JPWO2016143343A1 - Vinyl chloride resin composition for powder molding, vinyl chloride resin molded body and laminate - Google Patents
Vinyl chloride resin composition for powder molding, vinyl chloride resin molded body and laminate Download PDFInfo
- Publication number
- JPWO2016143343A1 JPWO2016143343A1 JP2017504874A JP2017504874A JPWO2016143343A1 JP WO2016143343 A1 JPWO2016143343 A1 JP WO2016143343A1 JP 2017504874 A JP2017504874 A JP 2017504874A JP 2017504874 A JP2017504874 A JP 2017504874A JP WO2016143343 A1 JPWO2016143343 A1 JP WO2016143343A1
- Authority
- JP
- Japan
- Prior art keywords
- vinyl chloride
- chloride resin
- powder molding
- resin composition
- mass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 title claims abstract description 230
- 229920005989 resin Polymers 0.000 title claims abstract description 169
- 239000011347 resin Substances 0.000 title claims abstract description 169
- 238000000465 moulding Methods 0.000 title claims abstract description 94
- 239000000843 powder Substances 0.000 title claims abstract description 94
- 239000011342 resin composition Substances 0.000 title claims abstract description 71
- 239000002245 particle Substances 0.000 claims abstract description 70
- 239000010419 fine particle Substances 0.000 claims abstract description 53
- 239000004014 plasticizer Substances 0.000 claims abstract description 42
- 239000003822 epoxy resin Substances 0.000 claims abstract description 33
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 33
- 239000004814 polyurethane Substances 0.000 claims abstract description 22
- 229920002635 polyurethane Polymers 0.000 claims abstract description 22
- 238000005187 foaming Methods 0.000 claims description 3
- -1 allyl glycidyl ether Ethers Chemical class 0.000 description 52
- ARCGXLSVLAOJQL-UHFFFAOYSA-N anhydrous trimellitic acid Natural products OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 48
- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 23
- 229910052751 metal Inorganic materials 0.000 description 21
- 239000002184 metal Substances 0.000 description 21
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 description 21
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 21
- GDVKFRBCXAPAQJ-UHFFFAOYSA-A dialuminum;hexamagnesium;carbonate;hexadecahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Al+3].[Al+3].[O-]C([O-])=O GDVKFRBCXAPAQJ-UHFFFAOYSA-A 0.000 description 18
- 229960001545 hydrotalcite Drugs 0.000 description 18
- 229910001701 hydrotalcite Inorganic materials 0.000 description 18
- 239000000049 pigment Substances 0.000 description 18
- 235000014113 dietary fatty acids Nutrition 0.000 description 17
- 239000000194 fatty acid Substances 0.000 description 17
- 229930195729 fatty acid Natural products 0.000 description 17
- 239000000463 material Substances 0.000 description 17
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 15
- 239000003795 chemical substances by application Substances 0.000 description 15
- 150000004665 fatty acids Chemical class 0.000 description 14
- 238000000034 method Methods 0.000 description 14
- 150000003839 salts Chemical class 0.000 description 14
- 239000004593 Epoxy Substances 0.000 description 13
- 238000010410 dusting Methods 0.000 description 13
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 12
- 238000006116 polymerization reaction Methods 0.000 description 11
- 239000000203 mixture Substances 0.000 description 10
- 150000001875 compounds Chemical class 0.000 description 9
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 8
- 229910021536 Zeolite Inorganic materials 0.000 description 7
- 239000000654 additive Substances 0.000 description 7
- 229910052799 carbon Inorganic materials 0.000 description 7
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 7
- 150000002148 esters Chemical class 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 7
- 238000002156 mixing Methods 0.000 description 7
- 239000010457 zeolite Substances 0.000 description 7
- NRCMAYZCPIVABH-UHFFFAOYSA-N Quinacridone Chemical compound N1C2=CC=CC=C2C(=O)C2=C1C=C1C(=O)C3=CC=CC=C3NC1=C2 NRCMAYZCPIVABH-UHFFFAOYSA-N 0.000 description 6
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 6
- 238000002845 discoloration Methods 0.000 description 6
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 6
- 230000032683 aging Effects 0.000 description 5
- 125000000217 alkyl group Chemical group 0.000 description 5
- 239000002216 antistatic agent Substances 0.000 description 5
- 125000004432 carbon atom Chemical group C* 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 239000006260 foam Substances 0.000 description 5
- 239000000417 fungicide Substances 0.000 description 5
- VLTRZXGMWDSKGL-UHFFFAOYSA-M perchlorate Inorganic materials [O-]Cl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-M 0.000 description 5
- 235000012424 soybean oil Nutrition 0.000 description 5
- 239000003549 soybean oil Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 229920002554 vinyl polymer Polymers 0.000 description 5
- VVJKKWFAADXIJK-UHFFFAOYSA-N Allylamine Chemical compound NCC=C VVJKKWFAADXIJK-UHFFFAOYSA-N 0.000 description 4
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerol Natural products OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 4
- 229920005830 Polyurethane Foam Polymers 0.000 description 4
- 239000003963 antioxidant agent Substances 0.000 description 4
- 230000003078 antioxidant effect Effects 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- 150000001768 cations Chemical class 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- 239000003063 flame retardant Substances 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 239000011777 magnesium Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000178 monomer Substances 0.000 description 4
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 description 4
- CSHWQDPOILHKBI-UHFFFAOYSA-N peryrene Natural products C1=CC(C2=CC=CC=3C2=C2C=CC=3)=C3C2=CC=CC3=C1 CSHWQDPOILHKBI-UHFFFAOYSA-N 0.000 description 4
- 229920000728 polyester Polymers 0.000 description 4
- 239000011496 polyurethane foam Substances 0.000 description 4
- 238000005245 sintering Methods 0.000 description 4
- 238000009864 tensile test Methods 0.000 description 4
- 235000015112 vegetable and seed oil Nutrition 0.000 description 4
- 239000008158 vegetable oil Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- 239000006229 carbon black Substances 0.000 description 3
- 238000009833 condensation Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 239000004088 foaming agent Substances 0.000 description 3
- RBTKNAXYKSUFRK-UHFFFAOYSA-N heliogen blue Chemical compound [Cu].[N-]1C2=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=NC([N-]1)=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=N2 RBTKNAXYKSUFRK-UHFFFAOYSA-N 0.000 description 3
- PXZQEOJJUGGUIB-UHFFFAOYSA-N isoindolin-1-one Chemical compound C1=CC=C2C(=O)NCC2=C1 PXZQEOJJUGGUIB-UHFFFAOYSA-N 0.000 description 3
- 239000004611 light stabiliser Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 3
- JQCXWCOOWVGKMT-UHFFFAOYSA-N phthalic acid diheptyl ester Natural products CCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCC JQCXWCOOWVGKMT-UHFFFAOYSA-N 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 230000035882 stress Effects 0.000 description 3
- 238000006467 substitution reaction Methods 0.000 description 3
- 235000010215 titanium dioxide Nutrition 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 2
- BBMCTIGTTCKYKF-UHFFFAOYSA-N 1-heptanol Chemical compound CCCCCCCO BBMCTIGTTCKYKF-UHFFFAOYSA-N 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- KMZHZAAOEWVPSE-UHFFFAOYSA-N 2,3-dihydroxypropyl acetate Chemical class CC(=O)OCC(O)CO KMZHZAAOEWVPSE-UHFFFAOYSA-N 0.000 description 2
- NXQMCAOPTPLPRL-UHFFFAOYSA-N 2-(2-benzoyloxyethoxy)ethyl benzoate Chemical compound C=1C=CC=CC=1C(=O)OCCOCCOC(=O)C1=CC=CC=C1 NXQMCAOPTPLPRL-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- YIWUKEYIRIRTPP-UHFFFAOYSA-N 2-ethylhexan-1-ol Chemical compound CCCCC(CC)CO YIWUKEYIRIRTPP-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- IRIAEXORFWYRCZ-UHFFFAOYSA-N Butylbenzyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCC1=CC=CC=C1 IRIAEXORFWYRCZ-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 239000004709 Chlorinated polyethylene Substances 0.000 description 2
- IEPRKVQEAMIZSS-UHFFFAOYSA-N Di-Et ester-Fumaric acid Natural products CCOC(=O)C=CC(=O)OCC IEPRKVQEAMIZSS-UHFFFAOYSA-N 0.000 description 2
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Chemical compound CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 2
- IEPRKVQEAMIZSS-WAYWQWQTSA-N Diethyl maleate Chemical compound CCOC(=O)\C=C/C(=O)OCC IEPRKVQEAMIZSS-WAYWQWQTSA-N 0.000 description 2
- NIQCNGHVCWTJSM-UHFFFAOYSA-N Dimethyl phthalate Chemical compound COC(=O)C1=CC=CC=C1C(=O)OC NIQCNGHVCWTJSM-UHFFFAOYSA-N 0.000 description 2
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- 239000004609 Impact Modifier Substances 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 2
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- ZFOZVQLOBQUTQQ-UHFFFAOYSA-N Tributyl citrate Chemical compound CCCCOC(=O)CC(O)(C(=O)OCCCC)CC(=O)OCCCC ZFOZVQLOBQUTQQ-UHFFFAOYSA-N 0.000 description 2
- UYXTWWCETRIEDR-UHFFFAOYSA-N Tributyrin Chemical class CCCC(=O)OCC(OC(=O)CCC)COC(=O)CCC UYXTWWCETRIEDR-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 150000001336 alkenes Chemical class 0.000 description 2
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- 239000011162 core material Substances 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- MWKFXSUHUHTGQN-UHFFFAOYSA-N decan-1-ol Chemical compound CCCCCCCCCCO MWKFXSUHUHTGQN-UHFFFAOYSA-N 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- FLKPEMZONWLCSK-UHFFFAOYSA-N diethyl phthalate Chemical compound CCOC(=O)C1=CC=CC=C1C(=O)OCC FLKPEMZONWLCSK-UHFFFAOYSA-N 0.000 description 2
- MGWAVDBGNNKXQV-UHFFFAOYSA-N diisobutyl phthalate Chemical compound CC(C)COC(=O)C1=CC=CC=C1C(=O)OCC(C)C MGWAVDBGNNKXQV-UHFFFAOYSA-N 0.000 description 2
- LQZZUXJYWNFBMV-UHFFFAOYSA-N dodecan-1-ol Chemical compound CCCCCCCCCCCCO LQZZUXJYWNFBMV-UHFFFAOYSA-N 0.000 description 2
- 238000010556 emulsion polymerization method Methods 0.000 description 2
- 150000002170 ethers Chemical class 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 235000011187 glycerol Nutrition 0.000 description 2
- 150000002334 glycols Chemical class 0.000 description 2
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- HQKMJHAJHXVSDF-UHFFFAOYSA-L magnesium stearate Chemical compound [Mg+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O HQKMJHAJHXVSDF-UHFFFAOYSA-L 0.000 description 2
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 2
- ZWRUINPWMLAQRD-UHFFFAOYSA-N nonan-1-ol Chemical compound CCCCCCCCCO ZWRUINPWMLAQRD-UHFFFAOYSA-N 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 125000001477 organic nitrogen group Chemical group 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- PJQYNUFEEZFYIS-UHFFFAOYSA-N perylene maroon Chemical compound C=12C3=CC=C(C(N(C)C4=O)=O)C2=C4C=CC=1C1=CC=C2C(=O)N(C)C(=O)C4=CC=C3C1=C42 PJQYNUFEEZFYIS-UHFFFAOYSA-N 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920005903 polyol mixture Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 239000012321 sodium triacetoxyborohydride Substances 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 239000011593 sulfur Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 239000000454 talc Substances 0.000 description 2
- 229910052623 talc Inorganic materials 0.000 description 2
- 150000003512 tertiary amines Chemical class 0.000 description 2
- URAYPUMNDPQOKB-UHFFFAOYSA-N triacetin Chemical class CC(=O)OCC(OC(C)=O)COC(C)=O URAYPUMNDPQOKB-UHFFFAOYSA-N 0.000 description 2
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 2
- 125000005591 trimellitate group Chemical group 0.000 description 2
- KJIOQYGWTQBHNH-UHFFFAOYSA-N undecanol Chemical compound CCCCCCCCCCCO KJIOQYGWTQBHNH-UHFFFAOYSA-N 0.000 description 2
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 2
- 239000005968 1-Decanol Substances 0.000 description 1
- LRQGFQDEQPZDQC-UHFFFAOYSA-N 1-Phenyl-1,3-eicosanedione Chemical compound CCCCCCCCCCCCCCCCCC(=O)CC(=O)C1=CC=CC=C1 LRQGFQDEQPZDQC-UHFFFAOYSA-N 0.000 description 1
- BKUAQOCVPRDREL-UHFFFAOYSA-N 1-Phenyl-1,3-octadecanedione Chemical compound CCCCCCCCCCCCCCCC(=O)CC(=O)C1=CC=CC=C1 BKUAQOCVPRDREL-UHFFFAOYSA-N 0.000 description 1
- OZCMOJQQLBXBKI-UHFFFAOYSA-N 1-ethenoxy-2-methylpropane Chemical compound CC(C)COC=C OZCMOJQQLBXBKI-UHFFFAOYSA-N 0.000 description 1
- UKDKWYQGLUUPBF-UHFFFAOYSA-N 1-ethenoxyhexadecane Chemical compound CCCCCCCCCCCCCCCCOC=C UKDKWYQGLUUPBF-UHFFFAOYSA-N 0.000 description 1
- 239000000263 2,3-dihydroxypropyl (Z)-octadec-9-enoate Substances 0.000 description 1
- HDIFHQMREAYYJW-FMIVXFBMSA-N 2,3-dihydroxypropyl (e)-12-hydroxyoctadec-9-enoate Chemical compound CCCCCCC(O)C\C=C\CCCCCCCC(=O)OCC(O)CO HDIFHQMREAYYJW-FMIVXFBMSA-N 0.000 description 1
- PHDVPEOLXYBNJY-KTKRTIGZSA-N 2-(2-hydroxyethoxy)ethyl (z)-octadec-9-enoate Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OCCOCCO PHDVPEOLXYBNJY-KTKRTIGZSA-N 0.000 description 1
- QUYITUXSUUKIRL-ZDKIGPTLSA-N 2-(2-hydroxyethoxy)ethyl (z,12r)-12-hydroxyoctadec-9-enoate Chemical compound CCCCCC[C@@H](O)C\C=C/CCCCCCCC(=O)OCCOCCO QUYITUXSUUKIRL-ZDKIGPTLSA-N 0.000 description 1
- WGIMXKDCVCTHGW-UHFFFAOYSA-N 2-(2-hydroxyethoxy)ethyl dodecanoate Chemical compound CCCCCCCCCCCC(=O)OCCOCCO WGIMXKDCVCTHGW-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- RTGQGAXEHFZMBG-UHFFFAOYSA-N 2-(2-nonanoyloxyethoxy)ethyl nonanoate Chemical compound CCCCCCCCC(=O)OCCOCCOC(=O)CCCCCCCC RTGQGAXEHFZMBG-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- AHSGHEXYEABOKT-UHFFFAOYSA-N 2-[2-(2-benzoyloxyethoxy)ethoxy]ethyl benzoate Chemical compound C=1C=CC=CC=1C(=O)OCCOCCOCCOC(=O)C1=CC=CC=C1 AHSGHEXYEABOKT-UHFFFAOYSA-N 0.000 description 1
