JPWO2017037757A1 - Surface treatment equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a surface treatment apparatus capable of dealing with diversified materials to be processed efficiently.
A surface treatment apparatus according to the present invention is a surface treatment apparatus that performs a required surface treatment by bringing a surface of a material to be treated into contact with a treatment liquid, and has a side wall opening portion in which a part of the side wall is cut out. A tank body for storing the processing liquid therein, a replacement side plate that is detachably provided in the side wall opening and has a processing opening in which the surface of the material to be treated faces the tank body during surface treatment, It has a support mechanism which holds and moves the material to be treated and supports the surface of the material to be treated so as to face the inside of the tank body through the processing opening.
[Selection] Figure 1

Description

  The present invention relates to a surface treatment apparatus for performing a surface treatment such as a plating treatment or an etching treatment on a surface of a material to be treated using a required treatment liquid.

  As a plating apparatus that performs plating treatment, recently, as a method that has excellent uniformity in film thickness distribution and suppresses the occurrence of defects due to bubbles in the plating solution, the material to be plated should be placed perpendicular to the plating solution in the plating tank. A vertical system is known that is installed in (see, for example, Patent Documents 1 and 2).

JP-A-5-182965 JP 2004-353048 A

  However, in the vertical type plating apparatus, a holding member and an actuator are required for transporting the material to be plated and for allowing the surface of the material to be plated to face the plating solution, and for holding the material to be plated. Jigs are also required. In such a vertical type plating apparatus, the mechanism portion is controlled in the case of automation, but in order to cope with various materials to be plated, the plating tank itself is replaced by a mechanism. There are also problems such as poor working efficiency.

  SUMMARY OF THE INVENTION In view of the above problems, an object of the present invention is to provide a surface treatment apparatus capable of dealing with diversified materials to be processed with high work efficiency.

  In view of the above technical problem, the surface treatment apparatus of the present invention is a surface treatment apparatus that performs a required surface treatment by bringing a surface of a material to be treated into contact with a treatment liquid, and a side wall with a part of the side wall cut away. A tank main body having an opening for storing the processing liquid therein, and a processing opening provided detachably on the side wall opening so that the surface of the material to be processed faces the tank main body during surface treatment. It has an exchange side plate and a support mechanism that holds and moves the material to be processed and supports the surface of the material to be processed so as to face the tank body through the processing opening.

  According to the surface treatment apparatus of the present invention, since the replacement side plate that is detachably provided in the side wall opening is used, it is possible to deal with diversified materials to be processed with high work efficiency.

1 is a perspective view of a surface treatment apparatus according to a first embodiment of the present invention. It is a sectional side view of the surface treatment apparatus concerning the 1st Embodiment of this invention. It is a perspective view which shows the place which removes the replacement | exchange side plate of the surface treatment apparatus concerning the 1st Embodiment of this invention. It is a perspective view which shows the place which mounts the other exchange side board of the surface treatment apparatus concerning the 1st Embodiment of this invention. It is a typical perspective view which shows the example of the further another exchange side plate used with the surface treatment apparatus concerning the 1st Embodiment of this invention. It is a film thickness distribution map which shows the result of the experiment which performed the plating process using the surface treatment apparatus concerning the 1st Embodiment of this invention. It is a perspective view of the surface treatment apparatus concerning the 2nd Embodiment of this invention. FIG. 8 is a schematic perspective sectional view of the surface treatment apparatus shown in FIG. 7.

  Embodiments of the present invention will be described with reference to the drawings. In addition, the following description is some specific examples of this invention, and this invention is not limited to the aspect. Further, the present invention is not limited to the arrangement and dimensions of the components shown in the drawings.

