JPWO2018021061A1 - Imaging unit and endoscope - Google Patents

Abstract

Provided are an imaging unit and an endoscope that can obtain a high-quality image while reducing the diameter. The imaging unit 10 according to the present invention includes an imaging element 21, a semiconductor package 20 having a sensor electrode 23 formed on the back surface, a first connection electrode 31 and a second connection electrode 32, and electronic components 35 and 36. Built-in circuit board 30 in which first connection electrode 31 is connected to sensor electrode 23, third connection electrode 41 is formed on the surface, and cable connection electrodes 42 a and 42 b are formed on two opposite side surfaces. Includes a deformed circuit board 40 connected to the second connection electrode 32, and a cable 60 electrically and mechanically connected to the cable connection electrodes 42a and 42b, and includes the circuit board 30, the deformed circuit board 40, and the cable 60. Is within the projection plane of the semiconductor package 20 in the optical axis direction.

Description

  The present invention relates to an imaging unit and an endoscope.

  Conventionally, endoscope apparatuses have been widely used for various examinations in the medical field and the industrial field. Among these, a medical endoscope apparatus incises a subject by inserting an elongated flexible insertion portion having an imaging element at the tip into the body cavity of the subject such as a patient. Without being able to acquire an in-vivo image inside the body cavity, and further, it is possible to perform a therapeutic treatment by projecting the treatment tool from the distal end of the insertion portion as necessary.

  An imaging unit including an imaging element and a circuit board on which electronic components such as a capacitor and an IC chip that constitute a driving circuit of the imaging element are mounted is fitted in the distal end of the insertion unit of such an endoscope apparatus, A signal cable is soldered to the circuit board of the imaging unit.

  In recent years, the circuit board connected to the image sensor has a three-dimensional structure (T-shaped) for the purpose of simplifying the connection work of the cable signal lines, improving the reliability of the connection part, or reducing the diameter of the image pickup unit. An imaging unit that connects an electronic component or a signal cable to a side surface of a substrate has been proposed (see, for example, Patent Document 1).

JP 2000-199863 A

  However, in Patent Document 1, since the electronic component is mounted at a position away from the image sensor, the impedance is increased and noise is generated. For this reason, there is a possibility that the image pickup element cannot be driven stably, which is a factor of image quality deterioration. This is particularly noticeable when the speed of the image sensor is increased.

  The present invention has been made in view of the above, and an object thereof is to provide an imaging unit and an endoscope that can obtain a high-quality image while reducing the diameter.

  In order to solve the above-described problems and achieve the object, an imaging unit according to the present invention includes a semiconductor package having an imaging element and a sensor electrode formed on the back surface, a first connection electrode and a first connection electrode on the front surface and the back surface. 2 connection electrodes are formed, a plurality of electronic components are built in, a circuit board in which the first connection electrode on the surface is electrically and mechanically connected to the sensor electrode of the semiconductor package, and a third connection on the surface An odd circuit board in which an electrode is formed, a cable connection electrode is formed on two opposing side surfaces, and the third connection electrode is electrically and mechanically connected to the second connection electrode of the circuit board; A plurality of cables electrically and mechanically connected to the cable connection electrodes of the odd-shaped circuit board, and the circuit board, the odd-shaped circuit board, and the plurality of cables are Wherein the fit in the semiconductor package of the optical axis direction of the projection plane.

  In the image pickup unit of the present invention, in the above invention, an electronic component is further mounted on the back surface of the circuit board, and the electronic component connected to the back surface of the circuit board is accommodated on the front surface of the irregular circuit board. A recess is formed.

  The imaging unit according to the present invention is characterized in that, in the above invention, the odd-shaped circuit board contains an electronic component.

  In the image pickup unit of the present invention, in the above invention, the fourth connection electrode and the fifth connection electrode are formed on the front surface and the back surface, respectively, and a plurality of electronic components are built in. The fourth connection electrode and the fifth connection electrode The connection electrode includes a second circuit board electrically and mechanically connected to the second connection electrode of the circuit board and the third connection electrode of the deformed circuit board, respectively.