- YJGHMLJGPSVSLF-UHFFFAOYSA-N 2-[2-(2-octanoyloxyethoxy)ethoxy]ethyl octanoate Chemical compound CCCCCCCC(=O)OCCOCCOCCOC(=O)CCCCCCC YJGHMLJGPSVSLF-UHFFFAOYSA-N 0.000 description 1
- JEYLQCXBYFQJRO-UHFFFAOYSA-N 2-[2-[2-(2-ethylbutanoyloxy)ethoxy]ethoxy]ethyl 2-ethylbutanoate Chemical compound CCC(CC)C(=O)OCCOCCOCCOC(=O)C(CC)CC JEYLQCXBYFQJRO-UHFFFAOYSA-N 0.000 description 1
- RELVVCLOQMWDAD-UHFFFAOYSA-N 2-[4-(2-carboxyanilino)anilino]benzoic acid Chemical compound OC(=O)C1=CC=CC=C1NC(C=C1)=CC=C1NC1=CC=CC=C1C(O)=O RELVVCLOQMWDAD-UHFFFAOYSA-N 0.000 description 1
- LIAWCKFOFPPVGF-UHFFFAOYSA-N 2-ethyladamantane Chemical compound C1C(C2)CC3CC1C(CC)C2C3 LIAWCKFOFPPVGF-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- AUZRCMMVHXRSGT-UHFFFAOYSA-N 2-methylpropane-1-sulfonic acid;prop-2-enamide Chemical compound NC(=O)C=C.CC(C)CS(O)(=O)=O AUZRCMMVHXRSGT-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- ALKCLFLTXBBMMP-UHFFFAOYSA-N 3,7-dimethylocta-1,6-dien-3-yl hexanoate Chemical compound CCCCCC(=O)OC(C)(C=C)CCC=C(C)C ALKCLFLTXBBMMP-UHFFFAOYSA-N 0.000 description 1
- NUCFNMOPTGEHQA-UHFFFAOYSA-N 3-bromo-2h-pyrazolo[4,3-c]pyridine Chemical compound C1=NC=C2C(Br)=NNC2=C1 NUCFNMOPTGEHQA-UHFFFAOYSA-N 0.000 description 1
- RZRNAYUHWVFMIP-GDCKJWNLSA-N 3-oleoyl-sn-glycerol Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OC[C@H](O)CO RZRNAYUHWVFMIP-GDCKJWNLSA-N 0.000 description 1
- ULVDMKRXBIKOMK-UHFFFAOYSA-N 4,5,6,7-tetrachloro-2,3-dihydroisoindol-1-one Chemical compound ClC1=C(Cl)C(Cl)=C2CNC(=O)C2=C1Cl ULVDMKRXBIKOMK-UHFFFAOYSA-N 0.000 description 1
- WZSFTHVIIGGDOI-UHFFFAOYSA-N 4,5,6,7-tetrachloro-3-[2-methyl-3-[(4,5,6,7-tetrachloro-3-oxoisoindol-1-yl)amino]anilino]isoindol-1-one Chemical group ClC1=C(Cl)C(Cl)=C(Cl)C2=C1C(NC1=CC=CC(NC=3C4=C(C(=C(Cl)C(Cl)=C4Cl)Cl)C(=O)N=3)=C1C)=NC2=O WZSFTHVIIGGDOI-UHFFFAOYSA-N 0.000 description 1
- LEUWBMAQQQENOO-UHFFFAOYSA-N 4-(4-chlorophenyl)-6-methyl-2-oxo-3,4-dihydro-1h-pyridine-5-carboxylic acid Chemical compound C1C(=O)NC(C)=C(C(O)=O)C1C1=CC=C(Cl)C=C1 LEUWBMAQQQENOO-UHFFFAOYSA-N 0.000 description 1
- VVAAYFMMXYRORI-UHFFFAOYSA-N 4-butoxy-2-methylidene-4-oxobutanoic acid Chemical compound CCCCOC(=O)CC(=C)C(O)=O VVAAYFMMXYRORI-UHFFFAOYSA-N 0.000 description 1
- OIYTYGOUZOARSH-UHFFFAOYSA-N 4-methoxy-2-methylidene-4-oxobutanoic acid Chemical compound COC(=O)CC(=C)C(O)=O OIYTYGOUZOARSH-UHFFFAOYSA-N 0.000 description 1
- ICGLPKIVTVWCFT-UHFFFAOYSA-N 4-methylbenzenesulfonohydrazide Chemical compound CC1=CC=C(S(=O)(=O)NN)C=C1 ICGLPKIVTVWCFT-UHFFFAOYSA-N 0.000 description 1
- UKWUOTZGXIZAJC-UHFFFAOYSA-N 4-nitrosalicylic acid Chemical compound OC(=O)C1=CC=C([N+]([O-])=O)C=C1O UKWUOTZGXIZAJC-UHFFFAOYSA-N 0.000 description 1
- GPZYYYGYCRFPBU-UHFFFAOYSA-N 6-Hydroxyflavone Chemical compound C=1C(=O)C2=CC(O)=CC=C2OC=1C1=CC=CC=C1 GPZYYYGYCRFPBU-UHFFFAOYSA-N 0.000 description 1
- NAZODJSYHDYJGP-UHFFFAOYSA-N 7,18-bis[2,6-di(propan-2-yl)phenyl]-7,18-diazaheptacyclo[14.6.2.22,5.03,12.04,9.013,23.020,24]hexacosa-1(23),2,4,9,11,13,15,20(24),21,25-decaene-6,8,17,19-tetrone Chemical compound CC(C)C1=CC=CC(C(C)C)=C1N(C(=O)C=1C2=C3C4=CC=1)C(=O)C2=CC=C3C(C=C1)=C2C4=CC=C3C(=O)N(C=4C(=CC=CC=4C(C)C)C(C)C)C(=O)C1=C23 NAZODJSYHDYJGP-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 229910017090 AlO 2 Inorganic materials 0.000 description 1
- OSDWBNJEKMUWAV-UHFFFAOYSA-N Allyl chloride Chemical compound ClCC=C OSDWBNJEKMUWAV-UHFFFAOYSA-N 0.000 description 1
- 239000004156 Azodicarbonamide Substances 0.000 description 1
- 239000004604 Blowing Agent Substances 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 229910020366 ClO 4 Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XTJFFFGAUHQWII-UHFFFAOYSA-N Dibutyl adipate Chemical compound CCCCOC(=O)CCCCC(=O)OCCCC XTJFFFGAUHQWII-UHFFFAOYSA-N 0.000 description 1
- PYGXAGIECVVIOZ-UHFFFAOYSA-N Dibutyl decanedioate Chemical compound CCCCOC(=O)CCCCCCCCC(=O)OCCCC PYGXAGIECVVIOZ-UHFFFAOYSA-N 0.000 description 1
- VOWAEIGWURALJQ-UHFFFAOYSA-N Dicyclohexyl phthalate Chemical compound C=1C=CC=C(C(=O)OC2CCCCC2)C=1C(=O)OC1CCCCC1 VOWAEIGWURALJQ-UHFFFAOYSA-N 0.000 description 1
- ZVFDTKUVRCTHQE-UHFFFAOYSA-N Diisodecyl phthalate Chemical compound CC(C)CCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC(C)C ZVFDTKUVRCTHQE-UHFFFAOYSA-N 0.000 description 1
- MWRWFPQBGSZWNV-UHFFFAOYSA-N Dinitrosopentamethylenetetramine Chemical compound C1N2CN(N=O)CN1CN(N=O)C2 MWRWFPQBGSZWNV-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- GJEPCLZVXSSTRW-UHFFFAOYSA-N F.F.F.Cl Chemical compound F.F.F.Cl GJEPCLZVXSSTRW-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- CNCOEDDPFOAUMB-UHFFFAOYSA-N N-Methylolacrylamide Chemical compound OCNC(=O)C=C CNCOEDDPFOAUMB-UHFFFAOYSA-N 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- DOOTYTYQINUNNV-UHFFFAOYSA-N Triethyl citrate Chemical compound CCOC(=O)CC(O)(C(=O)OCC)CC(=O)OCC DOOTYTYQINUNNV-UHFFFAOYSA-N 0.000 description 1
- FRQDZJMEHSJOPU-UHFFFAOYSA-N Triethylene glycol bis(2-ethylhexanoate) Chemical compound CCCCC(CC)C(=O)OCCOCCOCCOC(=O)C(CC)CCCC FRQDZJMEHSJOPU-UHFFFAOYSA-N 0.000 description 1
- GTVWRXDRKAHEAD-UHFFFAOYSA-N Tris(2-ethylhexyl) phosphate Chemical compound CCCCC(CC)COP(=O)(OCC(CC)CCCC)OCC(CC)CCCC GTVWRXDRKAHEAD-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- NJSSICCENMLTKO-HRCBOCMUSA-N [(1r,2s,4r,5r)-3-hydroxy-4-(4-methylphenyl)sulfonyloxy-6,8-dioxabicyclo[3.2.1]octan-2-yl] 4-methylbenzenesulfonate Chemical compound C1=CC(C)=CC=C1S(=O)(=O)O[C@H]1C(O)[C@@H](OS(=O)(=O)C=2C=CC(C)=CC=2)[C@@H]2OC[C@H]1O2 NJSSICCENMLTKO-HRCBOCMUSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000006230 acetylene black Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000003926 acrylamides Chemical class 0.000 description 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 239000008186 active pharmaceutical agent Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 150000001278 adipic acid derivatives Chemical class 0.000 description 1
- 125000003158 alcohol group Chemical group 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 239000004844 aliphatic epoxy resin Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- CEGOLXSVJUTHNZ-UHFFFAOYSA-K aluminium tristearate Chemical compound [Al+3].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CEGOLXSVJUTHNZ-UHFFFAOYSA-K 0.000 description 1
- 229940063655 aluminum stearate Drugs 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 229940053200 antiepileptics fatty acid derivative Drugs 0.000 description 1
- 239000003429 antifungal agent Substances 0.000 description 1
- 229940121375 antifungal agent Drugs 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 150000001535 azelaic acid derivatives Chemical class 0.000 description 1
- 239000000987 azo dye Substances 0.000 description 1
- XOZUGNYVDXMRKW-AATRIKPKSA-N azodicarbonamide Chemical compound NC(=O)\N=N\C(N)=O XOZUGNYVDXMRKW-AATRIKPKSA-N 0.000 description 1
- 235000019399 azodicarbonamide Nutrition 0.000 description 1
- RAKMKCZMVZBODU-PIQLPZBWSA-L barium(2+);(z)-12-hydroxyoctadec-9-enoate Chemical compound [Ba+2].CCCCCCC(O)C\C=C/CCCCCCCC([O-])=O.CCCCCCC(O)C\C=C/CCCCCCCC([O-])=O RAKMKCZMVZBODU-PIQLPZBWSA-L 0.000 description 1
- AGXUVMPSUKZYDT-UHFFFAOYSA-L barium(2+);octadecanoate Chemical compound [Ba+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O AGXUVMPSUKZYDT-UHFFFAOYSA-L 0.000 description 1
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- PKVYKIKWKPWIMO-UHFFFAOYSA-N bis(2-butyloctyl) decanedioate Chemical compound CCCCCCC(CCCC)COC(=O)CCCCCCCCC(=O)OCC(CCCC)CCCCCC PKVYKIKWKPWIMO-UHFFFAOYSA-N 0.000 description 1
- ROPXFXOUUANXRR-BUHFOSPRSA-N bis(2-ethylhexyl) (e)-but-2-enedioate Chemical compound CCCCC(CC)COC(=O)\C=C\C(=O)OCC(CC)CCCC ROPXFXOUUANXRR-BUHFOSPRSA-N 0.000 description 1
- ROPXFXOUUANXRR-YPKPFQOOSA-N bis(2-ethylhexyl) (z)-but-2-enedioate Chemical compound CCCCC(CC)COC(=O)\C=C/C(=O)OCC(CC)CCCC ROPXFXOUUANXRR-YPKPFQOOSA-N 0.000 description 1
- CGNRQCGWXXLTIA-UHFFFAOYSA-N bis(2-ethylhexyl) 2-methylidenebutanedioate Chemical compound CCCCC(CC)COC(=O)CC(=C)C(=O)OCC(CC)CCCC CGNRQCGWXXLTIA-UHFFFAOYSA-N 0.000 description 1
- SAOKZLXYCUGLFA-UHFFFAOYSA-N bis(2-ethylhexyl) adipate Chemical compound CCCCC(CC)COC(=O)CCCCC(=O)OCC(CC)CCCC SAOKZLXYCUGLFA-UHFFFAOYSA-N 0.000 description 1
- WXZOXVVKILCOPG-UHFFFAOYSA-N bis(2-ethylhexyl) benzene-1,3-dicarboxylate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC(C(=O)OCC(CC)CCCC)=C1 WXZOXVVKILCOPG-UHFFFAOYSA-N 0.000 description 1
- ZVPBHZIVOWGPMT-UHFFFAOYSA-N bis(2-ethylhexyl) cyclohexene-1,2-dicarboxylate Chemical compound CCCCC(CC)COC(=O)C1=C(C(=O)OCC(CC)CCCC)CCCC1 ZVPBHZIVOWGPMT-UHFFFAOYSA-N 0.000 description 1
- ZDWGXBPVPXVXMQ-UHFFFAOYSA-N bis(2-ethylhexyl) nonanedioate Chemical compound CCCCC(CC)COC(=O)CCCCCCCC(=O)OCC(CC)CCCC ZDWGXBPVPXVXMQ-UHFFFAOYSA-N 0.000 description 1
- IMIOEHJVRZOQBJ-UHFFFAOYSA-N bis(6-methylheptyl) benzene-1,3-dicarboxylate Chemical compound CC(C)CCCCCOC(=O)C1=CC=CC(C(=O)OCCCCCC(C)C)=C1 IMIOEHJVRZOQBJ-UHFFFAOYSA-N 0.000 description 1
- XRFYGUOAWVKOCQ-UHFFFAOYSA-N bis(8-methylnonyl) cyclohex-4-ene-1,2-dicarboxylate Chemical compound CC(C)CCCCCCCOC(=O)C1CC=CCC1C(=O)OCCCCCCCC(C)C XRFYGUOAWVKOCQ-UHFFFAOYSA-N 0.000 description 1
- OAXZVLMNNOOMGN-UHFFFAOYSA-N bis(8-methylnonyl) decanedioate Chemical compound CC(C)CCCCCCCOC(=O)CCCCCCCCC(=O)OCCCCCCCC(C)C OAXZVLMNNOOMGN-UHFFFAOYSA-N 0.000 description 1
- 210000000988 bone and bone Anatomy 0.000 description 1
- 238000012662 bulk polymerization Methods 0.000 description 1
- BEWFIPLBFJGWSR-UHFFFAOYSA-N butyl 12-acetyloxyoctadec-9-enoate Chemical compound CCCCCCC(OC(C)=O)CC=CCCCCCCCC(=O)OCCCC BEWFIPLBFJGWSR-UHFFFAOYSA-N 0.000 description 1
- FEXXLIKDYGCVGJ-UHFFFAOYSA-N butyl 8-(3-octyloxiran-2-yl)octanoate Chemical compound CCCCCCCCC1OC1CCCCCCCC(=O)OCCCC FEXXLIKDYGCVGJ-UHFFFAOYSA-N 0.000 description 1
- ULBTUVJTXULMLP-UHFFFAOYSA-N butyl octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCCCC ULBTUVJTXULMLP-UHFFFAOYSA-N 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 1
- 239000008116 calcium stearate Substances 0.000 description 1
- 235000013539 calcium stearate Nutrition 0.000 description 1
- HIAAVKYLDRCDFQ-UHFFFAOYSA-L calcium;dodecanoate Chemical compound [Ca+2].CCCCCCCCCCCC([O-])=O.CCCCCCCCCCCC([O-])=O HIAAVKYLDRCDFQ-UHFFFAOYSA-L 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 239000006231 channel black Substances 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 238000005660 chlorination reaction Methods 0.000 description 1
- KYKAJFCTULSVSH-UHFFFAOYSA-N chloro(fluoro)methane Chemical compound F[C]Cl KYKAJFCTULSVSH-UHFFFAOYSA-N 0.000 description 1
- 150000001860 citric acid derivatives Chemical class 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- IFDVQVHZEKPUSC-UHFFFAOYSA-N cyclohex-3-ene-1,2-dicarboxylic acid Chemical class OC(=O)C1CCC=CC1C(O)=O IFDVQVHZEKPUSC-UHFFFAOYSA-N 0.000 description 1
- SASYSVUEVMOWPL-NXVVXOECSA-N decyl oleate Chemical compound CCCCCCCCCCOC(=O)CCCCCCC\C=C/CCCCCCCC SASYSVUEVMOWPL-NXVVXOECSA-N 0.000 description 1
- NZZIMKJIVMHWJC-UHFFFAOYSA-N dibenzoylmethane Chemical compound C=1C=CC=CC=1C(=O)CC(=O)C1=CC=CC=C1 NZZIMKJIVMHWJC-UHFFFAOYSA-N 0.000 description 1
- UCVPKAZCQPRWAY-UHFFFAOYSA-N dibenzyl benzene-1,2-dicarboxylate Chemical compound C=1C=CC=C(C(=O)OCC=2C=CC=CC=2)C=1C(=O)OCC1=CC=CC=C1 UCVPKAZCQPRWAY-UHFFFAOYSA-N 0.000 description 1
- JBSLOWBPDRZSMB-BQYQJAHWSA-N dibutyl (e)-but-2-enedioate Chemical compound CCCCOC(=O)\C=C\C(=O)OCCCC JBSLOWBPDRZSMB-BQYQJAHWSA-N 0.000 description 1
- JBSLOWBPDRZSMB-FPLPWBNLSA-N dibutyl (z)-but-2-enedioate Chemical compound CCCCOC(=O)\C=C/C(=O)OCCCC JBSLOWBPDRZSMB-FPLPWBNLSA-N 0.000 description 1
- OGVXYCDTRMDYOG-UHFFFAOYSA-N dibutyl 2-methylidenebutanedioate Chemical compound CCCCOC(=O)CC(=C)C(=O)OCCCC OGVXYCDTRMDYOG-UHFFFAOYSA-N 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical class OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- ZEFVHSWKYCYFFL-UHFFFAOYSA-N diethyl 2-methylidenebutanedioate Chemical compound CCOC(=O)CC(=C)C(=O)OCC ZEFVHSWKYCYFFL-UHFFFAOYSA-N 0.000 description 1
- YKDMBTQVKVEMSA-UHFFFAOYSA-N diethylene glycol distearate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCCOCCOC(=O)CCCCCCCCCCCCCCCCC YKDMBTQVKVEMSA-UHFFFAOYSA-N 0.000 description 1
- 229940111071 diethylene glycol distearate Drugs 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- ZWWQRMFIZFPUAA-UHFFFAOYSA-N dimethyl 2-methylidenebutanedioate Chemical compound COC(=O)CC(=C)C(=O)OC ZWWQRMFIZFPUAA-UHFFFAOYSA-N 0.000 description 1
- VNGOYPQMJFJDLV-UHFFFAOYSA-N dimethyl benzene-1,3-dicarboxylate Chemical compound COC(=O)C1=CC=CC(C(=O)OC)=C1 VNGOYPQMJFJDLV-UHFFFAOYSA-N 0.000 description 1
- LDCRTTXIJACKKU-ARJAWSKDSA-N dimethyl maleate Chemical compound COC(=O)\C=C/C(=O)OC LDCRTTXIJACKKU-ARJAWSKDSA-N 0.000 description 1
- FBSAITBEAPNWJG-UHFFFAOYSA-N dimethyl phthalate Natural products CC(=O)OC1=CC=CC=C1OC(C)=O FBSAITBEAPNWJG-UHFFFAOYSA-N 0.000 description 1
- 229960001826 dimethylphthalate Drugs 0.000 description 1
- DROMNWUQASBTFM-UHFFFAOYSA-N dinonyl benzene-1,2-dicarboxylate Chemical compound CCCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCCC DROMNWUQASBTFM-UHFFFAOYSA-N 0.000 description 1
- UCEHPOGKWWZMHC-UHFFFAOYSA-N dioctyl cyclohex-3-ene-1,2-dicarboxylate Chemical compound CCCCCCCCOC(=O)C1CCC=CC1C(=O)OCCCCCCCC UCEHPOGKWWZMHC-UHFFFAOYSA-N 0.000 description 1
- VJHINFRRDQUWOJ-UHFFFAOYSA-N dioctyl sebacate Chemical compound CCCCC(CC)COC(=O)CCCCCCCCC(=O)OCC(CC)CCCC VJHINFRRDQUWOJ-UHFFFAOYSA-N 0.000 description 1
- DWNAQMUDCDVSLT-UHFFFAOYSA-N diphenyl phthalate Chemical compound C=1C=CC=C(C(=O)OC=2C=CC=CC=2)C=1C(=O)OC1=CC=CC=C1 DWNAQMUDCDVSLT-UHFFFAOYSA-N 0.000 description 1
- AXZAYXJCENRGIM-UHFFFAOYSA-J dipotassium;tetrabromoplatinum(2-) Chemical compound [K+].[K+].[Br-].[Br-].[Br-].[Br-].[Pt+2] AXZAYXJCENRGIM-UHFFFAOYSA-J 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- YCZJVRCZIPDYHH-UHFFFAOYSA-N ditridecyl benzene-1,2-dicarboxylate Chemical compound CCCCCCCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCCCCCCC YCZJVRCZIPDYHH-UHFFFAOYSA-N 0.000 description 1