First Embodiment This embodiment is an example of a vertical type plating apparatus 10 that performs a plating process. As shown in FIGS. 1 and 2, a part of a side wall 20 is notched in the plating apparatus 10. A tank body 12 having a side wall opening 18 for storing the plating solution therein, and a treatment that is detachably provided in the side wall opening 18 so that the surface of the material to be treated 22 faces the tank body 12 during the plating process. An exchange side plate 14 having an opening 24 for supporting, and a support mechanism 16 for holding and moving the material 22 to be supported so that the surface of the material 22 faces the tank body 12 through the processing opening 24. have.

  The tank body 12 is a container formed by processing a generally rectangular plate material having liquid resistance, such as vinyl chloride resin (PVC), and left and right side plates arranged so that the surfaces are vertical. 20L, 20R and the back plate 20B constitute the side wall 20. A rectangular bottom surface 21 is disposed on the bottom side of the tank body 12, and a pair of plating solution injection / discharge ports 26a and 26b are provided on the side of the bottom surface 21 slightly closer to the back plate 20B. The plating solution is introduced into the tank body 12 through the plating solution inlet / outlet 26a, 26b. The tank body 12 is configured such that a part of the side wall 20 is cut out, and the side wall opening 18 is provided in a shape that opens substantially the entire front surface of the tank body 12. The replacement side plate 14 is detachably inserted into the side wall opening 18. The side wall opening 18 is formed with vertical insertion grooves 19L and 19R extending vertically to the front end portions of the left and right side plates 20L and 20R, respectively, and horizontally on the front end portion of the bottom surface portion 21. The extended horizontal insertion groove 19H is formed to be continuous with the end portions of the vertical insertion grooves 19L and 19R. These horizontal insertion grooves 19H and vertical insertion grooves 19L and 19R are each provided with required packing for preventing liquid leakage.

  On the upper side of the left and right side plates 20L, 20R of the tank body 12, openings 26c, 26d for maintaining the liquid level are formed, respectively, and the plating solution injected from the plating solution inlet / outlets 26a, 26b is formed. The plating solution can be circulated while maintaining the liquid level. The portions below the bottom surface portion 21 of the plating solution inlet / outlet 26a, 26b are connected to L-shaped pipes 27a, 27b, and the L-shaped pipes 27a, 27b are connected to the left and right openings of the T-shaped pipe 30 via the connecting portion 29. Connected. Therefore, when introducing the plating solution, the plating solution is introduced into the lower opening of the T-shaped pipe 30 from a pump or the like, and the plating solution is divided in the T-shaped pipe 30 to be left and right plating solution injection / discharge ports 26a. 26b is introduced into the tank body 12. In addition, the plating solution in the tank body 12 is configured to be returned to the filter or the pump, although not shown, for example, from the openings 26c and 26d.

  The tank body 12 is not limited to a rectangular shape, and may have another shape, or may have a structure having a curved surface that does not necessarily have an angle at which straight lines intersect. For example, the back surface, the side surface, and the bottom surface may be integrated. An overflow tank (not shown) can be attached to the openings 26c and 26d, and a partition plate for separating a liquid storage tank for storing a plating solution and a processing tank for storing a plating used for processing is disposed in the tank body 12. It is also possible to set up.

  An exchangeable side plate 14 that can be selectively attached is detachably attached to the side wall opening 18 of the tank body 12. The replacement side plate 14 is also made of a liquid-resistant plate material such as vinyl chloride resin (PVC), similar to the tank body 12 described above. In the present embodiment, the replacement side plate 14 is made of one plate material for convenience of replacement work, but the replacement side plate 14 may be configured by combining, for example, a plurality of sheets. In the center of the replacement side plate 14, a processing opening 24 is provided that is opened so that the surface of the material to be processed faces the inside of the tank body 12 during the plating process. The processing opening 24 has a square shape of, for example, about 42 cm square with respect to the replacement side plate 14. A long and thin line packing member 28 is attached to the end of the processing opening 24 on the side of the material to be processed, and when the material 22 is pressed together with the stage as described later, Prevent leakage. When the replacement side plate 14 is removed, the replacement side plate 14 is slid vertically upward in the state where the plating solution is not present inside the tank body 12, and the side portions of the replacement side plate 14 are grooves of the vertical insertion grooves 19L and 19R. The replacement side plate 14 itself can be removed from the tank body 12 by sliding inside. When the replacement side plate 14 is attached to the tank body 12, conversely, the side portion of the replacement side plate 14 is inserted into the vertical insertion grooves 19 </ b> L and 19 </ b> R of the tank body 12 and pushed from above. The bottom of the exchange side plate 14 is fitted into the horizontal insertion groove 19H, and the attachment of the exchange side plate 14 is finished. The same operation is performed when the other replacement side plate 14 is attached or detached.

