JPWO2016043244A1 - Fine patterned fiber - Google Patents
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- JPWO2016043244A1 JPWO2016043244A1 JP2016548925A JP2016548925A JPWO2016043244A1 JP WO2016043244 A1 JPWO2016043244 A1 JP WO2016043244A1 JP 2016548925 A JP2016548925 A JP 2016548925A JP 2016548925 A JP2016548925 A JP 2016548925A JP WO2016043244 A1 JPWO2016043244 A1 JP WO2016043244A1
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- 239000000835 fiber Substances 0.000 title claims abstract description 87
- 239000011342 resin composition Substances 0.000 claims abstract description 19
- 229920005989 resin Polymers 0.000 claims description 37
- 239000011347 resin Substances 0.000 claims description 37
- 238000006116 polymerization reaction Methods 0.000 claims description 12
- 239000003112 inhibitor Substances 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 239000005871 repellent Substances 0.000 claims description 4
- 238000005034 decoration Methods 0.000 claims description 3
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 239000000463 material Substances 0.000 description 18
- 238000000034 method Methods 0.000 description 18
- 239000000178 monomer Substances 0.000 description 11
- 239000000758 substrate Substances 0.000 description 10
- -1 polyethylene terephthalate Polymers 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000010453 quartz Substances 0.000 description 3
- 230000001105 regulatory effect Effects 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000012780 transparent material Substances 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000001878 scanning electron micrograph Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000013518 transcription Methods 0.000 description 2
- 230000035897 transcription Effects 0.000 description 2
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 1
- WJFKNYWRSNBZNX-UHFFFAOYSA-N 10H-phenothiazine Chemical compound C1=CC=C2NC3=CC=CC=C3SC2=C1 WJFKNYWRSNBZNX-UHFFFAOYSA-N 0.000 description 1
- JIGUICYYOYEXFS-UHFFFAOYSA-N 3-tert-butylbenzene-1,2-diol Chemical compound CC(C)(C)C1=CC=CC(O)=C1O JIGUICYYOYEXFS-UHFFFAOYSA-N 0.000 description 1
- UZFMOKQJFYMBGY-UHFFFAOYSA-N 4-hydroxy-TEMPO Chemical group CC1(C)CC(O)CC(C)(C)N1[O] UZFMOKQJFYMBGY-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- 229920001410 Microfiber Polymers 0.000 description 1
- XQVWYOYUZDUNRW-UHFFFAOYSA-N N-Phenyl-1-naphthylamine Chemical compound C=1C=CC2=CC=CC=C2C=1NC1=CC=CC=C1 XQVWYOYUZDUNRW-UHFFFAOYSA-N 0.000 description 1
- 229930192627 Naphthoquinone Natural products 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- QYTDEUPAUMOIOP-UHFFFAOYSA-N TEMPO Chemical group CC1(C)CCCC(C)(C)N1[O] QYTDEUPAUMOIOP-UHFFFAOYSA-N 0.000 description 1
- BGNXCDMCOKJUMV-UHFFFAOYSA-N Tert-Butylhydroquinone Chemical compound CC(C)(C)C1=CC(O)=CC=C1O BGNXCDMCOKJUMV-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000012986 chain transfer agent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000007607 die coating method Methods 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 125000005641 methacryl group Chemical group 0.000 description 1
- KOOMFXGDLMRWSN-UHFFFAOYSA-N n-phenylnitrous amide Chemical compound O=NNC1=CC=CC=C1 KOOMFXGDLMRWSN-UHFFFAOYSA-N 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 150000002791 naphthoquinones Chemical class 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 229950000688 phenothiazine Drugs 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
-
- D—TEXTILES; PAPER
- D01—NATURAL OR MAN-MADE THREADS OR FIBRES; SPINNING
- D01F—CHEMICAL FEATURES IN THE MANUFACTURE OF ARTIFICIAL FILAMENTS, THREADS, FIBRES, BRISTLES OR RIBBONS; APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OF CARBON FILAMENTS
- D01F1/00—General methods for the manufacture of artificial filaments or the like
-
- D—TEXTILES; PAPER
- D02—YARNS; MECHANICAL FINISHING OF YARNS OR ROPES; WARPING OR BEAMING
- D02J—FINISHING OR DRESSING OF FILAMENTS, YARNS, THREADS, CORDS, ROPES OR THE LIKE
- D02J3/00—Modifying the surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Textile Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Engineering (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Laminated Bodies (AREA)
Abstract
高精度且つ効率的に製造可能な微細パターン付き繊維体を提供する。本発明によれば、繊維部と、前記繊維部に設けられた微細パターンとを備える繊維体であって、前記繊維体は、光硬化性樹脂組成物を用いて形成される、微細パターン付き繊維体が提供される。Provided is a finely patterned fiber body that can be produced with high accuracy and efficiency. According to this invention, it is a fiber body provided with a fiber part and the fine pattern provided in the said fiber part, Comprising: The said fiber body is a fiber with a fine pattern formed using a photocurable resin composition The body is provided.
