JPWO2018012203A1 - Wiring board manufacturing method and wiring board - Google Patents

Abstract

An object of the present invention is to provide a method of manufacturing a wiring board, which can more easily manufacture a wiring board formed by arranging two conductive films having a three-dimensional shape so as to face each other. Another object is to provide a wiring board. The method for manufacturing a wiring board according to the present invention comprises a step A of preparing two conductive films having a three-dimensional shape, comprising a substrate and a patterned metal layer disposed on at least one main surface of the substrate, One of the conductive films is placed on one of the first and second dies, and the other of the conductive films is placed on the other of the first and second dies. Placing the first mold and the second mold, injecting the resin into the mold cavity formed by the first mold and the second mold, and And B) manufacturing a wiring substrate having a resin layer disposed therebetween.

Description

  The present invention relates to a method of manufacturing a wiring board and a wiring board.

  Conductive films in which a metal layer is formed on a substrate are used in various applications. For example, in recent years, the demand for a conductive film for a capacitive touch panel sensor capable of multipoint detection has been rapidly expanding along with the increase in the mounting rate of touch panels on mobile phones, portable game devices and the like.

  On the other hand, with the widespread use of devices such as touch panels as described above, the types of devices on which these are mounted are diversified, and in order to further improve the operability of the devices, a touch panel having a curved touch surface is required. A conductive film having a three-dimensional shape is used for the manufacture of a touch panel having a curved touch surface. For example, in Patent Document 1, “1) On a substrate, composed of reducing polymer particles and a binder The step of providing a coating layer, 2) the step of three-dimensionally molding the substrate provided with the coating layer, and 3) the step of providing a plating film by electroless plating on the coating layer A method of producing a three-dimensional-shaped plated material, which is characterized by the

JP, 2011-74407, A

In general, a wiring substrate for a capacitive touch panel sensor (hereinafter also referred to as "touch sensor") is disposed by facing two conductive films having a pattern-like metal layer disposed on one side. It can be formed. When the inventor of the present invention attempted to manufacture a wiring board for a touch sensor having a curved surface shape by bonding the three-dimensional plated material described in Patent Document 1 above, in the case of bonding two conductive films. In addition, wrinkles and misalignment occur in the conductive film, making it difficult to manufacture the wiring board.
In addition, air bubbles generated at the time of bonding exist between the two conductive films of the manufactured wiring substrate, and there is a problem that the detection accuracy is lowered when the wiring substrate is applied to a touch sensor. Found out.

Then, this invention makes it a subject to provide the manufacturing method of a wiring board which can manufacture more easily the wiring board which arrange | positions two electroconductive films which have a three-dimensional shape opposingly, and can be manufactured more easily.
Another object of the present invention is to provide a wiring board.

  As a result of intensive studies to achieve the above-mentioned problems, the present inventor has found that the above-mentioned problems are achieved by the following configuration.

[1] Step A of preparing two sheets of a conductive film having a three-dimensional shape, including a substrate and a patterned metal layer disposed on at least one of the main surfaces of the substrate, a first mold and a second One of the conductive films is disposed on one of the dies, and the other of the conductive films is disposed on the other of the first and second dies. The mold and the second mold are clamped, and the resin is injected into the mold cavity formed by the first mold and the second mold, and the two conductive films are disposed via the resin layer. And B. manufacturing the wiring substrate.
[2] Step A forms a pattern-like to-be-plated layer containing a functional group that interacts with a plating catalyst or its precursor on a substrate to obtain a substrate with a to-be-plated layer X1, and a to-be-plated layer Step X2 of obtaining a substrate with a to-be-plated layer having a three-dimensional shape by deforming the substrate with a plate, plating the pattern-like substrate to be plated in the substrate with a to-be-plated layer having a three-dimensional shape A process X3 of forming a pattern-like metal layer on the plating layer, and a process of applying a plating catalyst or a precursor thereof to the pattern-like plated layer after the process X2 and before the process X3 The method for producing a wiring board according to [1], further comprising X4, or wherein a plating catalyst or a precursor thereof is contained in the pattern-like layer to be plated in step X1.
[3] The layer to be plated is obtained by curing a layer to be plated precursor layer formed of a composition for forming a layer to be plated containing a polymerization initiator and the following compound X or composition Y: The manufacturing method of the wiring board as described in [2].
Compound X: functional group interacting with plating catalyst or precursor thereof, and compound containing polymerizable group Composition Y: compound containing functional group interacting with plating catalyst or precursor thereof, and polymerizability Composition Containing Compound Containing Group [4] A step of forming a to-be-plated layer precursor layer containing a functional group that interacts with a plating catalyst or its precursor on a substrate, and patternwise Applying a pattern of energy to the layer-to-be-plated precursor layer through the photomask having the opening, and developing the layer-to-be-plated precursor layer after the energy is applied to form a pattern-like layer to be plated Obtaining the wiring board according to [2] or [3].
[5] The method for producing a wiring board according to any one of [1] to [4], wherein the substrate is made of polycarbonate.
[6] The method for producing a wiring board according to any one of [1] to [5], wherein the resin is made of polycarbonate.
[7] In step B, one of the conductive films is disposed on one of the first and second dies, and the other of the first and second dies is placed. When the other of the conductive films is disposed on the main surface, the main surfaces on which the pattern-like metal layers provided in the two conductive films are disposed are disposed on the mold cavity side, respectively [1] The manufacturing method of the wiring board in any one of [6].
[8] Any one of [1] to [7], wherein at least one of the two conductive films has a self-repairing layer on the main surface opposite to the main surface on which the pattern-like metal layer is disposed. The manufacturing method of the wiring board as described in-.
[9] The method for manufacturing a wiring board according to any one of [1] to [8], wherein the wiring board is a wiring board for a touch sensor.
[10] The wiring board is a wiring board for a capacitive touch sensor, and one of two conductive films is a transmitting conductive film, and the other is a receiving conductive film [, The manufacturing method of the wiring board in any one of 1]-[9].
[11] A substrate and a patterned metal layer disposed on at least one of the main surfaces of the substrate, containing two conductive films having a three-dimensional shape, and a resin layer, and two conductive Wiring board, in which a conductive film is disposed via a resin layer.
[12] The pattern-like metal layers respectively provided in the two conductive films are disposed to face each other via the resin layer, and the respective pattern-like metal layers are in direct contact with the resin layer, [ 11].
[13] The device according to [11] or [12], wherein at least one of the two conductive films has a self-repairing layer on the main surface opposite to the main surface on which the pattern-like metal layer is disposed. Wiring board.

ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of the wiring board which can manufacture more easily the wiring board which arrange | positions the two conductive films which have a three-dimensional shape opposingly can be provided more easily.
Further, according to the present invention, it is possible to provide a wiring board having the above characteristics.

1 is a cross-sectional view of an embodiment of a conductive film having a three-dimensional shape. It is a perspective view of the electroconductive film of FIG. It is a partially expanded sectional view of the electroconductive film of FIG. It is a partially expanded top view of a pattern-form metal layer. It is the schematic diagram which has arrange | positioned the electroconductive film of 2 sheets, respectively on a 1st metal mold | die and a 2nd metal mold | die. It is a schematic diagram at the time of clamping a 1st metal mold | die and a 2nd metal mold | die. It is a sectional view of one embodiment of a wiring board. It is the schematic diagram which has arrange | positioned the electroconductive film of 2 sheets, respectively on a 1st metal mold | die and a 2nd metal mold | die. It is the schematic diagram which has arrange | positioned the electroconductive film of 2 sheets, respectively on a 1st metal mold | die and a 2nd metal mold | die. It is a schematic diagram of the elongate board | substrate wound by roll shape.