  A support mechanism 16 that holds and moves the material to be processed 22 is disposed on the front side of the tank body 12 so as to face the replacement side plate 14 that is detachably attached to the tank body 12. And a stage 32 made of, for example, a resin, an actuator 34 that presses the stage 32 against the processing opening 24 together with the workpiece 22, a shaft member 36 that extends in the horizontal direction, and the shaft member 36. And a frame member 38 that rotates around the center.

  The stage 32 is provided with a seal member 40 that holds the material 22 to be processed and prevents the plating solution from flowing into the back side of the material 22 when immersed in the plating solution. The size of the seal member 40 is larger than that of the material 22 to be processed, and when the plating process is performed, the material 22 to be processed is placed at a substantially central portion of the seal member 40 on the stage 32. At this time, the workpiece 22 may be chucked with respect to the seal member 40 by vacuum suction.

  When the stage 32 is held horizontally (indicated by a dotted line in FIG. 2), the actuator 34 is positioned below the stage 32, and when the stage 32 is held vertically (indicated by a solid line in FIG. 2), the actuator. 34 is located on the side of the stage 32. The actuator 34 includes a torque motor 42 and a cylinder 44 attached to the shaft of the torque motor 42, and the stage 32 itself can be pressed or released toward the processing opening 24 by a signal to the torque motor 42. A spherical bearing or the like (not shown) is disposed at the tip of the cylinder 44, and the stage 32 is moved in parallel along a guide 46 disposed in parallel with the cylinder 44. The actuator 34 and the stage 32 rotate around the shaft member 36 together with the frame member 38. A shaft member actuator is disposed at an end portion (not shown) of the shaft member 36, and the entire support mechanism 16 is rotated according to the operation of the shaft member actuator, and the stage 32 is held horizontally. Move between positions where 32 is held vertically.

  As shown in FIG. 2, the plating apparatus 10 further includes an anode plate 50 and an adjustment plate 52 made of a dielectric for adjusting the electric field from the anode plate 50 as necessary. If the electroplating is not used, the anode plate 50 and the like need not be provided. An agitating member 54 for agitating the plating solution is provided inside the tank body 12 of the plating apparatus 10. The stirring member 54 is a member that performs paddle stirring, but other liquid flow control members such as a jet flow and a parallel flow may be disposed instead or in combination. The adjustment plate 52 is formed with an opening 52a having a size and shape that matches the material 22 to be processed, and adjusts a necessary electric field.

  At the time of plating, the workpiece 22 is mounted on the stage 32, and the shaft member actuator is operated to change the state of holding the workpiece 22 from the horizontal state together with the stage 32 to the state of holding the workpiece 22 vertically. Next, the actuator 34 is operated to move the cylinder 44 to the processing opening 24 side of the replacement side plate 14 so that the material 22 to be processed and the stage 32 face the inside of the tank body 12 through the processing opening 24. . At this time, the liquid is held between the stage 32 and the replacement side plate 14 by the packing material 28 formed around the processing opening 24 so as not to leak.

  In this state, the pump or the like is operated to introduce the plating solution into the tank body 12 from the plating solution inlet / outlet 26a, 26b. Thereafter, an electric field is applied between the anode plate 50 and the workpiece 22 and the plating solution is circulated while stirring the plating solution by the stirring member 54 to perform electroplating as a required surface treatment. In addition, when taking out the to-be-processed material 22, a mechanism is operated reverse to the said process.

