JPWO2017188063A1 - Coil array and DC-DC converter module - Google Patents

Abstract

  The element body (40) formed by laminating the base material layers (41, 42, 43), and coil elements (L1, L2, L3) provided in the element body (40) The element (L1) is configured by connecting coil patterns (11, 12, 13) provided corresponding to the base material layers (41 to 43), and the coil element (L2) is a base material. The coil pattern (24, 25, 26) provided corresponding to each of the layers (41 to 43) is connected, and the coil element (L3) is formed of each of the base material layers (41 to 43). The coil pattern (37, 38, 39) provided corresponding to is connected. When the element body (40) is viewed from the stacking direction (Z), the coil patterns (11, 38, 26) substantially overlap, the coil patterns (24, 12, 39) substantially overlap, and the coil The patterns (37, 25, 13) substantially overlap.

Description

  The present invention relates to a coil array having a plurality of coil elements, and a DC-DC converter module using the coil array.

  Conventionally, a multi-phase type switching power supply circuit is known.

  As an example of this type of power supply circuit, Patent Document 1 discloses a three-phase multiphase switching power supply circuit including an IC element, three coil elements, and a capacitor. In this power supply circuit, when switching is performed by an IC element, the ripple current generated by the capacitor is canceled by operating with the phase shifted by an equal interval (for example, 2π / 3 rad).

JP 2013-172666 A

  In a multi-phase type switching power supply circuit, there is a case where voltage output is performed in a state where coil elements provided in each power stage are coupled to each other. As the coil element in that case, for example, a coil array in which a plurality of coil elements are accommodated in one chip is used. However, if the degree of coupling between the coil elements of the coil array is different, there arises a problem that the ripple current cannot be sufficiently canceled in the switching power supply circuit.

  Therefore, an object of the present invention is to provide a coil array or the like that can reduce the difference in the degree of coupling between a plurality of coil elements.

  In order to achieve the above object, a coil array according to an aspect of the present invention includes an element body formed by laminating a first base material layer, a second base material layer, and a third base material layer, A coil array including a first coil element, a second coil element, and a third coil element provided in an element body, wherein the first coil element is a first coil pattern provided on the first base material layer. And a second coil pattern provided on the second base material layer and a third coil pattern provided on the third base material layer are connected, and the second coil element is The fourth coil pattern provided on the first base material layer, the fifth coil pattern provided on the second base material layer, and the sixth coil pattern provided on the third base material layer are connected. The third coil element is provided on the first base material layer. The seventh coil pattern, the eighth coil pattern provided on the second base material layer, and the ninth coil pattern provided on the third base material layer are connected to each other. When the body is viewed from the stacking direction of the first base material layer, the second base material layer, and the third base material layer, the first coil pattern, the eighth coil pattern, and the sixth coil pattern are The fourth coil pattern, the second coil pattern, and the ninth coil pattern substantially overlap, and the seventh coil pattern, the fifth coil pattern, and the third coil pattern substantially overlap. ing.

  Thus, when the element body is viewed from the stacking direction, the first coil pattern, the eighth coil pattern, and the sixth coil pattern substantially overlap, and the fourth coil pattern, the second coil pattern, and the ninth coil pattern By adopting a structure that substantially overlaps and the seventh coil pattern, the fifth coil pattern, and the third coil pattern substantially overlap, the difference in the degree of coupling between the coil elements of the coil array can be reduced.

  The first coil pattern, the second coil pattern, the third coil pattern, the fourth coil pattern, the fifth coil pattern, the sixth coil pattern, the seventh coil pattern, the eighth coil pattern, and Each of the ninth coil patterns is a loop pattern, and each of the first coil element, the second coil element, and the third coil element has a coil axis that is formed in the loop shape. The second coil pattern, the third coil pattern, the fourth coil pattern, the fifth coil pattern, the sixth coil pattern, the seventh coil pattern, the eighth coil pattern, and the ninth coil pattern, respectively. It may be located inside.

  According to this, the coupling degree between each coil element of a coil array can be made substantially equal.

  In addition, coil axes of the first coil element, the second coil element, and the third coil element may coincide with each other.

  According to this, the degree of coupling between the coil elements of the coil array can be made equal.

  The coil diameters of the first coil pattern, the second coil pattern, and the third coil pattern of the first coil element are: first coil pattern> second coil pattern> third coil pattern, The sizes of the respective coil diameters of the fourth coil pattern, the fifth coil pattern, and the sixth coil pattern of the second coil element are as follows: sixth coil pattern> fourth coil pattern> fifth coil pattern The coil diameters of the seventh coil pattern, the eighth coil pattern, and the ninth coil pattern of the third coil element are as follows: eighth coil pattern> 9th coil pattern> seventh coil Pattern.

  According to this, the respective coil diameters of the first coil pattern, the eighth coil pattern, and the sixth coil pattern, the respective coil diameters of the fourth coil pattern, the second coil pattern, and the ninth coil pattern, and the first The coil diameters of the 7-coil pattern, the fifth coil pattern, and the third coil pattern can be easily made uniform, and the inductance values of the coil elements can be made almost equal.

  The coil diameters of the first coil pattern, the eighth coil pattern, and the sixth coil pattern are equal, and the coil diameters of the fourth coil pattern, the second coil pattern, and the ninth coil pattern are The coil diameters of the seventh coil pattern, the fifth coil pattern, and the third coil pattern may be equal.

  According to this, the coil diameter of each coil element can be made equal, and the inductance value of each coil element can be made equal.

  Further, in a direction perpendicular to the stacking direction, a line-to-line distance between the first coil pattern and the fourth coil pattern, a line-to-line distance between the fourth coil pattern and the seventh coil pattern, and the eighth coil pattern And the second coil pattern, the line distance between the second coil pattern and the fifth coil pattern, the line distance between the sixth coil pattern and the ninth coil pattern, and the first The line-to-line distance between the 9 coil pattern and the third coil pattern may be equal.