- QQVHEQUEHCEAKS-UHFFFAOYSA-N diundecyl benzene-1,2-dicarboxylate Chemical compound CCCCCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCCCCC QQVHEQUEHCEAKS-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000007720 emulsion polymerization reaction Methods 0.000 description 1
- UIWXSTHGICQLQT-UHFFFAOYSA-N ethenyl propanoate Chemical compound CCC(=O)OC=C UIWXSTHGICQLQT-UHFFFAOYSA-N 0.000 description 1
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 description 1
- 229920005680 ethylene-methyl methacrylate copolymer Polymers 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- XUCNUKMRBVNAPB-UHFFFAOYSA-N fluoroethene Chemical compound FC=C XUCNUKMRBVNAPB-UHFFFAOYSA-N 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 150000002237 fumaric acid derivatives Chemical class 0.000 description 1
- NKHAVTQWNUWKEO-UHFFFAOYSA-N fumaric acid monomethyl ester Natural products COC(=O)C=CC(O)=O NKHAVTQWNUWKEO-UHFFFAOYSA-N 0.000 description 1
- 230000000855 fungicidal effect Effects 0.000 description 1
- 239000006232 furnace black Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 235000013773 glyceryl triacetate Nutrition 0.000 description 1
- 238000010559 graft polymerization reaction Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 229920002681 hypalon Polymers 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 229910001853 inorganic hydroxide Inorganic materials 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 150000002531 isophthalic acids Chemical class 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000006233 lamp black Substances 0.000 description 1
- 238000007561 laser diffraction method Methods 0.000 description 1
- 235000021388 linseed oil Nutrition 0.000 description 1
- 239000000944 linseed oil Substances 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- HGPXWXLYXNVULB-UHFFFAOYSA-M lithium stearate Chemical compound [Li+].CCCCCCCCCCCCCCCCCC([O-])=O HGPXWXLYXNVULB-UHFFFAOYSA-M 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 235000019359 magnesium stearate Nutrition 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 150000002688 maleic acid derivatives Chemical class 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 125000005641 methacryl group Chemical group 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Natural products C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- RTWNYYOXLSILQN-UHFFFAOYSA-N methanediamine Chemical compound NCN RTWNYYOXLSILQN-UHFFFAOYSA-N 0.000 description 1
- NKHAVTQWNUWKEO-IHWYPQMZSA-N methyl hydrogen fumarate Chemical compound COC(=O)\C=C/C(O)=O NKHAVTQWNUWKEO-IHWYPQMZSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000003094 microcapsule Substances 0.000 description 1
- 239000011859 microparticle Substances 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- RZRNAYUHWVFMIP-UHFFFAOYSA-N monoelaidin Natural products CCCCCCCCC=CCCCCCCCC(=O)OCC(O)CO RZRNAYUHWVFMIP-UHFFFAOYSA-N 0.000 description 1
- WIBFFTLQMKKBLZ-SEYXRHQNSA-N n-butyl oleate Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OCCCC WIBFFTLQMKKBLZ-SEYXRHQNSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 150000002832 nitroso derivatives Chemical class 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical class CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- QTDSLDJPJJBBLE-PFONDFGASA-N octyl (z)-octadec-9-enoate Chemical compound CCCCCCCCOC(=O)CCCCCCC\C=C/CCCCCCCC QTDSLDJPJJBBLE-PFONDFGASA-N 0.000 description 1
- 150000002888 oleic acid derivatives Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- ZZSIDSMUTXFKNS-UHFFFAOYSA-N perylene red Chemical compound CC(C)C1=CC=CC(C(C)C)=C1N(C(=O)C=1C2=C3C4=C(OC=5C=CC=CC=5)C=1)C(=O)C2=CC(OC=1C=CC=CC=1)=C3C(C(OC=1C=CC=CC=1)=CC1=C2C(C(N(C=3C(=CC=CC=3C(C)C)C(C)C)C1=O)=O)=C1)=C2C4=C1OC1=CC=CC=C1 ZZSIDSMUTXFKNS-UHFFFAOYSA-N 0.000 description 1
- ODFKDYBAQKFTOU-KTKRTIGZSA-N phenyl (z)-octadec-9-enoate Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OC1=CC=CC=C1 ODFKDYBAQKFTOU-KTKRTIGZSA-N 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- 150000003021 phthalic acid derivatives Chemical class 0.000 description 1
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920006350 polyacrylonitrile resin Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 150000008442 polyphenolic compounds Chemical class 0.000 description 1
- 235000013824 polyphenols Nutrition 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 229910001487 potassium perchlorate Inorganic materials 0.000 description 1
- QYUMESOEHIJKHV-UHFFFAOYSA-M prop-2-enamide;trimethyl(propyl)azanium;chloride Chemical compound [Cl-].NC(=O)C=C.CCC[N+](C)(C)C QYUMESOEHIJKHV-UHFFFAOYSA-M 0.000 description 1
- BPJZKLBPJBMLQG-KWRJMZDGSA-N propanoyl (z,12r)-12-hydroxyoctadec-9-enoate Chemical compound CCCCCC[C@@H](O)C\C=C/CCCCCCCC(=O)OC(=O)CC BPJZKLBPJBMLQG-KWRJMZDGSA-N 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 239000001054 red pigment Substances 0.000 description 1
- WBHHMMIMDMUBKC-XLNAKTSKSA-N ricinelaidic acid Chemical class CCCCCC[C@@H](O)C\C=C\CCCCCCCC(O)=O WBHHMMIMDMUBKC-XLNAKTSKSA-N 0.000 description 1
- 150000003329 sebacic acid derivatives Chemical class 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- BAZAXWOYCMUHIX-UHFFFAOYSA-M sodium perchlorate Chemical compound [Na+].[O-]Cl(=O)(=O)=O BAZAXWOYCMUHIX-UHFFFAOYSA-M 0.000 description 1
- 229910001488 sodium perchlorate Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- FRKHZXHEZFADLA-UHFFFAOYSA-L strontium;octadecanoate Chemical compound [Sr+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O FRKHZXHEZFADLA-UHFFFAOYSA-L 0.000 description 1
- 150000003871 sulfonates Chemical class 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- 238000010558 suspension polymerization method Methods 0.000 description 1
- 238000010557 suspension polymerization reaction Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- PZTAGFCBNDBBFZ-UHFFFAOYSA-N tert-butyl 2-(hydroxymethyl)piperidine-1-carboxylate Chemical compound CC(C)(C)OC(=O)N1CCCCC1CO PZTAGFCBNDBBFZ-UHFFFAOYSA-N 0.000 description 1
- 239000006234 thermal black Substances 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 229960002622 triacetin Drugs 0.000 description 1
- STCOOQWBFONSKY-UHFFFAOYSA-N tributyl phosphate Chemical compound CCCCOP(=O)(OCCCC)OCCCC STCOOQWBFONSKY-UHFFFAOYSA-N 0.000 description 1
- WEAPVABOECTMGR-UHFFFAOYSA-N triethyl 2-acetyloxypropane-1,2,3-tricarboxylate Chemical compound CCOC(=O)CC(C(=O)OCC)(OC(C)=O)CC(=O)OCC WEAPVABOECTMGR-UHFFFAOYSA-N 0.000 description 1
- 239000001069 triethyl citrate Substances 0.000 description 1
- VMYFZRTXGLUXMZ-UHFFFAOYSA-N triethyl citrate Natural products CCOC(=O)C(O)(C(=O)OCC)C(=O)OCC VMYFZRTXGLUXMZ-UHFFFAOYSA-N 0.000 description 1
- 235000013769 triethyl citrate Nutrition 0.000 description 1
- DQWPFSLDHJDLRL-UHFFFAOYSA-N triethyl phosphate Chemical compound CCOP(=O)(OCC)OCC DQWPFSLDHJDLRL-UHFFFAOYSA-N 0.000 description 1
- UFTFJSFQGQCHQW-UHFFFAOYSA-N triformin Chemical compound O=COCC(OC=O)COC=O UFTFJSFQGQCHQW-UHFFFAOYSA-N 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- KOWVWXQNQNCRRS-UHFFFAOYSA-N tris(2,4-dimethylphenyl) phosphate Chemical compound CC1=CC(C)=CC=C1OP(=O)(OC=1C(=CC(C)=CC=1)C)OC1=CC=C(C)C=C1C KOWVWXQNQNCRRS-UHFFFAOYSA-N 0.000 description 1
- WTLBZVNBAKMVDP-UHFFFAOYSA-N tris(2-butoxyethyl) phosphate Chemical compound CCCCOCCOP(=O)(OCCOCCCC)OCCOCCCC WTLBZVNBAKMVDP-UHFFFAOYSA-N 0.000 description 1
- HQUQLFOMPYWACS-UHFFFAOYSA-N tris(2-chloroethyl) phosphate Chemical compound ClCCOP(=O)(OCCCl)OCCCl HQUQLFOMPYWACS-UHFFFAOYSA-N 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 239000012855 volatile organic compound Substances 0.000 description 1
- 239000012463 white pigment Substances 0.000 description 1
- 239000001052 yellow pigment Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229940098697 zinc laurate Drugs 0.000 description 1
- GAWWVVGZMLGEIW-GNNYBVKZSA-L zinc ricinoleate Chemical compound [Zn+2].CCCCCC[C@@H](O)C\C=C/CCCCCCCC([O-])=O.CCCCCC[C@@H](O)C\C=C/CCCCCCCC([O-])=O GAWWVVGZMLGEIW-GNNYBVKZSA-L 0.000 description 1
- 229940100530 zinc ricinoleate Drugs 0.000 description 1
- IFNXAMCERSVZCV-UHFFFAOYSA-L zinc;2-ethylhexanoate Chemical compound [Zn+2].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O IFNXAMCERSVZCV-UHFFFAOYSA-L 0.000 description 1
- GPYYEEJOMCKTPR-UHFFFAOYSA-L zinc;dodecanoate Chemical compound [Zn+2].CCCCCCCCCCCC([O-])=O.CCCCCCCCCCCC([O-])=O GPYYEEJOMCKTPR-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
- C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L27/04—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing chlorine atoms
- C08L27/06—Homopolymers or copolymers of vinyl chloride
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Moulding By Coating Moulds (AREA)
Abstract
本発明は、低温での柔軟性に優れる成形体を与える、粉体成形用塩化ビニル樹脂組成物、低温での柔軟性に優れる塩化ビニル樹脂成形体、及び、この塩化ビニル樹脂成形体と発泡ポリウレタン成形体を有する積層体を提供する。本発明の粉体成形用塩化ビニル樹脂組成物は、(a)塩化ビニル樹脂粒子、(b)塩化ビニル樹脂微粒子、(c)エポキシ樹脂、及び(d)可塑剤を含む。The present invention provides a vinyl chloride resin composition for powder molding that gives a molded article having excellent flexibility at low temperature, a vinyl chloride resin molded article having excellent flexibility at low temperature, and the vinyl chloride resin molded article and foamed polyurethane. Provided is a laminate having a molded body. The vinyl chloride resin composition for powder molding of the present invention comprises (a) vinyl chloride resin particles, (b) vinyl chloride resin fine particles, (c) an epoxy resin, and (d) a plasticizer.
Description
本発明は、低温での柔軟性に優れる成形体を与える粉体成形用塩化ビニル樹脂組成物、上記粉体成形用塩化ビニル樹脂組成物を粉体成形してなる塩化ビニル樹脂成形体、及び上記塩化ビニル樹脂成形体と発泡ポリウレタン成形体とを有する積層体に関する。 The present invention provides a vinyl chloride resin composition for powder molding that gives a molded article excellent in flexibility at low temperature, a vinyl chloride resin molded body obtained by powder molding the vinyl chloride resin composition for powder molding, and the above The present invention relates to a laminate having a vinyl chloride resin molded body and a polyurethane foam molded body.
自動車インスツルメントパネルは、発泡ポリウレタン層が、塩化ビニル樹脂からなる表皮と基材との間に設けられた構造を有している。ここで、表皮が塩化ビニル樹脂からなる場合は、表皮が経時的に変色し、また、表皮の耐熱老化性が低下することがある。当該変色等の原因の1つは、発泡ポリウレタン層の形成時に触媒として使用された第三級アミンの、塩化ビニル樹脂からなる表皮への移行に伴う化学反応である。そこで、当該表皮の変色防止のため、発泡ポリウレタン層内で発生する揮発性有機化合物を捕捉する粒状のキャッチャー材を発泡ポリウレタン層内に導入することが検討されている。具体的には、連通気泡のシート材で被覆された上記キャッチャー材が、発泡ポリウレタン層端末の、表皮材と基材とによるシール箇所近傍に配置されているウレタン一体発泡成形品が検討された(例えば、特許文献1参照)。しかし、特許文献1に記載のウレタン一体発泡成形品では、上記表皮と上記発泡ポリウレタン層とが接触している部分があるため、上記化学反応による表皮材の変色を長期間防止できず、表皮材の耐熱老化性は低下する。
また、心材(基材)と表皮とを接合する合成樹脂製発泡体層が設けられた積層体において、当該発泡体層で発生するガスを排出するガス抜き孔が上記心材に設けられている積層体が検討された(例えば、特許文献2参照)。しかし、特許文献2に記載の積層体においても、上記表皮と上記合成樹脂製発泡体層とが接触しているため、上記化学反応による表皮材の変色を長期間防止できず、表皮材の耐熱老化性は低下する。The automobile instrument panel has a structure in which a foamed polyurethane layer is provided between a skin made of a vinyl chloride resin and a base material. Here, when the skin is made of a vinyl chloride resin, the skin may discolor over time, and the heat aging resistance of the skin may decrease. One cause of the discoloration or the like is a chemical reaction associated with the transfer of the tertiary amine used as a catalyst during the formation of the foamed polyurethane layer to the skin made of vinyl chloride resin. Therefore, in order to prevent discoloration of the skin, it has been studied to introduce a granular catcher material that captures volatile organic compounds generated in the foamed polyurethane layer into the foamed polyurethane layer. Specifically, a urethane integrated foam-molded product in which the catcher material covered with the open-cell sheet material is disposed in the vicinity of the sealing portion of the foamed polyurethane layer terminal by the skin material and the base material was examined ( For example, see Patent Document 1). However, in the urethane integrated foam molded article described in Patent Document 1, since the skin and the foamed polyurethane layer are in contact with each other, discoloration of the skin material due to the chemical reaction cannot be prevented for a long period of time. The heat aging resistance is reduced.
Also, in a laminate provided with a synthetic resin foam layer that joins the core material (base material) and the skin, a laminate in which a vent hole for discharging gas generated in the foam layer is provided in the core material. The body was examined (for example, refer patent document 2). However, even in the laminate described in Patent Document 2, since the skin and the synthetic resin foam layer are in contact with each other, discoloration of the skin material due to the chemical reaction cannot be prevented for a long time, and the heat resistance of the skin material can be prevented. Aging is reduced.
更に、ポリウレタン成形体と、塩化ビニル樹脂を含有し、かつ当該ポリウレタン成形体の少なくとも一表面を被覆する表皮層と、当該ポリウレタン成形体および当該表皮層の間に介在するアミンキャッチャー剤層とからなる成形体が検討された(例えば、特許文献3参照)。しかし、上記アミンキャッチャー剤は揮発しやすい。従って、特許文献3に記載の成形体においても、第三級アミンが、塩化ビニル樹脂からなる表皮へ移行することを長期間阻止できない。その結果、上記化学反応による表皮材の変色を長期間防止できず、表皮材の耐熱老化性は低下する。
ところで、特定のトリメリテート類可塑剤が配合された粉体成形用塩化ビニル樹脂組成物が自動車内装材に用いられる表皮材の原料として検討された(例えば、特許文献4参照)。上記粉体成形用塩化ビニル樹脂組成物を粉体成形することにより得られる表皮材の耐熱老化性を向上させるためには、上記可塑剤の配合量を増加させなければならないため、上記可塑剤に由来するベタつき感が発生する問題があった。
また平均重合度が1500以上の塩化ビニル系樹脂からなる塩化ビニル系樹脂粒子100質量部と、特定のトリメリテート系可塑剤110質量部以上150質量部以下とを含有する、粉体成形用塩化ビニル系樹脂組成物が検討された(例えば、特許文献5参照)。Furthermore, it comprises a polyurethane molded body, a skin layer containing a vinyl chloride resin and covering at least one surface of the polyurethane molded body, and an amine catcher agent layer interposed between the polyurethane molded body and the skin layer. Molded bodies have been studied (see, for example, Patent Document 3). However, the amine catcher agent is volatile. Therefore, even in the molded article described in Patent Document 3, it is impossible to prevent the tertiary amine from moving to the skin made of the vinyl chloride resin for a long period of time. As a result, discoloration of the skin material due to the chemical reaction cannot be prevented for a long time, and the heat aging resistance of the skin material is reduced.