Hereinafter, the method of manufacturing the wiring board according to the embodiment of the present invention will be described in detail.
In addition, the numerical range represented using "-" in this specification means the range which contains the numerical value described before and after "-" as a lower limit and an upper limit. Further, the drawings in the present invention are schematic diagrams for facilitating the understanding of the invention, and the relationship or positional relationship between the thickness of each layer and the like do not necessarily coincide with the actual one.
In addition, (meth) acryloyl is intended for acryloyl and / or methacryloyl. In addition, (meth) acrylic means acrylic and / or methacrylic.

[Method 1 of manufacturing wiring board]
In the method of manufacturing a wiring board according to the first embodiment of the present invention, two conductive films having a three-dimensional shape are disposed on two molds (first and second molds), respectively. The method is characterized in that a resin is injected into a mold cavity formed by the above-described mold (hereinafter, the above-described molding method is also referred to as "insert molding").
By injecting the resin between two opposing conductive films by insert molding, air bubbles are not mixed between the two conductive films, and the wiring substrate can be manufactured more easily.
Below, the procedure of each process is explained in full detail, referring to drawings.

[Step A]
Process A is a process of preparing two conductive films each having a three-dimensional shape, including a substrate and a patterned metal layer disposed on at least one main surface of the substrate.
In the present specification, preparation is intended to manufacture the conductive film using a raw material described later, or to procure the conductive film by a method such as simply purchasing.

<Conductive film>
The conductive film prepared in step A comprises a substrate and a patterned metal layer disposed on at least one major surface of the substrate. In the present specification, the main surface is intended to be the surface having the largest area facing each other among surfaces constituting the substrate, and typically corresponds to the surface facing in the thickness direction of the substrate.
For example, FIG. 7 is a schematic view of a long substrate wound in a roll. As shown in FIG. 7, the long substrate 70 includes the main surface 71 (note that the main surface 71 and the opposite surface opposite in the thickness direction also become the other main surface).

  In step A, two conductive films are prepared. The two conductive films prepared may be the same or different. For example, in the case where the wiring substrate according to the above-described embodiment is for a capacitive touch sensor of mutual capacitance system, a patterned metal layer to be described later provided in two opposing conductive films has a vertical and horizontal two-dimensional matrix Preferably, the electrodes are arranged in the form of a circle. Therefore, it is preferable that the patterns of the metal layers disposed on the two conductive films be different from each other.

FIG. 1 shows one embodiment of the conductive film prepared in this process. FIG. 2A is a perspective view of an embodiment of the conductive film, and FIG. 1 is a cross-sectional view taken along the line A-A. FIG. 2B is a partially enlarged view of the conductive film.
As shown in FIG. 1, FIG. 2A and FIG. 2B, the conductive film 10 includes a substrate 12 and a patterned metal layer 14 disposed on one main surface of the substrate 12, partially It has a hemispherical three-dimensional shape. That is, the substrate 12 has the hemispherical portion 12a and the flat portion 12b extending outward from the bottom of the hemispherical portion 12a, and the metal layer 14 in a pattern form is mainly disposed on the hemispherical portion 12a. Further, as shown in FIG. 2B, the patterned metal layer 14 disposed on the hemispherical portion 12a is disposed on the outer surface of the hemispherical portion 12a.

In addition, although the form of a hemispherical conductive film was shown in FIG. 1, FIG. 2A, and FIG. 2B, if a conductive film has a three-dimensional shape (three-dimensional shape), it will be in this form. It is not restricted. Examples of the three-dimensional shape include a three-dimensional shape including a curved surface, and more specifically, a semi-cylindrical shape, a corrugated shape, a convex-concave shape, and a cylindrical shape.
Moreover, in FIG. 1, FIG. 2A, and FIG. 2B, although the pattern-form metal layer 14 is arrange | positioned on the outer surface of the hemispherical part 12a of the board | substrate 12, it is not restrict | limited to this form. For example, it may be disposed on the inner surface of the hemispherical portion 12 a of the substrate 12.
Further, as shown in FIG. 2A, the five metal layers 14 in a pattern are arranged in a stripe, but the present invention is not limited to this form, and any arrangement pattern may be used.

FIG. 2C is a partially enlarged top view of the patterned metal layer 14. The patterned metal layer 14 is composed of a plurality of thin metal wires 30 and includes a plurality of lattices 31 of intersecting thin metal wires 30. It has a mesh-like pattern.
The line width of the thin metal wire 30 is not particularly limited, but is preferably 1000 μm or less, more preferably 500 μm or less, still more preferably 300 μm or less, preferably 2 μm or more, and more preferably 10 μm or more.
The thickness of the thin metal wire 30 is not particularly limited, but from the viewpoint of conductivity, it can be selected from 0.00001 to 0.2 mm, preferably 30 μm or less, more preferably 20 μm or less, and still more preferably 0.01 to 9 μm. And 0.05 to 5 μm are particularly preferred.
The grid 31 includes an open area surrounded by the fine metal wires 30. 1500 micrometers or less are preferable, 1300 micrometers or less are more preferable, 1000 micrometers or less are further more preferable, 5 micrometers or more are preferable, 30 micrometers or more are more preferable, and 80 micrometers or more are further more preferable.

In FIG. 2C, the grid 31 has a substantially rhombus shape. However, it is also possible to use polygonal shapes (for example, triangles, quadrangles, hexagons, and random polygons). Moreover, the shape of one side may be a curved shape other than a linear shape, or may be an arc shape. In the case of the arc shape, for example, the two opposing sides may have an outwardly convex arc shape, and the other two opposing sides may have an inward convex arc shape. Further, the shape of each side may be a wavy line shape in which an outward convex arc and an inward convex arc are continuous. Of course, the shape of each side may be a sine curve.
In addition, in FIG. 2C, although the pattern-like metal layer 14 has a mesh-like pattern, it is not restrict | limited to this form.

(substrate)
The type of the substrate is not particularly limited as long as it has a main surface and supports the pattern-like metal layer. As the substrate, a flexible substrate (preferably an insulating substrate) is preferable, and a resin substrate is more preferable.
Examples of the material of the resin substrate include polyether sulfone resin, polyacrylic resin, polyurethane resin, polyester resin (polyethylene terephthalate, polyethylene naphthalate etc.), polycarbonate resin, polysulfone resin, polyamide resin And polyarylate resins, polyolefin resins, cellulose resins, polyvinyl chloride resins, and cycloolefin resins. Among them, polycarbonate resins (more preferably polycarbonates) are preferable in terms of heat resistance after molding.
The thickness (mm) of the substrate is not particularly limited, but is preferably 0.05 to 2 mm, and more preferably 0.1 to 1 mm, from the viewpoint of the balance between handleability and thinning.
In addition, the substrate may have a multilayer structure, and may contain, for example, a functional film as one of its layers. The substrate itself may be a functional film.

(Patterned metal layer)
The type of metal constituting the patterned metal layer is not particularly limited, and examples thereof include copper, chromium, lead, nickel, gold, silver, tin, and / or zinc, etc., and from the viewpoint of conductivity, copper , Gold or silver is preferred, and copper or silver is more preferred.

(Method of manufacturing conductive film)
The conductive film having a three-dimensional shape can be produced by a known method. Details will be described later.

[Step B]
In step B, one of the conductive films is placed on one of the first and second molds capable of forming a mold cavity, and one of the first and second molds is formed. The other of the conductive film is disposed on the other mold, the first mold and the second mold are clamped, and a resin is formed in a mold cavity formed by the first mold and the second mold. The second embodiment is a process of manufacturing a wiring substrate in which two conductive films are disposed with a resin layer interposed therebetween.