  According to this, the degree of coupling between adjacent coil patterns in the direction perpendicular to the stacking direction can be made substantially equal.

  The first base material layer, the second base material layer, and the third base material layer are sequentially stacked, and in the stacking direction, an interval between the first coil pattern and the eighth coil pattern, and the eighth An interval between the coil pattern and the sixth coil pattern, an interval between the fourth coil pattern and the second coil pattern, an interval between the second coil pattern and the ninth coil pattern, the seventh coil pattern and the The interval between the five coil patterns and the interval between the fifth coil pattern and the third coil pattern may be equal.

  According to this, the degree of coupling between adjacent coil patterns in the stacking direction can be made substantially equal.

  In addition, the lengths of the first coil pattern, the eighth coil pattern, and the sixth coil pattern are equal, and the lengths of the fourth coil pattern, the second coil pattern, and the ninth coil pattern are The lengths of the seventh coil pattern, the fifth coil pattern, and the third coil pattern may be equal.

  According to this, the winding length of each coil element can be made equal, and the inductance value of each coil element can be made mutually equal.

  The first coil pattern, the second coil pattern, the third coil pattern, the fourth coil pattern, the fifth coil pattern, the sixth coil pattern, the seventh coil pattern, the eighth coil pattern, and Each of the ninth coil patterns may be configured by connecting a plurality of coil patterns.

  According to this, the inductance value of each coil element can be improved.

  Further, the first base material layer, the second base material layer, and the third base material layer are sequentially laminated, and between the first base material layer and the second base material layer, and the second base layer. An intermediate layer having a lower magnetic permeability than the first base material layer, the second base material layer, and the third base material layer may be provided between the material layer and the third base material layer, respectively. Good.

  Thus, by providing an intermediate layer having a low magnetic permeability between the coil patterns, it is possible to suppress the formation of minor loops in each of the coil patterns. As a result, the degree of coupling between the coil elements can be increased and the difference in the degree of coupling can be reduced.

  Moreover, the DC-DC converter module which concerns on 1 aspect of this invention may be comprised by the said coil array. That is, a DC-DC converter module according to an aspect of the present invention includes an element body formed by laminating a first base material layer, a second base material layer, and a third base material layer, and the element body. A coil array comprising a provided first coil element, a second coil element, and a third coil element, wherein the first coil element comprises a first coil pattern provided on the first base material layer, A second coil pattern provided on the second base material layer and a third coil pattern provided on the third base material layer are connected to each other, and the second coil element includes the first base element. The fourth coil pattern provided on the material layer, the fifth coil pattern provided on the second base material layer, and the sixth coil pattern provided on the third base material layer are connected to each other. And the third coil element is disposed on the first base material layer. The seventh coil pattern, the eighth coil pattern provided on the second base material layer, and the ninth coil pattern provided on the third base material layer are connected, and the element When the body is viewed from the stacking direction of the first base material layer, the second base material layer, and the third base material layer, the first coil pattern, the eighth coil pattern, and the sixth coil pattern are The fourth coil pattern, the second coil pattern, and the ninth coil pattern substantially overlap, and the seventh coil pattern, the fifth coil pattern, and the third coil pattern substantially overlap. The coil array is configured.

  As described above, the ripple current in the DC-DC converter module can be reduced by using the coil array having a small coupling degree difference between the coil elements.

  ADVANTAGE OF THE INVENTION According to this invention, the coil array etc. which can make the difference of the coupling degree between several coil elements small can be provided.

1A and 1B are perspective views of a coil array according to Embodiment 1, in which FIG. 1A is a diagram viewed from one main surface side of the element body, and FIG. 1B is a diagram viewed from the other main surface side. 2A is a coil array according to Embodiment 1, and is a schematic diagram of a cross section taken along line IIA-IIA shown in FIG. FIG. 2B is a schematic diagram when the coil array according to Embodiment 1 is viewed from the stacking direction. FIG. 3 is an equivalent circuit of the coil array according to the first embodiment. FIG. 4 is a diagram illustrating each component (base material layer, coil pattern, lead conductor pattern) of the coil array according to the first embodiment, and (a) to (c) show each base material layer on the lower surface side. It is the figure seen from. FIG. 5 is a perspective view schematically showing a coil pattern, which is a coil array in a modification of the first embodiment. FIG. 6 is a schematic cross-sectional view of the coil array according to the second embodiment. FIG. 7 is a perspective view of the coil array according to the third embodiment. FIG. 8 is a schematic cross-sectional view of the coil array according to the third embodiment. 9A and 9B are perspective views of a DC-DC converter module according to Embodiment 4, wherein FIG. 9A is a diagram viewed from one main surface side of the element body, and FIG. 9B is a diagram viewed from the other main surface side. is there. FIG. 10 is a circuit diagram of a DC-DC converter module according to the fourth embodiment. FIG. 11 is a perspective view of a coil array according to the fifth embodiment. 12 is a coil array according to the fifth embodiment, and is a schematic diagram of a cross section taken along line XII-XII shown in FIG. FIG. 13 is an equivalent circuit of the coil array according to the fifth embodiment.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. It should be noted that each of the embodiments described below shows a comprehensive or specific example. The numerical values, shapes, materials, constituent elements, arrangement and connection forms of the constituent elements, manufacturing steps, order of manufacturing steps, and the like shown in the following embodiments are merely examples, and are not intended to limit the present invention. Among the constituent elements in the following embodiments, constituent elements not described in the independent claims are described as optional constituent elements.

  Each figure is a schematic diagram and is not necessarily illustrated strictly. Moreover, in each figure, the same code | symbol is attached | subjected to the substantially same structure, The overlapping description is abbreviate | omitted or simplified. In the following embodiments, “connected” includes not only the case of direct connection but also the case of electrical connection via other elements.

(Embodiment 1)
The coil array according to the first embodiment is a laminated coil built-in component that incorporates a plurality of coil elements. This coil array is used as a part constituting a power supply module such as a choke coil of a multi-phase DC-DC converter.