By the way, a vinyl chloride resin composition for powder molding in which a specific trimellitate plasticizer is blended has been studied as a raw material for skin materials used for automobile interior materials (see, for example, Patent Document 4). In order to improve the heat aging resistance of the skin material obtained by powder molding the powder molding vinyl chloride resin composition, the amount of the plasticizer must be increased. There was a problem that a sticky feeling originated.
Further, a vinyl chloride resin for powder molding containing 100 parts by mass of vinyl chloride resin particles composed of a vinyl chloride resin having an average polymerization degree of 1500 or more and 110 to 150 parts by mass of a specific trimellitate plasticizer. Resin compositions have been studied (see, for example, Patent Document 5).
近年、発泡ポリウレタン層が積層された自動車インスツルメントパネル用表皮において、低温で表皮が設計通りに割れてエアバッグが膨張し、且つ当該膨張の際に当該表皮の破片が飛散しないよう、低温での柔軟性に優れる表皮を備える自動車インスツルメントパネルが要求されてきていた。しかし、そのような表皮を備える自動車インスツルメントパネルは実現されていなかった。
そこで、本発明が解決しようとする課題は、低温での柔軟性に優れる成形体を与える粉体成形用塩化ビニル樹脂組成物の提供である。本発明が解決しようとする別の課題は、上記粉体成形用塩化ビニル樹脂組成物を粉体成形してなる、低温での柔軟性に優れる塩化ビニル樹脂成形体、及び、上記塩化ビニル樹脂成形体と発泡ポリウレタン成形体とを有する積層体の提供である。In recent years, in automotive instrument panel skins with polyurethane foam layers laminated, the skin is cracked as designed at low temperatures and the airbag is inflated. There has been a demand for an automobile instrument panel having a skin with excellent flexibility. However, an automobile instrument panel having such a skin has not been realized.
Therefore, the problem to be solved by the present invention is to provide a vinyl chloride resin composition for powder molding that gives a molded article having excellent flexibility at low temperatures. Another problem to be solved by the present invention is that a vinyl chloride resin molded article excellent in flexibility at low temperature, which is obtained by powder molding the vinyl chloride resin composition for powder molding, and the vinyl chloride resin molded article It is provision of the laminated body which has a body and a foaming polyurethane molding.
本発明の発明者は、上記課題を解決するために鋭意検討した結果、(a)塩化ビニル樹脂粒子、(b)塩化ビニル樹脂微粒子、(c)エポキシ樹脂、及び(d)可塑剤を含む粉体成形用塩化ビニル樹脂組成物が、特に優れた低温での柔軟性を有する成形体を与えることを見出し、本発明を完成させるに至った。 The inventor of the present invention has intensively studied to solve the above problems, and as a result, (a) vinyl chloride resin particles, (b) vinyl chloride resin fine particles, (c) epoxy resin, and (d) a powder containing a plasticizer. The present inventors have found that a vinyl chloride resin composition for body molding gives a molded body having particularly excellent flexibility at low temperature, and has completed the present invention.
本発明は、(a)塩化ビニル樹脂粒子、(b)塩化ビニル樹脂微粒子、(c)エポキシ樹脂、及び(d)可塑剤を含む、粉体成形用塩化ビニル樹脂組成物である。 The present invention is a vinyl chloride resin composition for powder molding comprising (a) vinyl chloride resin particles, (b) vinyl chloride resin fine particles, (c) an epoxy resin, and (d) a plasticizer.
ここで、本発明の粉体成形用塩化ビニル樹脂組成物において、前記(c)エポキシ樹脂の好ましい含有量は、前記(a)塩化ビニル樹脂粒子と前記(b)塩化ビニル樹脂微粒子との合計100質量部に対して0.2質量部以上20質量部以下である。 Here, in the vinyl chloride resin composition for powder molding of the present invention, a preferable content of the (c) epoxy resin is a total of 100 of the (a) vinyl chloride resin particles and the (b) vinyl chloride resin fine particles. It is 0.2 mass part or more and 20 mass parts or less with respect to a mass part.
また、本発明の粉体成形用塩化ビニル樹脂組成物において、前記(a)塩化ビニル樹脂粒子の好ましい平均粒子径は50μm以上500μm以下である。そして、本発明の粉体成形用塩化ビニル樹脂組成物において、前記(b)塩化ビニル樹脂微粒子の好ましい平均粒子径は0.1μm以上10μm以下である。
なお、本発明において、「樹脂粒子」とは、粒子径が30μm以上の粒子を指し、「樹脂微粒子」とは、粒子径が30μm未満の粒子を指す。そして(a)塩化ビニル樹脂粒子および(b)塩化ビニル樹脂微粒子の「粒子径」及び「平均粒子径」とは、JIS Z8825に準拠し、レーザー回折法によって測定することができる。In the vinyl chloride resin composition for powder molding of the present invention, a preferable average particle size of the (a) vinyl chloride resin particles is 50 μm or more and 500 μm or less. And in the vinyl chloride resin composition for powder molding of the present invention, the preferred average particle diameter of the (b) vinyl chloride resin fine particles is 0.1 μm or more and 10 μm or less.
In the present invention, “resin particles” refers to particles having a particle size of 30 μm or more, and “resin particles” refers to particles having a particle size of less than 30 μm. The “particle diameter” and “average particle diameter” of (a) vinyl chloride resin particles and (b) vinyl chloride resin fine particles can be measured by a laser diffraction method in accordance with JIS Z8825.
また、本発明の粉体成形用塩化ビニル樹脂組成物は、好ましくはパウダースラッシュ成形に用いられる。 The vinyl chloride resin composition for powder molding of the present invention is preferably used for powder slush molding.
また、本発明は、上述したいずれかの粉体成形用塩化ビニル樹脂組成物を粉体成形してなる塩化ビニル樹脂成形体である。 Moreover, this invention is a vinyl chloride resin molded object formed by powder-molding any of the vinyl chloride resin compositions for powder molding described above.
ここで、本発明の塩化ビニル樹脂成形体は、好ましくは、上述した粉体成形用塩化ビニル樹脂組成物をパウダースラッシュ成形してなる。 Here, the vinyl chloride resin molded article of the present invention is preferably formed by powder slush molding of the above-described vinyl chloride resin composition for powder molding.
また、本発明の塩化ビニル樹脂成形体は、好ましくは、自動車インスツルメントパネル表皮用である。 Moreover, the vinyl chloride resin molded article of the present invention is preferably for an automotive instrument panel skin.
そして、本発明は、発泡ポリウレタン成形体と、上述したいずれかの塩化ビニル樹脂成形体とを有する積層体である。 And this invention is a laminated body which has a foaming polyurethane molding and one of the vinyl chloride resin moldings mentioned above.
また、本発明の積層体は、好ましくは、自動車インスツルメントパネル用である。 The laminate of the present invention is preferably for an automobile instrument panel.
本発明の粉体成形用塩化ビニル樹脂組成物は、低温での柔軟性に優れる成形体を与える。 The vinyl chloride resin composition for powder molding of the present invention gives a molded article having excellent flexibility at low temperatures.
(粉体成形用塩化ビニル樹脂組成物)
本発明の粉体成形用塩化ビニル樹脂組成物は、(a)塩化ビニル樹脂粒子と、(b)塩化ビニル樹脂微粒子と、(c)エポキシ樹脂と、(d)可塑剤とを含み、任意に添加剤を更に含有する。(Vinyl chloride resin composition for powder molding)
The vinyl chloride resin composition for powder molding of the present invention comprises (a) vinyl chloride resin particles, (b) vinyl chloride resin fine particles, (c) an epoxy resin, and (d) a plasticizer. It further contains an additive.
<(a)塩化ビニル樹脂粒子>
(a)塩化ビニル樹脂粒子は、塩化ビニル樹脂からなる樹脂粒子である。(a)塩化ビニル樹脂粒子は、粉体成形用塩化ビニル樹脂組成物において、通常、マトリックス樹脂として機能する。
そして、(a)塩化ビニル樹脂粒子を構成する塩化ビニル樹脂としては、塩化ビニルの単独重合体の他、塩化ビニル単位を好ましくは50質量%以上、より好ましくは70質量%以上含有する共重合体(塩化ビニル共重合体)が挙げられる。
塩化ビニル共重合体における、塩化ビニルと共重合可能な単量体(共単量体)の具体例は、エチレン、プロピレンなどのオレフィン類;塩化アリル、塩化ビニリデン、フッ化ビニル、三フッ化塩化エチレンなどのハロゲン化オレフィン類;酢酸ビニル、プロピオン酸ビニルなどのカルボン酸ビニルエステル類;イソブチルビニルエーテル、セチルビニルエーテルなどのビニルエーテル類;アリル−3−クロロ−2−オキシプロピルエーテル、アリルグリシジルエーテルなどのアリルエーテル類;アクリル酸、マレイン酸、イタコン酸、アクリル酸−2−ヒドロキシエチル、メタクリル酸メチル、マレイン酸モノメチル、マレイン酸ジエチル、無水マレイン酸などの不飽和カルボン酸、そのエステルまたはその酸無水物類;アクリロニトリル、メタクリロニトリルなどの不飽和ニトリル類;アクリルアミド、N−メチロールアクリルアミド、アクリルアミド−2−メチルプロパンスルホン酸、(メタ)アクリルアミドプロピルトリメチルアンモニウムクロライドなどのアクリルアミド類;アリルアミン安息香酸塩、ジアリルジメチルアンモニウムクロライドなどのアリルアミンおよびその誘導体類;などである。以上に例示される単量体は、共単量体の一部に過ぎず、共単量体としては、近畿化学協会ビニル部会編「ポリ塩化ビニル」日刊工業新聞社(1988年)第75〜104頁に例示されている各種単量体が使用され得る。これらの単量体の1種又は2種以上が使用され得る。上記(a)塩化ビニル樹脂粒子を構成する塩化ビニル樹脂は、エチレン−酢酸ビニル共重合体、エチレン−メタクリル酸メチル共重合体、エチレン−アクリル酸エチル共重合体、塩素化ポリエチレンなどの樹脂に、(1)塩化ビニルまたは(2)塩化ビニルと前記共単量体とがグラフト重合された樹脂も含む。
ここで、本明細書において、「(メタ)アクリル」とは、アクリル及び/又はメタクリルを意味する。<(A) Vinyl chloride resin particles>
(A) Vinyl chloride resin particles are resin particles made of vinyl chloride resin. (A) The vinyl chloride resin particles usually function as a matrix resin in a vinyl chloride resin composition for powder molding.
And (a) As a vinyl chloride resin which comprises vinyl chloride resin particle | grains, the copolymer which contains a vinyl chloride unit preferably 50 mass% or more more preferably 70 mass% or more other than the homopolymer of vinyl chloride (Vinyl chloride copolymer).
Specific examples of monomers (comonomers) copolymerizable with vinyl chloride in vinyl chloride copolymers include olefins such as ethylene and propylene; allyl chloride, vinylidene chloride, vinyl fluoride, trifluoride chloride Halogenated olefins such as ethylene; carboxylic acid vinyl esters such as vinyl acetate and vinyl propionate; vinyl ethers such as isobutyl vinyl ether and cetyl vinyl ether; allyls such as allyl-3-chloro-2-oxypropyl ether and allyl glycidyl ether Ethers; unsaturated carboxylic acids such as acrylic acid, maleic acid, itaconic acid, 2-hydroxyethyl acrylate, methyl methacrylate, monomethyl maleate, diethyl maleate, maleic anhydride, their esters or their acid anhydrides Acrylonitrile, Unsaturated nitriles such as tacrylonitrile; acrylamides such as acrylamide, N-methylolacrylamide, acrylamide-2-methylpropanesulfonic acid, (meth) acrylamidepropyltrimethylammonium chloride; allylamine benzoate, diallyldimethylammonium chloride, etc. Allylamine and its derivatives; The monomers exemplified above are only a part of the comonomer, and examples of the comonomer include “Polyvinyl Chloride” edited by Kinki Chemical Association Vinyl Division, Nikkan Kogyo Shimbun (1988), No. 75- Various monomers exemplified on page 104 can be used. One or more of these monomers can be used. The vinyl chloride resin constituting the vinyl chloride resin particles (a) is a resin such as ethylene-vinyl acetate copolymer, ethylene-methyl methacrylate copolymer, ethylene-ethyl acrylate copolymer, chlorinated polyethylene, It also includes (1) vinyl chloride or (2) a resin obtained by graft polymerization of vinyl chloride and the comonomer.
Here, in this specification, “(meth) acryl” means acryl and / or methacryl.
ここで、上記(a)塩化ビニル樹脂粒子を構成する塩化ビニル樹脂は、懸濁重合法、乳化重合法、溶液重合法、塊状重合法など、従来から知られているいずれの製造法によっても製造され得る。特に、(a)塩化ビニル樹脂粒子を構成する塩化ビニル樹脂としては、懸濁重合法により製造された塩化ビニル樹脂が好ましい。 Here, the vinyl chloride resin constituting the vinyl chloride resin particles (a) is produced by any conventionally known production method such as suspension polymerization method, emulsion polymerization method, solution polymerization method or bulk polymerization method. Can be done. In particular, (a) the vinyl chloride resin constituting the vinyl chloride resin particles is preferably a vinyl chloride resin produced by suspension polymerization.
また、上記(a)塩化ビニル樹脂粒子の平均粒径は、好ましくは50μm以上であり、より好ましくは100μm以上であり、好ましくは500μm以下であり、より好ましくは250μm以下であり、更に好ましくは200μm以下である。(a)塩化ビニル樹脂粒子の平均粒径が上記範囲内であると、粉体成形用塩化ビニル樹脂組成物の粉体流動性が良好であり、かつ、粉体成形用塩化ビニル樹脂組成物を粉体成形してなる塩化ビニル樹脂成形体の平滑性が向上する。 The average particle diameter of the vinyl chloride resin particles (a) is preferably 50 μm or more, more preferably 100 μm or more, preferably 500 μm or less, more preferably 250 μm or less, and further preferably 200 μm. It is as follows. (A) When the average particle size of the vinyl chloride resin particles is within the above range, the powder flowability of the vinyl chloride resin composition for powder molding is good, and the vinyl chloride resin composition for powder molding is The smoothness of the vinyl chloride resin molded product formed by powder molding is improved.
そして、上記(a)塩化ビニル樹脂粒子を構成する塩化ビニル樹脂の平均重合度は、好ましくは800以上であり、好ましくは5000以下であり、より好ましくは3000以下であり、更に好ましくは2200以下、特に好ましくは2000以下である。上記(a)塩化ビニル樹脂粒子の平均重合度が上記範囲内であると、粉体成形用塩化ビニル樹脂組成物を粉体成形してなる塩化ビニル樹脂成形体に、良好な耐熱性を付与できる。なお、「平均重合度」は、JIS K 6720−2に準拠して測定される。 The average degree of polymerization of the vinyl chloride resin constituting the (a) vinyl chloride resin particles is preferably 800 or more, preferably 5000 or less, more preferably 3000 or less, still more preferably 2200 or less, Especially preferably, it is 2000 or less. When the average degree of polymerization of the above (a) vinyl chloride resin particles is within the above range, good heat resistance can be imparted to a vinyl chloride resin molded article obtained by powder molding a vinyl chloride resin composition for powder molding. . The “average degree of polymerization” is measured according to JIS K 6720-2.
<(b)塩化ビニル樹脂微粒子>
(b)塩化ビニル樹脂微粒子は、塩化ビニル樹脂からなる樹脂微粒子である。(b)塩化ビニル樹脂微粒子は、粉体成形用塩化ビニル樹脂組成物において、粉体成形用塩化ビニル樹脂組成物の粉体流動性を向上させるダスティング剤(粉体流動性改良剤)として機能する。
ここで、(b)塩化ビニル樹脂微粒子を構成する塩化ビニル樹脂としては、上述した(a)塩化ビニル樹脂粒子を構成する塩化ビニル樹脂と同じものを使用することができる。
そして、(b)塩化ビニル樹脂微粒子を構成する塩化ビニル樹脂としては、特に、乳化重合法により製造された塩化ビニル樹脂が好ましい。<(B) Vinyl chloride resin fine particles>
(B) Vinyl chloride resin fine particles are resin fine particles made of vinyl chloride resin. (B) The vinyl chloride resin fine particles function as a dusting agent (powder fluidity improver) for improving the powder fluidity of the powdered vinyl chloride resin composition in the powdered vinyl chloride resin composition. To do.
Here, as the vinyl chloride resin constituting the vinyl chloride resin fine particles (b), the same vinyl chloride resin as the vinyl chloride resin particles (a) described above can be used.
And as (b) vinyl chloride resin which comprises vinyl chloride resin microparticles | fine-particles, the vinyl chloride resin manufactured by the emulsion polymerization method is especially preferable.
また、上記(b)塩化ビニル樹脂微粒子の平均粒子径は、好ましくは0.1μm以上であり、好ましくは10μm以下である。上記(b)塩化ビニル樹脂微粒子の平均粒子径が上記範囲内であると、粉体成形性塩化ビニル樹脂組成物の粉体流動性が向上する。 The average particle diameter of the (b) vinyl chloride resin fine particles is preferably 0.1 μm or more, and preferably 10 μm or less. When the average particle diameter of the (b) vinyl chloride resin fine particles is within the above range, the powder flowability of the powder moldable vinyl chloride resin composition is improved.
