乙醇酸酯、聯苯醯及樟腦酮。作為自由基聚合起始劑可使用單獨物質，亦可併用2種以上物質。
[0051] 樹脂組成物中，在不損及本實施形態之樹脂組成物特性之範圍內，且根據需要，亦可摻合碳黑、鈦黑、氧化矽填料、氧化鋁填料、滑石填料、碳酸鈣填料、PTFE填料、矽烷偶合劑、離子捕捉劑、調平劑、抗氧化劑、消泡劑、搖變劑或其他添加劑等。且，樹脂組成物中，亦可摻合黏度調整劑、難燃劑或溶劑等。此處，碳黑及鈦黑可使用作為遮光性賦予材。基於兼具遮光性及UV硬化性（硬化深度）之觀點，較好使用鈦黑。作為鈦黑之例舉例為鈦黑12S（三菱材料電子化成股份有限公司製）、鈦黑13M（三菱材料電子化成股份有限公司製）及鈦黑13M-C（三菱材料電子化成股份有限公司製）、TilackD（赤穗化成股份有限公司製）。鈦黑13M特佳。
[0052] 樹脂組成物可藉由例如同時或個別將（A）成分~（C）成分及其他添加劑等，根據需要邊施加加熱處理而攪拌、熔融、混合及分散而獲得。用於該等混合、攪拌及分散等之裝置並未特別限定。可使用具備攪拌裝置及加熱裝置之擂潰機、亨歇爾混合機、3輥研磨機、球磨機、行星式混合機或珠粒研磨機等。且，該等裝置亦可適當組合使用。
[0053] 如此所得之樹脂組成物為光硬化性及熱硬化性。樹脂組成物之熱硬化溫度，於使用於影像感測器模組時，較好為70~80℃。
[0054] 本實施形態之樹脂組成物可使用作為例如用以使零件彼此接合之接著劑、密封劑、壩劑及其原料。此處壩劑係例如於基板上以低黏度填料劑密封複數半導體晶片之前，預先形成於基板外圍。藉由該壩劑形成壩，可抑制隨後密封複數半導體晶片之低黏度填料劑之流出。且，含有本實施形態之樹脂組成物之接著劑對於工程塑膠、陶瓷及金屬均可良好接合。
［實施例］
[0055] 以下，藉由實施例說明本實施形態之樹脂組成物。惟，本實施形態不受該等實施例之限定。又，以下實施例中，份及%只要未特別限定則表示質量份及質量%。
[0056]
［實施例1~24、比較例1~2］
以表1~表3所示之配方，使用3輥混合機調製樹脂組成物。表1~表3中之（B’）成分相當於前述之（B2）成分。（B”）成分相當於前述之（B1）成分。
[0057]
［剝離強度］
於下側基材（SUS-304製，平滑板：40mm×60mm×0.3mm）上之20mm×60mm區域以樹脂組成物塗佈。經塗佈之區域上之樹脂組成物具有50μm厚度。邊注意不使夾帶氣泡之方式，將上側基材（SUS-304製肋條（厚度20μm，寬5mm，長50mm））載置於樹脂組成物上。如此，製作5個具有5mm×20mm接著面之試驗片。其次，以送風乾燥機將所製作之試驗片保持於80℃×60分鐘，而使試驗片之樹脂組成物熱硬化。藉此獲得剝離強度測定用試驗片。
[0058] 隨後，於室溫，藉由剝離試驗機（MINEBEA股份有限公司製荷重測定器LTS-500N-S100及90°剝離夾具），把持上述所得試驗片之上側基材。隨後，將硬化物一端略為剝下，以90°之角度及50mm/min之上拉速度，上拉至15mm之距離，將上側基材自試驗片剝下。此時，以與上拉距離相同距離，將試驗片追隨剝離操作之方式，水平移動。上拉距離為5~15mm時之測定值之平均值定義為初期剝離強度。
[0059] 且，藉由以下手法，亦求出耐濕試驗後之剝離強度。上述剝離強度測定用之試驗片於溫度85℃及濕度85%之條件下，於恆溫恆濕槽內放置100小時。自恆溫恆濕槽取出之試驗片溫度於1小時內確認成為與常溫相同。使用該試驗片，以與上述同樣測定方法求得之剝離強度定義為耐濕試驗後之剝離強度。且，由下述式算出保持率。
保持率=［（耐濕式驗後之剝離強度）/（初期剝離強度）×100］（單位：%）
剝離強度較好為0.3N/mm以上，更好為0.5N/mm以上。表1~表3中顯示測定結果（單位為N/mm）。
[0060]
1）東亞合成製（品名：M7100，丙烯酸當量：188g/eq）
2）共榮社化學製二羥甲基三環癸烷二丙烯酸酯（品名：LIGHT ACRYLATE DCP-A，
丙烯酸當量：152g/eq）
3）SC有機化學製硫醇化合物（品名：PEPT，硫醇當量：124g/eq）
4）SC有機化學製季戊四醇四（3-巰基丙酸酯）（品名：PEMP，硫醇當量：122.7g/eq）
5）四國化成工業製二醇脲衍生物（品名：TS-G，硫醇當量：100 g/eq）
6）旭化成E MATERIALS製潛在性硬化促進劑（品名：NOVACURE HXA9322HP）
7）T&K TOKA製潛在性硬化促進劑（品名：FXR1121）
8）四國化成製2-乙基-4-甲基咪唑（品名：2E4MZ）
9）和光純藥製N-亞硝基-N-苯基羥基胺鋁
10）東京化成工業製三苯基膦（品名：TPP）
11）東京化成工業製硼酸三異丙酯
12）味之素精密技術製鋁螯合物
13）東京化成工業製巴比妥酸
14）DIC製環氧樹脂（品名：EXA835LV，環氧當量：165g/eq）
15）新日鐵住金製環氧樹脂（品名：YDF8170，環氧當量：158g/eq）
16）BASF製自由基聚合起始劑（品名：IRGACURE 184）
17）三菱材料製鈦黑（品名：TITAN BLACK 13M）
18）ADOMATECHS製高純度合成球狀氧化矽（品名：SE2200SEE，平均粒徑：0.6μm）
19）日本AEROSIL製疏水性發菸氧化矽粉末（品名：R805，平均粒徑：20nm）
20）信越化學工業製3-縮水甘油氧基丙基三甲氧基矽烷（品名：KBM403）
[0061]
[0062]
[0063]
［彈性率］
藉由對不鏽鋼板（SUS-304製，平滑板：40mm×60mm×0.3mm）以使硬化時膜厚為500±100μm之方式塗佈樹脂組成物，而形成塗膜。藉由於80℃放置1小時，使塗膜硬化。自不鏽鋼板剝離之塗膜，以切割器切取具有特定尺寸（5mm×40mm）之塗膜。又，切口以砂紙修飾至平滑。依據JISC6481，使用SEIKO INSTRUMENT公司製之動態熱機械測定（DMA），藉由拉伸法，於頻率10Hz測定該切取之塗膜儲存彈性率。該25℃之儲存彈性率定義為初期彈性率。測定結果示於表4。M意指“百萬（Mega）”。且塗膜於溫度85℃及濕度85%之條件下，於恆溫恆濕槽內放置100小時。隨後亦測定該塗膜之耐濕試驗後之彈性率。測定結果示於表4。
[0064]
[0065] 如表1~表3所了解，所有實施例1~24，初期剝離強度及耐濕試驗後剝離強度均為0.3N/mm以上。又，其保持率為30%以上。如此，獲得良好結果。相對於此，代替（B）成分而使用（B’）成分之比較例1，耐濕試驗後剝離強度為0N/mm顯著較低。代替（C）成分而使用（C’）成分之比較例2摻合時引起硬化。因此，無法測定剝離強度（表2中記載為“×”）。表4之比較例1於耐濕試驗後無法維持硬化物形狀。因此無法測定彈性率（表4中記載為“×”）。
[0066]
［異種材質之接著劑強度試驗］
＜接著強度＞
以實施例1之接著劑或比較例1之接著劑塗佈由選自表5所示之各種材料（SUS-304平滑板，氧化鋁，LCP（液晶聚合物）、PC（聚碳酸酯）、PI（聚醯亞胺）、PA（聚醯胺）、FR-4（玻璃環氧樹脂）、PE（聚乙烯）及PP（聚丙烯））之1種材料所成之下側基材。隨後，以與上述相同方法，藉由載置上側基材（SUS-304置肋條（寬5mm，厚20μm，長50mm）），製作試驗片。其次藉由使作成之試驗片於80℃保持60分鐘，而使試驗片之接著劑熱硬化。此處，LCP、PC、PI、PA及FR-4為工程塑膠。該等中，LCP及PI為超級工程塑膠。
[0067] 以與上述相同方法算出耐濕試驗前後之剝離強度。0.3N/mm以上之剝離強度評價為「○」。未達0.3N/mm之剝離強度評價為「×」。表5顯示結果。
[0068]
[0069] 如由表5所了解，實施例1中，具有SUS、氧化鋁及工程塑膠之基材之試驗片具有高的耐濕試驗後之剝離強度。相對於此，比較例1中，具有SUS、氧化鋁、工程塑膠、PE及PP之試驗片全部顯示耐濕試驗後之低剝離強度。又，實施例1中，具有PE及PP之基材之試驗片顯示低的初期剝離強度。
本實施形態之樹脂組成物亦可為以下之第1~7之樹脂組成物。
上述第1樹脂組成物之特徵為含有（A）丙烯酸樹脂，（B）以通式（1）表示之硫醇化合物：
（式中，R
1、R
2、R
3及R
4分別獨立為氫或C
3H
6SH，且R
1、R
2、R
3及R
4中之至少一者為C
3H
6SH），及（C）潛在性硬化促進劑。
上述第2樹脂組成物係進而含有（B）以外之硫醇化合物的上述第1樹脂組成物。
上述第3樹脂組成物係進而含有（D）自由基聚合抑制劑的上述第1或2樹脂組成物。
上述第4樹脂組成物係（D）成分係選自由N-亞硝基-N-苯基羥基胺鋁、三苯基膦、對-甲氧基酚及對苯二酚所成之群中之至少一種化合物的上述第3樹脂組成物。
上述第5樹脂組成物係進而含有（E）陰離子聚合抑制劑的上述第1~4中任一項之樹脂組成物。
上述第6樹脂組成物係其中（E）成分係選自由硼酸酯、鋁螯合物及有機酸所成之群中之至少一種化合物的上述第5樹脂組成物。
上述第7樹脂組成物係其中［（B）成分之硫醇當量］/［（A）成分之丙烯酸當量］為0.5~2.0的上述第1~6中任一項之樹脂組成物。
本實施形態之接著劑可含有上述第1~7中任一項之樹脂組成物。
本實施形態之密封劑可含有上述第1~7中任一項之樹脂組成物。
本實施形態之壩劑可含有上述第1~7中任一項之樹脂組成物。
本實施形態之半導體裝置亦可含有上述第1~7之樹脂組成物、上述接著劑之硬化物、上述密封劑之硬化物或上述壩劑之硬化物。
［產業上之可利用性］
[0070] 本實施形態之樹脂組成物係硬化後具有高的接著強度（尤其是高的剝離強度），且可抑制硬化後之耐濕試驗後之接著強度之降低的光及熱硬化性之樹脂組成物。因此，該樹脂組成物特別是作為接著劑、密封劑及壩劑非常有用。
The resin composition of the present embodiment (hereinafter referred to as the resin composition) contains an acrylic resin as the component (A), a thiol compound represented by the general formula (1) as the component (B), (wherein, R 1 , R 2 , R 3 and R 4 are independently hydrogen or C 3 H 6 SH, and at least one of R 1 , R 2 , R 3 and R 4 is C 3 H 6 SH), and a latent hardening accelerator as (C) component. [0016] The acrylic resin of the component (A) can impart transparency and moderate hardness to the cured resin composition. This (A) component is an acrylate monomer, a methacrylic monomer, or these oligomers. Examples of acrylate monomers, methacrylic monomers, or oligomers thereof that can be used in this embodiment include diacrylate and dimethacrylate of tris(2-hydroxyethyl)isocyanurate, triacrylate and trimethacrylate of tris(2-hydroxyethyl)isocyanurate, trimethylolpropane triacrylate and trimethacrylate, pentaerythritol triacrylate and