  The imaging unit according to the present invention is characterized in that, in the above invention, the opposite side surfaces of the odd-shaped circuit board have a gradient so as to approach each other on the proximal end side in the optical axis direction of the imaging element.

  In the imaging unit according to the aspect of the invention, in the invention described above, the deformed circuit board may be configured such that a center surface of two opposing side surfaces on which the cable connection electrodes are formed has a cable connection electrode of the circuit board. Shifted from the center plane of the side surface parallel to the two opposing side surfaces formed, and connected to the circuit board, and further electronic components are connected to the back surface of the circuit board where the deformed circuit board does not contact It is characterized by being.

  An endoscope according to the present invention is characterized in that the imaging unit described above includes an insertion portion provided at a distal end.

  According to the present invention, an electronic component is arranged in the immediate vicinity of an image sensor via a circuit board close to the image sensor, so that the image sensor can be driven at high speed, and a high-quality image can be obtained while reducing the diameter. Can be obtained.

FIG. 1 is a diagram schematically illustrating the overall configuration of the endoscope system according to the first embodiment of the present invention. FIG. 2 is a perspective view of an imaging unit arranged at the distal end portion of the endoscope shown in FIG. FIG. 3 is a side view of the imaging unit shown in FIG. FIG. 4 is a side view of the imaging unit according to the first modification of the first embodiment of the present invention. FIG. 5 is a side view of the imaging unit according to the second modification of the first embodiment of the present invention. FIG. 6 is a side view of the imaging unit according to the third modification of the first embodiment of the present invention. FIG. 7 is a side view of the imaging unit according to the fourth modification of the first embodiment of the present invention. FIG. 8 is a side view of the imaging unit according to the second embodiment of the present invention. FIG. 9 is a side view of the imaging unit according to the first modification of the second embodiment of the present invention. FIG. 10 is a perspective view of the imaging unit according to the third embodiment of the present invention. FIG. 11 is a side view of the imaging unit shown in FIG. FIG. 12 is a side view of the imaging unit according to the first modification of the third embodiment of the present invention.

  In the following description, an endoscope system including an imaging unit will be described as a mode for carrying out the present invention (hereinafter referred to as “embodiment”). Moreover, this invention is not limited by this embodiment. Furthermore, the same code | symbol is attached | subjected to the same part in description of drawing. Furthermore, the drawings are schematic, and it should be noted that the relationship between the thickness and width of each member, the ratio of each member, and the like are different from the actual ones. Moreover, the part from which a mutual dimension and ratio differ also in between drawings.

(Embodiment 1)
FIG. 1 is a diagram schematically illustrating the overall configuration of the endoscope system according to the first embodiment of the present invention. As shown in FIG. 1, an endoscope system 1 according to the present embodiment is introduced into a subject, an endoscope 2 that images the inside of the subject and generates an image signal in the subject, An information processing device 3 that performs predetermined image processing on an image signal captured by the endoscope 2 and controls each part of the endoscope system 1, a light source device 4 that generates illumination light of the endoscope 2, and information processing And a display device 5 that displays an image of an image signal after image processing by the device 3.

  The endoscope 2 includes an insertion unit 6 to be inserted into a subject, an operation unit 7 on the proximal end side of the insertion unit 6 and held by an operator, and a flexible universal extending from the operation unit 7. Code 8 is provided.

  The insertion portion 6 is realized using an illumination fiber (light guide cable), an electric cable, an optical fiber, and the like. The insertion portion 6 has a distal end portion 6a in which an imaging unit to be described later is incorporated, a bendable bending portion 6b constituted by a plurality of bending pieces, and a flexibility provided on the proximal end side of the bending portion 6b. Flexible tube portion 6c. The distal end portion 6a includes an illumination unit that illuminates the inside of the subject via an illumination lens, an observation unit that images the inside of the subject, an opening that communicates with the treatment instrument channel, and an air / water supply nozzle (not shown). Is provided.

