JP2012182353A - Curved surface substrate and method for manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a curved surface substrate and method for manufacturing the same, capable of concurrently achieving high pattern accuracy and high productivity.SOLUTION: The present invention is of a spherical shape having a first surface and a second surface, and includes a dielectric substance (1) in which an irregular section is formed on at least either one of the first surface and the second surface, and a conductor (2) provided in a recessed portion formed on the dielectric substance (1). Thus, a process requiring time is limited to only a molding manufacturing process by machining for reduction in the time required for a manufacturing process for a curved surface substrate, thereby concurrently achieving high pattern accuracy and high productivity.

Description

  The present invention relates to a curved substrate having a conductor pattern and a dielectric, and has a surface shape such as a sphere or a spheroid, and a method of manufacturing the curved substrate.

  A printed wiring board is known as a substrate made of a conductor pattern and a dielectric. The printed wiring board has a planar shape, and the conductor pattern (copper wiring) is generally formed by an exposure / development method using a photosensitive resist. On the other hand, for applications such as radomes, antenna reflectors, and radar devices, there is a need for curved substrates such as spheres or spheroids, and various methods for realizing curved substrates have been known. It has been.

For example, as a conventional method for manufacturing a curved substrate, the following is known (for example, see Patent Document 1).
(Method 1) Method of spotting exposure after forming a conductor on the entire surface in the same manner as a flat substrate (Method 2) Method of curving a flat substrate on which a conductor pattern is formed (Method 3) Plane on which a conductor pattern is formed Method of dividing a substrate and pasting it into tiles to form a curved surface as a whole (Method 4) Method of forming a conductor on the entire surface and then cutting the conductor by machining

JP-A-9-139619

However, the prior art has the following problems.
In the exposure method of Method 1, when it is intended to form a highly accurate pattern, it is necessary to control the exposure head three-dimensionally with a robot arm or the like. Therefore, in order to cope with a large curved surface, a large-scale exposure apparatus is required. Moreover, since it exposes many times like a spot, it is inferior to productivity.

  Since the curved surface processing method of method 2 bends the plane, if the curvature of the spherical surface increases, wrinkles and displacement occur, and a highly accurate curved surface pattern cannot be formed. Similarly, in the method 3 in which the curved substrates are pseudo-realized by bonding the flat substrates, the gaps and deviations are generated in the bonded portions because they are not strictly curved surfaces.

  Furthermore, the machining method of method 4 can be manufactured with existing machining equipment and does not cause misalignment or the like. However, it is necessary to perform machining one by one, and as with the exposure method of method 1, productivity is improved. Inferior. In other words, the conventional techniques according to the methods 1 to 4 have a problem that the pattern accuracy and the productivity cannot be compatible.

  The present invention has been made to solve the above-described problems, and an object thereof is to obtain a curved substrate and a method of manufacturing the curved substrate that can achieve both improvement in pattern accuracy and improvement in productivity. And

  A curved substrate according to the present invention has a spherical shape having a first surface and a second surface, a dielectric having an uneven portion formed on at least one of the first surface and the second surface, and a dielectric And a conductor provided in the formed recess.

  In addition, the method of manufacturing a curved substrate according to the present invention includes a dielectric having a spherical shape having a first surface and a second surface, and an uneven portion formed on at least one of the first surface and the second surface. And a method of manufacturing a curved substrate having a conductor provided in a concave portion formed in a dielectric, wherein a step of forming irregularities on the surface of the curved mold is first performed using the mold. The method includes a step of forming a dielectric having a concavo-convex portion formed on at least one of the surface and the second surface, and a step of forming a conductor in a recess formed in the dielectric.

  According to the curved substrate and the method of manufacturing a curved substrate according to the present invention, by using a curved mold, an uneven dielectric is formed, and a conductor is formed in the concave formed in the dielectric. We manufacture curved substrates and limit the time-consuming process to the manufacturing process of molds by machining, shortening the time required for the manufacturing process of curved substrates, improving pattern accuracy and producing It is possible to obtain a curved substrate and a method of manufacturing the curved substrate that can achieve both improvement in performance.