trimethacrylate, and oligomers thereof. As other examples, the examples are polyacrylates of two -seasons of tetraxol and polymethyl acrylate, triangular (acryl oxygenononononl) isocyanate, and iconic alcohol (acryl oxygenononite), lymite of gyanic acid ester, lycopylene (methyl oxyl oxyl oxygenyl), and alkyl -based polycryilic polyacrylene. Polycrylate and polymethylene acrylics of acid ester and polymethyl acrylic, and polycopytol, and polymethyl acrylic. Examples of the commercially available component (A) include Toagosei Co., Ltd. polyester acrylate (product name: M7100), Kyoeisha Chemical Co., Ltd. dimethyloltricyclodecane diacrylate (product name: LIGHT ACRYLATE DCP-A), and DAICEL ALLNEX Co., Ltd. polyester acrylate (product name: EBECRYL810). A single substance may be used as (A) component, and 2 or more types may be used together. (B) The thiol compound of component is represented by general formula (1), [0018] (wherein, R 1 , R 2 , R 3 and R 4 are independently hydrogen or C 3 H 6 SH, and at least one of R 1 , R 2 , R 3 and R 4 is C 3 H 6 SH). The thiol compound preferably has 2 to 4 mercaptopropyl groups from the viewpoint of curability, and preferably has 3 mercaptopropyl groups from the viewpoint of the balance between the physical properties of the cured product and the curing speed. The component (B) may be a mixture of plural thiol compounds containing different numbers of mercaptopropyl groups. This (B) component itself has a rather soft skeleton. Therefore, the modulus of elasticity of the cured product can be effectively reduced. By adding component (B), the modulus of elasticity of the cured product can be controlled. Therefore, the adhesive strength (especially peeling strength) after hardening can be improved, and the fall of the adhesive strength after the humidity resistance test of the resin composition after hardening can be suppressed. (B) The component does not contain an ester bond. Therefore, the hardened product has excellent long-term moisture resistance. Here, the pentaerythritol tetrakis(3-mercaptopropionate), trimethylolpropane tris(3-mercaptopropionate), dipentaerythritol hexa(3-mercaptopropionate), and pentaerythritol hexa(3-mercaptopropionate) used as the thiol compound disclosed in the above-mentioned Patent Document 3 all have an ester bond. The ester bond is easily hydrolyzed. Therefore, it is thought that the resin composition containing these thiol compounds does not have sufficient moisture resistance depending on the use. On the other hand, (B) component does not have an ester bond. An example of the commercially available (B) component is thiol compound (product name: PEPT) manufactured by SC Organic Chemicals. [0020] As the thiol compound that can be used in combination with the (B) component, there are, for example, a thiol compound that does not have an ester bond as the component (B1) (excluding the thiol compound that is the component (B)) and a thiol compound that has an ester bond as the component (B2). As the example of (B1) component, exemplify the thiol compound represented by following general formula (2), [0022] (in the formula, R and R are independently hydrogen, an alkyl or phenyl group with 1 to 10 carbons , and n is an integer of 0 to 10). As a preferred example, it is represented by chemical formula (3) or chemical formula (4) [0024] [0025] [0026] A polyfunctional nitrogen-containing heterocyclic compound having a functional group (-CH 2 -CH 2 -SH or -CH 2 -CH 2 -CH 2 -SH) bonded to 4 nitrogen atoms of the nitrogen-containing heterocycle. [0027] A commercially available product as the component (B1) is, for example, a thioldiol urea derivative (trade name: TS-G) manufactured by Shikoku Chemical Industry Co., Ltd. A single substance may be used as (B1) component, and 2 or more types may be used together. When (B1) is used together, it is better to satisfy the relationship of (B1):(B)=15:85~95:5, more preferably 20:80~90:10 in terms of weight ratio. By using the component (B) and the component (B1) together, the moisture resistance can be maintained and the modulus of elasticity after curing can be adjusted. As a result, adhesion strength (peel strength) can be further improved. As an example of the component (B2), pentaerythritol tetrakis(3-mercaptopropionate), trimethylolpropane tetrakis(3-mercaptopropionate), dipentaerythritol hexa(3-mercaptopropionate), pentaerythritol tetrakis(3-mercaptopropionate), tris-[(3-mercaptopropionyloxy)-ethyl]-isocyanurate, pentaerythritol tetrakis(3-mercaptobutyrate), 1,4-bis(3-mercaptobutyl Acyloxy)butane, 1,3,5-tris(3-mercaptobutyryloxyethyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, trimethylolpropane tris(3-mercaptobutyrate) and trimethylolethane tris(3-mercaptobutyrate). The ester bonds of these ingredients are easily hydrolyzed. Therefore, there is a possibility that the cured product may not have sufficient moisture resistance. Therefore, when (B2) is used together, the weight of (B2) is preferably at most 200 parts by mass, more preferably at most 100 parts by mass, when the component (B) is 