Description
本発明は、微細パターン付き繊維体に関する。 The present invention relates to a finely patterned fibrous body.
特許文献１には、熱インプリント法によって直径９０μｍのナイロン製の丸型ファイバーに対して直径５〜２０μｍ程度の円柱アレイからなる微細パターンを有する繊維体を形成する方法が開示されている。 Patent Document 1 discloses a method of forming a fibrous body having a fine pattern made of a cylindrical array having a diameter of about 5 to 20 μm with respect to a nylon round fiber having a diameter of 90 μm by a thermal imprint method.
特許文献１で形成された繊維体では、２つの繊維体を互いに連結させるための連結構造として微細パターンが利用されており、直径５〜２０μｍ程度の比較的大きな微細パターンが形成されている。 In the fiber body formed in Patent Document 1, a fine pattern is used as a connection structure for connecting two fiber bodies to each other, and a relatively large fine pattern having a diameter of about 5 to 20 μm is formed.
しかし、微細パターン付き繊維体は、超親水性繊維、超撥水性繊維、ホログラム加飾用繊維、偽造防止繊維、又は目視し難い導電性ワイヤーなどの種々の用途への利用が考えられるものであり、特許文献１に開示されているものよりも、より微細なパターンを有する繊維体を高精度且つ効率的に製造する技術が望まれている。 However, the fibrous body with a fine pattern is considered to be used for various applications such as super hydrophilic fibers, super water-repellent fibers, hologram decoration fibers, anti-counterfeit fibers, or conductive wires that are difficult to see. Therefore, a technique for manufacturing a fibrous body having a finer pattern with higher accuracy and efficiency than that disclosed in Patent Document 1 is desired.
本発明はこのような事情に鑑みてなされたものであり、高精度且つ効率的に製造可能な微細パターン付き繊維体を提供するものである。 This invention is made | formed in view of such a situation, and provides the fiber body with a fine pattern which can be manufactured highly accurately and efficiently.
本発明によれば、繊維部と、前記繊維部に設けられた微細パターンとを備える繊維体であって、前記繊維体は、光硬化性樹脂組成物を用いて形成される、微細パターン付き繊維体が提供される。 According to this invention, it is a fiber body provided with a fiber part and the fine pattern provided in the said fiber part, Comprising: The said fiber body is a fiber with a fine pattern formed using a photocurable resin composition The body is provided.
本発明者らは、特許文献１に開示されている繊維体よりも、繊維断面積及び微細パターン形状がはるかに小さい繊維体を高精度且つ効率的に製造する方法について鋭意検討を行ったところ、微細パターン付き繊維体を、光硬化性樹脂組成物で形成することを思い付いた。このような構成によれば、ナノオーダーの超微細な構造を形成することが容易であり、幅１０μｍ以下の極細の繊維にすることも容易であることが分かり、本発明の完成に到った。 The inventors of the present invention have conducted intensive studies on a method for highly accurately and efficiently producing a fiber body having a much smaller fiber cross-sectional area and fine pattern shape than the fiber body disclosed in Patent Document 1. The inventors have come up with the idea of forming a finely patterned fibrous body with a photocurable resin composition. According to such a configuration, it has been found that it is easy to form a nano-order ultrafine structure, and it is also easy to make ultrafine fibers with a width of 10 μm or less, and the present invention has been completed. .
以下、本発明の種々の実施形態を例示する。以下に示す実施形態は、互いに組み合わせ可能である。
好ましくは、前記繊維部は、断面積が１０００μｍ２以下である。
好ましくは、前記微細パターンは、周期が１μｍ以下である。
好ましくは、前記光硬化性樹脂組成物は、重合禁止剤を含む。
好ましくは、前記微細パターンは、活性エネルギー線照射によるインプリント方式によって形成される。
本発明の別の観点によれば、上記記載の微細パターン付き繊維体からなる、超親水性繊維、超撥水性繊維、ホログラム加飾用繊維、偽造防止繊維、又は目視し難い導電性ワイヤーが提供される。
本発明のさらに別の観点によれば、光硬化性樹脂組成物からなる樹脂層に対して微細パターンを有するモールドを押し当てた状態で前記樹脂層に硬化光を照射することによって前記樹脂層を硬化させる硬化工程を備え、前記繊維部は、前記硬化工程において短冊状の遮光マスクを介して前記樹脂層を硬化させるか、又は前記硬化工程によって得られる構造体を繊維状に加工する工程によって形成される、微細パターン付き繊維体の製造方法が提供される。Hereinafter, various embodiments of the present invention will be exemplified. The embodiments described below can be combined with each other.