  The operation unit 7 includes a bending knob 7a that bends the bending portion 6b in the vertical direction and the left-right direction, a treatment instrument insertion portion 7b in which a treatment instrument such as a biological forceps and a laser knife is inserted into the body cavity of the subject, and an information processing device 3. A plurality of switch units 7c for operating peripheral devices such as the light source device 4, the air supply device, the water supply device, and the gas supply device. The treatment instrument inserted from the treatment instrument insertion portion 7b is exposed from the opening at the distal end of the insertion portion 6 through a treatment instrument channel provided therein.

  The universal cord 8 is configured using an illumination fiber, a cable, or the like. The universal cord 8 is branched at the base end, one end of the branch is the connector 8a, and the other base end is the connector 8b. The connector 8a is detachable from the connector of the information processing apparatus 3. The connector 8b is detachable from the light source device 4. The universal cord 8 propagates the illumination light emitted from the light source device 4 to the distal end portion 6a via the connector 8b and the illumination fiber. Further, the universal code 8 transmits an image signal picked up by an image pickup unit described later to the information processing apparatus 3 via a cable and a connector 8a.

  The information processing device 3 performs predetermined image processing on the image signal output from the connector 8a and controls the entire endoscope system 1.

  The light source device 4 is configured using a light source that emits light, a condensing lens, and the like. The light source device 4 emits light from the light source under the control of the information processing device 3, and illuminates the inside of the subject, which is the subject, to the endoscope 2 connected via the connector 8b and the illumination fiber of the universal cord 8. Supply as light.

  The display device 5 is configured using a display or the like using liquid crystal or organic EL (Electro Luminescence). The display device 5 displays various types of information including images that have been subjected to predetermined image processing by the information processing device 3 via the video cable 5a. Thereby, the surgeon can observe and characterize a desired position in the subject by operating the endoscope 2 while viewing the image (in-vivo image) displayed on the display device 5.

  Next, the imaging unit used in the endoscope system 1 will be described in detail. FIG. 2 is a perspective view of the imaging unit 10 arranged at the distal end portion of the endoscope shown in FIG. FIG. 3 is a side view of the imaging unit 10 shown in FIG.

  The imaging unit 10 includes an imaging element 21, the semiconductor package 20 in which the sensor electrode 23 is formed on the f2 surface that is the back surface, and the first connection electrode 31 and the second connection on the f3 surface that is the front surface and the f4 surface that is the back surface. Each of the connection electrodes 32 is formed, and the third connection electrode 41 is formed on the circuit board 30 containing the electronic components 35 and 36, and the surface f5, and the f6 and f7 surfaces that are the opposite side surfaces. And a plurality of cables 60 electrically and mechanically connected to the cable connection electrodes 42a and 42b of the variant circuit board 40, respectively.

  In the imaging unit 10, the circuit board 30, the irregular circuit board 40, and the plurality of cables 60 connected to the irregular circuit board 40 are sized to fit within the projection plane of the semiconductor package 20 in the optical axis direction.

  The semiconductor package 20 has a structure in which a glass 22 is attached to the image sensor 21. The light collected by the lens unit is incident on the light receiving surface of the image pickup device 21 including the light receiving portion via the f1 surface which is the surface of the glass 22. A sensor electrode 23 and a first solder ball 24 are formed on the f2 surface (back surface) of the image sensor 21. The first solder balls 24 may be metal core solder balls, resin core solder balls, Au bumps, or the like. The semiconductor package 20 is a CSP (Chip Size Package) in which an image pickup device chip in a wafer state is subjected to wiring, electrode formation, resin sealing, and dicing, and finally the size of the image pickup device chip becomes the size of the semiconductor package. ) Is preferable.

  The circuit board 30 is formed in a plate shape by laminating a plurality of substrates on which wiring is formed (a plurality of substrates parallel to the f3 surface and the f4 surface are laminated). As a substrate to be laminated, a ceramic substrate, a glass epoxy substrate, a flexible substrate, a glass substrate, a silicon substrate, or the like is used. Inside the circuit board 30, electronic parts 35 and 36 are built, and a plurality of vias are formed for conducting the wiring on the stacked boards. The electronic components 35 and 36 are passive components such as capacitors and resistance coils, and active components such as driver ICs. In the first embodiment, by incorporating the electronic components 35 and 36 in the circuit board 30, the distance between the image sensor 21 and the electronic components 35 and 36 can be shortened, so that the impedance can be reduced and the image sensor 21 is stable. High quality images can be obtained by enabling efficient driving.