In this process, first, as shown in FIG. 3, the conductive film 10 is disposed (mounted) on the first mold 20 and the second mold 22, respectively. The conductive film 10 comprises a substrate 12 and a patterned metal layer 14 on the main surface of the substrate. Next, as shown in FIG. 4, the first mold 20 and the second mold 22 are clamped and not shown in the mold cavity C formed by the first mold 20 and the second mold 22. The resin is injected from the injection port (injection injection). During the injection, the resin is usually heated by a known heating means, and the molten resin is injected into the mold cavity C. Also, the mold (first mold and / or second mold) may be heated by a known heating means.
After that, the mold is cooled to solidify the resin, and the wiring board 24a which is a molded body is removed from the mold, if necessary. As shown in FIG. 5, the wiring board 24a contains the conductive film 10, the resin layer 26, and the conductive film 10 in this order.
By carrying out the above steps, it is possible to obtain a wiring board in which the resin layer 26 is disposed without a gap between the two conductive films 10 disposed facing each other.

In the present specification, the mold cavity is a space for forming a resin layer provided between the first mold and the second mold.
Moreover, in FIG. 4, although the shape of the 1st metal mold | die 20 is concave shape and the shape of the 2nd metal mold 22 is convex shape, it is not restrict | limited to this form, The three-dimensional shape (solid According to the shape), a mold having an optimum shape is selected. That is, a mold having a shape corresponding to the three-dimensional shape of the conductive film 10 is selected.

In addition, in FIG. 3, the main surface where the pattern-like metal layer 14 with which each conductive film 10 is provided is arrange | positioned is arrange | positioned so that it may become a metal mold cavity side.
As in the present embodiment, when the pattern-like metal layers 14 are arranged to be on the mold cavity side, the obtained wiring board 24 a is obtained by: substrate 12 / pattern-like metal layer 14 / resin layer 26 / pattern Metal layer 14 / substrate 12 in this order. That is, the patterned metal layers 14 respectively provided in the two conductive films are disposed to face each other via the resin layer 26, and the respective patterned metal layers 14 are in direct contact with the resin layer 26. There is.
When applied to a touch sensor, such a wiring board 24 a functions as a protective layer of the pattern-like metal layer 14, and therefore, the wiring board 24 a is scratch-resistant even if the protective layer of the pattern-like metal layer 14 is not separately provided. It has the feature of being superior by the nature.

6A and 6B show modified examples of the arrangement of the conductive film 10 when the conductive film 10 is arranged in the first mold 20 and the second mold 22 in the step B, respectively. In FIG. 6A, the conductive film 10 is disposed on the first mold 20 with the main surface on which the pattern-like metal layer 14 is disposed on the mold side, and the second mold 22 has a pattern-shaped metal. The conductive film 10 is disposed with the main surface on which the layer 14 is disposed facing the mold cavity.
6B, the conductive film 10 is disposed on the first mold 20 with the main surface on which the pattern-like metal layer 14 is disposed facing the mold cavity, and the second mold 22 has a pattern. The conductive film 10 is disposed with the main surface on which the metal layer 14 in the shape of a circle is disposed on the mold side.

  The type of resin to be injected (filled) into the mold cavity is not particularly limited, and known resins can be used. For example, polyether sulfone resin, polyacrylic resin, polyurethane resin, polyester resin (polyethylene terephthalate and polyethylene naphthalate), polycarbonate resin, polysulfone resin, polyamide resin, polyarylate resin, polyolefin resin Examples thereof include resins, cellulose resins, polyvinyl chloride resins, and cycloolefin resins. Among them, polycarbonate resins are preferable.

  Also, the material of the substrate and the resin injected into the mold cavity may be the same or different. If the material of the substrate and the resin injected into the mold cavity are the same resin, the thermal expansion coefficients (thermal thermal expansion coefficient and thermal expansion coefficient) of the two become equal, so the temperature of the wiring substrate changes. Even if (for example, heat is generated by use), stress and strain due to the difference in thermal expansion coefficient are less likely to occur. Since the stress and strain are less likely to occur, the durability of the wiring board is further improved. The material of the substrate and the resin injected into the mold cavity are preferably polycarbonate resins in view of heat resistance after molding.

[Optional step]
The method of manufacturing a wiring board according to the above-described embodiment may include optional steps other than the step A and the step B within the range where desired effects can be obtained. Examples of the optional steps include a self-repairing layer forming step and a hard coat layer forming step.

Self-Repairing Layer Forming Step The self-repairing layer forming step is a step of forming a self-repairing layer on the main surface of the substrate. This step can be carried out before step A, after step A, and / or after step B.
In the present specification, the self-repairing layer is a layer having a function (self-repairing ability) of self-repairing a scratch attached to the layer surface. Self-healing property is a function that makes it difficult to make a scratch by repairing a scratch by elastic recovery, and more specifically, the surface of the layer was rubbed and rubbed with a brass brush applied with a load of 500 g. Immediately after the existence of a scratch is visually confirmed, it is intended that the wound recovers within 3 minutes after scratching in an environment of 20 to 25 ° C.

A well-known layer can be used as a self-repairing layer. For example, the self-repairing layer includes a layer containing a resin having a soft segment and a hard segment. The soft segment acts as a cushion to relieve the external force and function to elastically recover the wound, and the hard segment acts to resist the external force.
More specifically, examples of the material contained in the self-repairing layer include urethane resins having a polycarbonate skeleton, urethane resins having a polycaprolactone skeleton, and urethane resins having a polyester skeleton, etc., and polycarbonates thereof The skeleton, polycaprolactone skeleton, and polyester skeleton function as soft segments, and urethane bonds function as hard segments.

  The thickness of the self-repairing layer is preferably 0.5 to 50 μm, and more preferably 1 to 30 μm.

  The method for forming the self-repairing layer is not particularly limited, and any known forming method can be used. As a method of forming a self-repairing layer, for example, a method of applying a composition for forming a self-repairing layer containing the above-mentioned material on the main surface of a substrate and drying and / or curing as required, or The method (for example, the method of making it dip) which makes a board | substrate contact with the composition for repair layer formation, etc. are mentioned.

The self-repairing layer may be formed on one side or both sides of the substrate. In addition, the self-repairing layer may be formed on one of the two conductive film substrates, or may be formed on both substrates.
When the wiring substrate is applied to a touch panel, the self-repairing layer is preferably disposed at a portion touched by the user's finger at the time of use. Therefore, the form arrange | positioned on the main surface on the opposite side to the main surface in which the pattern-form metal layer of a conductive film board | substrate is arrange | positioned is preferable.

Hard Coat Layer Forming Step The hard coat layer forming step is a step of forming a hard coat layer on the main surface of the conductive film. This step can be carried out after step A or after step B, and is preferably carried out after step A.

The hard coat layer is not particularly limited, and known layers can be used.
Examples of the hard coat layer include a layer obtained by polymerizing and curing a compound containing an unsaturated double bond, and a layer obtained by thermally curing using a sol-gel reaction.

0.4-35 micrometers is preferable, as for the thickness of a hard-coat layer, 1-30 micrometers is more preferable, and 1.5-20 micrometers is more preferable.
The method for forming the hard coat layer is not particularly limited, and it contains, for example, a compound containing an unsaturated double bond, and an additive (for example, a polymerization initiator, a light transmitting particle, a solvent) optionally used. The composition for hard-coat layer formation is made to contact with a conductive film, a coating film is formed on a conductive film, and the method of forming by hardening a coating film is mentioned.
The hard coat layer may be formed on one or both of the two conductive films, and the hard coat layer is preferably formed on one main surface of the substrate.
It is preferable that the hard coat layer is disposed at a portion touched by the user's finger at the time of use when the wiring substrate is applied to the touch sensor.