Preferably, the fiber part has a cross-sectional area of 1000 μm 2 or less.
Preferably, the fine pattern has a period of 1 μm or less.
Preferably, the photocurable resin composition contains a polymerization inhibitor.
Preferably, the fine pattern is formed by an imprint method using active energy ray irradiation.
According to another aspect of the present invention, there is provided a super-hydrophilic fiber, a super-water-repellent fiber, a hologram decorating fiber, a forgery-preventing fiber, or a conductive wire that is difficult to see, comprising the above-described fine patterned fiber body Is done.
According to still another aspect of the present invention, the resin layer is formed by irradiating the resin layer with curing light in a state where a mold having a fine pattern is pressed against the resin layer made of the photocurable resin composition. A curing step for curing is provided, and the fiber portion is formed by a step of curing the resin layer through a strip-shaped light-shielding mask in the curing step or processing a structure obtained by the curing step into a fiber shape. A method for producing a finely patterned fibrous body is provided.
以下、図面を参照しながら本発明の好ましい実施の形態について具体的に説明する。 Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.
本発明の一実施形態の微細パターン付き繊維体１０は、図１（ａ）〜（ｄ）に示すように、繊維部１と、繊維部１に設けられた微細パターン３とを備える繊維体である。繊維体１０は、光硬化性樹脂組成物を用いて形成される。 The fiber body 10 with a fine pattern of one embodiment of the present invention is a fiber body including a fiber part 1 and a fine pattern 3 provided on the fiber part 1 as shown in FIGS. is there. The fibrous body 10 is formed using a photocurable resin composition.
繊維部１の形状は、特に限定されないが、例えば図１（ａ）〜（ｄ）に示すような短冊状であり、その幅Ｗ及び厚さＴは、特に規定されないが、例えば５０μｍ以下であり、２０μｍ以下が好ましく、１０μｍ以下がさらに好ましく、５μｍ以下がさらに好ましい。幅Ｗ及び厚さＴの下限は、特に規定されないが、例えば、０．１μｍ、０．５μｍ、１μｍ程度である。幅Ｗは、図１（ａ）〜（ｃ）に示すように厚さＴよりも大きくてもよく、図１（ｄ）に示すように厚さＴよりも小さくてもよい。幅Ｗ／厚さＴの比は、例えば０．０５〜２０であり、０．１〜１０が好ましい。繊維部１の断面積は、特に限定されないが、例えば１０００μｍ２以下であり、５００μｍ２以下が好ましく、２００μｍ２以下が好ましく、１００μｍ２以下がさらに好ましく、５０μｍ２以下がさらに好ましい。繊維部１の断面積の下限は、特に規定されないが、例えば、０．１μｍ２、１μｍ２、５μｍ２程度である。Although the shape of the fiber part 1 is not specifically limited, For example, it is a strip shape as shown to Fig.1 (a)-(d), The width W and thickness T are not prescribed | regulated in particular, For example, it is 50 micrometers or less. , 20 μm or less, preferably 10 μm or less, more preferably 5 μm or less. The lower limits of the width W and the thickness T are not particularly specified, but are, for example, about 0.1 μm, 0.5 μm, and 1 μm. The width W may be larger than the thickness T as shown in FIGS. 1A to 1C, or may be smaller than the thickness T as shown in FIG. The ratio of width W / thickness T is, for example, 0.05 to 20, and preferably 0.1 to 10. Sectional area of the fiber unit 1 is not particularly limited, and for example 1000 .mu.m 2 or less, preferably 500 [mu] m 2 or less, preferably 200 [mu] m 2 or less, more preferably 100 [mu] m 2 or less, more preferably 50 [mu] m 2 or less. The lower limit of the cross-sectional area of the fiber unit 1 is not particularly defined, for example, 0.1 [mu] m 2, 1 [mu] m 2, it is about 2 5 [mu] m.