It is sectional drawing which shows the curved-surface-shaped board | substrate by Embodiment 1 of this invention. It is sectional drawing which shows the curved-surface-shaped board | substrate by Embodiment 1 of this invention. It is sectional drawing which shows the manufacturing process of the curved-surface-shaped board | substrate by Embodiment 1 of this invention. It is sectional drawing which shows the manufacturing process of the curved-surface-shaped board | substrate by Embodiment 1 of this invention. It is sectional drawing which shows the manufacturing process of the curved-surface-shaped board | substrate by Embodiment 1 of this invention. It is sectional drawing which shows the manufacturing process of the curved-surface-shaped board | substrate by Embodiment 1 of this invention. It is sectional drawing which shows the manufacturing process of the curved-surface-shaped board | substrate by Embodiment 1 of this invention. It is sectional drawing which shows the manufacturing process of the curved-surface-shaped board | substrate by Embodiment 1 of this invention. It is sectional drawing which shows the manufacturing process of the curved-surface-shaped board | substrate by Embodiment 1 of this invention. It is sectional drawing which shows the manufacturing process of the curved-surface-shaped board | substrate by Embodiment 2 of this invention. It is sectional drawing which shows the manufacturing process of the curved-surface-shaped board | substrate by Embodiment 2 of this invention. It is sectional drawing which shows the curved-surface-shaped board | substrate by Embodiment 3 of this invention. It is sectional drawing which shows the curved-surface-shaped board | substrate by Embodiment 4 of this invention. It is explanatory drawing of the manufacturing method of the curved-surface-shaped board | substrate by Embodiment 4 of this invention.

  Hereinafter, preferred embodiments of a curved substrate and a method of manufacturing a curved substrate of the present invention will be described with reference to the drawings.

Embodiment 1 FIG.
FIG. 1 is a cross-sectional view showing a curved substrate according to Embodiment 1 of the present invention. The curved substrate shown in FIG. 1 is composed of, for example, a dielectric 1 having a curved surface such as a sphere or a spheroid and a conductor pattern 2, and a conductor pattern 2 is formed in a recess formed in the dielectric 1. Is formed. As shown in FIGS. 1A to 1C, the conductor pattern 2 is formed either on the inner side (corresponding to the first surface) or the outer side (corresponding to the second surface) of the dielectric 1, or on the inner side and It may be formed on both outsides.

  FIG. 2 is a cross-sectional view showing a curved substrate according to Embodiment 1 of the present invention. For the sake of simple explanation, in the following explanation, as shown in FIG. 2, the section of the curved surface is expressed in a pseudo manner by a planar section.

  3A to 3G are cross-sectional views showing a manufacturing process of the curved substrate according to Embodiment 1 of the present invention. First, as shown in FIG. 3A, a curved mold 3 is prepared. The material of the mold 3 can be a metal such as SUS or aluminum, or gypsum. Preferably, aluminum is optimal from the viewpoint of weight.

  Next, as shown in FIG. 3B, grooves 4 are formed in the curved mold 3. As will be described later, a portion where the groove 4 is not formed becomes a concave portion formed in the dielectric 1 later and becomes a portion where the conductor pattern 2 is formed. The depth of the groove 4 is preferably 0.05 mm or more and less than 0.3 mm.

  The reason for this is that if the depth of the groove 4 is less than 0.05 mm, the conductor pattern is polished at the time of polishing. Conversely, if the depth of the groove 4 is 0.3 mm or more, the curved surface shape This is because, when the product is removed from the mold 3, the dielectric 1 in the groove 4 portion remains in the mold 3 and falls off depending on the curvature of.

  Furthermore, after forming the groove | channel 4, it is preferable to coat the shaping | molding die 3 with the fluororesin which has mold release property. This is to make it easier to remove the product from the mold 3.

  Next, as shown in FIG. 3C, the dielectric 1 is formed using the curved mold 3 in which the grooves 4 are formed. Here, the dielectric 1 is preferably a fiber reinforced plastic made of fiber 5 and resin from the viewpoint of strength and rigidity.

  Moreover, if the fiber 5 used for the fiber reinforced plastic 1 is the insulating fiber 5, it will not specifically limit. However, when applied to a radome or the like, quartz fibers having a small relative dielectric constant and dielectric loss tangent are preferable from the viewpoint of radio wave transmission. Further, the fiber 5 is preferably a plain weave cloth, and more preferably, when the fiber 5 is formed into a curved surface (that is, when it is formed into a curved surface with the mold 3), the fiber 5 is thin and does not have wrinkles. Certain fiber cloths are preferred.

  The resin used for the fiber reinforced plastic 1 is not particularly limited. However, a bis-E type cyanate ester resin, which has both radio wave permeability and heat resistance and is a low-viscosity liquid at room temperature, is preferable.