The compound having an unsaturated double bond can function as a binder after curing. The compound having an unsaturated double bond is preferably a polyfunctional monomer containing two or more polymerizable unsaturated groups. Moreover, it is more preferable that a polymerizable unsaturated group is three or more.
Examples of the compound having an unsaturated double bond include compounds having a polymerizable unsaturated group such as a (meth) acryloyl group, a vinyl group, a styryl group, and an allyl group. Among them, as the polymerizable unsaturated group, a (meth) acryloyl group is preferable.
Specific examples of the compound containing an unsaturated double bond include (meth) acrylic acid diesters of alkylene glycol, (meth) acrylic acid diesters of polyoxyalkylene glycol, and (meth) acrylic acid diesters of polyhydric alcohol And (meth) acrylic acid diesters of ethylene oxide or propylene oxide adducts, epoxy (meth) acrylates, urethane (meth) acrylates, and polyester (meth) acrylates.

  As a specific example of the other additive contained in the composition for hard-coat layer formation, the photoinitiator as described in Unexamined-Japanese-Patent No.2012-103689, paragraphs 0025-0043, translucent particle | grains, a solvent, etc. The contents of which are incorporated herein by reference.

[Wiring board]
The wiring board obtained by the above procedure is a wiring board having a three-dimensional shape, formed by arranging two conductive films opposite each other on which at least one main surface a pattern-like metal layer is arranged. It is.
The wiring substrate is, for example, a touch sensor (also referred to as a "touch panel sensor"), a semiconductor chip, a flexible printed circuits (FPC), a chip on film (COF), a tape automated bonding (TAB), an antenna, a multilayer wiring substrate, It can be applied to various applications such as motherboards. Especially, it is preferable to use for a touch sensor (electrostatic capacitance type touch panel sensor). When the wiring substrate is applied to a touch sensor (when the wiring substrate is for a touch sensor), a patterned metal layer in the wiring substrate functions as a detection electrode or a lead wiring in the touch sensor.
Moreover, when applying the said wiring board to a touch sensor, it is preferable that one sheet is an electroconductive film for transmission among the said 2 sheets of electroconductive films, and the other is an electroconductive film for reception.
The wiring board can also be used as a heating element. That is, by passing a current through the patterned metal layer, the temperature of the patterned metal layer rises, and the patterned metal layer functions as a thermal wire.

In the step A, as a method of preparing two conductive films having a three-dimensional shape, including the substrate and a patterned metal layer disposed on at least one main surface of the substrate, for example, the above-mentioned conductive film Or a method of procuring.
It does not restrict | limit especially as a manufacturing method of the said conductive film, A well-known manufacturing method can be used.

[Method 1 for producing a conductive film]
As one of the suitable forms of the manufacturing method of a conductive film, the method containing the following process X1-the process X4 is mentioned.
Each step will be described in detail below.

[Step X1]
Step X1 forms a pattern-like to-be-plated layer containing a functional group that interacts with the plating catalyst or its precursor (hereinafter also referred to as “interactive group”) on the substrate to form a substrate with a layer to be plated Is a process of obtaining
Although the method in particular of forming the said pattern-like to-be-plated layer is not restrict | limited, For example, the following method is mentioned.

(Method 1 for forming a pattern-like layer to be plated)
A process of forming a plated layer precursor layer containing a functional group that interacts with a plating catalyst or a precursor thereof on a substrate, and a plated layer precursor layer through a photomask provided with a pattern-like opening Applying energy (eg, exposure) to the
And D. developing the plated layer precursor layer to which energy has been applied to obtain a pattern-like plated layer (a photolithographic method).

(Method 2 for forming a pattern-like layer to be plated)
Applying a composition for forming a layer to be plated in a pattern on a substrate to obtain a pattern-like precursor layer of a layer to be plated;
And (d) applying (for example, exposing) energy to the pattern-like to-be-plated layer precursor layer to obtain the pattern-like to-be-plated layer (printing method).

In the formation method 1, the method for forming the layer to be plated precursor on the substrate is not particularly limited. For example, a method for applying a composition for forming a layer to be described later on the substrate or The method (For example, the method of immersing a board | substrate in the composition for to-be-plated layer forming) which contacts the composition for a composition and a board | substrate is mentioned.
Moreover, in the forming method 2, the method for applying the composition for forming a layer to be plated in a pattern is not particularly limited, and examples thereof include a screen printing method, an inkjet method, and the like.

  It is preferable that the said to-be-plated layer is what hardened the to-be-plated layer precursor layer formed with the composition for to-be-plated layer formation containing a polymerization initiator and the following compound X or the composition Y. . Below, the composition for to-be-plated layer forming is demonstrated for every component.

<Composition for forming a layer to be plated>
It is preferable that the composition for to-be-plated layer forming contains a polymerization initiator and the following compound X or the composition Y.

(Polymerization initiator)
The polymerization initiator is not particularly limited, and known polymerization initiators can be used. Examples of the polymerization initiator include benzophenones, acetophenones, α-aminoalkylphenones, benzoins, ketones, thioxanthones, benzyls, benzyl ketals, oxesters, ansolones, tetramethylthiuram monosulfide And bisacyl phosphinoxides, acyl phosphine oxides, anthraquinones, azo compounds, and derivatives thereof.
The content of the polymerization initiator in the composition for forming a layer to be plated is not particularly limited, but it is preferably 0.01 to 1% by mass with respect to the total solid content of the composition for forming a layer to be plated And 0.1 to 0.5% by mass is more preferable.

(Compound X or Composition Y)
It is preferable that the composition for to-be-plated layer forming contains the following compound X or the composition Y. Compound X: functional group that interacts with a plating catalyst or its precursor (hereinafter, also simply referred to as “interactive group”), and a compound composition containing a polymerizable group Y: mutual interaction with a plating catalyst or its precursor COMPOUNDS CONTAINING FUNCTIONAL FUNCTIONAL GROUPS AND COMPOSITIONS COMPRISING COMPOUNDS COMPRISING POLYMERIZABLE GROUPS

・ Compound X
The compound X is a compound containing an interactive group and a polymerizable group.
The interactive group intends a functional group capable of interacting with the plating catalyst or its precursor applied to the pattern-like plated layer, and for example, a functional group capable of forming an electrostatic interaction with the plating catalyst or its precursor Groups, and nitrogen-containing functional groups, sulfur-containing functional groups, oxygen-containing functional groups, etc. that can form a coordinate with the plating catalyst or its precursor.
More specifically, as an interactive group, amino group, amide group, imide group, urea group, tertiary amino group, ammonium group, amidino group, triazine ring, triazole ring, benzotriazole group, imidazole group, benzimidazole Group, quinoline group, pyridine group, pyrimidine group, pyrazine group, quinazoline group, quinoxaline group, purine group, triazine group, piperidine group, piperazine group, pyrrolidine group, pyrazole group, aniline group, group containing an alkylamine structure, isocyanuric acid Nitrogen-containing functional groups such as groups containing structures, nitro groups, nitroso groups, azo groups, diazo groups, azide groups, cyano groups, and cyanate groups; ether groups, hydroxyl groups, phenolic hydroxyl groups, carboxylic acid groups, carbonate groups , Carbonyl group, ester group, group containing N-oxide structure, S Oxygen-containing functional groups such as groups having an oxide structure and groups having an N-hydroxy structure; thiophene group, thiol group, thiourea group, thiocyanuric acid group, benzthiazole group, mercaptotriazine group, thioether group, thioxy group And sulfur-containing functional groups such as a sulfoxide group, a sulfonic acid group, a sulfite group, a group containing a sulfoximine structure, a group containing a sulfoxinium salt structure, a sulfonic acid group, and a group containing a sulfonic acid ester structure; Phosphorus-containing functional groups such as phosphate group, phophoroamide group, phosphine group, and groups containing phosphoric acid ester structure; groups containing halogen atoms such as chlorine atom and bromine atom; In the functional group which can be taken, their salts can also be used.
Among them, ionic polar groups such as carboxylic acid groups, sulfonic acid groups, phosphoric acid groups, and boronic acid groups, ether groups, or the like because they have high polarity and high adsorption ability to a plating catalyst or a precursor thereof, etc. And a cyano group is preferable, and a carboxylic acid group or a cyano group is more preferable.
The compound X may contain two or more interactive groups.