100 parts by mass. Moreover, when the weight of (B2) is made into 100 mass parts of (B) components from a viewpoint of peeling strength, it is preferable that it is 25 mass parts or more. [0029] The latent hardening accelerator of the component (C) is a compound that is inactive at room temperature and is activated by heating to function as a hardening accelerator. Examples of the component (C) include solid-dispersed amine adduct-based latent hardening accelerators such as imidazole compounds that are solid at room temperature, reaction products of amine compounds and epoxy compounds (amine-epoxy adduct systems), and reaction products of amine compounds, isocyanurate compounds, or urea compounds (urea-type adduct systems). Be the example of the imidazole compound of solid at normal temperature, be exemplified as 2-heptadecyl imidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-undecylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2-phenyl-4-benzyl-5-hydroxymethylimidazole, 2,4-diamino-6-(2-methylimidazolyl-(1))-ethyl-S-triazine, 2,4-diamino-6-(2 '-Methylimidazolyl-(1)')-ethyl-S-triazine. Isocyanuric acid adduct, 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole-trimellitate, 1-cyanoethyl-2-phenylimidazole-trimellitate, N-(2-methylimidazolyl-1-ethyl)-urea and N,N'-(2-methylimidazolyl-(1)-ethyl)-hexanedi Acyl diamide. However, the above-mentioned imidazole compounds are not limited to these compounds. Examples of epoxy compounds used as one of the raw materials for the production of solid-dispersed amine adduct latent hardening accelerators (amine-epoxy adduct system) include polyglycidyl ethers obtained by reacting polyphenols such as bisphenol A, bisphenol F, catechol or resorcinol with epichlorohydrin, and polyglycidyl ethers obtained by reacting polyhydric alcohols such as glycerin or polyethylene glycol with epichlorohydrin. And, other examples include polyglycidyl ether esters obtained by reacting hydroxycarboxylic acids such as p-hydroxybenzoic acid or β-hydroxynaphthoic acid with epichlorohydrin, polyglycidyl ether esters obtained by reacting polycarboxylic acids such as phthalic acid or terephthalic acid with epichlorohydrin, or polyglycidylamine compounds obtained by reacting amine compounds such as 4,4'-diaminodiphenylmethane or m-aminophenol with epichlorohydrin. Furthermore, as another example, a polyfunctional epoxy compound such as epoxidized phenol novolac resin, epoxidized cresol novolak resin, or epoxidized polyolefin, and a monofunctional epoxy compound such as butyl glycidyl ether, phenyl glycidyl ether, or glycidyl methacrylate are exemplified. However, the above-mentioned epoxy compounds are not limited to these compounds. The amine compound used as another raw material for the solid-dispersed amine adduct-based latent hardening accelerator should be a compound that has more than one active hydrogen capable of addition reaction with epoxy groups in the molecule and at least one functional group selected from the primary amine group, the secondary amine group, and the tertiary amine group in the molecule. Among these, examples of the amine compound are shown below. However, the above-mentioned amine compound is not limited to these compounds. Examples thereof include aliphatic amines such as diethylenetriamine, triethylenetetramine, n-propylamine, 2-hydroxyethylaminopropylamine, cyclohexylamine, and 4,4'-diamino-dicyclohexylmethane, aromatic amine compounds such as 4,4'-diaminodiphenylmethane or 2-methylaniline, and 2-ethyl-4-methylimidazole, 2-ethyl-4-methylimidazoline, 2,4-dimethylimidazoline, and piperidine. Or heterocyclic compounds containing nitrogen atoms of piperazine. However, the above-mentioned amine compound is not limited to these compounds. [0033] In addition, among these compounds, especially compounds having tertiary amino groups in the molecule are raw materials for providing latent hardening accelerators with excellent hardening accelerating ability. Examples of such compounds include amine compounds such as dimethylaminopropylamine, diethylaminopropylamine, di-n-propylaminopropylamine, dibutylaminopropylamine, dimethylaminoethylamine, diethylaminoethylamine or N-methylpiperazine, and primary or secondary amines having tertiary amine groups in the molecule of imidazole compounds such as 2-methylimidazole, 2-ethylimidazole, 2-ethyl-4-methylimidazole or 2-phenylimidazole. And, as other examples, such as 2-dimethylaminoethanol, 1-methyl-2-dimethylaminoethanol, 1-phenoxymethyl-2-dimethylaminoethanol, 2-diethylaminoethanol, 1-butoxymethyl-2-dimethylaminoethanol, 1-(2-hydroxy-3-phenoxypropyl)-2-methylimidazole, 1-(2-hydroxy-3-phenoxypropyl)-2-ethyl-4-methylimidazole, 1-(2-hydroxy-3-butyl Oxypropyl)-2-methylimidazole, 1-(2-hydroxy-3-butoxypropyl)-2-ethyl-4-methylimidazoline, 1-(2-hydroxy-3-phenoxypropyl)-2-phenylimidazole, 1-(2-hydroxy-3-butoxypropyl)-2-several imidazoline, 2-(dimethylaminomethyl)phenol, 2,4,6-tris(dimethylaminomethyl)phenol, N-β-hydroxyethylmorpholine, 2- Dimethylaminoethanethiol, 2-mercaptopyridine, 2-benzimidazole, 2-mercaptobenzimidazole, 