  A first connection electrode 31 is formed on the f3 surface of the circuit board 30 and is electrically and mechanically connected to the sensor electrode 23 of the semiconductor package 20 via the first solder balls 24, respectively. The connection portion between the first connection electrode 31 on the f3 surface and the sensor electrode 23 on the f2 surface is sealed with a sealing resin (not shown).

  Further, the second connection electrode 32 is formed on the two opposite sides of the f4 surface of the circuit board 30 and is electrically connected via the third connection electrode 41 and the second solder ball 33 on the f5 surface of the deformed circuit board 40 described later. Connected mechanically and mechanically. The second solder ball 33 may be a metal core solder ball, a resin core solder ball, an Au bump, or the like. In the first embodiment, the second connection electrodes 32 are arranged along two opposing sides. However, the present invention is not limited to this, and the second connection electrodes 32 may be arranged uniformly over the entire f4 surface.

  The odd-shaped circuit board 40 is made of a ceramic substrate, a glass epoxy substrate, a glass substrate, a silicon substrate, or the like, and a plurality of substrates on which wiring is formed are stacked, and the opposing f6 surface and f7 surface are in the optical axis direction of the semiconductor package 20 Are adjacent to each other (the distance between the f6 surface and the f7 surface is shortened on the proximal end side), that is, step portions S1, S2, and S3 are formed on the f6 surface and the f7 surface.

  A third connection electrode 41 is formed on the f5 surface of the odd-shaped circuit board 40, and is electrically and mechanically connected to the second connection electrode 32 of the circuit board 30 and the second solder ball 33, respectively. The connection portion between the second connection electrode 32 on the f4 surface and the third connection electrode 41 on the f5 surface is sealed with a sealing resin (not shown).

  A groove-like cable connection electrode 42a is formed on the step S3 on the f6 surface, and the core wire 61 exposed by peeling the outer skin 62 of the cable 60 is electrically and mechanically connected to the groove by solder or the like (not shown). ing. By forming the cable connection electrode 42a into a groove shape and accommodating and connecting the core wire 61 of the cable 60, the cable 60 can be accommodated in the projection plane in the optical axis direction of the semiconductor package 20 even when the cable 60 has a large diameter. The imaging unit 10 can be reduced in diameter. Further, by forming the cable connection electrode 42a into a groove shape, the solder for cable connection is anchored in the laminated substrate inner layer constituting the deformed circuit board 40, so that the connection strength of the cable is improved and the large diameter is increased. It is hard for cable disconnection to occur. Further, a flat cable connection electrode 42b is formed on the step S3 on the f7 surface, and the core wire 61 exposed by peeling off the outer skin 62 of the cable 60 is electrically and mechanically connected. In the first embodiment, only the cable connection electrode 42a on the f6 surface has a groove shape. However, depending on the width of the stepped portion of the irregular circuit board 40, the diameter of the cable 60 to be used, the size of the semiconductor package 20, etc. The cable connection electrodes on both the surface and the f7 surface may have a groove shape, or both may have a flat structure. Moreover, when there are many cables 60 to be used, a cable connection electrode can be formed in the staircase portion S2. When forming the cable connection electrodes on the staircase portions S2 and S3, it is preferable to arrange them in a staggered pattern (zigzag).

  In the first embodiment, since the f6 surface and the f7 surface of the odd-shaped circuit board 40 are stepped so as to be close to each other on the proximal end side in the optical axis direction of the semiconductor package 20, the cable 60 to be connected has a large diameter. In this case as well, if the cable 60 is connected to the staircase portion S3 on the base end side, the cable 60 can be accommodated in the projection plane in the optical axis direction of the semiconductor package 20, and the imaging unit 10 can be reduced in diameter. .

