JPWO2015098815A1 - Sheet-like electronic device manufacturing method, manufacturing apparatus, and laminate - Google Patents

Abstract

A method for manufacturing a sheet-like electronic device in a state where the base film (11) and the support film (12) are electrostatically adhered and stacked without using an adhesive, a manufacturing apparatus therefor, and a stack therefor Provide the body. Laminating step of laminating the base film (11) and the support film (12) to form the laminated film (15), and providing a potential difference between the two films constituting the laminated film (15) under vacuum, A sheet-like electronic device manufacturing method and a manufacturing apparatus therefor, comprising: a charging step of charging; and an electronic device forming step of forming an electronic device on the base film (11) of the laminated film (15). is there. The base film (11) and the support film (12) are electrostatically adhered and laminated, and the peel strength of both films is 0.03 to 0.5 N / 25 mm. It is the laminated body in which the electronic device was formed.

Description

  The present invention relates to a sheet-like electronic device manufacturing method, a sheet-like electronic device manufacturing apparatus, and a laminate on which a sheet-like electronic device is formed.

In recent years, various electronic devices such as organic electroluminescence elements, liquid crystal display elements, touch panels, electronic paper, and solar cells have been developed.
These electronic devices are reduced in weight by being made into a thin plate shape, and are easy to handle when carrying or installing, saving space, and easy to handle during transportation and storage. For this reason, there is an increasing demand for thinner electronic devices.

  In order to reduce the thickness of a thin plate-like electronic device, that is, a sheet-like electronic device, it is required to reduce the thickness of each base material and each functional material constituting the electronic device. In particular, the base sheet used as a base when laminating various functional layers is conventionally relatively thick from the viewpoint of mechanical strength, dimensional stability, handleability, etc. as an electronic device. Glass plates and resin plates have been adopted. However, development for thinning the base sheet is also underway.

  Considering the use of a thin base film having a thickness on the order of several tens of μm as the base sheet, there is a problem in manufacturing a sheet-like electronic device. That is, it is difficult to handle the base film during the process of laminating various functional layers on the thin base film. When forming a layer on the base film, it is necessary to apply tension from both sides of the base film in order to keep it flat at a predetermined position. However, since the thickness of the base film is thin and the rigidity is insufficient, misalignment and wrinkles are generated, and it is difficult to form an accurate and uniform layer.

  Then, in order to improve the handleability in the manufacturing process of the base film, an attempt to laminate a thick support material with an adhesive on the base film has been disclosed.

  For example, Patent Literature 1 discloses a method of forming a pattern on a thin film substrate after temporarily fixing a hard substrate to the back side of the thin film substrate using an adhesive layer. Patent Document 2 discloses a polyester resin carrier material having an adhesive layer as a support for a thin film substrate.

JP 2012-186315 A JP 2012-255122 A

  In both methods disclosed in Patent Document 1 and Patent Document 2, a thin base film and a support film serving as a support are temporarily bonded via an adhesive layer to form a functional layer or the like. It is a method of peeling later.

  However, since the functional layer or the like is exposed to various conditions, the pressure-sensitive adhesive layer may change over time. Therefore, when the support film is peeled off after the formation of the functional layer, etc., part of the adhesive remains locally on the base film, or the adhesive layer cohesively breaks down and adheres to the base film. The agent may remain in a layered state, and furthermore, peeling may be difficult.

  If the pressure-sensitive adhesive remains on the base film, the appearance deteriorates, leading to a decrease in performance as an electronic device such as light emission luminance. Moreover, in order to remove the adhesive which has adhered, it is necessary to provide a washing | cleaning and drying process newly.

  The present invention has been made in view of such a situation. An object of the present invention is to provide a method of manufacturing a sheet-like electronic device and a manufacturing apparatus therefor in a state where a base film and a support film are electrostatically adhered and laminated without using an adhesive. That is. Another object of the present invention is to provide a laminate in which a base film and a support film are electrostatically adhered and laminated without using an adhesive, and a sheet-like electronic device is formed on the base film.