微細パターン３は、図１（ａ）、（ｃ）、（ｄ）に示すように繊維部１の片面にのみ形成してもよく、図１（ｂ）に示すように繊維部１の両面に形成してもよい。両面に形成される場合、それぞれの面に形成する微細パターン３は、同一であっても異なっていてもよい。微細パターン３の形状は、特に制限はないが、微細パターン３は、モスアイ、線、円柱、モノリス、円錐、多角錐、マイクロレンズなどの構造体３ａが規則的に又は不規則に並んだパターンであることが好ましく、このような構造体３ａが周期的に並んだ周期パターンが特に好ましい。微細パターン３が周期パターンである場合、構造体３ａが並ぶ周期は、特に限定されないが、１μｍ以下が好ましく、０．５μｍ以下がさらに好ましく、０．３μｍ以下がさらに好ましく、０．１μｍ以下がさらに好ましい。構造体３ａが並ぶ周期の下限は、特に規定されないが、例えば、１０ｎｍである。構造体３ａは、図１（ａ）〜（ｂ）に示すような凸形状であってもよく、図１（ｃ）〜（ｄ）に示すような凹形状であってもよい。構造体３ａの高さ又は深さは、特に限定されないが、１μｍ以下が好ましく、０．５μｍ以下がさらに好ましく、０．３μｍ以下がさらに好ましい。構造体３ａの高さ又は深さの下限は、特に規定されないが、例えば、０．０１μｍ又は０．０５μｍである。繊維部１の表面での各構造体３ａの断面積は、例えば１０μｍ２以下であり、１μｍ２以下が好ましく、０．１μｍ２以下が好ましく、０．０５μｍ２以下がさらに好ましく、０．０２μｍ２以下がさらに好ましい。繊維部１の断面積の下限は、特に規定されないが、例えば、０．０００１μｍ２、０．０００５μｍ２、０．００１μｍ２、０．００５μｍ２程度である。The fine pattern 3 may be formed only on one side of the fiber part 1 as shown in FIGS. 1A, 1C and 1D, and on both sides of the fiber part 1 as shown in FIG. You may form. When formed on both surfaces, the fine pattern 3 formed on each surface may be the same or different. The shape of the fine pattern 3 is not particularly limited, but the fine pattern 3 is a pattern in which structural bodies 3a such as moth eyes, lines, cylinders, monoliths, cones, polygonal pyramids, and microlenses are arranged regularly or irregularly. Preferably, there is a periodic pattern in which such structures 3a are periodically arranged. When the fine pattern 3 is a periodic pattern, the period in which the structures 3a are arranged is not particularly limited, but is preferably 1 μm or less, more preferably 0.5 μm or less, further preferably 0.3 μm or less, and further 0.1 μm or less. preferable. The lower limit of the period in which the structures 3a are arranged is not particularly limited, but is, for example, 10 nm. The structure 3a may have a convex shape as shown in FIGS. 1 (a) to 1 (b), or may have a concave shape as shown in FIGS. 1 (c) to 1 (d). The height or depth of the structure 3a is not particularly limited, but is preferably 1 μm or less, more preferably 0.5 μm or less, and further preferably 0.3 μm or less. The lower limit of the height or depth of the structure 3a is not particularly defined, but is, for example, 0.01 μm or 0.05 μm. Cross-sectional area of each structure 3a on the surface of the fiber unit 1 is, for example, 10 [mu] m 2 or less, preferably 1 [mu] m 2 or less, preferably 0.1 [mu] m 2 or less, more preferably 0.05 .mu.m 2 or less, 0.02 [mu] m 2 More preferred are: The lower limit of the cross-sectional area of the fiber unit 1 is not particularly defined, for example, 0.0001micrometer 2, 0.0005 2, 0.001 [mu] m 2, it is about 2 0.005 .mu.m.
実際に製造した微細パターン付き繊維体１０のＳＥＭ画像を図２に示す。図２の４枚の写真は、倍率を変えて同じ繊維体１０を撮影したものである。繊維体１０は、幅２．５μｍで厚さ５μｍの繊維部１の一面に直径０．１５μｍで深さ０．２μｍの円形の凹部からなる構造体３ａが周期０．２５μｍで設けられて構成されている。 The SEM image of the fiber body 10 with a fine pattern actually manufactured is shown in FIG. The four photographs in FIG. 2 are taken from the same fiber body 10 at different magnifications. The fibrous body 10 is configured by providing a structure 3a formed of a circular concave portion having a diameter of 0.15 μm and a depth of 0.2 μm on one surface of a fiber portion 1 having a width of 2.5 μm and a thickness of 5 μm at a period of 0.25 μm. ing.