The polymerizable group is a functional group capable of forming a chemical bond by energy application, and examples thereof include a radically polymerizable group and a cationically polymerizable group. Among them, a radically polymerizable group is preferable from the viewpoint of more excellent reactivity. As a radically polymerizable group, for example, acrylic acid ester group (acryloyloxy group), methacrylic acid ester group (methacryloyloxy group), itaconic acid ester group, crotonic acid ester group, isocrotonic acid ester group, maleic acid ester group, etc. Examples thereof include unsaturated carboxylic acid ester groups, styryl groups, vinyl groups, acrylamide groups, and methacrylamide groups. Among them, a methacryloyloxy group, an acryloyloxy group, a vinyl group, a styryl group, an acrylamide group, or a methacrylamide group is preferable, and a methacryloyloxy group, an acryloyloxy group, or a styryl group is more preferable.
The compound X may contain two or more types of polymerizable groups. In addition, the number of polymerizable groups contained in the compound X is not particularly limited, and may be one or two or more.

  The compound X may be a low molecular weight compound or a high molecular weight compound. The low molecular weight compound intends a compound having a molecular weight of less than 1000, and the high molecular weight compound intends a compound having a molecular weight of 1000 or more.

When the compound X is a polymer, the weight-average molecular weight of the polymer is not particularly limited, but is preferably 1000 to 700,000, and more preferably 2000 to 200,000 in terms of more excellent handleability such as solubility. In particular, from the viewpoint of polymerization sensitivity, 20000 or more is more preferable.
The synthesis method of the polymer having such a polymerizable group and the interaction group is not particularly limited, and known synthesis methods (see paragraphs [0097] to [0125] of JP2009-280905A) are used.

  As a preferable form of the polymer, a repeating unit containing a polymerizable group represented by the following formula (a) (hereinafter, also appropriately referred to as a polymerizable group unit), and an interactive group represented by the following formula (b) And copolymers containing repeating units having the following (hereinafter also referred to as interactive group units as appropriate).

In formulas (a) and (b), R ^{1 to} R ⁵ each independently represent a hydrogen atom or a substituted or unsubstituted alkyl group (eg, methyl group, ethyl group, propyl group, and Represents a butyl group or the like). The type of substituent is not particularly limited, and examples thereof include a methoxy group, a chlorine atom, a bromine atom, and a fluorine atom.
In addition, as R ¹ , a hydrogen atom, a methyl group or a methyl group substituted with a bromine atom is preferable. As R ² , a hydrogen atom, a methyl group or a methyl group substituted with a bromine atom is preferable. As R ³ , a hydrogen atom is preferable. As R ⁴ , a hydrogen atom is preferable. As R ⁵ , a hydrogen atom, a methyl group or a methyl group substituted with a bromine atom is preferable.

In the formulas (a) and (b), X, Y and Z each independently represent a single bond or a substituted or unsubstituted divalent organic group. As the divalent organic group, a substituted or unsubstituted divalent aliphatic hydrocarbon group (preferably having a carbon number of 1 to 8; for example, an alkylene group such as a methylene group, an ethylene group, and a propylene group), a substituted or substituted group Unsubstituted divalent aromatic hydrocarbon group (preferably having a carbon number of 6 to 12. For example, phenylene group), -O-, -S-, -SO _2- , -N (R)-(R: alkyl group) And -CO-, -NH-, -COO-, -CONH-, and groups in which these are combined (for example, an alkyleneoxy group, an alkyleneoxy carbonyl group, an alkylene carbonyloxy group, etc.) and the like.

  As X, Y, and Z, a single bond, an ester group (-COO-), an amide group (-CONH-), an ether are easy in that synthesis of a polymer is easy and adhesion of a patterned metal layer is more excellent. A group (-O-) or a substituted or unsubstituted divalent aromatic hydrocarbon group is preferable, and a single bond, an ester group (-COO-) or an amido group (-CONH-) is more preferable.

In formulas (a) and (b), L ¹ and L ² each independently represent a single bond or a substituted or unsubstituted divalent organic group. As a definition of a bivalent organic group, it is synonymous with the bivalent organic group described by X, Y, and Z mentioned above.
As L ¹ , an aliphatic hydrocarbon group or a divalent organic group having a urethane bond or a urea bond (for example, a fat), since synthesis of a polymer is easy and adhesion of a patterned metal layer is more excellent Group hydrocarbon group) is preferable, and those having 1 to 9 carbon atoms in total are preferable. Incidentally, the total number of carbon atoms of L ^1, means the total number of carbon atoms contained in the divalent organic group or a substituted or unsubstituted represented by L ^1.

L ² is a single bond, or a divalent aliphatic hydrocarbon group, a divalent aromatic hydrocarbon group, or a group obtained by combining these, in that the adhesion of the patterned metal layer is more excellent. Is preferred. Among them, L ² is preferably a single bond or a total of 1 to 15 carbon atoms. Incidentally, the total number of carbon atoms of L ^2, means the total number of carbon atoms contained in the divalent organic group or a substituted or unsubstituted represented by L ^2.

  In the above formula (b), W represents an interactive group. The definition of the interactive group is as described above.

The content of the polymerizable group unit is preferably 5 to 50 mol% with respect to all the repeating units in the polymer from the viewpoint of reactivity (curability, polymerizability) and suppression of gelation in synthesis, 5-40 mol% is more preferable.
In addition, the content of the above-mentioned interactive group unit is preferably 5 to 95% by mole, and 10 to 95% by mole with respect to all repeating units in the polymer, from the viewpoint of adsorption to the plating catalyst or its precursor. More preferable.

· · Preferred Form of Monomer When the above compound is a so-called monomer, one preferred form is a compound represented by Formula (X).

Wherein (X), R ¹¹ ~R ¹³ are each independently a hydrogen atom, or a substituted or unsubstituted alkyl group. Examples of the unsubstituted alkyl group include a methyl group, an ethyl group, a propyl group and a butyl group. Moreover, as a substituted alkyl group, a methyl group, an ethyl group, a propyl group, and a butyl group substituted by the methoxy group, a chlorine atom, a bromine atom, or a fluorine atom etc. are mentioned. In addition, as R ¹¹ , a hydrogen atom or a methyl group is preferable. As R ¹² , a hydrogen atom is preferable. As R ¹³ , a hydrogen atom is preferable.