  1A and 1B are perspective views of a coil array 1 according to Embodiment 1, wherein FIG. 1A is a view seen from one main surface 40a side of an element body 40, and FIG. 1B is a view seen from the other main surface 40b side. FIG. 2A is a coil array 1 according to Embodiment 1, and is a schematic diagram of a cross section taken along line IIA-IIA shown in FIG. FIG. 2B is a schematic diagram when the coil array 1 is viewed from the stacking direction Z. FIG. 3 is an equivalent circuit of the coil array 1.

  The coil array 1 has via conductors (interlayer conductors) and lead conductor patterns that connect the coil patterns, but these are not shown in FIGS. 1, 2A, and 2B.

  As shown in FIGS. 1, 2A, and 2B, the coil array 1 includes an element body 40 having a plurality of base material layers 41, 42, and 43, and a first coil element L1 provided in the element body 40. A second coil element L2 and a third coil element L3 are provided. The coil array 1 includes a plurality of external terminals 50 provided on the other main surface 40b (the surface opposite to the one main surface 40a) of the element body 40. The external terminal 50 is an LGA (Land Grid Array) type planar electrode.

  The element body 40 includes the first base material layer 41, the second base material layer 42, the third base material layer 43, and the outermost layers provided on both outer sides in the stacking direction Z of the base material layers 41 to 43. And outer layers 44 and 45. Each thickness of each base material layer 41-43 is the same. As a material for each of the base material layers 41 to 43 and the outermost layers 44 and 45, for example, magnetic ferrite ceramics are used. Specifically, ferrite containing iron oxide as a main component and containing at least one of zinc, nickel, and copper is used.

  Inside the element body 40, the first coil element L1, the second coil element L2, and the third coil element L3 are provided in a mixed state. The coil array 1 is configured such that the degree of coupling (coupling coefficients K1, K2, K3) between the coil elements L1, L2, L3 is equal.

  The first coil element L1 is provided on the first coil pattern 11 provided on the first base material layer 41, the second coil pattern 12 provided on the second base material layer 42, and the third base material layer 43. The third coil pattern 13 is connected. The coil patterns 11, 12, and 13 are sequentially connected by via conductors. Each of both ends of the first coil element L1 is connected to each of the pair of external terminals 50 via a lead conductor pattern.

  The second coil element L2 is provided on the fourth coil pattern 24 provided on the first base material layer 41, the fifth coil pattern 25 provided on the second base material layer 42, and the third base material layer 43. The sixth coil pattern 26 is connected. The coil patterns 24, 25, and 26 are sequentially connected by via conductors. Both ends of the second coil element L2 are connected to the pair of external terminals 50 via lead conductor patterns.

  The third coil element L3 is provided in the seventh coil pattern 37 provided in the first base material layer 41, the eighth coil pattern 38 provided in the second base material layer 42, and the third base material layer 43. The ninth coil pattern 39 is connected. The coil patterns 37, 38, and 39 are sequentially connected by via conductors. Each of both ends of the third coil element L3 is connected to each of the pair of external terminals 50 via a lead conductor pattern.

  Each of the coil patterns 11 to 39 is a rectangular pattern having a loop shape. Each coil axis A of each coil element L1, L2, L3 is located inside each of the coil patterns 11 to 39 having a loop shape. The coil axes (winding axes) of the coil elements L1, L2, and L3 are the same. The coil patterns 11 to 39 have the same width dimension and the same thickness dimension.

  In the following, the direction in which the plurality of base material layers 41 to 43 are stacked is the stacking direction Z, the direction perpendicular to the stacking direction Z, and the direction in which the long sides of the rectangular coil patterns 11 to 39 extend. Is called the Y direction. The direction perpendicular to both the stacking direction Z and the X direction is called the Y direction.

  As a material of each coil pattern 11-39, the metal or alloy which has silver as a main component is used, for example. Each of these coil patterns 11 to 39 may be plated with, for example, nickel, palladium, or gold.

  The coil diameters of the coil patterns 11 to 13 of the first coil element L1 are: first coil pattern 11> second coil pattern 12> third coil pattern 13. The coil diameters of the coil patterns 24 to 26 of the second coil element L2 are sixth coil pattern 26> fourth coil pattern 24> fifth coil pattern 25. The coil diameters of the coil patterns 37 to 39 of the third coil element L3 are the eighth coil pattern 38> the ninth coil pattern 39> the seventh coil pattern 37.

  In the present embodiment, when the element body 40 is viewed from the stacking direction Z, the first coil pattern 11, the eighth coil pattern 38, and the sixth coil pattern 26 substantially overlap, and the fourth coil pattern 24, the second coil pattern 24, The coil pattern 12 and the ninth coil pattern 39 substantially overlap, and the seventh coil pattern 37, the fifth coil pattern 25, and the third coil pattern 13 substantially overlap. Thereby, the coil array 1 has a structure in which the degree of coupling between the coil elements L1, L2, and L3 is substantially equal. Note that “substantially overlapping” does not need to be completely identical, and includes a case where the shapes of two coil patterns to be compared are approximately equal and part of them do not overlap.

  In the present embodiment, the first coil pattern 11, the eighth coil pattern 38, and the sixth coil pattern 26 have the same coil diameter, and the fourth coil pattern 24, the second coil pattern 12, and the ninth coil pattern 39. The coil diameters of the seventh coil pattern 37, the fifth coil pattern 25, and the third coil pattern 13 are equal. According to this, each coil diameter of the coil patterns 11, 38, 26, each coil diameter of the coil patterns 24, 12, 39, and each coil diameter of the coil patterns 37, 25, 13 can be easily made. The inductance values of the coil elements L1, L2, and L3 can be made substantially equal. When the two coil patterns to be compared have a rectangular shape, the distance between the opposing long sides (the length of the short side) is the same, and the distance between the opposing short sides ( It means that the length of the long side is the same.