As a result of repeated investigations on the solution to the above problems, the inventors of the present invention applied a voltage application electrode under vacuum and electrostatically brought the base film and the support film into close contact with each other. It was found that there is no problem in processing when forming a functional layer or the like. It has also been found that a predetermined electrostatic adhesion strength can be achieved under a vacuum by a voltage lower than that under atmospheric pressure. The present invention has been achieved by obtaining such knowledge.
The present invention has the following configuration.

  1. A method for producing a sheet-like electronic device in a state in which a base film and a support film are laminated, wherein a lamination step of laminating the base film and the support film to form a laminated film, and under vacuum A sheet-like process comprising: a charging step for charging by providing a potential difference between the two films constituting the laminated film; and an electronic device forming step for forming an electronic device on the base film of the laminated film. Electronic device manufacturing method.

  2. 2. The method for producing a sheet-like electronic device according to 1 above, further comprising a charge removing step of removing the surface of the laminated film between the charging step and the electronic device forming step.

  3. 3. The method for producing a sheet-like electronic device according to 1 or 2, wherein the base film and the support film are each a long film.

  4). An apparatus for forming a laminated film by laminating a base film and a support film, a vacuum chamber having a voltage applying electrode and a ground electrode for charging the laminated film, and a power source for applying a voltage to the voltage applying electrode And an apparatus for forming an electronic device on the base film of the laminated film.

  5. 5. The apparatus for producing a sheet-like electronic device according to 4 above, further comprising an apparatus for removing the surface of the laminated film in the vacuum chamber.

  6). Furthermore, a laminated film is formed by laminating a roll-out base film, a roll-out support film, a roll-out support film, and a roll-out base film and support film in the vacuum chamber. The apparatus for manufacturing a sheet-like electronic device according to 4 or 5, wherein the apparatus for forming a sheet is provided.

  7). A base film and a support film are electrostatically adhered and laminated, and a peel strength of the base film and the support film is 0.03 to 0.5 N / 25 mm, and a sheet shape is formed on the base film. A laminate in which electronic devices are formed.

  8). 8. The laminate according to 7 above, wherein the surface of the laminate is neutralized.

  9. 9. The laminate according to 7 or 8, wherein the sheet-like electronic device is one of an organic electroluminescence element, a liquid crystal display element, a touch panel, electronic paper, a solar cell, or a component for constituting them.

  Since the manufacturing method of the sheet-like electronic device of the present invention does not use an adhesive, there is no deterioration in appearance as a result of the adhesive remaining, and no deterioration in performance as an electronic device such as light emission luminance. Similarly, the sheet-like electronic device manufacturing apparatus of the present invention and the laminate of the present invention do not use a pressure-sensitive adhesive. There is no performance degradation. In addition, it is not necessary to provide a new washing / drying step in order to remove the adhering adhesive.

It is a table | surface which shows the manufacturing conditions and evaluation result of an Example and a comparative example. It is a cross-sectional schematic diagram which shows the manufacturing apparatus of the sheet-like electronic device of this embodiment (however, the apparatus which forms an electronic device is not shown). It is a cross-sectional schematic diagram which shows the measuring method of the peeling strength of a laminated | multilayer film.

  In the present invention, the sheet-like electronic device refers to a functional layer such as an organic electroluminescence element (hereinafter sometimes referred to as “organic EL element”), a liquid crystal display element, a touch panel, electronic paper, a solar cell, and the like. It refers to an electronic device that performs its function by being laminated.

  DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Modes for carrying out the present invention will be described below, but the present invention is not limited to the embodiments described below, and the embodiments are arbitrarily changed within the scope of the present invention. Is possible.