2-mercaptobenzothiazole, 4-mercaptopyridine, N,N-dimethylaminobenzoic acid, N,N-dimethylglycine, niacin, isonicotinic acid, picolinic acid, N,N-dimethylglycine hydrazide, N,N-dimethylpropionate hydrazide, nicotinic acid hydrazide and isonicotinic acid Alcohols with tertiary amino groups in the molecule, such as hydrazine, phenols, thiols, carboxylic acids, and hydrazine, etc. However, the compounds having tertiary amino groups in the above-mentioned molecules are not limited to these compounds. Examples of isocyanate compounds used as solid dispersion-type amine adduct-based latent hardening accelerators and further as another manufacturing raw material are monofunctional isocyanate compounds such as n-butyl isocyanate, isopropyl isocyanate, phenyl isocyanate or benzyl isocyanate, and hexamethylene diisocyanate, tolyl diisocyanate, 1,5-naphthalene diisocyanate, diphenylmethane-4,4'-diisocyanate, isophorone diisocyanate, dimethyl Polyfunctional isocyanate compound of phenylene diisocyanate, p-phenylene diisocyanate, 1,3,6-hexamethylene triisocyanate or biscycloheptane triisocyanate. Furthermore, a terminal isocyanate group-containing compound obtained by reacting the polyfunctional isocyanate compound with an active hydrogen compound, etc. may also be used. Examples of the compound having an isocyanate group at the end include an addition compound having an isocyanate group at the end obtained by reacting toluene diisocyanate with trimethylolpropane, and an addition compound having an isocyanate group at the end obtained by reacting toluene diisocyanate with pentaerythritol. However, the addition compound having an isocyanate group at the terminal is not limited to these compounds. [0035] Also, examples of the urea compound include urea and thiourea. However, the urea compound is not limited to these compounds. [0036] The solid-dispersed latent hardening accelerator usable in this embodiment can be easily prepared as follows, for example. The various components taken are mixed in such a way as to form a combination of the above-mentioned 2 components of amine compound and epoxy compound, these 2 components and 3 components of active hydrogen compound; or a combination of 2 or 3 components of amine compound, isocyanate compound and/or urea compound. Then, the ingredients are reacted at a temperature from room temperature to 200°C. Subsequently, the cooled and solidified reactant was pulverized. Alternatively, the above components are reacted in a solvent such as methyl ethyl ketone, dioxane, or tetrahydrofuran. Next, after removing the solvent, the solid content was pulverized. Among the representative examples of commercially available solid-dispersed latent hardening accelerators, examples of amine-epoxy addition systems (amine addition systems) include "AMICURE PN-23" (trade name of Ajinomoto Precision Technology Co., Ltd.), "AMICURE PN-40" (trade name of Ajinomoto Precision Technology Co., Ltd.), "AMICURE PN-50" (trade name of Ajinomoto Precision Technology Co., Ltd.), "HARDNER X- 3661S" (trade name of ACR Co., Ltd.), "HARDNER X-3670S" (trade name of ACR Co., Ltd.), "NOVACURE HX-3742" (trade name of Asahi Kasei E Materials Co., Ltd.), "NOVACURE HX-3721" (trade name of (stock) trade name), "FXR1121"(T&KTOKA (stock) trade name). Furthermore, examples of the urea-type addition system include "FUJICURE FXE-1000" (trade name of T&K TOKA Co., Ltd.) and "FUJICURE FXR-1030" (trade name of T&K TOKA Co., Ltd.). However, the above-mentioned commercially available products are not limited to these. As the (C) component, one substance may be used alone, or two or more kinds may be used in combination. As the latent hardening accelerator of the component (C), it is preferably a solid dispersion type amine addition latent hardening accelerator from the viewpoint of expiration date and curability. [0038] The [mercaptan equivalent of component (B)]/[acrylic acid equivalent of component (A)] of the resin composition is preferably 0.5 to 2.0. (B) The thiol equivalent of component is the value obtained by dividing the molecular weight of (B) component by the number of thiol groups in 1 molecule. The actual thiol equivalent weight can be determined, for example, by obtaining the thiol value through potential difference measurement. The equivalent weight of the acrylic resin is equal to the value obtained by dividing the molecular weight of the acrylic resin by the number of acrylic (or methacrylic) groups in one molecule. The actual acrylic acid equivalent weight can be determined by, for example, NMR. By setting [mercaptan equivalent of component (B)]/[acrylic acid equivalent of component (A)] in the range of 0.5 to 2.0, acrylic acid and thiol can be reacted over a certain amount, and a high polymer can be formed more reliably. Therefore, high adhesive strength can be more easily exhibited. When the equivalent is less than 0.5 or exceeds 2.0, molecular crosslinking cannot be sufficiently formed. Therefore, bleeding may easily occur on the surface of the cured product, or the peel strength may easily