本実施形態の繊維体１０は、繊維部１及び微細パターン３の寸法や形状を適宜変化させることによって、様々な特性を付与することが可能であり、それによって様々な用途に適用が可能になる。応用可能な用途としては、超親水性繊維、超撥水性繊維、ホログラム加飾用繊維、偽造防止繊維、又は目視し難い導電性ワイヤーなどが挙げられる。 The fiber body 10 of the present embodiment can be imparted with various characteristics by appropriately changing the dimensions and shapes of the fiber part 1 and the fine pattern 3, thereby being applicable to various uses. . Applications that can be applied include super-hydrophilic fibers, super-water-repellent fibers, hologram decoration fibers, anti-counterfeit fibers, or conductive wires that are difficult to see.
また、以下に説明するように、繊維体１０は、光硬化性樹脂組成物を用いて形成され、以下に例示される方法によって高精度且つ効率的に製造可能である。以下、繊維体１０の製造方法について説明する。 Moreover, as will be described below, the fibrous body 10 is formed using a photocurable resin composition, and can be manufactured with high accuracy and efficiency by the method exemplified below. Hereinafter, the manufacturing method of the fiber body 10 is demonstrated.
（１）第１実施形態
本発明の第１実施形態の繊維体１０の製造方法は、被転写樹脂層形成工程、転写及び硬化工程を備える。
以下、図３を用いて、各工程について詳細に説明する。(1) 1st Embodiment The manufacturing method of the fiber body 10 of 1st Embodiment of this invention is equipped with the to-be-transferred resin layer formation process, a transcription | transfer, and a hardening process.
Hereafter, each process is demonstrated in detail using FIG.
（１−１）被転写樹脂層形成工程
まず、図３（ａ）に示すように、透明基材２上に光硬化性樹脂組成物を塗布して被転写樹脂層５を形成する。(1-1) Transferred Resin Layer Formation Step First, as shown in FIG. 3A, a photocurable resin composition is applied on the transparent substrate 2 to form the transferred resin layer 5.
＜透明基材＞
透明基材２は、樹脂基材、石英基材などの透明材料で形成され、その材質は、特に限定されないが、樹脂基材であることが好ましい。樹脂基材を構成する樹脂としては、例えば、ポリエチレンテレフタレート、ポリカーボネート、ポリエステル、ポリオレフィン、ポリイミド、ポリサルフォン、ポリエーテルサルフォン、環状ポリオレフィンおよびポリエチレンナフタレートからなる群から選ばれる１種からなるものである。また、透明基材２は可撓性を有することが好ましく、その厚さは２５〜５００μｍの範囲であることが好ましい。<Transparent substrate>
The transparent substrate 2 is formed of a transparent material such as a resin substrate or a quartz substrate, and the material is not particularly limited, but is preferably a resin substrate. Examples of the resin constituting the resin base material include one selected from the group consisting of polyethylene terephthalate, polycarbonate, polyester, polyolefin, polyimide, polysulfone, polyethersulfone, cyclic polyolefin, and polyethylene naphthalate. Moreover, it is preferable that the transparent base material 2 has flexibility, and it is preferable that the thickness is the range of 25-500 micrometers.
＜光硬化性樹脂組成物＞
被転写樹脂層５を構成する光硬化性樹脂組成物は、モノマーと、光開始剤を含有し、活性エネルギー線の照射によって硬化する性質を有する。<Photocurable resin composition>
The photocurable resin composition constituting the transferred resin layer 5 contains a monomer and a photoinitiator, and has a property of being cured by irradiation with active energy rays.
モノマーとしては、（メタ）アクリル樹脂、スチレン樹脂、オレフィン樹脂、ポリカーボネート樹脂、ポリエステル樹脂、エポキシ樹脂、シリコーン樹脂等を形成するための光重合性のモノマーが挙げられ、光重合性の（メタ）アクリル系モノマーが好ましい。なお、本明細書において、（メタ）アクリルとは、メタクリルおよび／またはアクリルを意味し、（メタ）アクリレートはメタクリレートおよび／またはアクリレートを意味する。 Monomers include photopolymerizable monomers for forming (meth) acrylic resins, styrene resins, olefin resins, polycarbonate resins, polyester resins, epoxy resins, silicone resins, etc., and photopolymerizable (meth) acrylic. System monomers are preferred. In the present specification, (meth) acryl means methacryl and / or acryl, and (meth) acrylate means methacrylate and / or acrylate.
光開始剤は、モノマーの重合を促進するために添加される成分であり、前記モノマー１００質量部に対して０．１質量部以上含有されることが好ましい。光開始剤の含有量の上限は、特に規定されないが、例えば前記モノマー１００質量部に対して２０質量部である。 A photoinitiator is a component added in order to accelerate | stimulate superposition | polymerization of a monomer, and it is preferable to contain 0.1 mass part or more with respect to 100 mass parts of said monomers. Although the upper limit of content of a photoinitiator is not prescribed | regulated in particular, For example, it is 20 mass parts with respect to 100 mass parts of said monomers.