  In the first embodiment, since the distance between the image sensor 21 and the electronic components 35 and 36 can be shortened by incorporating the electronic components 35 and 36 in the circuit component 30, the impedance can be reduced, and the image sensor 21. High-quality images can be obtained. The electronic components 35 and 36 are preferably mounted on the circuit board 30. However, when the number of electronic components to be mounted is large, the electronic components 35 and 36 can be mounted on the f8 surface which is the back surface of the odd circuit board 40. For example, a decoupling capacitor or the like that wants to suppress impedance by being close to the image sensor 21 is built in the circuit board 30, and a coupling capacitor that is not required to suppress impedance by being close to the image sensor 21 may be mounted on the f8 surface. it can.

  In the first embodiment, the electronic components 35 and 36 are built in the circuit board 30. However, when the number of electronic components 35 and 36 to be mounted is large, the electronic components are mounted on the back surface f4 of the circuit board 30. May be. FIG. 4 is a side view of the imaging unit 10A according to the first modification of the first embodiment of the present invention.

  In the imaging unit 10A, the electronic components 35 and 36 are built in the circuit board 30A and mounted on the f4 surface which is the back surface of the circuit board 30A. On the f5 surface of the odd-shaped circuit board 40A, there is formed a recess 43 that accommodates the electronic components 35 and 36 mounted on the f4 surface of the circuit board 30A. In the first modification, the distance between the image sensor 21 and the electronic components 35 and 36 can be shortened by incorporating the electronic components 35 and 36 in the circuit board 30A and mounting the electronic components 35 and 36 on the f4 surface. The image pickup element 21 can be driven stably, and a high-quality image can be obtained. Further, since the concave portion 43 is provided on the f5 surface of the odd-shaped circuit board 40A and the electronic components 35 and 36 are accommodated, the hard portion length (the length of the hard portion in the optical axis direction of the imaging unit 10A) can be shortened.

  Furthermore, you may have multiple circuit boards which incorporate the electronic components 35 and 36. FIG. FIG. 5 is a side view of the imaging unit 10E according to the second modification of the first embodiment of the present invention.

  The imaging unit 10E has the first connection electrode 31-1 and the second connection electrode 32-1 formed on the front surface f3-1 and the back surface f4-1, respectively, and includes the electronic components 35 and 36, and the first connection electrode The first circuit board 30E-1 31-1 is electrically and mechanically connected to the sensor electrode 23 of the semiconductor package 20, and the fourth connection electrode 31-2 and the fifth are connected to the front surface f3-2 and the back surface f4-2. Each of the connection electrodes 32-2 is formed, and the electronic components 35 and 36 are incorporated. The fourth connection electrode 31-2 and the fifth connection electrode 32-2 are the second connection electrodes of the first circuit board 30E-1. 32-1 and the third circuit board 30E-2 electrically and mechanically connected to the third connection electrode 41 of the odd-shaped circuit board 40. In the fourth modification, the first circuit board 30E-1 and the second circuit board 30E-2 having the same shape are connected in the optical axis direction so that the imaging unit 10E on which many electronic components 35 and 36 are mounted. Can be obtained. By using the first circuit board 30E-1 and the second circuit board 30E-2 having the same shape, the manufacturing process can be simplified.

  Moreover, it can replace with the 2nd circuit board 30E-2, and can also use the 3rd circuit board by which the recessed part 54 which accommodates the electronic components 35 and 36 was formed in the back surface f10 side. FIG. 6 is a side view of the imaging unit 10F according to the third modification of the first embodiment of the present invention.

  In the imaging unit 10F, the fourth connection electrode 51 and the fifth connection electrode 52 are formed on the front surface f9 and the back surface f10, respectively, and the concave portion 54 that houses the electronic components 35 and 36 is formed on the back surface f10 side. The electrode 51 and the fifth connection electrode 52 include a third circuit board 50 that is electrically and mechanically connected to the second connection electrode 32 of the circuit board 30 and the third connection electrode 41 of the odd-shaped circuit board 40, respectively.