decrease. [0039] From the viewpoint of the adhesive strength of the resin composition, the component (A) is preferably 10 to 90 parts by mass relative to 100 parts by mass of the resin composition. [0040] From the viewpoint of the curing speed and expiration date of the resin composition, the component (C) is preferably 0.1 to 40 parts by mass relative to 100 parts by mass of the resin composition. [0041] The resin composition preferably further contains a radical polymerization inhibitor as the component (D). (D) The radical polymerization inhibitor of component is added in order to improve the storage stability of a resin composition. That is, the radical polymerization inhibitor of (D) component is added in order to suppress progress of an unintentional radical polymerization reaction. (A) The acrylic resin of component (A) may generate free radicals by itself, although the probability is extremely low. Therefore, an unintentional radical polymerization reaction may proceed using the radical as a base point. By adding a radical polymerization inhibitor, progress of the radical polymerization reaction of such unintentional (A) component can be suppressed. [0042] As the (D) component, a known radical polymerization inhibitor can be used. For example, at least one compound selected from the group consisting of N-nitroso-N-phenylhydroxylamine aluminum, triphenylphosphine, p-methoxyphenol and hydroquinone is preferably used. In addition, conventional radical polymerization inhibitors disclosed in JP-A-2010-117545 and JP-A-2008-184514 can also be used. A single substance may be used as (D) component, and 2 or more types may be used together. [0043] The resin composition preferably further contains an anionic polymerization inhibitor as the component (E). The anionic polymerization inhibitor of the component (E) imparts stability during storage to the resin composition. That is, in order to suppress the unintentional reaction of the amine group contained in (C) component and (B) component, the anionic polymerization inhibitor of (E) component is added. (C) The imidazole and the tertiary amine which may be contained in a component have an amine group. The amine group reacts with the (B) component to start polymerization. Latent hardening accelerators are designed not to cause amine reaction at room temperature. However, there is still a slight possibility that the amine may react with the (B) component at room temperature. The component (E) acts to suppress the unintentional reaction between the amine group and the component (B) by reacting with the amine group before the amine group reacts with the component (B). [0044] As the (E) component, a known anionic polymerization inhibitor can be used. At least one compound selected from the group consisting of boric acid esters, aluminum chelates and organic acids is preferably used. As the boric acid ester, for example, boric acid esters disclosed in JP-A-2011-026539 and JP-A-2005/070991 can be used. As the aluminum chelate compound, for example, the aluminum chelate compound disclosed in JP 2005/070991 A can be used. As the organic acid, for example, organic acids disclosed in JP 2002-509178 A can be used. Examples of commercially available (E) components include triisopropyl borate and barbituric acid. A single substance may be used as (E) component, and 2 or more types may be used together. [0045] The content of the component (D) is preferably 0.0001 to 1.0 parts by mass relative to 100 parts by mass of the resin composition. When the content of the component (D) falls within this range, the shelf life of the resin composition can be further extended because the stability of the resin composition during storage can be further improved. [0046] The content of the component (E) is preferably 0.0001 to 1.0 parts by mass relative to 1 part by mass of the component (C). When the content of the component (E) falls within this range, the stability of the resin composition during storage can be further improved. As a result, the validity period of the resin composition can be extended further. [0047] The resin composition of this embodiment preferably further contains (F) a glycidyl group-containing compound other than the acrylic resin having a glycidyl group. The reactivity of (F) component with (B) component by heating is lower than the reactivity of (A) component with (B) component. Therefore, like the anionic polymerization inhibitor of the component (E), the component (F) contributes to the improvement of the storage stability of the resin composition. [0048] The component (F) is preferably an epoxy resin, a vinyl compound having at least one glycidyl group, and a polybutadiene having at least one glycidyl group from the viewpoint of reactivity with the component (B). Examples of commercially available epoxy resins include DIC epoxy resin (product name: EXA835LV) and Nippon Steel & Sumitomo Metal epoxy resin (product name: YDF8170). An example of a commercially available polybutadiene having at least one glycidyl group is epoxidized 1,2-polybutadiene manufactured by