  First, a quartz fiber 5 is placed on a curved mold 3 in which a groove 4 is formed, a peel ply 6 and a flow media 7 are stacked thereon, and the whole is covered with a bagging film 8. Thereafter, the inside of the bagging film 8 is decompressed by a vacuum pump (not shown) through the tube 10 sealed with the sealant 9. Next, an uncured liquid resin having a low viscosity is supplied from a resin tank (not shown) through a tube 10 sealed with a sealant 9.

  At this time, the resin preferentially passes through the flow media 7 having a coarser mesh than the fibers 5, diffuses in the plane, is sent, soaks out of the plane, and impregnates the fibers 5. After the entire fiber 5 is impregnated with the resin, the resin supply port and the vacuum exhaust port are closed with a valve or the like, and the bagging film 8 is put in an oven while being depressurized and cured. When a bis-E type cyanate ester resin is used as the resin, the resin is held at 180 ° C. for 2 hours.

  Next, the mold is removed from the mold 3 to obtain a fiber reinforced plastic 1 as shown in FIG. 3D. The peel ply 6, the flow media 7, and the bagging film 8 on the fiber reinforced plastic 1 can be peeled off at the interface between the fiber reinforced plastic 1 and the peel ply 6.

  The molding method of the dielectric 1 (fiber reinforced plastic 1) is not particularly limited. However, the resin is supplied to the groove 4 by molding by a so-called VaRTM molding method (Vacuum Assisted Resin Transfer Molding), which is a method of manufacturing the fiber reinforced plastic 1 by impregnating the resin by vacuum drawing. There is an advantage.

  Further, by dividing the mold 3 to form the fiber reinforced plastic 1, even when the curvature of the curved surface is large, it is not necessary to divide the fiber reinforced plastic 1 for demolding, and a large fiber reinforced plastic. 1 can be integrally formed.

  Next, as shown in FIG. 3E, using a squeegee 11 equal to the curvature of the fiber reinforced plastic 1, the conductive paste 13 is applied to the uneven surface of the fiber reinforced plastic 1 as shown in FIG. 3F. The squeegee 11 is composed of a metal branch and a rubber 12 plate bonded together so that the rubber reinforced plastic 1 is in contact with the rubber 12 portion. Here, the conductive paste 13 is preferably a low-temperature dry type silver paste that develops conductivity without pressure. The conductive paste 13 is dried in an oven at 120 ° C. for 10 minutes after coating.

  Next, as shown in FIG. 3G, the conductive paste 13 on the convex portion is removed by polishing with a sandpaper or a jig having the same curvature as that of the fiber reinforced plastic 1. At this time, it is necessary to prevent the fiber reinforced plastic 1 from being exposed by cutting away the conductive paste 13 other than the convex portions.

  As described above, the conductor pattern 2 can be formed in the concave portion formed in the dielectric 1 by the series of processes of FIGS. 3A to 3G. 2 and 3A to 3G, the curved substrate having the conductor pattern 2 provided on the inner side (first surface) of the dielectric 1 has been described as shown in FIG. On the other hand, by using the curved mold 3 in which the surface on which the groove 4 is provided is reversed (second surface), as shown in FIG. It is also possible to manufacture a curved substrate having the conductor pattern 2 on the outer side (second surface).

  Further, by performing the two steps of FIG. 1A and FIG. 1B, a curved substrate having conductor patterns 2 provided on the inside and outside of the dielectric 1 is manufactured as shown in FIG. 1C. It is also possible.

  As described above, according to the first embodiment, a dielectric having irregularities is formed using a curved mold having irregularities formed on at least one side of the surface, and a conductor is provided in the concave formed in the dielectric. The curved substrate is manufactured by forming. Here, it is only necessary to machine the time-consuming machine. Therefore, according to such a manufacturing method, it is possible to manufacture a plurality of curved substrate having a conductor pattern with high productivity.

  Furthermore, the accuracy of the conductor pattern depends on the accuracy of the unevenness formed on the mold, and the unevenness of the mold is formed by machining. For this reason, a highly accurate conductor pattern can be formed.

  Furthermore, a dielectric with unevenness is formed by the VaRTM method. Accordingly, the resin can be filled in the convex portions without voids, and a relatively large curved substrate can be integrally formed by dividing the mold.

Embodiment 2. FIG.
In the second embodiment, a method for forming the conductor pattern 2 on the dielectric 1 in a process different from that of the first embodiment will be described.

  In previous Embodiment 1, after forming the fiber reinforced plastic 1 with an unevenness | corrugation, the conductive pattern 13 was formed by apply | coating the conductive paste 13 and grind | polishing after that. On the other hand, in this Embodiment 2, after forming the copper plating film 14 in the fiber reinforced plastic 1 with an unevenness | corrugation, the conductor pattern 2 is formed by grinding | polishing.