  Next, the case where the replacement side plate 14 is replaced will be described.As shown in FIG. 3, in the state where there is no plating solution inside the tank body 12 and the stage 32 is not pressed by the processing opening 24, The replacement side plate 14 is slid upward in the vertical direction, the side portion of the replacement side plate 14 slides in the grooves of the vertical insertion grooves 19L and 19R, and the replacement side plate 14 itself can be removed from the tank body 12. Subsequently, as shown in FIG. 4, when another replacement side plate 14A is attached, the replacement side plate 14A is fitted such that the replacement side plate 14A having a different opening 64 is fitted in the vertical insertion grooves 19L and 19R and the horizontal insertion groove 19H. Is slid downward in the vertical direction, and the other replacement side plate 14A is detachably attached to the tank body 12. The replacement side plate 14A is provided with a processing opening 64 having a circular opening at the center, and a packing material 68 is disposed around the outer periphery thereof.

  By replacing the replacement side plate 14 with the replacement side plate 14A in this way, the shape of the opening can be easily changed from the square of the processing opening 24 to the circle of the processing opening 64. Further, by preparing an exchange side plate 66 having four processing openings 62 as shown in FIG. 5, it is possible to perform plating on a plurality of materials to be processed.

  The plating treatment applied to this embodiment may be electroplating or electroless plating. The material to be processed 22 can be a substrate to be plated, and examples thereof include a semiconductor wafer, a glass plate, a ceramic plate, and an organic material substrate. For example, a conductive layer made of metal or the like formed on a substrate made of resin and patterned, a semiconductor substrate such as a silicon wafer provided with a fine circuit pattern on the surface, a substrate for electronic circuits such as a printed circuit board, etc. It is done. In addition, these substrates may include blind via holes, fine wiring trenches, through-holes penetrating the substrate, and the like. More specific examples of these substrates include printed circuit boards such as package substrates on which IC bare chips are directly mounted, silicon wafers on which LSIs are directly mounted, and silicon wafers for the purpose of manufacturing semiconductor chips themselves. A substrate etc. can be mentioned.

  The structure of the support mechanism 16 described above is an example, and may be a support mechanism that does not involve the rotational movement of the stage 32. For example, when a plurality of tank main bodies 12 are arranged side by side and a plurality of materials to be processed 22 are processed at once, a guide rail or the like is provided so that the support mechanism 16 can move in the direction in which the plurality of tank main bodies 12 are arranged. Is preferred.

FIG. 6 shows the result of producing the vertical plating apparatus 10 of this embodiment, preparing a 240 mm square copper-clad substrate as the material 22 to be processed, and plating the entire surface of nickel. As the plating solution used, BNI (nickel plating solution) manufactured by JCU Corporation was used. As electroplating conditions, a treatment was performed at a current density of 2.0 A / dm ² for 24 minutes. In order to evaluate the state of the formed plating, the distribution of film thickness for each segment was measured using a fluorescent X-ray analyzer XDVM-μ manufactured by Fisher Instruments Co., Ltd. as a film thickness analyzer.

  The results are shown in FIG. 6. The maximum film thickness value is 9.2 μm, the minimum film thickness value is 7.6 μm, the average film thickness is 8.5 μm, and the surface uniformity is 9.4%. Met. Accordingly, although a tendency that the film thickness slightly increases in the central part, a plating layer having a sufficient film thickness is formed in the peripheral part, and it is proved that practicality is sufficiently obtained.