本発明の光硬化性樹脂組成物は、溶剤、重合禁止剤、連鎖移動剤、酸化防止剤、光増感剤、充填剤、レベリング剤等の成分を光硬化性樹脂組成物の性質に影響を与えない範囲で含んでいてもよい。 The photocurable resin composition of the present invention affects the properties of the photocurable resin composition with components such as a solvent, a polymerization inhibitor, a chain transfer agent, an antioxidant, a photosensitizer, a filler, and a leveling agent. You may include in the range which does not give.
重合禁止剤は、モノマーの重合を抑制するために添加される成分であり、後述する転写及び硬化工程において、遮光パターン１４で覆われた領域において被転写樹脂層５が硬化されないようにするために添加される。重合禁止剤は、前記モノマー１００質量部に対して０．１質量部以上含有される。重合禁止剤の含有量の上限は、特に規定されないが、例えば前記モノマー１００質量部に対して２０質量部である。また、光開始剤の含有量に比べて重合禁止剤の含有量が多すぎると、モノマーの重合が開始されないか又は不十分となる場合があるので、重合禁止剤／光開始剤の質量比は、０．０１〜０．５であることが好ましい。 The polymerization inhibitor is a component added to suppress the polymerization of the monomer, and in order to prevent the resin layer 5 to be transferred from being cured in the region covered with the light shielding pattern 14 in the transfer and curing process described later. Added. The polymerization inhibitor is contained in an amount of 0.1 part by mass or more with respect to 100 parts by mass of the monomer. Although the upper limit of content of a polymerization inhibitor is not prescribed | regulated in particular, For example, it is 20 mass parts with respect to 100 mass parts of said monomers. Also, if the content of the polymerization inhibitor is too much compared to the content of the photoinitiator, the polymerization of the monomer may not be started or may be insufficient, so the mass ratio of the polymerization inhibitor / photoinitiator is 0.01 to 0.5 is preferable.
重合禁止剤の種類は、特に限定されないが、具体的には、たとえば、フェノチアジン、ベンゾキノン、ハイドロキノン、ナフトキノン、ｐ−メトキシフェノール、ハイドロキノンモノメチルエーテル、ｔ−ブチルハイドロキノン、ｔ−ブチルカテコール、Ｎ−メチル−Ｎ−ニトロソアニリン、N−フェニルナフチルアミン、２，２，６，６−テトラメチルピペリジン−１−オキシル、４−ヒドロキシ−２，２，６，６−テトラメチルピペリジン−１−オキシルのほかに和光純薬工業社製のＱ−１３００、Ｑ−１３０１、川崎化成工業社製のキノパワーＱＳ−Ｗ１０、キノパワーＱＳ−３０のような上市品等が挙げられる。 The type of the polymerization inhibitor is not particularly limited. Specifically, for example, phenothiazine, benzoquinone, hydroquinone, naphthoquinone, p-methoxyphenol, hydroquinone monomethyl ether, t-butylhydroquinone, t-butylcatechol, N-methyl- In addition to N-nitrosoaniline, N-phenylnaphthylamine, 2,2,6,6-tetramethylpiperidine-1-oxyl, 4-hydroxy-2,2,6,6-tetramethylpiperidine-1-oxyl, Wako Jun Examples include Q-1300 and Q-1301 manufactured by Yakuhin Kogyo Co., and Kinopower QS-W10 and Kinopower QS-30 manufactured by Kawasaki Kasei Kogyo Co., Ltd.
光硬化性樹脂組成物は、上記成分を公知の方法で混合することにより製造することができる。光硬化性樹脂組成物は、スピンコート、スプレーコート、バーコート、ディップコート、ダイコートおよびスリットコート等の方法で透明基材２上に塗布して被転写樹脂層５を形成することが可能である。 A photocurable resin composition can be manufactured by mixing the said component by a well-known method. The photocurable resin composition can be applied onto the transparent substrate 2 by a method such as spin coating, spray coating, bar coating, dip coating, die coating, and slit coating to form the transferred resin layer 5. .