L ¹⁰ represents a single bond or a divalent organic group. As a divalent organic group, a substituted or unsubstituted aliphatic hydrocarbon group (preferably having 1 to 8 carbon atoms), a substituted or unsubstituted aromatic hydrocarbon group (preferably having 6 to 12 carbon atoms), -O -, -S-, -SO _2- , -N (R)-(R: alkyl group), -CO-, -NH-, -COO-, -CONH-, and a combination thereof (eg, And alkyleneoxy group, alkyleneoxy carbonyl group, and alkylene carbonyloxy group).
In Formula (X), one of the preferable forms of L ¹⁰ includes —NH—aliphatic hydrocarbon group— or —CO—aliphatic hydrocarbon group—.

The definition of W is the same as the definition of W in Formula (b), and represents an interactive group. The definition of the interactive group is as described above.
In Formula (X), preferred examples of W include an ionic polar group, and a carboxylic acid group is more preferable.

・ Composition Y
Composition Y is a composition containing a compound containing an interactive group and a compound containing a polymerizable group. That is, the to-be-plated layer precursor layer contains two types, the compound containing an interactive group, and the compound containing a polymeric group. The definitions of the interactive group and the polymerizable group are as described above. Also, the definition of the interactive group is as described above.
Such a compound may be a low molecular weight compound or a high molecular weight compound. As a suitable form of the compound containing an interactive group, a polymer having a repeating unit represented by the above-mentioned formula (b) (for example, polyacrylic acid) can be mentioned. In addition, a polymerizable group is not contained in the compound containing an interactive group.
The compound containing a polymerizable group is a so-called monomer, and is preferably a polyfunctional monomer containing two or more polymerizable groups in that the hardness of the formed pattern-like layer to be plated is more excellent. Specifically, as the polyfunctional monomer, it is preferable to use a monomer containing 2 to 6 polymerizable groups. The molecular weight of the polyfunctional monomer to be used is preferably 150 to 1000, and more preferably 200 to 800, from the viewpoint of the molecular mobility during the crosslinking reaction that affects the reactivity.
The compound containing a polymerizable group may contain an interactive group.

  The mass ratio of the compound containing the interactive group to the compound containing the polymerizable group (the mass of the compound containing the interactive group / the mass of the compound containing the polymerizable group) is not particularly limited, 0.1-10 are preferable and 0.5-5 are more preferable at the point of the balance of the intensity | strength and plating aptitude of the pattern-form to-be-plated layer formed.

(Optional ingredient)
The composition for forming a layer to be plated may, if necessary, contain other components (for example, a polymerization initiator, a solvent, a sensitizer, a curing agent, a polymerization inhibitor, an antioxidant, an antistatic agent, a filler, particles, Flame retardants, lubricants, plasticizers, etc.) may be included.

  The type of substrate used in the method is as described above.

  The method for bringing the composition for forming a layer to be plated into contact with the substrate is not particularly limited. For example, the method for applying the composition for forming a layer to be plated on a substrate or the substrate in the composition for forming a layer to be plated The method of immersing is mentioned.

  It does not restrict | limit especially as a method to provide energy to a to-be-plated layer precursor layer, For example, a heat processing or exposure processing (light irradiation processing) etc. are mentioned, An exposure processing is preferable at the point which a processing finishes in a short time. By applying energy to the to-be-plated layer precursor layer, the polymerizable group in the compound in the to-be-plated layer precursor layer is activated to cause cross-linking between the compounds, and curing of the layer proceeds.

In addition, the method in particular of providing energy to a to-be-plated layer precursor layer in pattern shape is not restrict | limited. There is a method of performing exposure processing through a photomask having a desired pattern shape.
When energy is applied to the to-be-plated layer precursor layer in a pattern, the to-be-plated layer can be obtained by performing development processing on the to-be-plated layer precursor layer to which energy is given in a pattern. .
The method of the development treatment is not particularly limited, and the optimum development treatment is carried out depending on the type of material used. As a developing solution, the organic solvent and alkaline aqueous solution are mentioned, for example.

  In addition, when the pattern-like to-be-plated layer precursor layer is formed on the board | substrate, a pattern-like to-be-plated layer can be obtained if an exposure process is performed without using a photomask.

(Method 3 for forming a pattern-like layer to be plated)
The step of forming a pattern-like to-be-plated layer containing an interactive group on the substrate in step X1 to obtain a substrate with a to-be-plated layer is not limited to the above forming method.
For example, the method of apply | coating the following composition A in pattern shape on a board | substrate is mentioned.
Composition A: Composition containing a compound having an interactive group and containing no polymerizable group

The application method is not particularly limited, and the application method described above can be used. Among them, the screen printing method or the inkjet method is preferable.
The composition A may contain a solvent from the viewpoint of coatability.
When composition A contains a solvent, it may further include a heating step for drying the solvent after application.

  It does not restrict | limit especially as a compound which contains the interactive group which the said composition A contains, and does not contain a polymeric group, A well-known compound can be used. Examples of known compounds include, but are not limited to, polyvinyl pyrrole and the like.

[Step X2]
Step X2 is a step of deforming the substrate with a layer to be plated to obtain a substrate with a layer to be plated having a three-dimensional shape. In the step X2, preferably, the substrate with a layer to be plated is deformed such that at least a part of the layer to be plated is deformed.
As described above, when the substrate with the layer to be plated is deformed into a desired shape, the layer to be plated is also deformed following the deformation of the substrate.
The deformation method of the substrate with a layer to be plated is not particularly limited, and for example, known methods such as vacuum forming, blow molding, free blow molding, pressure forming, vacuum-pressure forming, and heat press forming can be used. The temperature of the heat treatment carried out at the time of deformation is preferably a temperature higher than the thermal deformation temperature of the material of the substrate, and is preferably in the range of glass transition temperature (Tg) + 50 to 350 ° C.

  By carrying out the above procedure, a substrate with a layer to be plated having a three-dimensional shape can be obtained. The form of the three-dimensional shape is not particularly limited, and may be hemispherical or other shape as shown in FIG. 2A.

[Step X3, Step X4]
Step X3 is a step of subjecting the pattern-like layer to be plated in the substrate with a layer to be plated having a three-dimensional shape to a plating treatment to form a pattern-like metal layer on the pattern-like layer to be plated.
In addition, in this processing method, it has further the process X4 of providing a plating catalyst or its precursor to a pattern-like to-be-plated layer before process X3, or a plating catalyst or its precursor has a pattern shape of process X1. Contained in the layer to be plated.
Below, the form which implements process X4 is explained in full detail.

Step X4 is a step of applying a plating catalyst or a precursor thereof to the pattern-like layer to be plated. Since the above-mentioned interactive group is contained in the pattern-like to-be-plated layer, the above-mentioned interactive group adheres (adsorbs) the imparted plating catalyst or its precursor according to its function.
The plating catalyst or the precursor thereof functions as a catalyst and / or an electrode for the plating process.
Therefore, the type of plating catalyst or precursor thereof to be used is appropriately determined depending on the type of plating process.
The plating catalyst or precursor thereof to be used is preferably an electroless plating catalyst or a precursor thereof. Hereinafter, the electroless plating catalyst or the precursor thereof and the like will be mainly described in detail.

As the electroless plating catalyst, any catalyst can be used as long as it becomes an active nucleus at the time of electroless plating, and specifically, a metal (having a lower ionizing tendency than Ni) having a catalytic ability for autocatalytic reduction reaction And the like) and the like. Specific examples thereof include Pd, Ag, Cu, Ni, Pt, Au, and Co.
A metal colloid may be used as the electroless plating catalyst.
The electroless plating catalyst precursor used in this step can be used without particular limitation as long as it can be an electroless plating catalyst by a chemical reaction. The metal ions of the metals listed above as the electroless plating catalyst are mainly used.