  In the present embodiment, the first coil pattern 11, the eighth coil pattern 38 and the sixth coil pattern 26 have the same length, and the fourth coil pattern 24, the second coil pattern 12 and the ninth coil pattern 39. Are equal in length, and the seventh coil pattern 37, the fifth coil pattern 25, and the third coil pattern 13 are equal in length. With this structure, the coil lengths of the coil elements L1, L2, and L3 in the coil array 1 can be made equal to each other, and the inductance values of the coil elements L1, L2, and L3 can be made equal to each other.

  Further, in the present embodiment, in the direction (X direction and Y direction) perpendicular to the stacking direction Z, the line-to-line distances between adjacent coil patterns are equal. Specifically, the line-to-line distance between the first coil pattern 11 and the fourth coil pattern 24, the line-to-line distance between the fourth coil pattern 24 and the seventh coil pattern 37, the eighth coil pattern 38 and the second coil pattern 12. , The distance between the second coil pattern 12 and the fifth coil pattern 25, the distance between the sixth coil pattern 26 and the ninth coil pattern 39, and the ninth coil pattern 39 and the third The distance between lines with the coil pattern 13 is equal. With this structure, the degree of coupling between adjacent coil patterns in the direction perpendicular to the stacking direction Z (the degree of coupling when coupled via a magnetic field) can be made substantially equal.

  In the present embodiment, in the direction perpendicular to the stacking direction Z, the number of times that the coil pattern of one coil element is adjacent to the coil pattern of the other two coil elements, that is, the number of adjacent times is the same. For example, when focusing on the first coil element L1, the coil pattern 24 is located inside the coil pattern 11 in the first base material layer 41, and the coil pattern 25 and the outside are located inside the coil pattern 12 in the second base material layer 42. The coil pattern 38 is located on the outside of the coil pattern 13 in the third base material layer 43. In other words, the coil patterns of the second coil element L2 and the third coil element L3 are each positioned twice next to the coil pattern of the first coil element L1. Even when attention is paid to the second coil element L2 or the third coil element L3, the coil patterns of the other coil elements are configured to be positioned twice. Thereby, in the coil array 1, in the direction perpendicular to the stacking direction Z, it is possible to equalize the opportunities for adjacent coil patterns to be combined, and to achieve a uniform degree of coupling.

  Moreover, in this Embodiment, the space | interval of the adjacent coil patterns in the lamination direction Z is equal. Specifically, the interval between the first coil pattern 11 and the eighth coil pattern 38, the interval between the eighth coil pattern 38 and the sixth coil pattern 26, the interval between the fourth coil pattern 24 and the second coil pattern 12, The interval between the second coil pattern 12 and the ninth coil pattern 39, the interval between the seventh coil pattern 37 and the fifth coil pattern 25, and the interval between the fifth coil pattern 25 and the third coil pattern 13 are equal. Thereby, the coil array 1 has a structure in which the degree of coupling between adjacent coil patterns in the stacking direction Z is substantially equal.

  Further, in the present embodiment, in the stacking direction Z, the number of times the coil pattern of one coil element is adjacent to the coil pattern of the other two coil elements, that is, the number of adjacent times is the same. For example, when focusing on the first coil element L1, the coil pattern 38 is located below the coil pattern 11, the coil pattern 24 is located above the coil pattern 12, the coil pattern 39 is located below, and the coil pattern 13 is located above the coil pattern 13. The coil pattern 25 is located. In other words, the coil patterns of the second coil element L2 and the third coil element L3 are respectively arranged twice above and below the coil pattern of the first coil element L1. Even when attention is paid to the second coil element L2 or the third coil element L3, the coil patterns of the other coil elements are configured to be positioned twice. Thereby, in the coil array 1, in the lamination direction Z, the opportunity for adjacent coil patterns to combine can be made uniform, and the coupling degree can be leveled.

  In the above description, attention is paid to the degree of coupling between adjacent coil patterns. However, the present invention is not limited to this, and the coil array 1 is not limited to the adjacent coil patterns, even when considering the degree of coupling between adjacent coil patterns. Are connected in a well-balanced state. In addition, the coil array 1 is not limited to coupling via a magnetic field, but is balanced even by capacitive coupling via an electric field.

  Next, the manufacturing process of the coil array 1 will be described.

  FIG. 4 is a diagram illustrating each component (base material layers 41 to 43, coil patterns 11 to 39, and lead conductor patterns) of the coil array 1, and (a) to (c) are the base material layers 41 to 41, respectively. It is the figure which looked at 43 from the lower surface side.

  First, a plurality of ceramic green sheets are prepared. Specifically, a green sheet is prepared by sheet-forming a slurry containing magnetic ceramic powder.

  Next, in the green sheet to be the first base material layer 41, a plurality of through holes are formed, a conductive paste is filled in the through holes to form a plurality of via conductors, and a coil is formed on the main surface of the green sheet. Patterns 11, 24, and 37 are formed. Similarly, in the green sheet to be the second base material layer 42, a plurality of via conductors are formed and the coil patterns 38, 12, 25 are formed. Similarly, in the green sheet to be the third base material layer 43, a plurality of via conductors are formed, and the coil patterns 26, 39, and 13 are formed. The through hole is formed by, for example, laser processing. The coil patterns 11 to 39 are formed, for example, by screen printing a conductor paste containing Ag powder.

  Next, a plurality of ceramic green sheets on which the respective conductor patterns are formed are laminated and pressure-bonded. Thus, the ends b, h, n of the coil patterns 11, 24, 37 and the ends c, i, o of the coil patterns 12, 25, 38 are connected via the via conductors. Further, the ends d, j, and p of the coil patterns 12, 25, and 38 and the ends e, k, and q of the coil patterns 13, 26, and 39 are connected to each other through via conductors. And the laminated | stacked laminated body block is cut and separated into pieces, and is baked collectively after that. By this firing, the magnetic ceramic powder in each green sheet is sintered and the Ag powder in the conductor paste is sintered.