  4A and 4B are cross-sectional views showing a process for manufacturing a curved substrate according to Embodiment 2 of the present invention. First, as shown to FIG. 4A, the copper plating film 14 is formed in the fiber reinforced plastic 1 with an unevenness | corrugation. Here, in order to improve the adhesion between the fiber reinforced plastic 1 and the copper plating film 14, it is preferable to pre-treat the fiber reinforced plastic 1. As pretreatment, it is preferable to perform electroless nickel plating after roughening with sandblast or permanganate.

  Next, as shown in FIG. 4B, the copper plating film 14 formed on the convex portion of the fiber reinforced plastic 1 is polished, so that the conductor pattern 2 made of the copper plating film 14 remains only in the concave portion of the fiber reinforced plastic 1. Like that.

  As described above, the conductor pattern 2 can be formed in the recess formed in the dielectric 1 by the series of processes shown in FIGS. 4A and 4B. It is possible to manufacture the three types of curved-surface substrates shown in FIGS. 1A to 1C also by the manufacturing method according to the second embodiment.

  As described above, according to the second embodiment, the conductor pattern is formed in the concave portion of the dielectric using the copper plating film, and this also provides the same effect as in the first embodiment. it can.

Embodiment 3 FIG.
In the first and second embodiments, the curved substrate having the conductor pattern 2 formed on the concave portion provided on at least one side of the surface of the dielectric 1 having the curved shape and the manufacturing method thereof have been described. On the other hand, in Embodiment 3 of the present invention, a curved substrate having the conductor pattern 2 provided inside the dielectric 1 and a manufacturing method thereof will be described.

  FIG. 5 is a cross-sectional view showing a curved substrate according to Embodiment 3 of the present invention. As shown in FIG. 5, the curved substrate in the third embodiment is a surface on which the conductor pattern 2 is provided on the curved substrate having the conductor pattern 2 on one side produced by the manufacturing method of the first and second embodiments. Further, a fiber reinforced plastic 1 is formed.

  The method for forming the fiber reinforced plastic 1 is not particularly limited, but it is preferable to make the dielectric properties of the fiber reinforced plastic 1 uniform. For this reason, the method of forming a fiber by molding fibers on a curved substrate having the conductor pattern 2 on one side is preferable. Alternatively, a method of separately bonding fiber reinforced plastic produced by VaRTM molding is preferable.

  As described above, according to the third embodiment, the curved substrate formed by the manufacturing method of the first and second embodiments is used as a basic configuration, and the fiber reinforced plastic is further formed on the surface where the conductor pattern 2 is present. It has the structure which did. Even with such a curved substrate, the same effects as those of the first and second embodiments can be obtained.

Embodiment 4 FIG.
In the fourth embodiment of the present invention, a curved substrate using two curved substrates according to the third embodiment and a manufacturing method thereof will be described so as to sandwich the core material.

  FIG. 6 is a cross-sectional view showing a curved substrate according to Embodiment 4 of the present invention. As shown in FIG. 6, the curved substrate in the fourth embodiment is obtained by disposing a foam material 15 between the curved substrate having the conductor pattern 2 therein. In this way, by using a structure (so-called sandwich structure) in which the foam material 15 is used as a core material and the fiber reinforced plastics 1 are disposed on both surfaces thereof, a light and highly rigid radome or the like can be formed.

  In this case, the positional accuracy of the conductor pattern 2 provided above and below the foam material 15 greatly affects the electrical characteristics of the radome and the like. Therefore, it is important to improve the positional accuracy of the fiber reinforced plastic 1 provided on both surfaces of the foam material 15.

  FIG. 7 is an explanatory diagram of a method of manufacturing a curved substrate according to Embodiment 4 of the present invention. In the seventh embodiment, a method in which two curved substrates are produced in a hat shape and aligned at the flat portion of the edge is employed to improve the positional accuracy. Specifically, as shown in FIG. 7, it is preferable that the positioning pins 16 are used to integrate the two curved-shaped substrates produced in a hat shape and the foam material 15 sandwiched therebetween. Furthermore, since the relationship between the conductor pattern 2 and the alignment hole needs to correspond, it is preferable to form an alignment hole when processing the groove 4 for forming the uneven fiber reinforced plastic 1.