ADEKA. As the (F) component, one substance may be used alone, or two or more kinds of substances may be used in combination. [0049] The content of the component (F) is 1 to 50 parts by mass relative to 100 parts by mass of the resin composition from the perspective of the expiration date and UV curability of the resin composition. Moreover, when using an epoxy resin, it is preferable that the value of (thiol equivalent)/[(acrylic acid equivalent)+(epoxy equivalent)] is 0.5-2.0. [0050] The resin composition preferably further contains a radical polymerization initiator. By containing a radical polymerization initiator in the resin composition, the resin composition can be hardened by heating for a short time, that is, by UV irradiation. Usable radical polymerization initiators are not particularly limited. Conventional materials may be used. Specific examples of radical polymerization initiators include dicumyl peroxide, tert-butylcumene peroxide, 1,3-bis(2-tert-butylperoxyisopropyl)benzene or dialkyl peroxides of 2,5-dimethyl-2,5-bis(tert-butylperoxy)hexane, such as 1,1-bis(tert-butylperoxy)cyclohexane, 1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane, 1,1-bis( tert-pentylperoxy)cyclohexane, 2,2-bis(tert-butylperoxy)butane, n-butyl 4,4-bis(tert-butylperoxy)pentanoate or ethyl 3,3-(tert-butylperoxy)butyrate, and peroxyacetals such as tert-butylperoxy 2-ethylhexanoate, 1,1,3,3-tetramethylbutylperoxy 2-ethylhexanoate, tert-butylperoxyisobutyrate, tert-butylperoxyvalerate, or tert-butylperoxybenzene Alkyl peroxy ester of formate. Also, as other examples, 1-hydroxycyclohexyl phenyl ketone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, diethoxybenzophenone, 1-(4-isopropylphenyl)-2-hydroxy-2-methylpropan-1-one, 1-(4-dodecylphenyl)-2-hydroxy-2-methylpropane-1-one, 4-(2-hydroxyethoxy)-phenyl(2-hydroxy-2-propyl) ketone, 2-methyl-1-[ 4-(methylthio)phenyl]-2-morpholinopropane-1, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin n-butyl ether, benzoin phenyl ether, benzoin dimethyl acetal, benzophenone, benzoylbenzoic acid, benzoylbenzoic acid methyl ester, 4-phenylbenzophenone, hydroxybenzophenone, acrylated benzophenone, 4-benzoyl- 4'-Methyldiphenylsulfide, 3,3'-Dimethyl-4-methoxybenzophenone, Thioxanthone, 2-Chlorothioxanthone, 2-Methylthioxanthone, 2,4-Dimethylthioxanthone, Isopropylthioxanthone, 2,4-Dichlorothioxanthone, 2,4-Diethylthioxanthone, 2,4-Diisopropylthioxanthone, 2,4,6-Trimethylbenzoyldiphenylphosphine oxide, Methylphenylglycolate, Biphenylamide and camphorone. A single substance may be used as a radical polymerization initiator, and 2 or more types may be used together. In the resin composition, carbon black, titanium black, silicon oxide filler, alumina filler, talc filler, calcium carbonate filler, PTFE filler, silane coupling agent, ion scavenger, leveling agent, antioxidant, defoamer, thixotropic agent or other additives etc. can also be blended in the scope of not damaging the resin composition characteristic of this embodiment, and according to need. Furthermore, a viscosity modifier, a flame retardant, or a solvent may be blended into the resin composition. Here, carbon black and titanium black can be used as a light-shielding property imparting material. Titanium black is preferably used from the viewpoint of both light-shielding properties and UV curability (hardening depth). Examples of titanium black include titanium black 12S (manufactured by Mitsubishi Materials Electron Chemicals Co., Ltd.), titanium black 13M (manufactured by Mitsubishi Materials Electron Chemicals Co., Ltd.), titanium black 13M-C (manufactured by Mitsubishi Materials Electron Chemicals Co., Ltd.), and Tilack D (manufactured by Ako Chemicals Co., Ltd.). Titanium black 13M is especially good. [0052] The resin composition can be obtained by, for example, stirring, melting, mixing and dispersing components (A) to (C) and other additives simultaneously or individually while applying heat treatment as necessary. The equipment used for such mixing, stirring, dispersing and the like is not particularly limited. A grinder equipped with a stirring device and a heating device, a Henschel mixer, a 3-roll mill, a ball mill, a planetary mixer, or a bead mill can be used. Furthermore, these devices may be used in combination as appropriate. [0053] The resin composition thus obtained is photocurable and thermosetting. The thermosetting temperature of the resin composition is preferably 70~80°C when used in an image sensor module. [0054] The resin composition of this embodiment can be used as, for example, an adhesive, a sealant, a dam agent, and a raw material thereof for joining parts together. Here, the dam agent is pre-formed on the periphery of the substrate, for example, before sealing a plurality of semiconductor wafers with a low-viscosity filler on the substrate. By forming a dam with this dam agent, it is possible to suppress the outflow of the low-viscosity filler agent that subsequently seals a plurality of semiconductor wafers. Moreover, the adhesive containing the resin composition of this