そして、上記(b)塩化ビニル樹脂微粒子を構成する塩化ビニル樹脂の平均重合度は、好ましくは500以上であり、より好ましくは600以上であり、更に好ましくは700以上であり、好ましくは5000以下であり、より好ましくは3000以下であり、更に好ましくは2500以下であり、一層好ましくは2000以下であり、特に好ましくは1500以下であり、最も好ましくは1000以下である。上記(b)塩化ビニル樹脂微粒子の平均重合度が上記範囲内であると、粉体成形用塩化ビニル樹脂組成物の粉体流動性が良好であり、かつ、上記粉体成形用塩化ビニル樹脂組成物の発泡ポリウレタン成形体への焼結後の接着性と、焼結時の溶融性とが向上する。 The average degree of polymerization of the vinyl chloride resin constituting the (b) vinyl chloride resin fine particles is preferably 500 or more, more preferably 600 or more, still more preferably 700 or more, preferably 5000 or less. More preferably, it is 3000 or less, More preferably, it is 2500 or less, More preferably, it is 2000 or less, Especially preferably, it is 1500 or less, Most preferably, it is 1000 or less. (B) When the average degree of polymerization of the vinyl chloride resin fine particles is within the above range, the powder flowability of the vinyl chloride resin composition for powder molding is good, and the vinyl chloride resin composition for powder molding is The adhesiveness after sintering to the foamed polyurethane molded article and the meltability during sintering are improved.
上記(b)塩化ビニル樹脂微粒子の好ましい含有量は、上記(a)塩化ビニル樹脂粒子と上記(b)塩化ビニル樹脂微粒子との合計に対して、5質量%以上であることが好ましく、35質量%以下であることが好ましく、30質量%以下であることがより好ましく、25質量%以下であることが更に好ましい。上記(b)塩化ビニル樹脂微粒子の含有量が上記範囲内であると、粉体成形用塩化ビニル樹脂組成物の粉体流動性が良好であり、かつ、上記粉体成形用塩化ビニル樹脂組成物の発泡ポリウレタン成形体への焼結後の接着性と、焼結時の溶融性とが向上する。 The preferable content of the (b) vinyl chloride resin fine particles is preferably 5% by mass or more, and 35% by mass with respect to the total of the (a) vinyl chloride resin particles and the (b) vinyl chloride resin fine particles. % Or less, more preferably 30% by mass or less, and further preferably 25% by mass or less. When the content of the (b) vinyl chloride resin fine particles is within the above range, the powder flowability of the vinyl chloride resin composition for powder molding is good, and the vinyl chloride resin composition for powder molding is The adhesiveness after sintering to the foamed polyurethane molded article and the meltability during sintering are improved.
<(c)エポキシ樹脂>
本発明の粉体成形用塩化ビニル樹脂組成物は、(c)エポキシ樹脂を含有する。
ここで、本発明では、(c)エポキシ樹脂には、(d)可塑剤として用いられているエポキシ化大豆油などのエポキシ化植物油は含まれない。すなわち、(c)エポキシ樹脂は、エポキシ化植物油を除くものである。
また、(c)エポキシ樹脂は、上記条件以外は特に限定されず、芳香族系エポキシ樹脂、脂環族系エポキシ樹脂、及び脂肪族系エポキシ樹脂のいずれをも使用できる。好ましい(c)エポキシ樹脂としては、芳香族系エポキシ樹脂である。芳香族系エポキシ樹脂の具体例としては、ビスフェノールAとエピクロルヒドリンをアルカリの存在下で反応させて得られる、ビスフェノールA型液状エポキシ樹脂、ビスフェノールA型固形エポキシ樹脂、ビスフェノールFとエピクロルヒドリンとをアルカリの存在下で反応させて得られるビスフェノールF型エポキシ樹脂、これらの樹脂の臭素化樹脂、これらの樹脂のウレタン変性樹脂、フェノールノボラック型エポキシ化合物、クレゾールノボラック型エポキシ化合物、クレゾール型エポキシ化合物、ポリフェノール型エポキシ化合物、水素添加ビスフェノールA型エポキシ化合物等のグリシジルエーテル型エポキシ化合物等が挙げられる。上述した中でも、より好ましい(c)エポキシ樹脂は、ビスフェノールA型液状エポキシ樹脂、ビスフェノールA型固形エポキシ樹脂、ビスフェノールF型エポキシ樹脂である。これらの(c)エポキシ樹脂は、1種のみを用いても良く、2種以上を用いても良い。
なお、エポキシ樹脂が「液状」であるとは、温度25℃、圧力1atmの常温常圧下においてエポキシ樹脂が液状であることを指す。<(C) Epoxy resin>
The vinyl chloride resin composition for powder molding of the present invention contains (c) an epoxy resin.
Here, in the present invention, (c) epoxy resin does not include (d) epoxidized vegetable oil such as epoxidized soybean oil used as a plasticizer. That is, (c) an epoxy resin excludes epoxidized vegetable oil.
Moreover, (c) epoxy resin is not specifically limited except the said conditions, Any of an aromatic epoxy resin, an alicyclic epoxy resin, and an aliphatic epoxy resin can be used. Preferable (c) epoxy resin is an aromatic epoxy resin. Specific examples of aromatic epoxy resins include bisphenol A liquid epoxy resin, bisphenol A solid epoxy resin, bisphenol F and epichlorohydrin, which are obtained by reacting bisphenol A and epichlorohydrin in the presence of alkali. Bisphenol F type epoxy resins obtained by reaction under these conditions, brominated resins of these resins, urethane modified resins of these resins, phenol novolac type epoxy compounds, cresol novolak type epoxy compounds, cresol type epoxy compounds, polyphenol type epoxy compounds And glycidyl ether type epoxy compounds such as hydrogenated bisphenol A type epoxy compounds. Among the above-mentioned, more preferable (c) epoxy resins are bisphenol A type liquid epoxy resin, bisphenol A type solid epoxy resin, and bisphenol F type epoxy resin. These (c) epoxy resins may be used alone or in combination of two or more.
In addition, the epoxy resin being “liquid” means that the epoxy resin is in a liquid state under a normal temperature and a normal pressure of a temperature of 25 ° C. and a pressure of 1 atm.
ビスフェノールA型液状エポキシ樹脂は市販されており、その具体例は、例えば、商品名「jER827、jER828、jER828EL、jER828XA、jER834」(以上、三菱化学(株)製)、商品名「EPICLON840、EPICLON840−S、EPICLON850、EPICLON850−S、EPICLON850−CRP、EPICLON850−LC」(以上、DIC(株)製、「EPICLON」は登録商標)等である。また、ビスフェノールA型固形エポキシ樹脂は市販されており、その具体例は、例えば、商品名「EPICLON860、EPICLON1050、EPICLON1055、EPICLON3050、EPICLON4050、EPICLON7050、EPICLON AM−020−P、EPICLON AM−040−P、EPICLON HM−091、EPICLON HM−101」(以上、DIC(株)製)等である。更に、ビスフェノールF型エポキシ樹脂は市販されており、その具体例は、例えば、商品名「EPICLON830、EPICLON830−S、EPICLON830−LVP、EPICLON835、EPICLON835−LV」(以上、DIC(株)製)等である。 Bisphenol A type liquid epoxy resins are commercially available, and specific examples thereof include, for example, trade names “jER828, jER828, jER828EL, jER828XA, jER834” (manufactured by Mitsubishi Chemical Corporation), trade names “EPICLON840, EPICLON840-”. S, EPICLON 850, EPICLON 850-S, EPICLON 850-CRP, EPICLON 850-LC ”(above, manufactured by DIC Corporation,“ EPICLON ”is a registered trademark), and the like. Further, bisphenol A type solid epoxy resins are commercially available, and specific examples thereof include, for example, trade names “EPICLON 860, EPICLON 1050, EPICLON 1055, EPICLON 3050, EPICLON 4050, EPICLON 7050, EPICLON AM-020-P, EPICLON AM-040-P, EPICLON HM-091, EPICLON HM-101 "(manufactured by DIC Corporation). Furthermore, bisphenol F type epoxy resins are commercially available, and specific examples thereof include, for example, trade names “EPICLON 830, EPICLON 830-S, EPICLON 830-LVP, EPICLON 835, EPICLON 835-LV” (manufactured by DIC Corporation). is there.
ここで、(c)エポキシ樹脂のエポキシ当量は、好ましくは100g/eq以上であり、より好ましくは150g/eq以上であり、好ましくは5000g/eq以下であり、より好ましくは1000g/eq以下であり、更に好ましくは600g/eq以下である。なお、「エポキシ当量」は、JIS K 7236に準拠して測定される。 Here, the epoxy equivalent of the (c) epoxy resin is preferably 100 g / eq or more, more preferably 150 g / eq or more, preferably 5000 g / eq or less, more preferably 1000 g / eq or less. More preferably, it is 600 g / eq or less. The “epoxy equivalent” is measured according to JIS K 7236.
また、(c)エポキシ樹脂の、上記(a)塩化ビニル樹脂粒子と上記(b)塩化ビニル樹脂微粒子との合計100質量部に対する含有量は、好ましくは0.2質量部以上であり、より好ましくは0.5質量部以上であり、更に好ましくは0.7質量部以上であり、好ましくは20質量部以下であり、より好ましくは18質量部以下であり、更に好ましくは17質量部以下である。(c)エポキシ樹脂の含有量が上記範囲内であると、粉体成形用塩化ビニル樹脂組成物を粉体成形してなる塩化ビニル樹脂成形体に、良好な低温での柔軟性を付与することができる。 Further, the content of (c) epoxy resin with respect to 100 parts by mass in total of (a) vinyl chloride resin particles and (b) vinyl chloride resin fine particles is preferably 0.2 parts by mass or more, and more preferably. Is 0.5 parts by mass or more, more preferably 0.7 parts by mass or more, preferably 20 parts by mass or less, more preferably 18 parts by mass or less, and further preferably 17 parts by mass or less. . (C) When the content of the epoxy resin is within the above range, good flexibility at low temperature is imparted to a vinyl chloride resin molded body obtained by powder molding a vinyl chloride resin composition for powder molding. Can do.
<(d)可塑剤>
本発明の粉体成形用塩化ビニル樹脂組成物は、(d)可塑剤を含有する。ここで、好ましい(d)可塑剤としては、トリメリット酸エステル可塑剤が挙げられる。そして、本発明の粉体成形用塩化ビニル樹脂組成物は、トリメリット酸エステル可塑剤以外の可塑剤(以下、「その他の可塑剤」ともいう。)を含有し得る。<(D) Plasticizer>
The vinyl chloride resin composition for powder molding of the present invention contains (d) a plasticizer. Here, preferable (d) plasticizers include trimellitic acid ester plasticizers. And the vinyl chloride resin composition for powder molding of this invention can contain plasticizers (henceforth "other plasticizers") other than trimellitic acid ester plasticizer.
<<トリメリット酸エステル可塑剤>>
トリメリット酸エステル可塑剤としては、トリメリット酸と一価アルコールとのエステル化合物が挙げられる。ここで、トリメリット酸とエステル化合物を形成しうる一価アルコールの具体例としては、1−ヘキサノール、1−ヘプタノール、1−オクタノール、2−エチルヘキサノール、1−ノナノール、1−デカノール、1−ウンデカノール、1−ドデカノール等が挙げられる。<< Trimellitic acid ester plasticizer >>
Examples of trimellitic acid ester plasticizers include ester compounds of trimellitic acid and monohydric alcohols. Here, specific examples of the monohydric alcohol that can form an ester compound with trimellitic acid include 1-hexanol, 1-heptanol, 1-octanol, 2-ethylhexanol, 1-nonanol, 1-decanol, and 1-undecanol. 1-dodecanol and the like.
そして、トリメリット酸エステル可塑剤としては、上述した一価アルコールによりトリメリット酸のカルボン酸を実質的に全てエステル化したトリエステル化合物が好ましい。トリエステル化合物を調製するに際し、一価アルコールは1種を単独で使用してもよいし、複数種を組み合わせて使用してもよい。すなわち、トリエステル化合物中のアルコール残基部分は、単一の一価アルコール由来であってもよく、それぞれ異なる一価アルコール由来であってもよい。 And as a trimellitic acid ester plasticizer, the triester compound which esterified substantially all the carboxylic acid of trimellitic acid with the monohydric alcohol mentioned above is preferable. In preparing the triester compound, one kind of monohydric alcohol may be used alone, or a plurality of kinds may be used in combination. That is, the alcohol residue part in the triester compound may be derived from a single monohydric alcohol or may be derived from different monohydric alcohols.
好ましいトリメリット酸エステル可塑剤の具体例としては、トリメリット酸トリ−n−ヘキシル、トリメリット酸トリ−n−ヘプチル、トリメリット酸トリ−n−オクチル、トリメリット酸トリ−(2−エチルヘキシル)、トリメリット酸トリ−n−ノニル、トリメリット酸トリ−n−デシル、トリメリット酸トリイソデシル、トリメリット酸トリ−n−ウンデシル、トリメリット酸トリ−n−ドデシル、トリメリット酸トリ−n−アルキルエステル(炭素数が異なるアルキル基〔但し、炭素数は6〜12である。〕を分子内に2種以上有するエステル)、トリメリット酸トリアルキルエステル(炭素数が異なるアルキル基〔但し、炭素数は8〜10である。〕を分子内に2種以上有するエステル)、トリメリット酸トリ−n−アルキルエステル(炭素数が異なるアルキル基〔但し、炭素数は8〜10である。〕を分子内に2種以上有するエステル)、及びこれらの混合物等が挙げられる。
これらの中でも、トリメリット酸トリ−n−オクチル、トリメリット酸トリ−(2−エチルヘキシル)、トリメリット酸トリ−n−ノニル、トリメリット酸トリ−n−デシル、トリメリット酸トリ−n−アルキルエステル(炭素数が異なるアルキル基〔但し、炭素数は8〜10である。〕を分子内に2種以上有するエステル)、及びこれらの混合物がより好ましい。Specific examples of preferred trimellitic acid ester plasticizers include trimellitic acid tri-n-hexyl, trimellitic acid tri-n-heptyl, trimellitic acid tri-n-octyl, trimellitic acid tri- (2-ethylhexyl) , Trimellitic acid tri-n-nonyl, trimellitic acid tri-n-decyl, trimellitic acid triisodecyl, trimellitic acid tri-n-undecyl, trimellitic acid tri-n-dodecyl, trimellitic acid tri-n-alkyl Esters (esters having two or more alkyl groups having different carbon numbers [provided that the number of carbon atoms is 6 to 12]), trimellitic acid trialkyl esters (alkyl groups having different carbon numbers [however, carbon number Is an ester having 2 or more types in the molecule), trimellitic acid tri-n-alkyl ester Le (alkyl group carbon atoms are different [The number of carbon atoms is 8-10.] Ester having two or more in a molecule), and mixtures thereof.
Among these, trimellitic acid tri-n-octyl, trimellitic acid tri- (2-ethylhexyl), trimellitic acid tri-n-nonyl, trimellitic acid tri-n-decyl, trimellitic acid tri-n-alkyl Ester (an ester having two or more kinds of alkyl groups having different carbon numbers [wherein the carbon number is 8 to 10] in the molecule) and a mixture thereof are more preferable.
トリメリット酸エステル可塑剤は、単一化合物からなるものであっても、混合物であってもよい。 The trimellitic acid ester plasticizer may be a single compound or a mixture.
<<その他の可塑剤>>
その他の可塑剤の具体例としては、例えば、以下の一次可塑剤及び二次可塑剤などが挙げられる。<< Other plasticizers >>
Specific examples of other plasticizers include the following primary plasticizers and secondary plasticizers.