  The sheet-like electronic device of the present embodiment is usually manufactured by sequentially laminating functional layers that exhibit various functions on a base sheet. In this embodiment, a base film is used as the base sheet. The substrate film is not particularly limited, whether it is a single wafer film or a long film. However, since continuous production by a roll-to-roll system is possible and productivity is excellent, the base film and the support film described later are preferably long films.

  In this embodiment, an organic EL element is taken up as a representative sheet-like electronic device, and a case where a long film is used as a base film will be described as an example.

  In this embodiment, a base film is a base sheet used as a base when forming an organic EL element. The base film is flexible and preferably has mechanical strength, heat resistance when an organic EL element is produced on the base film, gas barrier properties against water vapor and oxygen, and the like. The base film is preferably made of a transparent resin when transmitting the emitted light.

  In the present embodiment, examples of the material constituting the base film include polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), polyethylene, polypropylene, cellophane (registered trademark), cellulose diacetate, and cellulose triacetate ( TAC), cellulose acetate butyrate, cellulose acetate propionate (CAP), cellulose acetate phthalate, cellulose esters such as cellulose nitrate, or derivatives thereof, polyvinylidene chloride, polyvinyl alcohol, polyethylene vinyl alcohol, syndiotactic polystyrene, Polycarbonate, norbornene resin, polymethylpentene, polyetherketone, polyimide, polyethersulfone (PES) Polyphenylene sulfide, polysulfone, polyetherimide, polyetherketoneimide, polyamide, fluororesin, polymethyl methacrylate, polyacrylic ester, polyarylate, Arton (registered trademark, manufactured by JSR) or Appel (registered trademark, manufactured by Mitsui Chemicals) And the like, and the like.

  The thickness of the base film is not particularly limited, but is preferably 20 to 100 μm in consideration of thinning, mechanical strength, handleability, and the like. In addition, the thickness of a base film can be measured using a micrometer.

  The base film is weak because it has a small thickness. Therefore, when laminating various functional layers while passing a long base film from roll to roll, sagging between rolls, wrinkles and twisting occur, and manufacturing problems It is easy to generate. When the base film is deformed at the time of manufacture, it becomes difficult to form a functional layer uniformly on the base film, resulting in a decrease in performance such as emission luminance and variations, resulting in a decrease in product yield. Become.

  Therefore, the above-mentioned manufacturing trouble can be prevented beforehand by laminating and integrating the support film on the base film. The support film is temporarily used only at the time of manufacturing the sheet-like electronic device, and is peeled off from the base film after a predetermined functional layer is laminated on the base film.

  In this embodiment, examples of the material constituting the support film include polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), polyethylene, polypropylene, cellophane (registered trademark), cellulose diacetate, and cellulose triacetate (TAC). ), Cellulose acetate butyrate, cellulose acetate propionate (CAP), cellulose acetates such as cellulose acetate phthalate, cellulose nitrate or derivatives thereof, polyvinylidene chloride, polyvinyl alcohol, polyethylene vinyl alcohol, syndiotactic polystyrene, polycarbonate , Norbornene resin, polymethylpentene, polyetherketone, polyimide, polyethersulfone (PE ), Polyphenylene sulfide, polysulfone, polyetherimide, polyether ketone imide, polyamide, fluororesin, polymethyl methacrylate, polyacrylic acid esters, and the like.

  Although the thickness of the support film is not particularly limited, it is preferably 50 to 300 μm in view of mechanical strength, handleability, and the like. The thickness of the support film can be measured using a micrometer.

  As described later, the base film and the support film are charged by providing a potential difference between the two films. Therefore, it is necessary to be electrically insulating. It is not possible to use a film containing a conductive filler to increase conductivity or a film having a conductive layer.

  Hereinafter, the manufacturing method and the manufacturing apparatus of the sheet-like electronic device of the present embodiment will be described with reference to the drawings. FIG. 2 is a schematic cross-sectional view showing the sheet-like electronic device manufacturing apparatus of the present embodiment.