  The magnetic ceramics are so-called LTCC ceramics (Low Temperature Co-fired Ceramics), and the firing temperature is not higher than the melting point of silver, and silver can be used as a material for each coil pattern and via conductor. By configuring the coil elements L1, L2, and L3 using silver having a low resistivity, the coil array 1 with less loss can be manufactured.

  As described above, in the coil array 1 according to the present embodiment, when the element body 40 is viewed from the stacking direction Z, the coil patterns 11, 38 and 26 substantially overlap, and the coil patterns 24, 12 and 39 are overlapped. Substantially overlap, and the coil patterns 37, 25, and 13 substantially overlap. Thereby, the difference of the coupling degree between each coil element L1, L2, L3 of the coil array 1 can be made small.

  For example, as a comparative example, a coil array in which three coil elements are sequentially arranged in the element body can be considered. However, in the coil array of the comparative example, the degree of coupling between adjacent coil elements can be made equal, but it is difficult to match the degree of coupling between coil elements located at both ends to the degree of coupling between other coil elements. is there. On the other hand, in the coil array 1 according to the present embodiment, the difference in the degree of coupling between the coil elements can be reduced in a state where the three coil elements are accommodated in one chip.

Further, in the coil array 1 according to the present embodiment, when the element body 40 is viewed from the stacking direction Z, the sum of the overlapping areas of the coil patterns of one set of coil elements is the coil of the other set of coil elements. It is equal to the sum of the overlapping areas of the patterns. Specifically, the coil patterns 11 to 39 have the relationship shown below.
(Area where coil patterns 11 and 38 overlap + Area where coil patterns 12 and 39 overlap) = (Area where coil patterns 12 and 24 overlap + Area where coil patterns 13 and 25 overlap) ) = (Area where coil patterns 25 and 37 overlap + Area where coil patterns 26 and 38 overlap)

  With this structure, the magnetic field coupling and capacitive coupling between the coil patterns 11 to 39 can be made substantially equal.

(Modification of Embodiment 1)
FIG. 5 is a perspective view schematically showing coil patterns 11 to 39, which is a coil array 1A according to a modification of the first embodiment.

  The coil array 1A in the modified example is different from the coil array 1 shown in the first embodiment in how the coil elements L1, L2, and L3 are pulled out. Specifically, the lead wires at both ends of the second coil element L1 are located at In / L2 and Out / L2 located on the negative side in the X direction, and the lead wires at both ends of the first coil element L1 and the third coil element L3 are denoted as X It is pulled out to In / L1, Out / L1, In / L3, and Out / L3 located on the positive direction side.

  Further, a plurality of end portions connecting the coil patterns 11 to 39 are dispersed in the corners of the rectangular coil pattern so as not to concentrate on a predetermined region when viewed from the stacking direction Z.

  In the coil array 1A in the modification, when the element body 40 is viewed from the stacking direction Z, the coil patterns 11, 38 and 26 substantially overlap, the coil patterns 24, 12 and 39 substantially overlap, and the coil pattern 37 , 25 and 13 substantially overlap. Thereby, the difference of the coupling degree between each coil element L1, L2, and L3 can be made small.

(Embodiment 2)
FIG. 6 is a schematic cross-sectional view of the coil array 1B according to the second embodiment.

  In the coil array 1B according to the second embodiment, each of the coil patterns 11 to 39 is configured by connecting a plurality of coil patterns. Further, intermediate layers 47a and 47b having a low magnetic permeability are provided between predetermined coil patterns adjacent in the stacking direction Z.

  In the coil array 1B, three coil patterns 11, 24, and 37 are provided in the magnetic layer 46a, and three coil patterns 38, 12, and 25 are provided in the magnetic layer 46b. Each of the three coil patterns 26, 39, and 13 is provided in the magnetic layer 46c. Each of the magnetic layers 46a, 46b, 46c is formed by laminating a plurality of base material layers.

  An intermediate layer 47a is provided between the magnetic layer 46a and the magnetic layer 46b, and an intermediate layer 47b is provided between the magnetic layer 46b and the magnetic layer 46c. These intermediate layers 47a and 47b are made of a material having a relative permeability lower than that of the magnetic layers 46a to 46c. For example, nonmagnetic ferrite ceramics or insulating glass ceramics mainly composed of alumina and glass is used. It is done. The intermediate layers 47a and 47b are sometimes called nonmagnetic layers.

  Thus, in the coil array 1B, since each of the coil patterns 11 to 39 is formed of a plurality of layers, the inductance values of the coil elements L1, L2, and L3 can be improved.

  Further, an intermediate layer 47a having a low magnetic permeability is provided between the coil patterns 11, 24, 37 and the coil patterns 38, 12, 25 and between the coil patterns 38, 12, 25 and the coil patterns 26, 39, 13. , 47b, it is possible to suppress the formation of minor loops in each of the coil patterns 11 to 39. As a result, the degree of coupling between the coil elements L1, L2, and L3 can be increased.

(Embodiment 3)
FIG. 7 is a perspective view of a coil array 1C according to the third embodiment. FIG. 8 is a schematic cross-sectional view of the coil array 1C.

  In the coil array 1 </ b> C according to the third embodiment, a plurality of external terminals 51 are provided on the side surfaces 40 c and 40 d of the element body 40.

  In this coil array 1 </ b> C, the element body 40 shown in the second embodiment is used. Note that the element body shown in the first embodiment may be used.

  Three external terminals 51 are formed on one side surface 40c of the element body 40 and three on the other side surface 40d. The external terminals 51 have a predetermined width in the Y direction, and are provided at intervals on the side surfaces 40c and 40d. The external terminal 51 has a lateral U shape and is provided so as to extend from the side surfaces 40c and 40d to a part of the one main surface 40a and from the side surfaces 40c and 40d to a part of the other main surface 40b.