  The third circuit board 50 is connected between the circuit board 30 and the odd circuit board 40, but may be connected between the semiconductor package 20 and the circuit board 30. FIG. 7 is a side view of the imaging unit 10G according to the fourth modification of the first embodiment of the present invention.

  In the imaging unit 10G, the third circuit board 50 includes a concave portion 54 in which the fourth connection electrode 51 and the fifth connection electrode 52 are formed on the front surface f9 and the back surface f10, respectively, and the electronic components 35 and 36 are accommodated on the back surface f10 side. The fourth connection electrode 51 and the fifth connection electrode 52 are electrically and mechanically connected to the sensor electrode 23 of the semiconductor package 20 and the first connection electrode 31 of the circuit board 30, respectively.

(Embodiment 2)
In the second embodiment, the electronic component is built in the irregular circuit board in addition to the circuit board. FIG. 8 is a side view of the imaging unit 10H according to the second embodiment of the present invention.

  In the imaging unit 10H, the odd-shaped circuit board 40H includes electronic components 35 and 36. Since the imaging unit 10H includes the electronic components 35 and 36 in the modified circuit board 40H in addition to the circuit board 30, the mounting density of the electronic components 35 and 36 is improved and the hard portion length (in the optical axis direction of the imaging unit 10H) is improved. The length of the hard part) can be shortened.

  Alternatively, a larger number of electronic components 35 and 36 may be built in the irregular circuit board, and the semiconductor package 20 and the irregular circuit board may be directly connected. FIG. 9 is a side view of an imaging unit 10J according to the first modification of the second embodiment of the present invention.

  In the imaging unit 10 </ b> J, the odd-shaped circuit board 40 </ b> J includes electronic components 35, 36 including the electronic components 35, 36 embedded in the circuit board 30, and the third connection electrode 41 formed on the f5 surface side that is the surface. Are electrically and mechanically connected to the sensor electrode 23 formed on the f2 surface which is the back surface of the semiconductor package 20. Since the imaging unit 10J incorporates more electronic components 35 and 36 in the odd-shaped circuit board 40J, the hard portion length (the length of the hard portion in the optical axis direction of the imaging unit 10J is improved while improving the mounting density of the electronic components 35 and 36. Can be further shortened.

(Embodiment 3)
In the third embodiment, the size of the odd-shaped circuit board in the optical axis direction is smaller than the size of the circuit board (semiconductor package) in the optical axis direction, and an electronic component mounting region is provided on the back surface of the circuit board. . FIG. 10 is a perspective view of an imaging unit 10L according to the third embodiment of the present invention. FIG. 11 is a side view of the imaging unit 10L shown in FIG.

  In the imaging unit 10L, the odd-shaped circuit board 40L is formed so that the size in the optical axis direction is smaller than the size in the optical axis direction of the circuit board 30L and the semiconductor package 20. The odd-shaped circuit board 40L has a staircase shape in which the opposed f6 surface and f7 surface are close to each other on the base end side in the optical axis direction of the semiconductor package 20, that is, the f6 surface and the f7 surface have stepped portions S1, S2, And S3 are formed.

  The deformed circuit board 40L has the opposite f6 and f7 surfaces on which the cable connection electrodes 42a and 42b are formed, and the center surface a1 of the deformed circuit board 40L and the opposite f6 and f7 surfaces on which the cable connection electrodes 42b are formed. Is shifted from the center plane a2 of the side surface of the circuit board 30L parallel to the circuit board 30L and connected to the circuit board 30L.

  An odd-shaped circuit board mounting area A1 and an electronic component mounting area A2 are provided on the back surface f4 of the circuit board 30L. The second connection electrode 32 connected to the third connection electrode 41 of the irregular circuit board 40L is arranged in the irregular circuit board mounting region A1, and the electronic component 35 is mounted in the electronic component mounting region A2. As shown in FIG. 11, the f6 plane of the odd-shaped circuit board 40L and the center plane a1 of the f6 plane are connected so as to shift from the center plane a2 of the circuit board 30L (shifted to the left in FIG. 11). Thereby, one side of the back surface f4 of the circuit board 30L can be used as the electronic component mounting region S2.