  The sheet-like electronic device manufacturing apparatus 100 according to the present embodiment is sealed in order to prevent foreign matter from entering from the outside environment and to place the base film and the support film in a steady temperature, humidity, pressure, and gas environment. Has been. In FIG. 2, the sheet-like electronic device manufacturing apparatus 100 is divided into five chambers 101 to 105 corresponding to the respective manufacturing processes.

  However, in FIG. 2, the apparatus corresponding to the electronic device formation process which forms an electronic device on the base film of a laminated film among the manufacturing apparatuses 100 of the sheet-like electronic device of this embodiment is not illustrated. This step is a step existing after the chamber 105 in FIG. Depending on the type of the sheet-like electronic device, it can be various processes and apparatuses, and is not shown.

  The temperature, humidity, pressure, and gas environment in the five chambers 101 to 105 in the sheet-like electronic device manufacturing apparatus 100 may be the same or may be different between the chambers. When the chambers 101 to 105 have the same temperature, humidity, pressure, and gas environment, the partition between the chambers can be removed.

(Feeding process)
The feeding process is a process of feeding the base film from a roll wound with a long base film. Similarly, it includes a step of feeding the support film from a roll on which a long support film is wound.

  The chamber 101 in FIG. 2 includes a device for feeding out the base film 11 from a roll 13 in which a long base film 11 is wound in a roll shape. Similarly, a device for feeding out the support film 12 from a roll 14 in which a long support film 12 is wound in a roll shape is provided. The pressure in the chamber 101 may be atmospheric pressure or a pressure below atmospheric pressure.

(Lamination process)
A lamination process is a process of laminating a substrate film and a support film to form a laminated film. Of the both surfaces of the substrate film, the surface on which the functional layer is not laminated and the surface of the support film on the side to be in close contact with the substrate film are laminated. In this lamination process, a base film and a support film are physically temporarily bonded. Since regular adhesion is performed in the charging process described later, the temporary adhesion up to that point is performed.

  The method of laminating is generally a pressure bonding method using a roll, but the means for laminating is not particularly limited. Various means such as roll lamination, flat plate bonding, and diaphragm bonding can be used. In this embodiment, a pressure bonding method using a roll is used as a typical stacking means.

  The chamber 102 in FIG. 2 includes a roll 16 that is an apparatus that forms the laminated film 15 by laminating the base film 11 and the support film 12. The roll 16 is a so-called nip roll composed of a pair of upper and lower rolls. By passing the roll 16, the base film 11 and the support film 12 are laminated | stacked and temporarily bonded, and the laminated | multilayer film 15 is formed. The number of laminated rolls may be two in a pair, or may be further increased to four in two pairs as necessary. Further, the nip pressure and the rotation speed of the roll are appropriately set to conditions under which the base film 11 and the support film 12 can be laminated. The pressure in the chamber 102 may be atmospheric pressure or a pressure below atmospheric pressure.

(Charging process)
The charging step is a step of charging by providing a potential difference between the two films constituting the laminated film under vacuum. When a laminated film is sandwiched and a potential difference is applied from both sides using a pair of electrodes having a film width, both films are charged with opposite charges. By having the opposite charge, both films are in close contact with each other electrostatically.

  In the chamber 103 of FIG. 2, the laminated film 15 passes between a voltage application electrode 17 having a film width and a roll-shaped ground electrode 18 having a film width. The voltage application electrode 17 is connected to a power source 19 that applies a DC voltage. On the other hand, the ground electrode 18 is connected to the ground. A discharge part (discharge space) is formed between the voltage application electrode 17 and the ground electrode 18. When the laminated film 15 passes through this discharge portion, both films constituting the laminated film 15 are charged with opposite charges. As a result, both films can be electrostatically brought into close contact with each other and then processed to form a functional layer or the like.