いわゆる一次可塑剤としては、
ピロメリット酸テトラ−n−ヘキシル、ピロメリット酸テトラ−n−ヘプチル、ピロメリット酸テトラ−n−オクチル、ピロメリット酸テトラ−(2−エチルヘキシル)、ピロメリット酸テトラ−n−ノニル、ピロメリット酸テトラ−n−デシル、ピロメリット酸テトライソデシル、ピロメリット酸テトラ−n−ウンデシル、ピロメリット酸テトラ−n−ドデシル、ピロメリット酸テトラ−n−アルキルエステル(炭素数が異なるアルキル基〔但し、炭素数は6〜12である。〕を分子内に2種以上有するエステル)のピロメリット酸エステル可塑剤;
ジメチルフタレート、ジエチルフタレート、ジブチルフタレート、ジ−(2−エチルヘキシル)フタレート、ジ−n−オクチルフタレート、ジイソブチルフタレート、ジヘプチルフタレート、ジフェニルフタレート、ジイソデシルフタレート、ジトリデシルフタレート、ジウンデシルフタレート、ジベンジルフタレート、ブチルベンジルフタレート、ジノニルフタレート、ジシクロヘキシルフタレート等のフタル酸誘導体;
ジメチルイソフタレート、ジ−(2−エチルヘキシル)イソフタレート、ジイソオクチルイソフタレート等のイソフタル酸誘導体;
ジ−(2−エチルヘキシル)テトラヒドロフタレート、ジ−n−オクチルテトラヒドロフタレート、ジイソデシルテトラヒドロフタレート等のテトラヒドロフタル酸誘導体;
ジ−n−ブチルアジペート、ジ(2−エチルヘキシル)アジペート、ジイソデシルアジペート、ジイソノニルアジペート等のアジピン酸誘導体;
ジ−(2−エチルヘキシル)アゼレート、ジイソオクチルアゼレート、ジ−n−ヘキシルアゼレート等のアゼライン酸誘導体;
ジ−n−ブチルセバケート、ジ−(2−エチルヘキシル)セバケート、ジイソデシルセバケート、ジ−(2−ブチルオクチル)セバケート等のセバシン酸誘導体;
ジ−n−ブチルマレエート、ジメチルマレエート、ジエチルマレエート、ジ−(2−エチルヘキシル)マレエート等のマレイン酸誘導体;
ジ−n−ブチルフマレート、ジ−(2−エチルヘキシル)フマレート等のフマル酸誘導体;
トリエチルシトレート、トリ−n−ブチルシトレート、アセチルトリエチルシトレート、アセチルトリ−(2−エチルヘキシル)シトレート等のクエン酸誘導体;
モノメチルイタコネート、モノブチルイタコネート、ジメチルイタコネート、ジエチルイタコネート、ジブチルイタコネート、ジ−(2−エチルヘキシル)イタコネート等のイタコン酸誘導体;
ブチルオレエート、グリセリルモノオレエート、ジエチレングリコールモノオレエート等のオレイン酸誘導体;
メチルアセチルリシノレート、ブチルアセチルリシノレート、グリセリルモノリシノレート、ジエチレングリコールモノリシノレート等のリシノール酸誘導体;
n−ブチルステアレート、ジエチレングリコールジステアレート等のステアリン酸誘導体;
ジエチレングリコールモノラウレート、ジエチレングリコールジペラルゴネート、ペンタエリスリトール脂肪酸エステル等のその他の脂肪酸誘導体;
トリエチルホスフェート、トリブチルホスフェート、トリ−(2−エチルヘキシル)ホスフェート、トリブトキシエチルホスフェート、トリフェニルホスフェート、クレジルジフェニルホスフェート、トリクレジルホスフェート、トリキシレニルホスフェート、トリス(クロロエチル)ホスフェート等のリン酸誘導体;
ジエチレングリコールジベンゾエート、ジプロピレングリコールジベンゾエート、トリエチレングリコールジベンゾエート、トリエチレングリコールジ−(2−エチルブチレート)、トリエチレングリコールジ−(2−エチルヘキソエート)、ジブチルメチレンビスチオグリコレート等のグリコール誘導体;
グリセロールモノアセテート、グリセロールトリアセテート、グリセロールトリブチレート等のグリセリン誘導体;
エポキシヘキサヒドロフタル酸ジイソデシル、エポキシトリグリセライド、エポキシ化オレイン酸オクチル、エポキシ化オレイン酸デシル等のエポキシ誘導体;
アジピン酸系ポリエステル、セバシン酸系ポリエステル、フタル酸系ポリエステル等のポリエステル系可塑剤;
等が挙げられる。上述した一次可塑剤は、1種又は2種以上を使用してもよい。As so-called primary plasticizers,
Pyromellitic acid tetra-n-hexyl, pyromellitic acid tetra-n-heptyl, pyromellitic acid tetra-n-octyl, pyromellitic acid tetra- (2-ethylhexyl), pyromellitic acid tetra-n-nonyl, pyromellitic acid Tetra-n-decyl, pyromellitic acid tetraisodecyl, pyromellitic acid tetra-n-undecyl, pyromellitic acid tetra-n-dodecyl, pyromellitic acid tetra-n-alkyl ester (an alkyl group having a different carbon number [however, An ester having two or more carbon atoms in the molecule), a pyromellitic acid ester plasticizer;
Dimethyl phthalate, diethyl phthalate, dibutyl phthalate, di- (2-ethylhexyl) phthalate, di-n-octyl phthalate, diisobutyl phthalate, diheptyl phthalate, diphenyl phthalate, diisodecyl phthalate, ditridecyl phthalate, diundecyl phthalate, dibenzyl phthalate, Phthalic acid derivatives such as butylbenzyl phthalate, dinonyl phthalate, dicyclohexyl phthalate;
Isophthalic acid derivatives such as dimethyl isophthalate, di- (2-ethylhexyl) isophthalate, diisooctyl isophthalate;
Tetrahydrophthalic acid derivatives such as di- (2-ethylhexyl) tetrahydrophthalate, di-n-octyltetrahydrophthalate, diisodecyltetrahydrophthalate;
Adipic acid derivatives such as di-n-butyl adipate, di (2-ethylhexyl) adipate, diisodecyl adipate, diisononyl adipate;
Azelaic acid derivatives such as di- (2-ethylhexyl) azelate, diisooctylazelate, di-n-hexylazelate;
Sebacic acid derivatives such as di-n-butyl sebacate, di- (2-ethylhexyl) sebacate, diisodecyl sebacate, di- (2-butyloctyl) sebacate;
Maleic acid derivatives such as di-n-butyl maleate, dimethyl maleate, diethyl maleate, di- (2-ethylhexyl) maleate;
Fumaric acid derivatives such as di-n-butyl fumarate and di- (2-ethylhexyl) fumarate;
Citric acid derivatives such as triethyl citrate, tri-n-butyl citrate, acetyl triethyl citrate, acetyl tri- (2-ethylhexyl) citrate;
Itaconic acid derivatives such as monomethyl itaconate, monobutyl itaconate, dimethyl itaconate, diethyl itaconate, dibutyl itaconate, di- (2-ethylhexyl) itaconate;
Oleic acid derivatives such as butyl oleate, glyceryl monooleate, diethylene glycol monooleate;
Ricinoleic acid derivatives such as methylacetylricinoleate, butylacetylricinoleate, glycerylmonoricinoleate, diethylene glycol monoricinoleate;
stearic acid derivatives such as n-butyl stearate and diethylene glycol distearate;
Other fatty acid derivatives such as diethylene glycol monolaurate, diethylene glycol dipelargonate, pentaerythritol fatty acid ester;
Phosphoric acid derivatives such as triethyl phosphate, tributyl phosphate, tri- (2-ethylhexyl) phosphate, tributoxyethyl phosphate, triphenyl phosphate, cresyl diphenyl phosphate, tricresyl phosphate, trixylenyl phosphate, tris (chloroethyl) phosphate;
Diethylene glycol dibenzoate, dipropylene glycol dibenzoate, triethylene glycol dibenzoate, triethylene glycol di- (2-ethylbutyrate), triethylene glycol di- (2-ethylhexoate), dibutylmethylene bisthioglycolate, etc. A glycol derivative of
Glycerol derivatives such as glycerol monoacetate, glycerol triacetate, glycerol tributyrate;
Epoxy derivatives such as epoxyhexahydrophthalate diisodecyl, epoxy triglyceride, epoxidized octyl oleate, epoxidized decyl oleate;
Polyester plasticizers such as adipic acid polyester, sebacic acid polyester, phthalic acid polyester;
Etc. The primary plasticizer mentioned above may use 1 type (s) or 2 or more types.
また、二次可塑剤としては、エポキシ化大豆油、エポキシ化亜麻仁油等のエポキシ化植物油;塩素化パラフィン、トリエチレングリコールジカプリレート等のグリコールの脂肪酸エステル;ブチルエポキシステアレート;フェニルオレエート;ジヒドロアビエチン酸メチル;等が挙げられる。二次可塑剤としては、1種又は2種以上を使用してもよい。中でも、二次可塑剤としては、エポキシ化植物油が好ましく、エポキシ化大豆油がより好ましい。なお、二次可塑剤を用いる場合、それと等質量以上のトリメリット酸エステルおよび/または一次可塑剤を併用することが好ましい。 Secondary plasticizers include epoxidized vegetable oils such as epoxidized soybean oil and epoxidized linseed oil; fatty acid esters of glycols such as chlorinated paraffin and triethylene glycol dicaprylate; butyl epoxy stearate; phenyl oleate; And methyl dihydroabietic acid. You may use 1 type (s) or 2 or more types as a secondary plasticizer. Especially, as a secondary plasticizer, an epoxidized vegetable oil is preferable and an epoxidized soybean oil is more preferable. In addition, when using a secondary plasticizer, it is preferable to use trimellitic acid ester and / or a primary plasticizer of equal mass or more together.
上記(d)可塑剤の、(a)塩化ビニル樹脂粒子と(b)塩化ビニル樹脂微粒子との合計100質量部に対する含有量は、5質量部以上が好ましく、30質量部以上がより好ましく、50質量部以上が更に好ましく、200質量部以下が好ましく、180質量部以下がより好ましく、150質量部以下が更に好ましい。上記可塑剤の含有量が上記範囲内であると、粉体成形用塩化ビニル樹脂組成物を粉体成形してなる塩化ビニル樹脂成形体に、良好な低温での柔軟性を付与でき、かつ、上記(d)可塑剤が(a)塩化ビニル樹脂粒子に良く吸収され、粉体成形用塩化ビニル樹脂組成物の粉体成形性が良好となる。 The content of the plasticizer (d) with respect to a total of 100 parts by mass of (a) vinyl chloride resin particles and (b) vinyl chloride resin fine particles is preferably 5 parts by mass or more, more preferably 30 parts by mass or more, and 50 More preferably, not less than 200 parts by mass, more preferably not more than 180 parts by mass, and still more preferably not more than 150 parts by mass. When the content of the plasticizer is within the above range, a vinyl chloride resin molded product obtained by powder molding a vinyl chloride resin composition for powder molding can be given good low temperature flexibility, and The (d) plasticizer is well absorbed in the (a) vinyl chloride resin particles, and the powder moldability of the vinyl chloride resin composition for powder molding is improved.
<添加剤>
粉体成形用塩化ビニル樹脂組成物が、(a)塩化ビニル樹脂粒子、(b)塩化ビニル樹脂微粒子、(c)エポキシ樹脂、及び(d)可塑剤に加えて更に含み得る添加剤としては、特に制限されることなく、例えば、過塩素酸処理ハイドロタルサイト、ゼオライト、脂肪酸金属塩、(b)塩化ビニル樹脂微粒子以外のダスティング剤、その他の添加剤を更に含むことができる。<Additives>
As an additive that the vinyl chloride resin composition for powder molding may further contain in addition to (a) vinyl chloride resin particles, (b) vinyl chloride resin fine particles, (c) an epoxy resin, and (d) a plasticizer, Without being particularly limited, for example, perchloric acid-treated hydrotalcite, zeolite, fatty acid metal salt, (b) a dusting agent other than vinyl chloride resin fine particles, and other additives can be further included.
<<過塩素酸処理ハイドロタルサイト>>
本発明の粉体成形用塩化ビニル樹脂組成物は、過塩素酸処理ハイドロタルサイトを含有していてもよい。過塩素酸処理ハイドロタルサイトは、例えば、ハイドロタルサイトを過塩素酸の希薄水溶液中に加えて撹拌し、その後必要に応じて、ろ過、脱水または乾燥することによって、ハイドロタルサイト中の炭酸アニオン(CO3 2-)の少なくとも一部を過塩素酸アニオン(ClO4 -)で置換(炭酸アニオン1モルにつき過塩素酸アニオン2モルが置換する)して、容易に製造することができる。上記ハイドロタルサイトと上記過塩素酸とのモル比は任意に設定できるが、一般には、ハイドロタルサイト1モルに対し、過塩素酸0.1モル以上2モル以下とする。<< Perchloric acid-treated hydrotalcite >>
The vinyl chloride resin composition for powder molding of the present invention may contain perchloric acid-treated hydrotalcite. Perchloric acid-treated hydrotalcite, for example, by adding hydrotalcite to a dilute aqueous solution of perchloric acid, stirring, and then filtering, dehydrating or drying as necessary, thereby allowing carbonate anions in hydrotalcite It can be easily produced by substituting at least a part of (CO 3 2− ) with a perchlorate anion (ClO 4 − ) (2 mol of perchlorate anion is substituted for 1 mol of carbonate anion). Although the molar ratio of the hydrotalcite to the perchloric acid can be arbitrarily set, it is generally 0.1 mol or more and 2 mol or less of perchloric acid with respect to 1 mol of hydrotalcite.
未処理(未置換)のハイドロタルサイト中の炭酸アニオンの過塩素酸アニオンへの置換率は、好ましくは50モル%以上、より好ましくは70モル%以上、更に好ましくは85モル%以上である。また、未処理(未置換)のハイドロタルサイト中の炭酸アニオンの過塩素酸アニオンへの置換率は、好ましくは95モル%以下である。未処理(未置換)のハイドロタルサイト中の炭酸アニオンの過塩素酸アニオンへの置換率が上記の範囲内にあることにより、粉体成形用塩化ビニル樹脂組成物を粉体成形してなる塩化ビニル樹脂成形体に、良好な低温での柔軟性を付与できる。 The substitution rate of the carbonate anion to the perchlorate anion in the untreated (unsubstituted) hydrotalcite is preferably 50 mol% or more, more preferably 70 mol% or more, still more preferably 85 mol% or more. Further, the substitution rate of the carbonate anion to the perchlorate anion in the untreated (unsubstituted) hydrotalcite is preferably 95 mol% or less. Chloride formed by powder molding a vinyl chloride resin composition for powder molding because the substitution rate of carbonate anions in untreated (unsubstituted) hydrotalcite to perchlorate anions is within the above range. Good flexibility at low temperature can be imparted to the vinyl resin molded article.
ハイドロタルサイトは、一般式:[Mg1-xAlx(OH)2]x+ [(CO3)x/2・mH2O]x-で表される不定比化合物で、プラスに荷電した基本層 [Mg1-xAlx(OH)2]x+と、マイナスに荷電した中間層 [(CO3)x/2・mH2O]x-とからなる層状の結晶構造を有する無機物質である。ここで、上記一般式中、xは0より大きく0.33以下の範囲の数である。天然のハイドロタルサイトは、Mg6Al2(OH)16CO3・4H2Oである。合成されたハイドロタルサイトとしては、Mg4.5Al2(OH)13CO3・3.5H2Oが市販されている。合成ハイドロタルサイトの合成方法は、例えば、特公昭61−174270号公報に記載されている。Hydrotalcite is a non - stoichiometric compound represented by the general formula: [Mg 1-x Al x (OH) 2 ] x + [(CO 3 ) x / 2 · mH 2 O] x- It is an inorganic substance having a layered crystal structure composed of a layer [Mg 1-x Al x (OH) 2 ] x + and a negatively charged intermediate layer [(CO 3 ) x / 2 · mH 2 O] x- . Here, in the above general formula, x is a number in the range of greater than 0 and less than or equal to 0.33. Natural hydrotalcite is Mg 6 Al 2 (OH) 16 CO 3 .4H 2 O. Mg 4.5 Al 2 (OH) 13 CO 3 .3.5H 2 O is commercially available as the synthesized hydrotalcite. A method for synthesizing a synthetic hydrotalcite is described in, for example, Japanese Patent Publication No. 61-174270.
過塩素酸処理ハイドロタルサイトの、(a)塩化ビニル樹脂粒子と(b)塩化ビニル樹脂微粒子との合計100質量部に対する含有量は、0.5質量部以上が好ましく、1質量部以上がより好ましく、1.5質量部以上が更に好ましく、7質量部以下が好ましく、6質量部以下がより好ましく、5.5質量部以下が更に好ましい。過塩素酸処理ハイドロタルサイトの含有量が上記範囲内であると、粉体成形用塩化ビニル樹脂組成物を粉体成形してなる塩化ビニル樹脂成形体に、良好な低温での柔軟性を付与できる。 The content of perchloric acid-treated hydrotalcite with respect to a total of 100 parts by mass of (a) vinyl chloride resin particles and (b) vinyl chloride resin fine particles is preferably 0.5 parts by mass or more, more preferably 1 part by mass or more. Preferably, 1.5 parts by mass or more is more preferable, 7 parts by mass or less is preferable, 6 parts by mass or less is more preferable, and 5.5 parts by mass or less is still more preferable. When the content of the perchloric acid-treated hydrotalcite is within the above range, good flexibility at low temperatures is imparted to a vinyl chloride resin molded product obtained by powder molding a vinyl chloride resin composition for powder molding. it can.
<<ゼオライト>>
本発明の粉体成形用塩化ビニル樹脂組成物は、ゼオライトを安定剤として含有し得る。ゼオライトは、一般式:Mx/n・[(AlO2)x・(SiO2)y]・zH2O(上記一般式中、Mは原子価nの金属イオン、x+yは単位格子当たりの四面体数、zは水のモル数である)で表されるものであって、当該一般式中のMの種類としてはNa、Li、Ca、Mg、Znなどの一価又は二価の金属及びこれらの混合型が挙げられる。<< Zeolite >>
The vinyl chloride resin composition for powder molding of the present invention can contain zeolite as a stabilizer. Zeolite is represented by the general formula: M x / n · [(AlO 2 ) x · (SiO 2 ) y ] · zH 2 O (in the above general formula, M is a metal ion of valence n, x + y is four sides per unit cell) Body number, z is the number of moles of water), and the type of M in the general formula is a monovalent or divalent metal such as Na, Li, Ca, Mg, Zn, and the like. These mixed types are mentioned.
ゼオライトの含有量は特定の範囲に限定されない。ゼオライトの含有量は、(a)塩化ビニル樹脂粒子と(b)塩化ビニル樹脂微粒子との合計100質量部に対して、0.1質量部以上が好ましく、5質量部以下が好ましい。ゼオライトの含有量が上記範囲内であると、粉体成形用塩化ビニル樹脂組成物を粉体成形してなる塩化ビニル樹脂成形体に、良好な低温での柔軟性を付与できる。 The content of zeolite is not limited to a specific range. The content of zeolite is preferably 0.1 parts by mass or more and preferably 5 parts by mass or less with respect to 100 parts by mass in total of (a) vinyl chloride resin particles and (b) vinyl chloride resin fine particles. When the zeolite content is within the above range, good flexibility at low temperature can be imparted to a vinyl chloride resin molded article obtained by powder molding a vinyl chloride resin composition for powder molding.
<<脂肪酸金属塩>>
本発明の粉体成形用塩化ビニル樹脂組成物は、脂肪酸金属塩を含有していてもよい。好ましい脂肪酸金属塩は、一価脂肪酸金属塩であり、より好ましい脂肪酸金属塩は、炭素数12以上24以下の一価脂肪酸金属塩であり、更に好ましい脂肪酸金属塩は、炭素数15以上21以下の一価脂肪酸金属塩である。脂肪酸金属塩の具体例は、ステアリン酸リチウム、ステアリン酸マグネシウム、ステアリン酸アルミニウム、ステアリン酸カルシウム、ステアリン酸ストロンチウム、ステアリン酸バリウム、ステアリン酸亜鉛、ラウリン酸カルシウム、ラウリン酸バリウム、ラウリン酸亜鉛、2−エチルヘキサン酸バリウム、2−エチルヘキサン酸亜鉛、リシノール酸バリウム、リシノール酸亜鉛等である。脂肪酸金属塩を構成する金属としては、多価陽イオンを生成しうる金属が好ましく、2価陽イオンを生成しうる金属がより好ましく、周期表第3周期〜第6周期の、2価陽イオンを生成しうる金属が更に好ましく、周期表第4周期の、2価陽イオンを生成しうる金属が特に好ましい。最も好ましい脂肪酸金属塩はステアリン酸亜鉛である。<< Fatty acid metal salt >>
The vinyl chloride resin composition for powder molding of the present invention may contain a fatty acid metal salt. Preferred fatty acid metal salts are monovalent fatty acid metal salts, more preferred fatty acid metal salts are monovalent fatty acid metal salts having 12 to 24 carbon atoms, and more preferred fatty acid metal salts having 15 to 21 carbon atoms. It is a monovalent fatty acid metal salt. Specific examples of the fatty acid metal salt include lithium stearate, magnesium stearate, aluminum stearate, calcium stearate, strontium stearate, barium stearate, zinc stearate, calcium laurate, barium laurate, zinc laurate, 2-ethylhexane Barium acid, zinc 2-ethylhexanoate, barium ricinoleate, zinc ricinoleate and the like. The metal constituting the fatty acid metal salt is preferably a metal capable of generating a polyvalent cation, more preferably a metal capable of generating a divalent cation, and a divalent cation of the third to sixth periods of the periodic table. Is more preferable, and a metal capable of generating a divalent cation in the fourth period of the periodic table is particularly preferable. The most preferred fatty acid metal salt is zinc stearate.