  In the coil array 1C according to the third embodiment, a plurality of external terminals 51 are provided on the side surfaces 40c and 40d of the element body. Thereby, the wiring drawn out from the end portions of the coil elements L1, L2, and L3 to the outside of the element body 40 can have a simple structure.

(Embodiment 4)
In the present embodiment, a DC-DC converter module 2 using the coil array 1 shown in the first embodiment will be described.

  9A and 9B are perspective views of the DC-DC converter module 2 according to the fourth embodiment, where FIG. 9A is a diagram viewed from the one main surface 40a side of the element body 40, and FIG. 9B is the other main surface 40b side. FIG. FIG. 10 is a circuit diagram of the DC-DC converter module 2.

  The DC-DC converter module 2 is a three-phase multi-phase DC-DC converter, and includes an element body 40, three coil elements L1, L2, and L3 provided in the element body 40, and one main surface 40a. A switching IC element 61 and a plurality of capacitors 62a, 62b, 62c, and 62d that are mounted and connected to the coil elements L1, L2, and L3 are provided. A plurality of external terminals 50 are provided on the other main surface 40 b of the element body 40.

  As shown in FIG. 10, the input terminal of the SW-IC (switching IC element 61) is connected to the external terminal Vin. The SW-IC has three output terminals. Each of the three output terminals is connected to the external terminal Vout1 through the first coil element L1, to the external terminal Vout2 through the second coil element L2, and to the third coil element. It is connected to the external terminal Vout3 via L3. Note that the external terminal Vin and the external terminals Vout <b> 1 to 3 are part of the external terminal 50.

  One end of the input side capacitor Cin (capacitor 62a) is connected between the external terminal Vin and the input terminal of the SW-IC, and the other end is connected to the ground. One end of the output side capacitor C1 (capacitor 62b) is connected between the first coil element L1 and the external terminal Vout1, and the other end is connected to the ground. One end of the output side capacitor C2 (capacitor 62c) is connected between the second coil element L2 and the external terminal Vout2, and the other end is connected to the ground. One end of the output side capacitor C3 (capacitor 62d) is connected between the third coil element L3 and the external terminal Vout3, and the other end is connected to the ground.

  The SW-IC includes, for example, a plurality of switch elements such as field effect transistors, and a controller that makes the plurality of switch elements conductive or non-conductive exclusively (alternately). The DC-DC converter module 2 switches the input voltage supplied to the external terminal Vin at a predetermined frequency using the plurality of switch elements, and also includes the coil elements L1, L2, L3 and the capacitor C1, The signals are smoothed by C2 and C3, converted to a desired output voltage, and output from the external terminals Vout1 to Vout1.

  In the DC-DC converter module 2 according to the present embodiment, the coil array 1 shown in the first embodiment is used as the coil elements L1, L2, and L3 shown in FIG. Thereby, the difference in the degree of coupling between the coil elements L1, L2, and L3 can be reduced, and the ripple current in the DC-DC converter module 2 can be reduced. Further, the load step response can be speeded up by reducing the difference in the degree of coupling between the coil elements L1, L2, and L3.

(Embodiment 5)
Next, a coil array 1D according to Embodiment 5 will be described. In coil array 1D of the fifth embodiment, external terminals are provided on both main surfaces of one main surface 40a and the other main surface 40b of element body 40.

  FIG. 11 is a perspective view of the coil array 1D. 12 is a schematic diagram of a cross section taken along line XII-XII shown in FIG. 11, which is the coil array 1D of the fifth embodiment. FIG. 13 is an equivalent circuit of the coil array 1D. Note that the coil array 1D has via conductors (interlayer conductors) and lead conductor patterns that connect the coil patterns, but these are not shown in FIGS. 11 and 12.

  As shown in FIGS. 11 to 13, the coil array 1 </ b> D includes an element body 40 having a plurality of base material layers 41, 42, 43, and a first coil element L <b> 1 and a second coil element provided in the element body 40. L2 and a third coil element L3. The coil array 1 includes a plurality of external terminals P1, P3, and P5 provided on the other main surface 40b of the element body 40, and a plurality of external terminals P2, P4, and P6 provided on the one main surface 40a. ing. The external terminals P1 to P6 are LGA type planar electrodes.

  The first coil element L1 is provided on the first coil pattern 11 provided on the first base material layer 41, the second coil pattern 12 provided on the second base material layer 42, and the third base material layer 43. The third coil pattern 13 is connected. The coil patterns 11, 12, and 13 are sequentially connected by via conductors. One end of the first coil element L1 is connected to the external terminal P1 via a lead conductor pattern, and the other end of the first coil element L1 is connected to the external terminal P2 via a lead conductor pattern.

  The second coil element L2 is provided on the fourth coil pattern 24 provided on the first base material layer 41, the fifth coil pattern 25 provided on the second base material layer 42, and the third base material layer 43. The sixth coil pattern 26 is connected. The coil patterns 24, 25, and 26 are sequentially connected by via conductors. One end of the second coil element L2 is connected to the external terminal P3 via a lead conductor pattern, and the other end of the second coil element L2 is connected to the external terminal P4 via a lead conductor pattern.

  The third coil element L3 is provided in the seventh coil pattern 37 provided in the first base material layer 41, the eighth coil pattern 38 provided in the second base material layer 42, and the third base material layer 43. The ninth coil pattern 39 is connected. The coil patterns 37, 38, and 39 are sequentially connected by via conductors. One end of the third coil element L3 is connected to the external terminal P5 via a lead conductor pattern, and the other end of the third coil element L3 is connected to the external terminal P6 via a lead conductor pattern.

  For example, the coil array 1D is mounted on a printed wiring board (not shown) built in the electronic device. Specifically, external terminals P1, P3, and P5 provided on the other main surface 40b side of the element body 40 are joined to the printed wiring board with solder or the like. A flexible cable (not shown) is joined to the external terminals P2, P4, and P6 provided on the one main surface 40a side by solder or the like. That is, the coil array 1D is used as an interposer for flexible cables and printed wiring boards. A flexible wiring board may be joined to the external terminals P2, P4, P6 of the coil array 1D instead of the flexible cable.