Since the voltage application electrode 17 and the ground electrode 18 respectively charge the entire surface on one side of the laminated film 15, it is preferable that the voltage applying electrode 17 and the ground electrode 18 have a width equal to or wider than the width of the laminated film 15. The voltage application electrode 17 may be an electrode that can directly contact the surface of the laminated film 15 or may be a non-contact type electrode. Similarly, the ground electrode 18 may be an electrode that can be in direct contact with the surface of the laminated film 15 or may be a non-contact type electrode. The contact-type electrode may be a roll-type rotating type or a type in which a large number of brush-like electrodes are arranged in the width direction. It can be appropriately selected from known electrode types. In this embodiment, the voltage application electrode 17 is a non-contact type, and the earth electrode 18 is a contact type rotary roll type.
Further, when applying a DC voltage, either the voltage application electrode 17 or the ground electrode 18 may be on the plus side, and either may be on the minus side.

  The pressure in the chamber 103 needs to be a vacuum chamber to be a vacuum. Here, the vacuum in this invention is 10-200 Pa. Preferably it is 50-150 Pa.

  In order to obtain an electrostatically adhered laminated film in a case where the laminated film is charged with a potential difference under vacuum and in a case where the laminated film is charged with a potential difference under atmospheric pressure. The potential difference was examined. As a result, when comparing the potential difference so that the peel strength between the base film and the support film becomes a constant value, the case of charging under vacuum is far more than the case of charging under atmospheric pressure. It has been found that a predetermined peel strength can be obtained with a small potential difference. Specifically, in order to obtain peel strength that enables processing to form a functional layer or the like, the potential difference may be 100 V or less under a vacuum of 100 Pa, whereas the potential difference is 5 under atmospheric pressure. 000-15,000V was necessary.

  Since a low potential difference is sufficient under vacuum, the manufacturing cost is low, and there is little danger in the work environment. On the other hand, under atmospheric pressure, the potential difference is high and the amount of charge increases, so that when it is rolled up, the charge accumulates, causing arc discharge, scratching the laminated film, and forming on the laminated film. There is a concern that this will affect electronic devices. Moreover, there is a concern of causing harm to workers and peripheral devices as well as the laminated film itself.

  In addition, since it is possible to laminate the base film and the support film without using an adhesive, the deterioration of the appearance caused by the remaining adhesive, as an electronic device such as light emission luminance, etc. Performance degradation and gas generation from the adhesive do not occur. In addition, there is no need to provide a cleaning / drying step that was necessary to remove the attached adhesive.

  The peel strength between the base film and the support film that are electrostatically adhered is 0.03 to 0.5 N / 25 mm. Preferably, it is 0.05 to 0.3 N / 25 mm. With such a peel strength, when the base film and the support film are peeled off, if the electronic device is formed on the base film, there is little adverse effect on the electronic device. Moreover, when the electronic device is not formed on the base film, the base film is easily peeled off, so that there is little adverse effect on the base film. Here, the peel strength can be measured by a 180 degree peel test using a 25 mm wide laminated film.

(Static elimination process)
The charge removal step is a step of removing the charge on the surface of the laminated film, provided between the charging step and the electronic device formation step described later. The laminated film after passing through the charging step is charged as a whole. Electric charges existing on the external surface other than the electric charge existing at the contact interface between the two films effective for electrostatically adhering the two films can cause discharges and the like when the laminated film is processed later. There are concerns that cause problems. Therefore, it is preferable to perform static elimination in order to remove the electric charge existing on the outer surface of the laminated film. By removing the charge, the laminated film is apparently neutralized in charge.

  In the chamber 104 of FIG. 2, the laminated film 15 passes between two static elimination electrodes 20 having a film width. The two static elimination electrodes 20 existing on both sides of the laminated film 15 are connected to the static elimination device 21, respectively. The laminated film 15 passes through a static elimination portion (static elimination space) that exists between the two static elimination electrodes 20 having a width of the film, thereby removing excess charges existing on the front and back surfaces. The static elimination electrode 20 and the static elimination device 21 can be appropriately selected from known static elimination electrodes and static elimination devices.