脂肪酸金属塩の(a)塩化ビニル樹脂粒子と(b)塩化ビニル樹脂微粒子との合計100質量部に対する含有量は、0.05質量部以上が好ましく、0.1質量部以上がより好ましく、5質量部以下が好ましく、1質量部以下がより好ましく、0.5質量部以下が更に好ましい。脂肪酸金属塩の含有量が上記範囲内であると、粉体成形用塩化ビニル樹脂組成物を粉体成形してなる塩化ビニル樹脂成形体に、良好な低温での柔軟性を付与でき、更に耐熱試験後の変色を小さくできる。 The content of fatty acid metal salt with respect to 100 parts by mass in total of (a) vinyl chloride resin particles and (b) vinyl chloride resin fine particles is preferably 0.05 parts by mass or more, more preferably 0.1 parts by mass or more. It is preferably no greater than 1 part by mass, more preferably no greater than 1 part by mass and even more preferably no greater than 0.5 parts by mass. When the content of the fatty acid metal salt is within the above range, the vinyl chloride resin molded product obtained by powder molding the vinyl chloride resin composition for powder molding can be imparted with good flexibility at a low temperature and further heat resistant. Discoloration after the test can be reduced.
<<その他のダスティング剤>>
本発明の粉体成形用塩化ビニル樹脂組成物は、(b)塩化ビニル樹脂微粒子以外のダスティング剤(以下、「その他のダスティング剤」ということがある。)を含有し得る。その他のダスティング剤の具体例としては、炭酸カルシウム、タルク、酸化アルミニウムなどの無機微粒子;ポリアクリロニトリル樹脂微粒子、ポリ(メタ)アクリレート樹脂微粒子、ポリスチレン樹脂微粒子、ポリエチレン樹脂微粒子、ポリプロピレン樹脂微粒子、ポリエステル樹脂微粒子、ポリアミド樹脂微粒子などの有機微粒子;等が挙げられる。中でも、平均粒子径が10nm以上100nm以下の無機微粒子が好ましい。<< Other dusting agents >>
The vinyl chloride resin composition for powder molding of the present invention may contain (b) a dusting agent other than the vinyl chloride resin fine particles (hereinafter sometimes referred to as “other dusting agents”). Specific examples of other dusting agents include inorganic fine particles such as calcium carbonate, talc, and aluminum oxide; polyacrylonitrile resin fine particles, poly (meth) acrylate resin fine particles, polystyrene resin fine particles, polyethylene resin fine particles, polypropylene resin fine particles, polyester resin Organic fine particles such as fine particles and polyamide resin fine particles; Among these, inorganic fine particles having an average particle size of 10 nm to 100 nm are preferable.
その他のダスティング剤の含有量は特定の範囲に限定されない。その他のダスティング剤の含有量は、(a)塩化ビニル樹脂粒子と(b)塩化ビニル樹脂微粒子との合計100質量部に対して、好ましくは20質量部以下であり、より好ましくは10質量部以下である。 The content of other dusting agents is not limited to a specific range. The content of the other dusting agent is preferably 20 parts by mass or less, more preferably 10 parts by mass with respect to a total of 100 parts by mass of (a) vinyl chloride resin particles and (b) vinyl chloride resin fine particles. It is as follows.
<<その他の添加剤>>
本発明の粉体成形用塩化ビニル樹脂組成物は、着色剤、耐衝撃性改良剤、過塩素酸処理ハイドロタルサイト以外の過塩素酸化合物(過塩素酸ナトリウム、過塩素酸カリウム等)、酸化防止剤、防カビ剤、難燃剤、帯電防止剤、充填剤、光安定剤、発泡剤、β−ジケトン等の、その他の添加剤を更に含有し得る。<< Other additives >>
The vinyl chloride resin composition for powder molding of the present invention comprises a colorant, an impact modifier, a perchloric acid compound other than perchloric acid-treated hydrotalcite (sodium perchlorate, potassium perchlorate, etc.), oxidation Other additives such as an inhibitor, an antifungal agent, a flame retardant, an antistatic agent, a filler, a light stabilizer, a foaming agent, and β-diketone may further be contained.
着色剤の具体例は、キナクリドン系顔料、ペリレン系顔料、ポリアゾ縮合顔料、イソインドリノン系顔料、銅フタロシアニン系顔料、チタンホワイト、カーボンブラックである。1種又は2種以上の顔料が使用される。キナクリドン系顔料は、p−フェニレンジアントラニル酸類が濃硫酸で処理されて得られ、黄みの赤から赤みの紫の色相を示す。キナクリドン系顔料の具体例は、キナクリドンレッド、キナクリドンマゼンタ、キナクリドンバイオレットである。
ペリレン系顔料は、ペリレン−3,4,9,10−テトラカルボン酸無水物と芳香族第一級アミンとの縮合反応により得られ、赤から赤紫、茶色の色相を示す。ペリレン系顔料の具体例は、ペリレンレッド、ペリレンオレンジ、ペリレンマルーン、ペリレンバーミリオン、ペリレンボルドーである。
ポリアゾ縮合顔料は、アゾ色素が溶剤中で縮合されて高分子量化されて得られ、黄、赤系顔料の色相を示す。ポリアゾ縮合顔料の具体例は、ポリアゾレッド、ポリアゾイエロー、クロモフタルオレンジ、クロモフタルレッド、クロモフタルスカーレットである。
イソインドリノン系顔料は、4,5,6,7−テトラクロロイソインドリノンと芳香族第一級ジアミンの縮合反応により得られ、緑みの黄色から、赤、褐色の色相を示す。イソインドリノン系顔料の具体例は、イソインドリノンイエローである。銅フタロシアニン系顔料は、フタロシアニン類に銅を配位した顔料で、黄みの緑から鮮やかな青の色相を示す。
銅フタロシアニン系顔料の具体例は、フタロシアニングリーン、フタロシアニンブルーである。
チタンホワイトは、二酸化チタンからなる白色顔料で、隠蔽力が大きく、アナタース型とルチル型がある。カーボンブラックは、炭素を主成分とし、酸素、水素、窒素を含む黒色顔料である。
カーボンブラックの具体例は、サーマルブラック、アセチレンブラック、チャンネルブラック、ファーネスブラック、ランプブラック、ボーンブラックである。Specific examples of the colorant are quinacridone pigments, perylene pigments, polyazo condensation pigments, isoindolinone pigments, copper phthalocyanine pigments, titanium white, and carbon black. One or more pigments are used. The quinacridone pigment is obtained by treating p-phenylene dianthranilic acid with concentrated sulfuric acid, and exhibits a yellowish red to reddish purple hue. Specific examples of the quinacridone pigment are quinacridone red, quinacridone magenta, and quinacridone violet.
The perylene pigment is obtained by a condensation reaction of perylene-3,4,9,10-tetracarboxylic anhydride and an aromatic primary amine, and exhibits a hue from red to magenta and brown. Specific examples of the perylene pigment are perylene red, perylene orange, perylene maroon, perylene vermilion, and perylene bordeaux.
The polyazo condensation pigment is obtained by condensing an azo dye in a solvent to obtain a high molecular weight, and exhibits a hue of a yellow or red pigment. Specific examples of the polyazo condensation pigment are polyazo red, polyazo yellow, chromophthal orange, chromophthal red, and chromophthal scarlet.
The isoindolinone pigment is obtained by a condensation reaction of 4,5,6,7-tetrachloroisoindolinone and an aromatic primary diamine, and exhibits a hue of greenish yellow to red and brown. A specific example of the isoindolinone pigment is isoindolinone yellow. The copper phthalocyanine pigment is a pigment in which copper is coordinated to phthalocyanines, and exhibits a hue of yellowish green to vivid blue.
Specific examples of the copper phthalocyanine pigment are phthalocyanine green and phthalocyanine blue.
Titanium white is a white pigment made of titanium dioxide and has a large hiding power, and there are anatase type and rutile type. Carbon black is a black pigment containing carbon as a main component and containing oxygen, hydrogen, and nitrogen.
Specific examples of carbon black are thermal black, acetylene black, channel black, furnace black, lamp black, and bone black.
耐衝撃性改良剤の具体例は、アクリロニトリル−ブタジエン−スチレン共重合体、メタクリル酸メチル−ブタジエン−スチレン共重合体、塩素化ポリエチレン、エチレン−酢酸ビニル共重合体、クロロスルホン化ポリエチレン等である。本発明の粉体成形用塩化ビニル樹脂組成物では、1種又は2種以上の耐衝撃性改良剤を使用できる。なお、耐衝撃性改良剤は、粉体成形用塩化ビニル樹脂組成物中で微細な弾性粒子の不均一相となって分散する。本発明の粉体成形用塩化ビニル樹脂組成物では、当該弾性粒子にグラフト重合した鎖及び極性基が(a)塩化ビニル樹脂粒子と相溶し、塩化ビニル樹脂組成物の耐衝撃性が向上する。 Specific examples of the impact modifier include acrylonitrile-butadiene-styrene copolymer, methyl methacrylate-butadiene-styrene copolymer, chlorinated polyethylene, ethylene-vinyl acetate copolymer, chlorosulfonated polyethylene and the like. In the vinyl chloride resin composition for powder molding of the present invention, one or more impact resistance improvers can be used. The impact resistance improver is dispersed as a heterogeneous phase of fine elastic particles in the vinyl chloride resin composition for powder molding. In the vinyl chloride resin composition for powder molding of the present invention, the chain and the polar group graft polymerized to the elastic particles are compatible with the (a) vinyl chloride resin particles, and the impact resistance of the vinyl chloride resin composition is improved. .
酸化防止剤の具体例は、フェノール系酸化防止剤、硫黄系酸化防止剤、リン系酸化防止剤等である。
防カビ剤の具体例は、脂肪族エステル系防カビ剤、炭化水素系防カビ剤、有機窒素系防カビ剤、有機窒素硫黄系防カビ剤等である。Specific examples of the antioxidant include a phenol-based antioxidant, a sulfur-based antioxidant, and a phosphorus-based antioxidant.
Specific examples of the fungicide include aliphatic ester fungicides, hydrocarbon fungicides, organic nitrogen fungicides, organic nitrogen sulfur fungicides and the like.
難燃剤の具体例は、塩素化パラフィン等のハロゲン系難燃剤;リン酸エステル等のリン系難燃剤;水酸化マグネシウム、水酸化アルミニウム等の無機水酸化物;等である。 Specific examples of the flame retardant include halogen-based flame retardants such as chlorinated paraffins; phosphorus-based flame retardants such as phosphate esters; inorganic hydroxides such as magnesium hydroxide and aluminum hydroxide;
帯電防止剤の具体例は、脂肪酸塩類、高級アルコール硫酸エステル類、スルホン酸塩類等のアニオン系帯電防止剤;脂肪族アミン塩類、第四級アンモニウム塩類等のカチオン系帯電防止剤;ポリオキシエチレンアルキルエーテル類、ポリオキシエチレンアルキルフェノールエーテル類等のノニオン系帯電防止剤等である。 Specific examples of the antistatic agent include anionic antistatic agents such as fatty acid salts, higher alcohol sulfates and sulfonates; cationic antistatic agents such as aliphatic amine salts and quaternary ammonium salts; polyoxyethylene alkyl Nonionic antistatic agents such as ethers and polyoxyethylene alkylphenol ethers.
充填剤の具体例は、シリカ、タルク、マイカ、炭酸カルシウム、クレー等である。 Specific examples of the filler are silica, talc, mica, calcium carbonate, clay and the like.
光安定剤の具体例は、ベンゾトリアゾール系、ベンゾフェノン系、ニッケルキレート系等の紫外線吸収剤、ヒンダートアミン系光安定剤等である。 Specific examples of the light stabilizer include benzotriazole-based, benzophenone-based, nickel chelate-based ultraviolet absorbers, hindered amine-based light stabilizers, and the like.
発泡剤の具体例は、アゾジカルボンアミド、アゾビスイソブチロニトリル等のアゾ化合物、N,N′−ジニトロソペンタメチレンテトラミン等のニトロソ化合物、p−トルエンスルホニルヒドラジド、p,p−オキシビス(ベンゼンスルホニルヒドラジド)等のスルホニルヒドラジド化合物等の有機発泡剤;フロンガス、炭酸ガス、水、ペンタン等の揮発性炭化水素化合物;これらを内包したマイクロカプセル等のガス系の発泡剤等である。 Specific examples of the blowing agent include azo compounds such as azodicarbonamide and azobisisobutyronitrile, nitroso compounds such as N, N'-dinitrosopentamethylenetetramine, p-toluenesulfonyl hydrazide, p, p-oxybis (benzene). Organic foaming agents such as sulfonyl hydrazide compounds such as sulfonyl hydrazide; volatile hydrocarbon compounds such as chlorofluorocarbon gas, carbon dioxide gas, water and pentane; gas-based foaming agents such as microcapsules enclosing these.
β−ジケトンは、本発明の粉体成形用塩化ビニル樹脂組成物を粉体成形して得られる塩化ビニル樹脂成形体の初期色調の変動をより効果的に抑えるために用いられ得る。β−ジケトンの具体例は、ジベンゾイルメタン、ステアロイルベンゾイルメタン、パルミトイルベンゾイルメタン等である。これらのβ−ジケトンは1種を用いてもよいし、2種以上を組み合わせて用いてもよい。
なお、β−ジケトンの含有量は特定の範囲に限定されない。β−ジケトンの含有量は、(a)塩化ビニル樹脂粒子と(b)塩化ビニル樹脂微粒子との合計100質量部に対して、0.1質量部以上が好ましく、5質量部以下が好ましい。β-diketone can be used to more effectively suppress fluctuations in the initial color tone of a vinyl chloride resin molded product obtained by powder molding the vinyl chloride resin composition for powder molding of the present invention. Specific examples of β-diketone are dibenzoylmethane, stearoylbenzoylmethane, palmitoylbenzoylmethane, and the like. These β-diketones may be used singly or in combination of two or more.
In addition, content of (beta) -diketone is not limited to a specific range. The content of β-diketone is preferably 0.1 parts by mass or more, and more preferably 5 parts by mass or less with respect to 100 parts by mass in total of (a) vinyl chloride resin particles and (b) vinyl chloride resin fine particles.
<粉体成形用塩化ビニル樹脂組成物の調製>
ここで、(a)塩化ビニル樹脂粒子、(b)塩化ビニル樹脂微粒子、(c)エポキシ樹脂、(d)可塑剤、及び必要に応じて添加される添加剤の混合方法は限定されない。好ましい混合方法は、ダスティング剤((b)塩化ビニル樹脂微粒子と、必要に応じて添加されるその他のダスティング剤とを含む)を除く成分を一旦ドライブレンドにより混合し、その後、未添加のダスティング剤を添加、混合する方法である。ドライブレンドには、ヘンシェルミキサーの使用が好ましい。また、ドライブレンド時の温度は、50℃以上が好ましく、70℃以上がより好ましく、100℃以下が好ましい。<Preparation of vinyl chloride resin composition for powder molding>
Here, the mixing method of (a) vinyl chloride resin particle, (b) vinyl chloride resin fine particle, (c) epoxy resin, (d) plasticizer, and the additive added as needed is not limited. In a preferred mixing method, the components excluding the dusting agent (including (b) vinyl chloride resin fine particles and other dusting agent added if necessary) are once mixed by dry blending, and then not added. This is a method of adding and mixing a dusting agent. The Henschel mixer is preferably used for dry blending. The temperature during dry blending is preferably 50 ° C. or higher, more preferably 70 ° C. or higher, and preferably 100 ° C. or lower.
(塩化ビニル樹脂成形体)
本発明の塩化ビニル樹脂成形体は、本発明の粉体成形用塩化ビニル樹脂組成物を粉体成形、好ましくはパウダースラッシュ成形して得られる。そして、本発明の塩化ビニル樹脂成形体は、自動車内装材、例えば、自動車インスツルメントパネル、ドアトリム等の表皮として好適に用いられる。(Vinyl chloride resin molding)
The vinyl chloride resin molded article of the present invention is obtained by powder molding, preferably powder slush molding, of the vinyl chloride resin composition for powder molding of the present invention. The vinyl chloride resin molded article of the present invention is suitably used as an automobile interior material, for example, a skin of an automobile instrument panel, a door trim or the like.
<塩化ビニル樹脂成形体の製造>
ここで、パウダースラッシュ成形時の金型温度は、好ましくは200℃以上、より好ましくは220℃以上であり、好ましくは300℃以下、より好ましくは280℃以下である。
また、本発明の塩化ビニル樹脂成形体は、例えば、上記温度範囲の金型に粉体成形用塩化ビニル樹脂組成物を振りかけて5秒以上30秒以下の間放置した後、余剰の塩化ビニル樹脂組成物を振り落とし、さらに、任意の温度下、30秒以上3分以下の間放置する。その後、金型を10℃以上60℃以下に冷却し、得られた塩化ビニル樹脂成形体を金型から脱型することにより、好適に得られる。<Manufacture of vinyl chloride resin molding>
Here, the mold temperature at the time of powder slush molding is preferably 200 ° C. or higher, more preferably 220 ° C. or higher, preferably 300 ° C. or lower, more preferably 280 ° C. or lower.