embodiment can bond well to engineering plastics, ceramics, and metals. [Example] [0055] Hereinafter, the resin composition of this embodiment will be described by way of examples. However, this embodiment is not limited to these examples. In addition, in the following examples, parts and % represent parts by mass and % by mass unless otherwise specified. [Examples 1-24, Comparative Examples 1-2] With the formulations shown in Table 1-Table 3, a 3-roller mixer was used to prepare the resin composition. The (B') component in Table 1 to Table 3 is equivalent to the aforementioned (B2) component. The (B") component is equivalent to the aforementioned (B1) component. [Peel Strength] Coat the 20mm×60mm area on the lower substrate (SUS-304, smooth plate: 40mm×60mm×0.3mm) with a resin composition. The resin composition on the coated area has a thickness of 50 μm. While paying attention to not entraining air bubbles, the upper substrate (SUS-304 ribs (thickness 20 μm, width 5mm) , length 50mm)) is loaded on the resin composition. In this way, 5 test pieces with a 5mm × 20mm bonding surface are made. Next, the test piece is kept at 80° C. × 60 minutes with a blower dryer, and the resin composition of the test piece is thermally hardened. Thereby, the test piece for peel strength measurement is obtained. , hold the upper side base material of the above-mentioned gained test piece. Then, one end of the hardened object is slightly peeled off, and with an angle of 90 ° and a pull-up speed of 50mm/min, the distance of pulling up to 15mm is peeled off from the test piece. At this time, with the same distance as the pull-up distance, the test piece is moved horizontally in the manner of following the peeling operation. The mean value of the measured value when the pull-up distance is 5 ~ 15mm is defined as the initial peel strength. Peel strength. The test piece used for the above peel strength measurement was placed in a constant temperature and humidity tank for 100 hours under the conditions of temperature 85°C and humidity 85%. The temperature of the test piece taken out of the constant temperature and humidity tank was confirmed to be the same as normal temperature within 1 hour. Using the test piece, the peel strength obtained by the same measurement method as above was defined as the peel strength after the humidity test. And, the retention rate was calculated by the following formula. (Unit: %) Peel strength is preferably more than 0.3N/mm, more preferably more than 0.5N/mm. Show measurement result (unit is N/mm) in table 1～table 3. [0060] 1) Toya Gosei (product name: M7100, acrylic acid equivalent: 188g/eq) 2) Kyoeisha Chemical Co., Ltd. dimethyloltricyclodecane diacrylate (product name: LIGHT ACRYLATE DCP-A, acrylic acid equivalent: 152g/eq) 3) SC Organic Chemicals thiol compound (product name: PEPT, thiol equivalent: 124g/eq) 4) SC Organic Chemicals Mercaptopropionate) (product name: PEMP, mercaptan equivalent: 122.7g/eq) 5) Glycol urea derivatives manufactured by Shikoku Chemical Industries (product name: TS-G, mercaptan equivalent: 100 g/eq) 6) latent hardening accelerator manufactured by Asahi Kasei E Materials (product name: NOVACURE HXA9322HP) 7) latent hardening accelerator manufactured by T&K TOKA (product name: FXR1121) 8) 2-Ethyl-4-methylimidazole (product name: 2E4MZ) manufactured by Shikoku Chemical Industry Co., Ltd. 9) N-Nitroso-N-phenylhydroxylamine aluminum manufactured by Wako Pure Chemical Industry Co., Ltd. 10) Triphenylphosphine (product name: TPP) manufactured by Tokyo Kasei Industry Co., Ltd. Epoxy equivalent: 165g/eq) 15) Epoxy resin manufactured by Nippon Steel & Sumitomo Metal (product name: YDF8170, epoxy equivalent: 158g/eq) 16) Radical polymerization initiator manufactured by BASF (product name: IRGACURE 184) 17) Titanium black manufactured by Mitsubishi Materials (product name: TITAN BLACK 13M) 18) High-purity synthetic spherical silica manufactured by ADOMATECHS (product name: SE2 200SEE, average particle size: 0.6μm) 19) Hydrophobic fumed silica powder manufactured by Japan AEROSIL (product name: R805, average particle size: 20nm) 20) 3-glycidyloxypropyltrimethoxysilane manufactured by Shin-Etsu Chemical Industry (product name: KBM403) [0061] [0062] [Elasticity modulus] A coating film was formed by applying a resin composition to a stainless steel plate (made of SUS-304, smooth plate: 40 mm x 60 mm x 0.3 mm) so that the film thickness at the time of curing was 500 ± 100 μm. The coating film was hardened by standing at 80° C. for 1 hour. The coating film peeled off from the stainless steel plate is cut with a cutter to a specific size (5mm×40mm) coating film. Also, the incision was smoothed with sandpaper. According to JISC6481, using the dynamic thermomechanical measurement (DMA) made by SEIKO INSTRUMENT Co., Ltd., the storage elastic modulus of the cut-out coating film was measured at a frequency of 10 Hz by a tensile method. The storage elastic modulus at 25°C is defined as the initial elastic modulus. The measurement results are shown in Table 4. M means "million (Mega)". And