As a method of applying a plating catalyst or a precursor thereof to a pattern-like to-be-plated layer, for example, a solution in which the plating catalyst or a precursor thereof is dispersed or dissolved in an appropriate solvent is prepared, and the solution is a pattern-like to-be-plated layer It may be applied on top, or the substrate with a layer to be plated may be immersed in the solution.
Water or an organic solvent is suitably used as the solvent.

Next, a plating process is performed with respect to the pattern-like to-be-plated layer to which the plating catalyst or its precursor was provided.
The method of plating treatment is not particularly limited, and examples thereof include electroless plating treatment and electrolytic plating treatment (electroplating treatment). In this step, the electroless plating process may be performed alone, or after the electroless plating process is performed, the electrolytic plating process may be further performed.
Hereinafter, procedures of the electroless plating process and the electrolytic plating process will be described in detail.

The electroless plating process is a process of depositing metal by a chemical reaction using a solution in which metal ions to be deposited as plating are dissolved.
The electroless plating treatment may be performed, for example, by washing the substrate with a layer to be plated to which the electroless plating catalyst has been applied with water to remove excess electroless plating catalyst (metal), and then immersing the substrate in an electroless plating bath. Is preferred. As the electroless plating bath to be used, a known electroless plating bath can be used.

  A common electroless plating bath mainly contains metal ions for plating, a reducing agent, and an additive (stabilizer) for improving the stability of metal ions, in addition to a solvent (for example, water). ing. In addition to these, the plating bath may contain known additives such as a stabilizer for the plating bath.

When the plating catalyst applied to the pattern-like to-be-plated layer or its precursor has a function as an electrode, electroplating can be performed on the pattern-like to-be-plated layer to which the catalyst or its precursor is applied .
As described above, in the present step, electrolytic plating can be performed after the above-described electroless plating, if necessary. In such an embodiment, the thickness of the pattern-like metal layer to be formed can be appropriately adjusted.

  In addition, although the form which implemented the process X4 was described above, when the plating catalyst or its precursor is contained in the pattern-form to-be-plated layer of the process X1 as mentioned above, it is not necessary to implement the process X3. .

By carrying out the above-mentioned treatment, a patterned metal layer is formed on the patterned plating layer. Therefore, according to the shape of the pattern-like metal layer to form, a desired conductive film can be obtained by forming a pattern-like to-be-plated layer.
The two conductive films used in the method of manufacturing a wiring board according to the above embodiment may be manufactured by the same method or may be manufactured by different methods. That is, one conductive film may be produced by photolithography, and the other conductive film may be produced by printing.

[Method 2 for producing a conductive film]
In addition, the manufacturing method of a conductive film is not restrict | limited to the said method.
For example, a pattern-like to-be-plated layer precursor layer containing a functional group that interacts with a plating catalyst or its precursor, and a polymerizable group is formed on a substrate to form a substrate with a to-be-plated layer precursor layer. Step Y1 of obtaining
Step Y2 of deforming the to-be-plated layer precursor layer-attached substrate to obtain a to-be-plated layer precursor layer-attached substrate having a three-dimensional shape;
Applying energy to the to-be-plated layer precursor layer to form a pattern-like to-be-plated layer Y3;
Performing a plating process on the patterned plating layer to form a patterned metal layer on the patterned plating layer;
After the step Y3 and before the step Y4, the method further includes the step Y5 of applying a plating catalyst or a precursor thereof to the pattern-like layer to be plated, or the plating catalyst or a precursor thereof is patterned in the step A The method contained in the to-be-plated layer precursor layer of this is mentioned.

[Method 3 for producing a conductive film]
Also, for example, a to-be-plated layer precursor layer containing a functional group that interacts with a plating catalyst or its precursor, and a polymerizable group is formed on a substrate to obtain a to-be-plated layer precursor layer-attached substrate Process Z1
Step Z2 of deforming the to-be-plated layer precursor layer-attached substrate to obtain a to-be-plated layer precursor layer-attached substrate having a three-dimensional shape;
A step Z3 of exposing the to-be-plated layer precursor layer in a pattern through a photomask having a three-dimensional shape corresponding to the surface shape of the to-be-plated layer precursor layer and having an opening;
The exposed layer precursor layer is developed to form a patterned layer to be plated Z4 and the patterned layer to be plated are plated to form a patterned metal layer on the patterned layer. Forming step Z5,
After the step Z4 and before the step Z5, the method further includes a step Z6 of applying a plating catalyst or a precursor thereof to the pattern-like layer to be plated, or a plating catalyst or a precursor thereof is patterned in the step A The method contained in the to-be-plated layer precursor layer of this is mentioned.

  Moreover, between the said board | substrate and a pattern-form to-be-plated layer, the primer layer for improving both adhesiveness may be arrange | positioned.

  Hereinafter, the present invention will be described in more detail based on examples. The materials, amounts used, proportions, treatment contents, treatment procedures, etc. shown in the following examples can be appropriately changed without departing from the spirit of the present invention. Accordingly, the scope of the present invention should not be construed as limited by the following examples.

Example 1
[Preparation of composition for forming primer layer]
The following components were mixed to obtain a composition for forming a primer layer.
Cyclopentanone 98% by mass
Zetpol 0020 (Nippon Zeon Co., hydrogenated nitrile rubber) 2 mass%

[Preparation of composition 1 for forming a layer to be plated]
The following components were mixed to obtain a composition 1 for forming a layer to be plated.
2-propanol 87.31% by mass
Polyacrylic acid 25% aqueous solution (manufactured by Wako Pure Chemical Industries, Ltd.) 10.8 mass%
Compound represented by the following general formula (A) (in the formula (A), R is a hydrogen atom) 1.8 mass%
IRGACURE 127 (made by BASF) 0.09 mass%