  The pressure in the chamber 104 may be atmospheric pressure or a pressure below atmospheric pressure. However, since it is preferable to remove static electricity continuously from the laminated film 15 that has undergone the charging process of the chamber 103, it is preferable that the chamber 104 and the chamber 103 are under the same temperature, humidity, pressure, and gas environment. That is, it is preferable to integrate the chamber 103 and the chamber 104 into the same vacuum chamber. Furthermore, it is preferable that the chamber 101 to the chamber 104 are integrated by combining the feeding process of the chamber 101 and the stacking process of the chamber 102 to form the same vacuum chamber.

(Winding process)
The laminated film that has been neutralized in the static elimination step can be temporarily wound into a roll before entering the electronic device formation step described later. By doing so, it can be stored as a roll-shaped laminated film for a predetermined period.

  In the chamber 105 of FIG. 2, the laminated film 15 is wound around the roll 23 via the guide roll 22. The pressure in the chamber 105 may be atmospheric pressure or a pressure below atmospheric pressure.

  From the feeding process of the chamber 101 to the winding process of the chamber 105, it is possible to continuously flow. By doing so, a laminated film can be manufactured with high productivity by a roll-to-roll method. Therefore, it is preferable that each chamber from the chamber 101 to the chamber 105 is under the same temperature, humidity, pressure, and gas environment. That is, it is preferable to integrate the chamber 101 to the chamber 105 into the same vacuum chamber.

(Electronic device formation process)
An electronic device formation process is a process of forming an electronic device on the base film of a laminated film. In the laminated film that is electrostatically adhered, an electronic device is then formed on the base film of the laminated film. As a result, the base film and the support film are electrostatically adhered and stacked, and a laminate in which a sheet-like electronic device is formed on the base film is formed.

  In the case of an organic EL element, the electronic device forming step is a step of sequentially forming a first electrode, an organic functional layer including a light emitting layer, and a second electrode. More specifically, the organic functional layer including the light emitting layer includes, in addition to the light emitting layer, an organic functional layer having various functions such as a carrier (hole and electron) injection layer, a blocking layer, and a transport layer. It may be.

  In FIG. 2, the apparatus which forms an electronic device on the base film of the laminated | multilayer film 15 is not shown in figure. In the case of an organic EL element, an apparatus for forming an electronic device is a vapor deposition apparatus, a sputtering apparatus, a coating apparatus, a cleaning apparatus, a drying apparatus, a laminating apparatus, or the like.

(Peeling process)
In the electronic device forming process, after the electronic device is formed on the laminated film, the support film of the laminated film has already played a role, and is peeled off. In the present embodiment, the base film and the support film are merely in close contact with each other without using an adhesive. Therefore, the support film can be peeled relatively easily by peeling from the end of the laminated film.

  The absolute amount of the electric charge existing at the interface between the two films is not large, so that there is little risk of harm caused by discharge or the like. Moreover, if the peeling process is performed under atmospheric pressure, it is discharged by the moisture contained in the atmosphere, and the charge disappears. Furthermore, if a conductive layer is formed as a functional layer, the charge disappears through the conductive layer.

  The laminate in which the base film and the support film are electrostatically adhered and laminated, and the sheet-like electronic device is formed on the base film is the original sheet-like electronic device after the support film is peeled off. Will function.

[Modification of this embodiment]
In addition to the organic EL element, the sheet-like electronic device can be a liquid crystal display element, a touch panel, electronic paper, a solar cell, or a component for constituting them. Therefore, in an electronic device formation process, various functional layers according to the kind of each sheet-like electronic device will be formed. Also about the apparatus which forms an electronic device on a laminated | multilayer film, it can be set as the various apparatus according to the kind of each sheet-like electronic device.
About a specific electronic device forming process and an electronic device forming apparatus for forming any one of an organic EL element, a liquid crystal display element, a touch panel, electronic paper, a solar cell, or a component for constituting them, publicly known Technology can be applied as appropriate.