  7 and 8 show a plating apparatus 10 according to a second embodiment of the present invention. The same reference numerals are assigned to the same constituent members as the constituent members of the plating apparatus 10 of the first embodiment. In the plating apparatus 10, a replacement side plate 14 having a processing opening 24 is detachably attached to the same tank body 12 as described above. An adapter 70 having a stepped portion 72 that is slightly smaller in size than the size of the processing opening 24 is fitted into the processing opening 24 of the replacement side plate 14 at the stepped portion 72. By fitting the adapter 70 functioning as the second replacement side plate having such a configuration from the outside of the tank body 12, it is possible to immediately cope with a smaller processing opening, and at the same time from a support mechanism (not shown). Liquid leakage can also be prevented against pressing. Specifically, a packing material 28 around the processing opening 24 of the replacement side plate 14 is disposed between the adapter 70 and the replacement side plate 14, and a predetermined packing material is also disposed around the opening 74 of the adapter 70. Therefore, liquid leakage can be prevented by these packing materials. In this embodiment, it is also possible to attach the adapter to the processing opening 24 using a fastening member such as a screw stopper.

  As described above, according to the surface treatment apparatus of the present invention, it is possible to change the shape and size of the processing opening by changing the replacement side plate without changing the tank body itself, and thus diversify. It is possible to deal with the material to be processed with high work efficiency.

  In the above-described embodiment, the surface treatment apparatus of the present invention has been mainly described as a plating apparatus. However, the present invention is not limited to this, and other treatment liquids such as an etching apparatus, a pretreatment apparatus and a cleaning apparatus, and treated water are used. It can also be applied to the handling equipment.

DESCRIPTION OF SYMBOLS 10 Plating apparatus 12 Tank main body 14, 14A, 66 Replacement side plate 16 Support mechanism 18 Side wall opening 19L, 19R Vertical insertion groove 19H Horizontal insertion groove 20 Side wall 20R, 20L Side surface plate 20B Back surface plate 21 Bottom surface portion 22 Processed materials 24, 62 , 64 Processing openings 26a, 26b Plating solution inlet / outlet 26c, 26d Openings 27a, 27b L-shaped pipe 28 Packing material 29 Connecting section 30 T-shaped pipe 32 Stage 34 Actuator 36 Shaft member 38 Frame member 40 Seal member 42 Torque Motor 44 Cylinder 46 Guide 50 Anode plate 52 Adjustment plate 52a Opening 54 Stirring member 70 Adapter 72 Stepped portion 74 Processing opening

Claims (8)

A surface treatment apparatus for performing a required surface treatment by bringing a surface of a material to be treated into contact with a treatment liquid, a tank body having a side wall opening part in which a part of a side wall is cut out and storing the treatment liquid therein. An exchange side plate that is detachably provided in the side wall opening and has a treatment opening in which the surface of the material to be treated faces the inside of the tank body during the surface treatment, and holds and moves the material to be treated. And a support mechanism for supporting the surface of the material so as to face the inside of the tank body through the processing opening. 2. The surface treatment apparatus according to claim 1, wherein the side wall opening has a pair of vertical insertion grooves extending in the vertical direction and a horizontal insertion groove extending in the horizontal direction on the bottom side, and the replacement side plate. Is a rectangular shape, and each end portion of the replacement side plate is fitted into the vertical insertion groove and the horizontal insertion groove. 2. The surface treatment apparatus according to claim 1, wherein a plurality of the replacement side plates, each having at least one of a shape, a size, and a number of the treatment openings, are detachably provided in the tank body. A featured surface treatment apparatus. The surface treatment apparatus according to claim 1, wherein a liquid flow control member that controls a flow of the treatment liquid is provided inside the treatment opening of the replacement side plate. The surface treatment apparatus according to claim 1, wherein the surface treatment is plating or etching. The surface treatment apparatus according to claim 1, wherein the surface treatment is electroplating, an anode plate is disposed in the tank body, and the anode plate has an opening on the material to be treated side. A surface treatment apparatus in which a dielectric is disposed. The surface treatment apparatus according to claim 1, wherein the support mechanism includes a holding unit that holds the material to be processed and a pressing member that presses the holding unit toward the processing opening. Surface treatment equipment. 2. The surface treatment apparatus according to claim 1, wherein a second exchange side plate having a treatment opening facing the inside of the tank body is further detachably provided on the exchange side plate. 3. .

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