In addition, the vinyl chloride resin molded body of the present invention is obtained by, for example, sprinkling a powder molding vinyl chloride resin composition on a mold in the above temperature range and leaving it for 5 seconds to 30 seconds, and then surplus vinyl chloride resin. The composition is shaken off, and is further allowed to stand for 30 seconds to 3 minutes at an arbitrary temperature. Thereafter, the mold is cooled to 10 ° C. or more and 60 ° C. or less, and the obtained vinyl chloride resin molded article is removed from the mold to be suitably obtained.
(積層体)
本発明の積層体は、上述した塩化ビニル樹脂成形体と発泡ポリウレタン成形体を積層して得ることができる。積層方法は、(1)塩化ビニル樹脂成形体と、発泡ポリウレタン成形体とを別途製造した後に、熱融着、熱接着、又は公知の接着剤などを用いることにより貼り合わせる方法;(2)塩化ビニル樹脂成形体上で、発泡ポリウレタン成形体の原料となるイソシアネート類とポリオール類などとを反応させて重合を行うと共に、公知の方法によりポリウレタンの発泡を行い、塩化ビニル樹脂成形体上に発泡ポリウレタン成形体を直接形成する方法;などが挙げられる。後者の方法(2)の方が、工程が簡素であり、かつ、種々の形状の積層体を得る場合においても、塩化ビニル樹脂成形体と発泡ポリウレタン成形体との接着を確実に行うことができるのでより好適である。(Laminate)
The laminate of the present invention can be obtained by laminating the above-described vinyl chloride resin molded article and foamed polyurethane molded article. The lamination method is as follows: (1) A vinyl chloride resin molded body and a foamed polyurethane molded body are separately manufactured, and then bonded together by using thermal fusion, thermal bonding, or a known adhesive; (2) Chlorination Polymerization is performed by reacting isocyanates, which are raw materials of the foamed polyurethane molded body, and polyols on the vinyl resin molded body, and polyurethane is foamed by a known method, and the polyurethane foam is formed on the vinyl chloride resin molded body. And a method of directly forming a molded body. In the latter method (2), the process is simple, and even when a laminated body having various shapes is obtained, the vinyl chloride resin molded body and the foamed polyurethane molded body can be reliably bonded. Therefore, it is more preferable.
以下、実施例により本発明が詳細に説明されるが、本発明はこれらの実施例に限定されない。なお、各種物性の測定方法は次の通りである。 EXAMPLES Hereinafter, although an Example demonstrates this invention in detail, this invention is not limited to these Examples. In addition, the measuring method of various physical properties is as follows.
<塩化ビニル樹脂の平均重合度>
(a)塩化ビニル樹脂粒子及び(b)塩化ビニル樹脂微粒子を構成する塩化ビニル樹脂の平均重合度は、JIS K6720−2に準拠して、(a)塩化ビニル樹脂粒子及び(b)塩化ビニル樹脂微粒子のそれぞれを、シクロヘキサノンに溶解させて粘度を測定することにより、算出した。<Average polymerization degree of vinyl chloride resin>
The average degree of polymerization of (a) vinyl chloride resin particles and (b) vinyl chloride resin constituting the vinyl chloride resin fine particles is in accordance with JIS K6720-2. (A) Vinyl chloride resin particles and (b) vinyl chloride resin Each fine particle was calculated by dissolving in cyclohexanone and measuring the viscosity.
<塩化ビニル樹脂粒子及び塩化ビニル樹脂微粒子の平均粒子径>
(a)塩化ビニル樹脂粒子及び(b)塩化ビニル樹脂微粒子の平均粒子径は、体積平均粒子径として、塩化ビニル樹脂粒子及び塩化ビニル樹脂微粒子それぞれを水槽内に分散させ、以下に示す装置を用いて、光の回折・散乱強度分布を測定・解析し、粒子径及び体積基準の粒子径分布を測定することにより、算出した。
装置:レーザー回折式粒度分布測定機(島津製作所製、型番「SALD−2300」)
測定方式:レーザー回折及び散乱
測定範囲:0.017μm〜2500μm
光源:半導体レーザー(波長680nm、出力3mW)<Average particle diameter of vinyl chloride resin particles and vinyl chloride resin fine particles>
The average particle size of (a) vinyl chloride resin particles and (b) vinyl chloride resin fine particles is a volume average particle size, and each of the vinyl chloride resin particles and the vinyl chloride resin fine particles is dispersed in a water tank, and the following apparatus is used. Then, the diffraction / scattering intensity distribution of light was measured and analyzed, and the particle diameter distribution based on the particle diameter and volume was measured.
Apparatus: Laser diffraction particle size distribution analyzer (manufactured by Shimadzu Corporation, model number “SALD-2300”)
Measurement method: Laser diffraction and scattering Measurement range: 0.017 μm to 2500 μm
Light source: Semiconductor laser (wavelength 680 nm, output 3 mW)
<低温引張試験(初期)>
得られた塩化ビニル樹脂成形体としての塩化ビニル樹脂成形シートを試料とし、当該試料をJIS K 6251に記載の1号ダンベルで打ち抜いた。そして、JIS K 7113に準拠して、引張速度200mm/分で、−35℃の低温下における、引張応力(MPa)及び引張伸び(%)を測定した。−35℃の低温下での引張伸びが大きいほど、塩化ビニル樹脂成形体が、低温での柔軟性に優れていることを示す。結果を表1に示す。<Low temperature tensile test (initial)>
A vinyl chloride resin molded sheet as the obtained vinyl chloride resin molded body was used as a sample, and the sample was punched with a No. 1 dumbbell described in JIS K 6251. Then, in accordance with JIS K 7113, tensile stress (MPa) and tensile elongation (%) were measured at a tensile rate of 200 mm / min and a low temperature of -35 ° C. A larger tensile elongation at a low temperature of −35 ° C. indicates that the vinyl chloride resin molded article is more excellent in flexibility at a low temperature. The results are shown in Table 1.
<低温引張試験(加熱後)>
得られた、発泡ポリウレタン成形体が裏打ちされた積層体を試料とし、当該試料をオーブンに入れ、温度130℃の環境下で100時間、当該試料を加熱した。その後、発泡ポリウレタン層を当該試料から剥離し、上記低温引張試験(初期)と同様の条件で、−35℃の低温下における、引張応力(MPa)及び引張伸び(%)を測定した。−35℃での引張伸びが大きいほど、塩化ビニル樹脂成形体が、耐熱性(加熱後の低温での柔軟性)に優れていることを示す。結果を表1に示す。<Low temperature tensile test (after heating)>
The obtained laminate with a foamed polyurethane molded article was used as a sample, the sample was put in an oven, and the sample was heated in an environment at a temperature of 130 ° C. for 100 hours. Thereafter, the polyurethane foam layer was peeled from the sample, and the tensile stress (MPa) and the tensile elongation (%) were measured at a low temperature of −35 ° C. under the same conditions as in the low temperature tensile test (initial). It shows that the larger the tensile elongation at −35 ° C., the better the vinyl chloride resin molded body is in heat resistance (flexibility at low temperature after heating). The results are shown in Table 1.
(実施例1〜9及び比較例1)
<塩化ビニル樹脂組成物の調製>
表1に示す配合成分のうち、可塑剤としてのエポキシ化大豆油と、ダスティング剤としての塩化ビニル樹脂微粒子とを除く成分をヘンシェルミキサーに入れて混合した。そして、混合物の温度が80℃に上昇した時点で可塑剤としてのエポキシ化大豆油を添加して混合物を得、当該混合物を更に昇温することにより、ドライアップ(可塑剤が、塩化ビニル樹脂粒子に吸収されて、上記混合物がさらさらになった状態をいう。)させた。その後、ドライアップさせた混合物が90℃以下に冷却された時点で、ダスティング剤としての塩化ビニル樹脂微粒子を添加し、粉体成形用塩化ビニル樹脂組成物を調製した。(Examples 1-9 and Comparative Example 1)
<Preparation of vinyl chloride resin composition>
Among the blending components shown in Table 1, components other than epoxidized soybean oil as a plasticizer and vinyl chloride resin fine particles as a dusting agent were placed in a Henschel mixer and mixed. When the temperature of the mixture rises to 80 ° C., epoxidized soybean oil as a plasticizer is added to obtain a mixture, and the mixture is further heated to dry up (the plasticizer is made of vinyl chloride resin particles). And the mixture was further absorbed.). Thereafter, when the dried-up mixture was cooled to 90 ° C. or lower, vinyl chloride resin fine particles as a dusting agent were added to prepare a vinyl chloride resin composition for powder molding.
<塩化ビニル樹脂成形体の製造>
得られた粉体成形用塩化ビニル樹脂組成物を、温度250℃に加熱したシボ付き金型に振りかけ、塩化ビニル樹脂成形シートの厚みが1mmになるよう、8秒〜20秒程度の任意の時間放置して溶融させた後、余剰の塩化ビニル樹脂組成物を振り落とした。その後、塩化ビニル樹脂組成物を振りかけたシボ付き金型を、温度200℃に設定したオーブン内に静置させ、静置から60秒経過した時点で、シボ付き金型を冷却水により冷却した。金型温度が40℃まで冷却された時点で、塩化ビニル樹脂成形体として、150mm×200mm×1mmの塩化ビニル樹脂成形シートを金型から脱型した。
そして、得られた塩化ビニル樹脂成形シートについて、上述の方法に従って、低温引張試験(初期)を実施した。結果を表1に示す。<Manufacture of vinyl chloride resin molding>
The obtained vinyl chloride resin composition for powder molding is sprinkled on a metal mold with a texture heated to a temperature of 250 ° C., and an arbitrary time of about 8 seconds to 20 seconds so that the thickness of the vinyl chloride resin molded sheet becomes 1 mm. After leaving it to melt, the excess vinyl chloride resin composition was shaken off. Thereafter, the embossed mold sprinkled with the vinyl chloride resin composition was allowed to stand in an oven set at a temperature of 200 ° C., and when 60 seconds had elapsed from the standing, the embossed mold was cooled with cooling water. When the mold temperature was cooled to 40 ° C., a vinyl chloride resin molded sheet of 150 mm × 200 mm × 1 mm was removed from the mold as a vinyl chloride resin molded body.
And the low-temperature tensile test (initial stage) was implemented about the obtained vinyl chloride resin molded sheet according to the above-mentioned method. The results are shown in Table 1.
<積層体の製造>
得られた塩化ビニル樹脂成形シート2枚を、200mm×300mm×10mmの金型中に、シボ付き面を下にして重ならないように敷いた。
別途、プロピレングリコールのプロピレンオキサイド・エチレンオキサイド(PO・EO)ブロック付加物(水酸基価28、末端EO単位の含有量=10%、内部EO単位の含有量4%)50質量部、グリセリンのPO・EOブロック付加物(水酸基価21、末端EO単位の含有量=14%)50質量部、水2.5質量部、トリエチレンジアミンのエチレングリコ−ル溶液(東ソー(株)製、商品名「TEDA−L33」)0.2質量部、トリエタノールアミン1.2質量部、トリエチルアミン0.5質量部及び整泡剤(信越化学工業(株)製、商品名:「F−122」)0.5質量部からなるポリオール混合物を用意した。そして、用意したポリオール混合物と、ポリメチレンポリフェニレンポリイソシアネート(ポリメリックMDI)とを、インデックスが98になる比率で混合して混合液を調製した。そして、調製した混合液を、上述の通り金型中に敷かれた塩化ビニル樹脂成形シート2枚の上にそれぞれ注いだ。その後、金型に348mm×255mm×10mmのアルミニウム板で金型に蓋をすることで金型を密閉した。金型を密閉してから5分後、1mm厚の塩化ビニル樹脂成形シートからなる表皮に、9mm厚、密度0.18g/cm3の発泡ポリウレタン成形体が裏打ちされた積層体を金型から取り出した。
そして、得られた積層体について、上述の方法に従って、低温引張試験(加熱後)を実施した。結果を表1に示す。<Manufacture of laminates>
Two sheets of the obtained vinyl chloride resin molded sheet were laid in a 200 mm × 300 mm × 10 mm mold so as not to overlap with the embossed surface down.
Separately, propylene oxide / propylene oxide / ethylene oxide (PO / EO) block adduct (hydroxyl value 28, content of terminal EO unit = 10%, content of internal EO unit 4%), 50 parts by mass of glycerin PO. EO block adduct (hydroxyl value 21, terminal EO unit content = 14%) 50 parts by mass, water 2.5 parts by mass, ethylene glycol solution of triethylenediamine (manufactured by Tosoh Corporation, trade name “TEDA-” L33 ") 0.2 parts by mass, triethanolamine 1.2 parts by mass, triethylamine 0.5 parts by mass and foam stabilizer (manufactured by Shin-Etsu Chemical Co., Ltd., trade name:" F-122 ") 0.5 parts by mass A polyol mixture consisting of parts was prepared. Then, the prepared polyol mixture and polymethylene polyphenylene polyisocyanate (polymeric MDI) were mixed at a ratio of an index of 98 to prepare a mixed solution. And the prepared liquid mixture was each poured on 2 sheets of vinyl chloride resin molding sheets spread | laid in the metal mold | die as above-mentioned. Thereafter, the mold was sealed by covering the mold with an aluminum plate of 348 mm × 255 mm × 10 mm. Five minutes after sealing the mold, a laminate of 9 mm thick and 0.18 g / cm 3 density foamed polyurethane molded product on the skin made of 1 mm thick vinyl chloride resin molded sheet is taken out from the mold. It was.
And the low-temperature tension test (after heating) was implemented about the obtained laminated body according to the above-mentioned method. The results are shown in Table 1.
1)新第一塩ビ(株)製ZEST 2000Z((a)塩化ビニル樹脂粒子、平均重合度:2000、平均粒子径:130μm)
2)花王(株)製、トリメックスN−08
3)(株)ADEKA製、アデカサイザーO−130S
4)DIC(株)製、EPICLON 850(エポキシ当量:183g/eq以上193g/eq以下)
5)DIC(株)製、EPICLON 830(エポキシ当量:165g/eq以上177g/eq以下)
6)DIC(株)製、EPICLON 1050(エポキシ当量:450g/eq以上500g/eq以下)
7)協和化学工業(株)製、アルカマイザー5
8)水澤化学工業(株)製、MIZUKALIZER DS
9)堺化学工業(株)、SAKAI SZ2000
10)(株)ADEKA製、アデカスタブ 522A
11)(株)ADEKA製、アデカスタブ LS−12
12)新第一塩ビ(株)製、ZEST PQLTX(乳化重合で得られた塩化ビニル樹脂微粒子、平均重合度:800、平均粒子径:2μm)
13)大日精化工業(株)製、DA PX−1720 ブラック(A)1) ZEST 2000Z manufactured by Shin Daiichi Vinyl Co., Ltd. ((a) vinyl chloride resin particles, average degree of polymerization: 2000, average particle size: 130 μm)
2) manufactured by Kao Corporation, Trimex N-08
3) Adeka Sizer O-130S manufactured by ADEKA Corporation
4) EPICLON 850 manufactured by DIC Corporation (epoxy equivalent: 183 g / eq or more and 193 g / eq or less)
5) EPICLON 830 manufactured by DIC Corporation (epoxy equivalent: 165 g / eq or more and 177 g / eq or less)
6) EPICLON 1050 manufactured by DIC Corporation (epoxy equivalent: 450 g / eq or more and 500 g / eq or less)
7) Alkamizer 5 manufactured by Kyowa Chemical Industry Co., Ltd.
8) MIZUKALIZER DS, manufactured by Mizusawa Chemical Co., Ltd.
9) Sakai Chemical Industry Co., Ltd., SAKAI SZ2000
10) ADEKA Corporation, ADK STAB 522A
11) ADEKA Corporation, ADK STAB LS-12
12) ZEST PQLTX (vinyl chloride resin fine particles obtained by emulsion polymerization, average degree of polymerization: 800, average particle size: 2 μm), manufactured by Shin Daiichi Vinyl Co., Ltd.
13) DAPX-1720 Black (A), manufactured by Dainichi Seika Kogyo Co., Ltd.
実施例1〜9の粉体成形用塩化ビニル樹脂組成物をパウダースラッシュ成形して得られた塩化ビニル樹脂成形体は、低温下における初期の引張特性を十分に保持しつつ、加熱後の引張特性に優れていた。
また、(c)エポキシ樹脂を含まない比較例1の粉体成形用塩化ビニル樹脂組成物をパウダースラッシュ成形して得られた塩化ビニル樹脂成形体は、低温下における加熱後の引張応力及び加熱後の引張伸びの値が低く、加熱後の塩化ビニル樹脂成形体は低温での柔軟性に劣っていた。The vinyl chloride resin molded products obtained by powder slush molding of the vinyl chloride resin compositions for powder molding of Examples 1 to 9 have sufficient tensile properties after heating while maintaining sufficient initial tensile properties at low temperatures. It was excellent.
In addition, (c) a vinyl chloride resin molded product obtained by powder slush molding of the vinyl chloride resin composition for powder molding of Comparative Example 1 containing no epoxy resin has a tensile stress after heating at a low temperature and a temperature after heating. The tensile elongation value of was low, and the vinyl chloride resin molded article after heating was inferior in flexibility at low temperatures.
本発明の粉体成形用塩化ビニル樹脂組成物は、自動車内装材、例えば自動車インスツルメントパネル、ドアトリム等の表皮に好適に成形される。 The vinyl chloride resin composition for powder molding of the present invention is suitably molded on the skin of automobile interior materials, such as automobile instrument panels and door trims.
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