EXAMPLES Hereinafter, the present invention will be specifically described with reference to examples, but the present invention is not limited thereto.
The apparatus equivalent to the manufacturing apparatus of the sheet-like electronic device shown in FIG. 2 was used. The apparatus is installed in one vacuum chamber in which the chamber 101 to the chamber 105 are integrated. Each apparatus which comprises the manufacturing apparatus of a sheet-like electronic device is as follows.
Power supply: Product number PST-2005N manufactured by Kasuga Electric Co., Ltd.
Voltage application electrode; manufactured by Kasuga Electric Co., Ltd. The gap between the voltage application electrode and the laminated film was 5 mm.
Earth electrode: Kasuga Electric Co., Ltd., a rotating roll electrode, which is grounded.

  A PET long film having a thickness of 50 μm and a width of 250 mm was prepared as a base film, and a long film of PET having a thickness of 100 μm and a width of 250 mm was prepared as a support film. A base film and a support film were installed in a sheet-like electronic device manufacturing apparatus.

(Example 1, Comparative Example 1)
A laminated film was produced at a potential difference under the pressure shown in FIG. 1 with the conveyance speed of the base film and the support film being 1 m / min.

(Comparative Example 2, Comparative Example 3)
In manufacturing the laminated film, the base film and the support film were bonded using an adhesive. As the support film, a film having the following two types of adhesive layers was used.
Comparative example 2: heat-resistant adhesive film manufactured by Kimoto Co. Substrate: 125 μm thick PET film. The adhesive layer is made of a heat resistant acrylic resin.
Comparative Example 3: An adhesive film manufactured by Sanei Kaken. Base material: LDPE film having a thickness of 50 μm. The adhesive layer is made of a non-heat resistant polyolefin resin.

  When the laminated films of Comparative Example 2 and Comparative Example 3 are manufactured, the charging device of the chamber 103 and the neutralization device of the chamber 104 are not used in the sheet-like electronic device manufacturing apparatus shown in FIG. The base film and the support film were bonded to each other through the pressure-sensitive adhesive layer using a roll. The same substrate film as that used in the example was used.

(Evaluation conditions)
The evaluation conditions for the laminated film are as follows.

(Peel strength)
Using a laminated film having a width of 25 mm, measurement was performed with a 180 degree peel tester. The tensile speed at the time of peeling was 300 mm / min. FIG. 3 is a schematic cross-sectional view showing a method for measuring the peel strength of a laminated film. The support film 1 and the base film 2 were peeled off, and the support film 1 was fixed to a fixture and pulled in the opposite direction by a 180 degree peel tester.

(Surface observation)
Using an optical microscope and a scanning electron microscope, the close-contact surface of the base film after peeling the support film was observed at a magnification of 30 to 3000 times to determine the presence or absence of foreign matter.

(Surface roughness Ra)
As an optical interference type surface roughness meter, wykoNT9300 manufactured by Veeco was used. The adhesion side surface of the base film after peeling the support film was observed to determine the arithmetic average surface roughness Ra.

(Heat treatment)
As a process simulating an electronic device formation step, the laminated film was heated on a hot plate at 150 ° C. for 2 hours. Each said evaluation was performed about the contact | adherence side surface of the base film after the support film peeling of the laminated | multilayer film before and behind heat processing.

(Device performance, device appearance)
After producing the laminated film, an organic EL element was produced on the laminated film. The conditions described in the examples of Japanese Patent Application Laid-Open No. 2012-48934 were used for the manufacturing conditions of the organic EL element. As device performance of the obtained organic EL element, light emission luminance was measured. Each of the produced organic EL elements was randomly selected, and the light emission luminance when a DC voltage of 10 V was applied was measured with CS-1000 (manufactured by Konica Minolta Sensing Co., Ltd.), and the average value thereof was taken as the light emission luminance. . The change rate of the light emission luminance was evaluated and determined with respect to the light emission luminance of the organic EL element manufactured using the conventional glass substrate. When the change rate of the light emission luminance was less than 10% and were equal, “good” was judged, and when the change rate of the light emission luminance was reduced by 10% or more, “good” was judged. Further, the surface appearance of the organic EL element was observed, and the presence or absence of the pressure-sensitive adhesive or the like was observed.