the coating film was placed in a constant temperature and humidity chamber for 100 hours under the conditions of temperature 85°C and humidity 85%. Subsequently, the modulus of elasticity of the coating film after the humidity test was also measured. The measurement results are shown in Table 4. [0064] As understood in table 1 ~ table 3, all embodiments 1 ~ 24, peel strength after initial stage peeling strength and moisture resistance test are more than 0.3N/mm. Moreover, the retention rate was 30% or more. In this way, good results were obtained. On the other hand, in the comparative example 1 which used (B') component instead of (B) component, the peeling strength after a moisture resistance test was 0 N/mm and was remarkably low. The comparative example 2 which used (C') component instead of (C) component caused hardening at the time of blending. Therefore, the peel strength could not be measured (described as "x" in Table 2). Comparative Example 1 in Table 4 could not maintain the shape of the hardened product after the humidity resistance test. Therefore, the modulus of elasticity could not be measured (indicated as "x" in Table 4). [0066] [Test of the follow-up agent strength test of the heterogeneous material] <The continuous strength> The last material (SUS-304 smooth plate, alumina, LCP (LCD polymer), PI (polytamine), PA (polyamide), PI (polytamine), PI (polytamine) ), FR-4 (glass epoxy resin), PE (polyethylene)), and PP (polypropylene) 1 type of material. Subsequently, a test piece was fabricated by placing an upper substrate (SUS-304 with ribs (5 mm in width, 20 μm in thickness, and 50 mm in length)) in the same manner as above. Next, the adhesive of the test piece was thermally hardened by keeping the produced test piece at 80° C. for 60 minutes. Here, LCP, PC, PI, PA and FR-4 are engineering plastics. Among them, LCP and PI are super engineering plastics. Calculate the peel strength before and after the moisture resistance test with the same method as above. The peel strength of 0.3 N/mm or more was evaluated as "○". The peel strength of less than 0.3 N/mm was evaluated as "x". Table 5 shows the results. [0068] As can be seen from Table 5, in Example 1, the test piece with the base material of SUS, alumina and engineering plastic has a high peel strength after the humidity resistance test. On the other hand, in Comparative Example 1, all the test pieces having SUS, alumina, engineering plastics, PE, and PP showed low peel strength after the humidity resistance test. Moreover, in Example 1, the test piece which has the base material of PE and PP showed low initial peel strength. The resin composition of this embodiment may also be the resin composition of the following 1st - 7th. The first resin composition above is characterized by containing (A) an acrylic resin, and (B) a thiol compound represented by the general formula (1): (wherein, R 1 , R 2 , R 3 and R 4 are independently hydrogen or C 3 H 6 SH, and at least one of R 1 , R 2 , R 3 and R 4 is C 3 H 6 SH), and (C) a latent hardening accelerator. The second resin composition is the first resin composition further containing a thiol compound other than (B). The third resin composition is the first or second resin composition further containing (D) a radical polymerization inhibitor. The fourth resin composition is the third resin composition in which the component (D) is at least one compound selected from the group consisting of N-nitroso-N-phenylhydroxylamine aluminum, triphenylphosphine, p-methoxyphenol and hydroquinone. The said 5th resin composition is the resin composition in any one of said 1st - 4th which further contains (E) an anionic polymerization inhibitor. The sixth resin composition is the fifth resin composition in which the component (E) is at least one compound selected from the group consisting of boric acid esters, aluminum chelates, and organic acids. The seventh resin composition is the resin composition according to any one of the first to sixth above, wherein [thiol equivalent of component (B)]/[acrylic acid equivalent of component (A)] is 0.5 to 2.0. The adhesive agent of this embodiment may contain the resin composition in any one of said 1st - 7th. The sealant of this embodiment may contain the resin composition in any one of said 1st - 7th. The dam agent of this embodiment may contain the resin composition of any one of the above-mentioned 1st to 7th. The semiconductor device of this embodiment may also contain the above-mentioned first to seventh resin compositions, a cured product of the above-mentioned adhesive agent, a cured product of the above-mentioned sealing agent, or a cured product of the above-mentioned dam agent. [Industrial Applicability] [0070] The resin composition of this embodiment is a light and thermosetting resin composition that has high adhesive strength (especially high peel strength) after curing, and can suppress the decrease in adhesive strength after curing after a moisture resistance test. Therefore, the resin composition is particularly useful as an adhesive, sealant, and dam.