  In addition, the imaging unit 10L can be reduced in diameter because the circuit board 30L, the irregular circuit board 40L, and the plurality of cables 60 are positioned within a projection plane in the optical axis direction of the semiconductor package 20. .

  The odd-shaped circuit board only needs to have a gradient that is close to the base end side in the optical axis direction of the semiconductor package, and the stepped portions may not be provided on both sides of the opposing f6 surface and f7 surface. . FIG. 12 is a side view of the imaging unit 10M according to the first modification of the third embodiment of the present invention.

  In the imaging unit 10M, the irregular circuit board 40M is provided with stepped portions S1, S2, and S3 only on the f6 plane, and the center plane a1 of the f6 plane and the f7 plane is formed with the cable connection electrodes 42a and 42b of the irregular circuit board 40M. The circuit board 30M is connected to the circuit board 30M while being shifted from the center plane a2 of the side surface parallel to the f6 surface and the f7 surface of the facing circuit board 30M.

  The imaging unit and the endoscope of the present invention are useful for an endoscope system that requires a high-quality image and a reduced diameter of the distal end portion.

DESCRIPTION OF SYMBOLS 1 Endoscope system 2 Endoscope 3 Information processing apparatus 4 Light source apparatus 5 Display apparatus 6 Insertion part 6a Tip part 6b Bending part 6c Flexible tube part 7 Operation part 7a Bending knob 7b Treatment tool insertion part 7c Switch part 8 Universal code 8a, 8b Connector 10, 10A, 10E, 10F, 10G, 10H, 10J, 10L, 10M Imaging unit 20 Semiconductor package 21 Imaging element 22 Glass 23 Sensor electrode 24 First solder ball 30, 30A Circuit board 31 First connection electrode 32 Second connection electrode 33 Second solder ball 35, 36 Electronic component 40, 40A, 40L Modified circuit board 41 Third connection electrode 42a, 42b Cable connection electrode 43 Recess 50 Third circuit board 60 Cable 61 Core wire 62 Skin

Claims (7)

A semiconductor package having an image sensor and having a sensor electrode formed on the back surface;
A first connection electrode and a second connection electrode are formed on the front surface and the back surface, respectively, and a plurality of electronic components are incorporated, and the first connection electrode on the front surface is electrically and mechanically connected to the sensor electrode of the semiconductor package. A circuit board,
A variant in which a third connection electrode is formed on the surface, a cable connection electrode is formed on two opposing side surfaces, and the third connection electrode is electrically and mechanically connected to the second connection electrode of the circuit board. A circuit board;
A plurality of cables electrically and mechanically connected to the cable connection electrodes of the odd circuit board;
With
The imaging unit, wherein the circuit board, the odd-shaped circuit board, and the plurality of cables are within a projection plane in the optical axis direction of the semiconductor package.   The electronic component is further mounted on the back surface of the circuit board, and a recess for accommodating the electronic component connected to the back surface of the circuit board is formed on the front surface of the odd circuit board. The imaging unit according to 1.   The imaging unit according to claim 1, wherein the odd-shaped circuit board includes an electronic component.   A fourth connection electrode and a fifth connection electrode are formed on the front surface and the back surface, respectively, and a plurality of electronic components are built in. The fourth connection electrode and the fifth connection electrode are the second connection electrode of the circuit board and The imaging unit according to claim 1, further comprising a second circuit board electrically and mechanically connected to the third connection electrode of the odd circuit board.   5. The imaging unit according to claim 1, wherein the opposite side surfaces of the odd-shaped circuit board have a gradient that approaches the proximal end side in the optical axis direction of the imaging element. The deformed circuit board has a center surface of two side surfaces facing each other on which the cable connection electrode is formed, and a center surface of a side surface of the circuit board parallel to the two facing side surfaces on which the cable connection electrode is formed. Connected to the circuit board shifted from the surface,
6. The imaging unit according to claim 5, wherein an electronic component is further connected to a region of the back surface of the circuit board that is not in contact with the odd circuit board.   An endoscope, wherein the imaging unit according to any one of claims 1 to 6 includes an insertion portion provided at a distal end.

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