被転写樹脂層５は、光硬化性樹脂組成物を主成分とするため、光透過性が高く（少なくとも８０％以上）、無色であることが多いが、ナノ粒子などの成分を含み、着色されていてもよい。また、被転写樹脂層５の厚さは、所望厚さの繊維体１０が得られるように適宜設定すればよい。 Since the transferred resin layer 5 is mainly composed of a photocurable resin composition, it has a high light transmission (at least 80% or more) and is often colorless, but it contains components such as nanoparticles and is colored. It may be. Further, the thickness of the transferred resin layer 5 may be appropriately set so that the fibrous body 10 having a desired thickness can be obtained.
（１−２）転写及び硬化工程
次に、図３（ｂ）〜（ｃ）に示すように、モールド７の微細パターン９を被転写樹脂層５に対して押し付けた状態で、短冊状の遮光パターン１４を有するマスク１３を通じて被転写樹脂層５に活性エネルギー線を照射する。これによって、遮光パターン１４で覆われた領域以外が硬化されて短冊状の繊維部１となり、隣接する繊維部１の間に未硬化部１６が残された構成となる。また、繊維部１には、図３（ｄ）に示すように、微細パターン９の反転パターンである微細パターン３が形成される。(1-2) Transfer and Curing Step Next, as shown in FIGS. 3 (b) to 3 (c), a strip-shaped light shield with the fine pattern 9 of the mold 7 pressed against the resin layer 5 to be transferred. The resin layer 5 to be transferred is irradiated with active energy rays through a mask 13 having a pattern 14. As a result, the region other than the region covered with the light shielding pattern 14 is cured to form the strip-shaped fiber portion 1, and the uncured portion 16 is left between the adjacent fiber portions 1. Further, as shown in FIG. 3 (d), the fine pattern 3 that is a reverse pattern of the fine pattern 9 is formed on the fiber portion 1.
モールド７は、樹脂基材、石英基材、シリコーン基材などの透明材料で形成され、透明基材２と同様の材質で形成可能である。微細パターン９は、繊維部１に形成する微細パターン３の反転パターンである。モールド７を被転写樹脂層５に押し付ける圧力は、微細パターン９の形状を被転写樹脂層５に転写可能な圧力であればよい。 The mold 7 is formed of a transparent material such as a resin base material, a quartz base material, or a silicone base material, and can be formed of the same material as the transparent base material 2. The fine pattern 9 is an inverted pattern of the fine pattern 3 formed on the fiber part 1. The pressure for pressing the mold 7 against the transferred resin layer 5 may be any pressure that can transfer the shape of the fine pattern 9 to the transferred resin layer 5.
被転写樹脂層５へ照射する活性エネルギー線１１は、被転写樹脂層５が十分に硬化する程度の積算光量で照射すればよく、積算光量は、例えば１００〜１００００ｍＪ／ｃｍ２である。活性エネルギー線１１の照射によって、被転写樹脂層５が硬化される。「活性エネルギー線」は、ＵＶ光、可視光、電子線などの、光硬化性樹脂組成物を硬化可能なエネルギー線の総称である。The active energy ray 11 irradiated to the transferred resin layer 5 may be irradiated with an integrated light amount sufficient to sufficiently cure the transferred resin layer 5. The integrated light amount is, for example, 100 to 10,000 mJ / cm 2 . The transferred resin layer 5 is cured by irradiation with the active energy ray 11. “Active energy rays” is a general term for energy rays that can cure a photocurable resin composition, such as UV light, visible light, and electron beams.
マスク１３の基材は、樹脂基材、石英基材、シリコーン基材などの透明材料で形成される。遮光パターン１４は、遮光材料（例えば、Ｃｒなどの金属材料）をスパッタリングによって基材上に付着させた後にパターニングしたり、インクジェット印刷又はスクリーン印刷などの方法で遮光材料のパターンを印刷したりすることによって形成することができる。 The base material of the mask 13 is formed of a transparent material such as a resin base material, a quartz base material, or a silicone base material. The light shielding pattern 14 is patterned after depositing a light shielding material (for example, a metal material such as Cr) on the base material by sputtering, or printing a pattern of the light shielding material by a method such as ink jet printing or screen printing. Can be formed.
次に、モールド７を取り外し、未硬化部１６を溶剤で洗い流した後、繊維部１を透明基材２から剥離することによって、図３（ｄ）に示すように、繊維部１に微細パターン３が形成された繊維体１０を得ることができる。 Next, after removing the mold 7 and washing away the uncured part 16 with a solvent, the fiber part 1 is peeled off from the transparent substrate 2, thereby forming a fine pattern 3 on the fiber part 1 as shown in FIG. Can be obtained.