  In Example 1, the charging process was performed under a vacuum of 100 Pa when the base film and the support film were adhered and laminated. In Comparative Example 1, the charging process was performed under atmospheric pressure. On the other hand, the comparative example 2 and the comparative example 3 are laminated | stacked under atmospheric pressure by the conventional adhesive instead of electrostatic adhesion.

  The evaluation results are shown in FIG. As can be seen from the results of FIG. 1, both Example 1 and Comparative Example 1 have a peel strength before and after heating of 0.05 N / 25 mm, and the subsequent manufacturing process of the organic EL element is performed without any problem. I was able to. The surface of the base film after peeling off the support film was clean without changing the surface roughness even before and after heating. The performance (light emission luminance) and appearance as an organic EL element were satisfactory. However, in Comparative Example 1, the charging process is under atmospheric pressure, and it is necessary to apply a potential difference that is 100 times higher than that in Example 1. Therefore, when electric charge is accumulated, arc discharge is caused, and the laminated film is There were concerns about destruction and harm to workers and peripheral equipment.

  On the other hand, in both Comparative Example 2 and Comparative Example 3, the surface of the base film after the support film was peeled was observed to have foreign matters as adhesive residues before and after heating. There was also a problem in performance (light emission luminance) and appearance as an organic EL element.

DESCRIPTION OF SYMBOLS 1 Support film 2 Base film 3 Fixing tool 11 Base film 12 Support film 13, 14, 23 Roll 15 Laminated | multilayer film 17 Voltage application electrode 18 Ground electrode 19 Power supply 20 Electrostatic discharge electrode 21 Static elimination apparatus 100 Sheet-like electronic device manufacturing apparatus 101, 102, 103, 104, 105 Chamber

Claims (9)

In a state in which a base film and a support film are laminated, a method for producing a sheet-like electronic device,
A laminating step of laminating the base film and the support film to form a laminated film;
A charging step of charging by providing a potential difference between the two films constituting the laminated film under vacuum; and
The manufacturing method of the sheet-like electronic device characterized by having an electronic device formation process which forms an electronic device on the base film of the said laminated | multilayer film.   The method for producing a sheet-like electronic device according to claim 1, further comprising a charge removing step of removing the surface of the laminated film between the charging step and the electronic device forming step.   The method for producing a sheet-like electronic device according to claim 1, wherein the base film and the support film are each a long film. An apparatus for laminating a base film and a support film to form a laminated film;
A vacuum chamber internally provided with a voltage applying electrode and a ground electrode for charging the laminated film;
A power source for applying a voltage to the voltage application electrode;
An apparatus for manufacturing a sheet-like electronic device, comprising: an apparatus for forming an electronic device on a base film of the laminated film.   The apparatus for manufacturing a sheet-like electronic device according to claim 4, further comprising an apparatus for removing the surface of the laminated film in the vacuum chamber.   Furthermore, a laminated film is formed by laminating a roll-out base film, a roll-out support film, a roll-out support film, and a roll-out base film and support film in the vacuum chamber. The apparatus for manufacturing a sheet-like electronic device according to claim 4 or 5, characterized by comprising: The base film and the support film are electrostatically adhered and laminated,
The peel strength of the base film and the support film is 0.03 to 0.5 N / 25 mm,
A laminate in which a sheet-like electronic device is formed on the base film.   The laminate according to claim 7, wherein a surface of the laminate is neutralized.   The laminate according to claim 7 or 8, wherein the sheet-like electronic device is one of an organic electroluminescence element, a liquid crystal display element, a touch panel, electronic paper, a solar cell, or a component for constituting them.

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