  In the coil array 1D according to the present embodiment, when the element body 40 is viewed from the stacking direction Z, the first coil pattern 11, the eighth coil pattern 38, and the sixth coil pattern 26 substantially overlap, and the fourth coil The pattern 24, the second coil pattern 12, and the ninth coil pattern 39 substantially overlap, and the seventh coil pattern 37, the fifth coil pattern 25, and the third coil pattern 13 substantially overlap. According to this configuration, the degree of coupling between the coil elements L1, L2, and L3 can be made substantially equal, and the difference in degree of coupling between the coil elements L1, L2, and L3 can be reduced.

(Other embodiments)
As described above, the coil arrays and the DC-DC converter modules according to the first to fifth embodiments and the modifications thereof have been described. However, the present invention is limited to the individual embodiments 1 to 5 and the modifications. Not. Unless it deviates from the meaning of the present invention, various modifications conceived by those skilled in the art are applied to the first to fifth embodiments and the modifications thereof, and the embodiment is constructed by combining different embodiments and components in the modifications. May also be included within the scope of one or more embodiments of the invention.

  In the first embodiment, the element body 40 is formed by sequentially laminating the base material layer 41, the base material layer 42, and the base material layer 43. However, the present invention is not limited to this. For example, the base body layer 43 is provided between the base material layer 41 and the base material layer 42, or the base material layer 41 is provided between the base material layer 42 and the base material layer 43 to form the element body 40. May be. That is, the 1st base material layer 41, the 2nd base material layer 42, and the 3rd base material layer 43 may be laminated | stacked sequentially, and may be laminated | stacked in random order.

  Moreover, the shape of the coil patterns 11 to 39 is not limited to a rectangular shape, and may be a circular shape or an elliptical shape. Moreover, the winding number of the coil patterns 11 to 39 may be one or half winding, and the winding shape may be spiral.

  The coil array of the present invention can be widely used as a component constituting a power supply module such as a choke coil of a DC-DC converter. The DC-DC converter module can be used as a component constituting a multiphase type switching power supply circuit.

1, 1A, 1B, 1C, 1D Coil array 2 DC-DC converter module
DESCRIPTION OF SYMBOLS 11 1st coil pattern 12 2nd coil pattern 13 3rd coil pattern 24 4th coil pattern 25 5th coil pattern 26 6th coil pattern 37 7th coil pattern 38 8th coil pattern 39 9th coil pattern 40 Element 40a Main surface 40b Other main surface 41 First base material layer 42 Second base material layer 43 Third base material layer 44, 45 Outermost layer 46a, 46b, 46c Magnetic layer 47a, 47b Intermediate layer (layer with low magnetic permeability)
50, 51 External terminal 61 Switching IC element 62a, 62b, 62c, 62d Capacitor A Coil shaft L1 First coil element L2 Second coil element L3 Third coil element P1, P2, P3, P4, P5, P6 External terminal

In order to achieve the above object, a coil array according to an aspect of the present invention includes an element body formed by laminating a first base material layer, a second base material layer, and a third base material layer, A coil array including a first coil element, a second coil element, and a third coil element provided in an element body, wherein the first coil element is a first coil pattern provided on the first base material layer. And a second coil pattern provided on the second base material layer and a third coil pattern provided on the third base material layer are connected, and the second coil element is The fourth coil pattern provided on the first base material layer, the fifth coil pattern provided on the second base material layer, and the sixth coil pattern provided on the third base material layer are connected. The third coil element is provided on the first base material layer. The seventh coil pattern, the eighth coil pattern provided on the second base material layer, and the ninth coil pattern provided on the third base material layer are connected to each other. When the body is viewed from the stacking direction of the first base material layer, the second base material layer, and the third base material layer, the first coil pattern, the eighth coil pattern, and the sixth coil pattern are The fourth coil pattern, the second coil pattern, and the ninth coil pattern substantially overlap, and the seventh coil pattern, the fifth coil pattern, and the third coil pattern substantially overlap. and said first base layer, the lamination direction of the second base material layer and the third base material layer, and, in each of the stacking direction perpendicular to the direction, the first coil element, the second carp Number of coil patterns of a single coil element is adjacent the coil pattern of the other two coil elements of the element and the third coil element is in the same.

Moreover, the DC-DC converter module which concerns on 1 aspect of this invention may be comprised by the said coil array. That is, a DC-DC converter module according to an aspect of the present invention includes an element body formed by laminating a first base material layer, a second base material layer, and a third base material layer, and the element body. A coil array comprising a provided first coil element, a second coil element, and a third coil element, wherein the first coil element comprises a first coil pattern provided on the first base material layer, A second coil pattern provided on the second base material layer and a third coil pattern provided on the third base material layer are connected to each other, and the second coil element includes the first base element. The fourth coil pattern provided on the material layer, the fifth coil pattern provided on the second base material layer, and the sixth coil pattern provided on the third base material layer are connected to each other. And the third coil element is disposed on the first base material layer. The seventh coil pattern, the eighth coil pattern provided on the second base material layer, and the ninth coil pattern provided on the third base material layer are connected, and the element When the body is viewed from the stacking direction of the first base material layer, the second base material layer, and the third base material layer, the first coil pattern, the eighth coil pattern, and the sixth coil pattern are The fourth coil pattern, the second coil pattern, and the ninth coil pattern substantially overlap, and the seventh coil pattern, the fifth coil pattern, and the third coil pattern substantially overlap. and said first base layer, the lamination direction of the second base material layer and the third base material layer, and, in each of the stacking direction perpendicular to the direction, the first coil element, the second co Number of coil patterns of a single coil element is adjacent the coil pattern of the other two coil elements of the Le element and the third coil element is in the same, and a coil array.