[Production of Touch Sensor 1]
The composition for forming a primer layer was coated on a polycarbonate substrate (trade name: Panlite PC 2151, manufactured by Teijin Limited, thickness 125 μm) using a bar coater so as to have an average dry film thickness of 1 μm to form a primer layer. The composition 1 for to-be-plated layer formation was apply | coated using a bar coater so that it might become a dry film thickness of 0.5 micrometer on it, and the board | substrate 1 with a to-be-plated layer precursor layer was obtained.
Next, a photomask designed to obtain a pattern-like metal layer that conforms to the drive pattern of True Touch Evaluation kit CYTK 58 (a touch drive IC (Integrated Circuit) manufactured by Cypress) with the substrate 1 to be plated layer precursor layer Exposed to light, and then developed with a 1% by mass aqueous solution of sodium carbonate to provide a pattern-like layer to be plated 1 having a pattern-like layer to be plated that conforms to the upper surface drive pattern of True Touch® Evaluation kit CYTK58 1 As a result, there was obtained a substrate 1-2 with a pattern-like layer to be plated provided with a pattern-like layer to be plated which also conforms to the lower side drive pattern and the same.
Next, vacuum thermoforming was carried out hemispherically (refer FIG. 2A) to the board | substrates 1-1 and 1-2 with a pattern-form to-be-plated layer. Next, the obtained substrates 1-1 and 1-2 with a pattern-like layer to be plated having a hemispherical shape were treated with a Pd catalyst application liquid omni shield 1573 activator (Rohm & Hearth Electronic Materials Co., Ltd.) 3. The hemispherical substrate with the layer to be plated is immersed for 5 minutes at 45 ° C. in an aqueous solution diluted with pure water to 6% by volume and adjusted to pH 4.0 with 0.1 N HCl, and then , Washed twice with pure water. Next, the obtained hemispherical substrate with a layer to be plated is treated with a 0.8% by volume aqueous solution of a reducing agent circumposit PB oxide converter 60C (manufactured by Rohm and Hearth Electronic Materials Co., Ltd.) at 30 ° C. 5 Immersed for a minute and then washed twice with pure water. Thereafter, the obtained hemispherical substrate with a layer to be plated is formed into 12 volume% of agent M, 6 volume% of agent A, and 10 volumes of agent B of Circuposit 4500 (manufactured by Rohm and Haas Electronic Materials Co., Ltd.) % Is mixed to prepare an electroless plating solution, and the substrate with a plated layer on the hemisphere is immersed at 45 ° C. for 15 minutes, then washed with pure water to form a patterned metal layer, and the hemisphere Conductive films 1-1 and 1-2 having a curved surface (three-dimensional shape) are obtained.
Next, conductive films 1-1 and 1-2 having hemispherical curved surfaces were respectively mounted on first and second molds capable of forming a mold cavity. At this time, the pattern-like metal layers of the conductive films 1-1 and 1-2 face each other (the main surface of each conductive film provided with the pattern-like metal layer is on the mold cavity side In the obtained wiring board, the metal layers in the pattern form become the inner surfaces via the resin layer.) The first metal mold and the second metal mold were mounted, respectively. Thereafter, the mold was clamped to form a mold cavity, and polycarbonate was injection-molded into the mold cavity to obtain a wiring substrate having a hemispherical curved surface. The above wiring board is used as the touch sensor 1.
The shape of the first mold is a shape corresponding to the three-dimensional shape of the obtained conductive film 1-1 (a shape matching the shape), and the shape of the second mold is the obtained conductive film 1 It was a shape corresponding to the three-dimensional shape of -2 (a shape matched).

Example 2
[Production of touch sensor 2]
A touch was carried out in the same manner as in Example 1 except that a self-repairing layer (Z 913-3 manufactured by Aika Kogyo Co., Ltd.) was formed on the main surface of the substrate opposite to the plating layer precursor layer of the substrate with the plating layer precursor layer. Sensor 2 was produced.

[Example 3]
[Production of Touch Sensor 3]
When the conductive films 1-1 and 1-2 having a hemispherical curved surface are attached to a mold, the pattern-like metal layers respectively face the mold side (in the obtained wiring substrate, the pattern-like A touch sensor 3 was obtained in the same manner as in Example 1 except that the metal layers were disposed on the outermost surfaces).

Comparative Example 1
[Production of touch sensor 4]
An acrylic adhesive (an adhesive for polycarbonate made by Aquasunde Co., Ltd.) is applied on the main surface on which the conductive metal films 1-1 and 1-2 having hemispherical curved surfaces are arranged, and a pressure-sensitive adhesive It bonded together so that the pattern-form metal layer by which T was apply | coated might oppose, and the touch sensor 4 was obtained.

[Evaluation: Driving as a touch sensor]
The drive as a touch sensor was confirmed about touch sensors 1-4.
As a result, the touch sensors 1 and 2 were driven without problems as touch sensors.
Further, in the touch sensor 3, the pattern-like metal layer had a scratch that was rubbed with the mold, and there was a broken portion in some parts, but it was driven as a touch sensor.
On the other hand, in the touch sensor 4, air bubbles exist between the conductive films 1-1 and 1-2, and the presence or absence of the air bubbles causes a difference in detection sensitivity in the touch sensor surface, and drives insufficient as a touch sensor. It could not be used practically as a touch sensor.

10: conductive film 12: substrate 12a: hemispherical portion 12b: flat portion 14: pattern-like metal layer 20: first mold 22: second mold 24a: wiring board 30: fine metal wire 31: grating 70: substrate 71 : Main surface

Claims (13)

Preparing two sheets of a conductive film having a three-dimensional shape, comprising a substrate and a patterned metal layer disposed on at least one major surface of the substrate;
Placing one of the conductive films on one of the first and second molds;
Placing the other of the conductive films on the other of the first mold and the second mold;
Clamping the first mold and the second mold,
A process of injecting a resin into a mold cavity formed by the first mold and the second mold, and manufacturing a wiring board in which two sheets of the conductive film are disposed via a resin layer B,
Method of manufacturing a wiring board containing The process A is
Forming on the substrate a pattern-like to-be-plated layer containing a functional group that interacts with the plating catalyst or its precursor to obtain a substrate with a to-be-plated layer;
Step X2 of deforming the substrate with a layer to be plated to obtain a substrate with a layer to be plated having a three-dimensional shape;
Performing a plating process on the pattern-like layer to be plated in the substrate with a layer to be plated having the three-dimensional shape to form a pattern-like metal layer on the pattern-like layer to be plated;
After the step X2 and before the step X3, the method further includes a step X4 of applying a plating catalyst or a precursor thereof to the pattern-like layer to be plated, or a plating catalyst or a precursor thereof is the step The manufacturing method of the wiring board of Claim 1 contained in the said pattern-form to-be-plated layer of X1. The said to-be-plated layer hardens the to-be-plated layer precursor layer formed of the composition for to-be-plated layer formation containing a polymerization initiator and the following compound X or the composition Y. The manufacturing method of the wiring board as described in 2.
Compound X: functional group interacting with plating catalyst or precursor thereof, and compound containing polymerizable group Composition Y: compound containing functional group interacting with plating catalyst or precursor thereof, and polymerizability Composition containing a compound containing a group A step of forming a plated layer precursor layer containing a functional group that interacts with the plating catalyst or the precursor thereof on the substrate;
Applying energy in a pattern to the to-be-plated layer precursor layer through a photomask provided with a pattern-like opening;
The method for manufacturing a wiring board according to claim 2 or 3, further comprising the step of developing the target layer to be plated after the energy application to obtain the pattern-like target layer.   The method for manufacturing a wiring board according to any one of claims 1 to 4, wherein the substrate is made of polycarbonate.   The method for manufacturing a wiring board according to any one of claims 1 to 5, wherein the resin is made of polycarbonate. In the step B,
One of the conductive films is disposed on one of the first mold and the second mold, and the conductive film is disposed on the other of the first mold and the second mold. When placing the other of the conductive films,
The main surface on which the pattern-like metal layer provided in the two conductive films is disposed is disposed on the mold cavity side, respectively, according to any one of claims 1 to 6. Method of manufacturing a wiring board.   The self-repairing layer is provided on at least one of the two conductive films on the main surface opposite to the main surface on which the pattern-like metal layer is disposed. The manufacturing method of the wiring board as described in-.   The manufacturing method of the wiring board as described in any one of Claims 1-8 whose said wiring board is a wiring board for touch sensors.   The wiring substrate is a wiring substrate for a capacitive touch sensor, and one of the two conductive films is a transmitting conductive film, and the other is a receiving conductive film. The manufacturing method of the wiring board as described in any one of 1-9. A substrate and two conductive films having a three-dimensional shape, comprising a patterned metal layer disposed on at least one major surface of the substrate, and
Containing a resin layer,
The wiring board by which the said 2 sheets of electroconductive film are arrange | positioned through the said resin layer.   The patterned metal layers respectively provided in the two conductive films are disposed to face each other via the resin layer, and the respective patterned metal layers are in direct contact with the resin layer. The wiring board according to claim 11.   The wiring substrate according to claim 11 or 12, wherein at least one of the two conductive films has a self-repairing layer on the main surface opposite to the main surface on which the patterned metal layer is disposed. .