（２）第２実施形態
本発明の第２実施形態の繊維体１０の製造方法は、被転写樹脂層形成工程、転写及び硬化工程、及び分断工程を備える。(2) 2nd Embodiment The manufacturing method of the fiber body 10 of 2nd Embodiment of this invention is equipped with the to-be-transferred resin layer formation process, the transcription | transfer and hardening process, and a cutting process.
本実施形態では、図４（ａ）に示すように、第１実施形態と同様の材料及び方法で、被転写樹脂層形成工程を行った後、図４（ｂ）〜（ｃ）に示すように、マスク１３を用いずに転写及び硬化工程を行うことによって被転写樹脂層５の全面を硬化して硬化樹脂層１５とする。次に、図４（ｄ）に示すように、硬化樹脂層１５を透明基材２から剥離し、所定位置Ｌに沿って硬化樹脂層１５を短冊状に分断することによって、硬化樹脂層１５が繊維状に加工されて、図４（ｅ）に示すように、短冊状の繊維部１に微細パターン３が形成された繊維体１０を得ることができる。分断は、レーザー加工によって行うことができる。なお、透明基材２から剥離する前に硬化樹脂層１５を短冊状に分断し、得られた繊維部１を透明基材２から剥離するようにしてもよい。 In the present embodiment, as shown in FIG. 4A, the transferred resin layer forming step is performed with the same material and method as in the first embodiment, and then as shown in FIGS. 4B to 4C. In addition, the entire surface of the transferred resin layer 5 is cured by performing a transfer and curing process without using the mask 13 to obtain a cured resin layer 15. Next, as shown in FIG. 4D, the cured resin layer 15 is peeled off from the transparent base material 2 and divided into a strip shape along the predetermined position L. As shown in FIG. 4E, a fiber body 10 in which the fine pattern 3 is formed on the strip-like fiber portion 1 can be obtained. The division can be performed by laser processing. Note that the cured resin layer 15 may be divided into strips before being peeled from the transparent substrate 2, and the obtained fiber portion 1 may be peeled from the transparent substrate 2.
なお、第１及び第２実施形態において、繊維部１の両面に微細パターン３を形成する場合には、微細パターン３の反転パターンを有する透明基材２上に被転写樹脂層５を形成した上で、上記と同様の工程を行えばよい。 In addition, in 1st and 2nd embodiment, when forming the fine pattern 3 on both surfaces of the fiber part 1, after forming the to-be-transferred resin layer 5 on the transparent base material 2 which has the inversion pattern of the fine pattern 3 Thus, the same process as described above may be performed.
Claims (7)
前記繊維体は、光硬化性樹脂組成物を用いて形成される、微細パターン付き繊維体。A fiber body comprising a fiber part and a fine pattern provided in the fiber part,
The said fiber body is a fiber body with a fine pattern formed using a photocurable resin composition.
前記繊維部は、前記硬化工程において短冊状の遮光マスクを介して前記樹脂層を硬化させるか、又は前記硬化工程によって得られる構造体を繊維状に加工する工程によって形成される、微細パターン付き繊維体の製造方法。A curing step of curing the resin layer by irradiating the resin layer with curing light in a state where a mold having a fine pattern is pressed against the resin layer made of the photocurable resin composition;
The fiber portion is formed by a step of curing the resin layer through a strip-shaped light shielding mask in the curing step or a step of processing the structure obtained by the curing step into a fiber shape. Body manufacturing method.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014188909 | 2014-09-17 | ||
| JP2014188909 | 2014-09-17 | ||
| PCT/JP2015/076365 WO2016043244A1 (en) | 2014-09-17 | 2015-09-16 | Fine-patterned fiber body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2016043244A1 true JPWO2016043244A1 (en) | 2017-06-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016548925A Pending JPWO2016043244A1 (en) | 2014-09-17 | 2015-09-16 | Fine patterned fiber |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2016043244A1 (en) |
| TW (1) | TW201622969A (en) |
| WO (1) | WO2016043244A1 (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2194075B1 (en) * | 2007-09-28 | 2013-01-09 | Asahi Glass Company, Limited | Photocurable composition, method for producing fine patterned body, and optical device |
| JP2010080680A (en) * | 2008-09-26 | 2010-04-08 | Bridgestone Corp | Rugged pattern forming method and rugged pattern manufacturing device |
-
2015
- 2015-09-16 TW TW104130537A patent/TW201622969A/en unknown
- 2015-09-16 JP JP2016548925A patent/JPWO2016043244A1/en active Pending
- 2015-09-16 WO PCT/JP2015/076365 patent/WO2016043244A1/en active Application Filing
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| Publication number | Publication date |
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| WO2016043244A1 (en) | 2016-03-24 |
| TW201622969A (en) | 2016-07-01 |
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