Claims (11)

An element body formed by laminating a first base material layer, a second base material layer, and a third base material layer, and a first coil element, a second coil element, and a third coil provided in the element body A coil array comprising elements,
The first coil element includes a first coil pattern provided on the first base material layer, a second coil pattern provided on the second base material layer, and a first coil pattern provided on the third base material layer. It is composed by connecting 3 coil patterns,
The second coil element includes a fourth coil pattern provided on the first base material layer, a fifth coil pattern provided on the second base material layer, and a third coil pattern provided on the third base material layer. It is configured by connecting 6 coil patterns,
The third coil element includes a seventh coil pattern provided on the first base material layer, an eighth coil pattern provided on the second base material layer, and a third coil pattern provided on the third base material layer. It is configured by connecting 9 coil patterns,
When the element body is viewed from the stacking direction of the first base material layer, the second base material layer, and the third base material layer,
The first coil pattern, the eighth coil pattern, and the sixth coil pattern substantially overlap, and the fourth coil pattern, the second coil pattern, and the ninth coil pattern substantially overlap, and the seventh coil A pattern, the fifth coil pattern and the third coil pattern substantially overlap each other. The first coil pattern, the second coil pattern, the third coil pattern, the fourth coil pattern, the fifth coil pattern, the sixth coil pattern, the seventh coil pattern, the eighth coil pattern, and the first Each of the 9 coil patterns is a loop pattern,
The coil axis of each of the first coil element, the second coil element, and the third coil element is the loop-shaped first coil pattern, the second coil pattern, the third coil pattern, the fourth The coil array according to claim 1, wherein the coil array is located inside each of a coil pattern, the fifth coil pattern, the sixth coil pattern, the seventh coil pattern, the eighth coil pattern, and the ninth coil pattern. The coil array according to claim 1 or 2, wherein coil axes of the first coil element, the second coil element, and the third coil element coincide with each other. The respective coil diameters of the first coil pattern, the second coil pattern, and the third coil pattern of the first coil element are: first coil pattern> second coil pattern> third coil pattern. ,
The coil diameters of the fourth coil pattern, the fifth coil pattern, and the sixth coil pattern of the second coil element are as follows: sixth coil pattern> fourth coil pattern> fifth coil pattern. ,
The coil diameters of the seventh coil pattern, the eighth coil pattern, and the ninth coil pattern of the third coil element are as follows: eighth coil pattern> 9th coil pattern> seventh coil pattern. The coil array according to any one of claims 1 to 3. The coil diameters of the first coil pattern, the eighth coil pattern, and the sixth coil pattern are equal,
The coil diameters of the fourth coil pattern, the second coil pattern, and the ninth coil pattern are equal,
The coil array according to claim 4, wherein the seventh coil pattern, the fifth coil pattern, and the third coil pattern have the same coil diameter. In a direction perpendicular to the stacking direction,
Distance between lines of the first coil pattern and the fourth coil pattern, distance between lines of the fourth coil pattern and the seventh coil pattern, distance between lines of the eighth coil pattern and the second coil pattern A distance between lines of the second coil pattern and the fifth coil pattern; a distance between lines of the sixth coil pattern and the ninth coil pattern; and a distance between the ninth coil pattern and the third coil pattern. The coil array according to claim 4 or 5, wherein the distance between the lines is equal. The first substrate layer, the second substrate layer, and the third substrate layer are sequentially laminated,
In the stacking direction,
An interval between the first coil pattern and the eighth coil pattern, an interval between the eighth coil pattern and the sixth coil pattern, an interval between the fourth coil pattern and the second coil pattern, the second coil pattern The distance between the coil pattern and the ninth coil pattern, the distance between the seventh coil pattern and the fifth coil pattern, and the distance between the fifth coil pattern and the third coil pattern are equal. The coil array according to any one of claims. The lengths of the first coil pattern, the eighth coil pattern, and the sixth coil pattern are equal,
The lengths of the fourth coil pattern, the second coil pattern, and the ninth coil pattern are equal,
The coil array according to any one of claims 4 to 7, wherein each of the seventh coil pattern, the fifth coil pattern, and the third coil pattern is equal in length. The first coil pattern, the second coil pattern, the third coil pattern, the fourth coil pattern, the fifth coil pattern, the sixth coil pattern, the seventh coil pattern, the eighth coil pattern, and the first The coil array according to any one of claims 1 to 8, wherein each of the nine coil patterns is configured by connecting a plurality of coil patterns. The first substrate layer, the second substrate layer, and the third substrate layer are sequentially laminated,
Between the first base material layer and the second base material layer, and between the second base material layer and the third base material layer, the first base material layer and the second base material layer. The coil array of any one of Claims 1-9 in which the intermediate | middle layer whose magnetic permeability is lower than a layer and the said 3rd base material layer is each provided.   An element body formed by laminating a first base material layer, a second base material layer, and a third base material layer, and a first coil element, a second coil element, and a third coil provided in the element body The first coil element includes a first coil pattern provided on the first base material layer, a second coil pattern provided on the second base material layer, The second coil element includes a fourth coil pattern provided on the first base material layer, and a second coil pattern provided on the third base material layer. The fifth coil pattern provided in the material layer and the sixth coil pattern provided in the third base material layer are connected to each other, and the third coil element is connected to the first base material layer. A seventh coil pattern provided and an eighth coil provided on the second base material layer; A pattern and a ninth coil pattern provided on the third base material layer are connected to each other, and the element body includes the first base material layer, the second base material layer, and the third base material. When viewed from the stacking direction of the material layers, the first coil pattern, the eighth coil pattern, and the sixth coil pattern substantially overlap, and the fourth coil pattern, the second coil pattern, and the ninth coil A DC-DC converter module configured by a coil array, wherein the patterns substantially overlap and the seventh coil pattern, the fifth coil pattern, and the third coil pattern substantially overlap.

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