  As described above, according to the fourth embodiment, a lightweight and high-rigid radome or the like is formed by using a curved substrate having a sandwich structure having a structure in which fiber reinforced plastics are arranged on both surfaces of a core material. can do. Furthermore, by realizing the sandwich configuration using the positioning pins, it is possible to improve the positioning accuracy of the conductor patterns arranged on both surfaces of the core material and to suppress the deterioration of the electrical characteristics.

  DESCRIPTION OF SYMBOLS 1 Dielectric (fiber-reinforced plastic), 2 conductor pattern, 3 curved-surface mold, 4 groove, 5 fiber, 6 peel ply, 7 flow media, 8 bagging film, 9 sealant, 10 tube, 11 squeegee, 12 rubber, 13 Conductive paste, 14 film (copper plating film), 15 foam, 16 positioning pin.

Claims (16)

A dielectric having a spherical shape having a first surface and a second surface, and having an uneven portion formed on at least one of the first surface and the second surface;
A curved substrate, comprising: a conductor provided in a recess formed in the dielectric. The curved substrate according to claim 1,
The dielectric substrate is made of a fiber reinforced plastic. The curved substrate according to claim 2,
The curved substrate is characterized in that the fiber-reinforced plastic is a quartz fiber. The curved substrate according to claim 2 or 3,
The fiber-reinforced plastic is a curved substrate, wherein a bis-E cyanate ester resin is applied as a resin. In the curved substrate according to any one of claims 1 to 4,
The curved substrate, wherein the conductor is formed by filling the recess with a conductive paste. The curved substrate according to claim 5,
The conductive paste is a low-temperature drying type silver paste. In the curved substrate according to any one of claims 1 to 4,
The said conductor is formed by coat | covering the said recessed part with copper plating. The curved-surface-shaped board | substrate characterized by the above-mentioned. The curved substrate according to any one of claims 1 to 7,
The concave portion formed in the dielectric has a depth of 0.05 mm or more and less than 0.3 mm. A first dielectric body having a spherical shape having a first surface and a second surface, wherein the first surface has an uneven portion;
A conductor provided in a recess formed in the first dielectric;
And a second dielectric formed on the first surface on which the conductor is provided. The curved substrate according to claim 9,
A curved substrate having a sandwich structure having two of the curved substrates so as to sandwich a core material therebetween. A spherical shape having a first surface and a second surface is formed, and a dielectric having an uneven portion formed on at least one of the first surface and the second surface, and a recess formed in the dielectric are provided. A method of manufacturing a curved substrate having a conductor,
Forming irregularities on the surface of the curved mold,
Forming the dielectric having the concavo-convex portion formed on at least one of the first surface and the second surface using the mold; and
And a step of forming a conductor in a recess formed in the dielectric. In the manufacturing method of the curved-surface-shaped board | substrate of Claim 11,
The step of forming the conductor includes
Applying a conductive paste on the concavo-convex portion formed on the dielectric;
And a step of removing the conductive paste on the convex portion. In the manufacturing method of the curved-surface-shaped board | substrate of Claim 11,
The step of forming the conductor includes
Copper plating on the irregularities formed in the dielectric;
And a step of removing the copper plating on the convex portion. The method of manufacturing a curved substrate according to any one of claims 11 to 13,
The process for forming the dielectric material employs a VaRTM method (vacuum impregnation molding method). A first dielectric body having a spherical shape having a first surface and a second surface, wherein an uneven portion is formed on the first surface; a conductor provided in a recess formed in the first dielectric body; A method of manufacturing a curved substrate having a second dielectric formed on the first surface provided with a conductor,
Forming irregularities on the surface of the curved mold,
Forming the first dielectric having the irregularities formed on the first surface using the mold;
A curved substrate, comprising: forming a conductor in a recess formed in the first dielectric; and forming a second dielectric on the first surface provided with the conductor. Production method. A method of manufacturing a curved substrate having a sandwich structure having two curved substrates manufactured by the method of manufacturing a curved substrate according to claim 15, with a core material interposed therebetween,
A step of individually producing the two curved-surface-shaped substrates as a hat shape having a positioning hole in the flat surface portion of the edge and comprising the flat surface portion of the edge and the curved surface shape;
A step of producing the core material sandwiched between the two curved-surface-shaped substrates as a hat shape having an alignment hole in the flat-surface portion of the edge and composed of the flat surface portion of the edge and the curved surface shape;
A curved substrate having the sandwich structure is manufactured by sequentially laminating the first curved substrate, the core material, and the second curved substrate, which are formed in a hat shape, using positioning pins. A method of manufacturing a curved substrate, comprising: a step.

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