JPWO2015011753A1 - Component mounting inspection device - Google Patents

Abstract

The component mounting inspection apparatus 18 mounts the first and second electronic components 60 and 70 on the first and second solders 54 and 58 printed on the first and second electrode pads 52 and 56 of the substrate 50 and then solders them. Before reflowing, the mounting state of each electronic component 60, 70 is inspected. Specifically, the component mounting inspection apparatus 18 includes the position information of the first and second electrode pads 52 and 56, the position information of the first and second solders 54 and 58, and the first and second electronic components 60 and 70. Get terminal location information. Next, the component mounting inspection apparatus 18 determines the positions of the first and second electronic components 60 and 70 relative to the first and second electrode pads 52 and 56 after the step of reflowing solder based on the positional information. It is predicted whether or not it falls within a predetermined appropriate range.

Description

  The present invention relates to a component mounting inspection apparatus.

  Conventionally, when mounting electronic components by soldering to the electrode pads on the board, first, cream-like solder is printed on the electrode pads on the board, then the electronic components are mounted on the printed solder, and then An operation of reflowing the solder and mounting the electronic component on the electrode pad by soldering is performed. In the process of printing solder on the electrode pads of the substrate, the solder is printed in a predetermined design area on the predetermined electrode pads, but the solder may be printed out of the design area for some reason. . Therefore, at the stage where the solder has been printed, an inspection is performed as to whether or not to proceed to the next step based on the amount of deviation of the printed solder. If the amount of deviation is too large, the mounting position and mounting strength of the electronic component are hindered after the electronic component is mounted on the solder and the solder is reflowed. On the other hand, if the deviation amount is not so large, the solder may fall within the design area at a stage after the solder is reflowed. This is because when the solder printed at the shifted position melts, the surface of the electrode pad spreads out and the shift is eliminated (self-alignment). Patent Document 1 proposes a technique that considers such self-alignment in an inspection performed at the stage where solder is printed.

JP 2009-192282 A

  However, in the technique of Patent Document 1, although self-alignment is considered, the inspection is performed before the electronic component is mounted on the solder printed on the electrode pad of the substrate. The position of the electronic component after being applied is not considered. Therefore, for example, if a deviation occurs when actually mounting an electronic component, even if self-alignment works even if the printed solder inspection result has passed, mounting defects will occur after reflow. There is. Or, even though the printed solder inspection result is unacceptable, the self-alignment may work and be mounted well after reflow. Therefore, there is a problem that the inspection accuracy performed before reflow is not sufficiently high.

  The present invention has been made to solve such a problem, and has as its main object to sufficiently increase the inspection accuracy performed before reflow in the component mounting inspection apparatus.

The component mounting inspection apparatus of the present invention is
A component mounting inspection apparatus for inspecting the mounting state of the electronic component before reflowing the solder after mounting the electronic component on the solder printed on the electrode pad of the substrate,
Position information acquisition means for acquiring position information of the electrode pads, position information of the printed solder, and position information of terminals of the mounted electronic component;
The electrons with respect to the electrode pad after the step of reflowing the solder based on the position information of the electrode pad, the printed solder and the terminal of the mounted electronic component acquired by the position information acquisition means Mounting state prediction means for predicting whether or not the position of the component falls within a predetermined appropriate range;
It is equipped with.

  In this component mounting inspection device, the position of the electronic component relative to the electrode pad after the solder reflow process is determined based on the positional information of the electrode pad, the printed solder, and the terminal of the mounted electronic component. Predict whether or not to enter the range. In other words, even if the position of the solder actually printed on the electrode pad is deviated from the target position, or the position of the electronic component actually attached to the solder is deviated from the target position, It is predicted whether the position of the electronic component with respect to the electrode pad after the step of reflowing will fall within a predetermined appropriate range. As a result, the inspection accuracy performed before reflow in the component mounting inspection apparatus is sufficiently high.

  In this specification, mounting an electronic component on a substrate is referred to as “mounting”, an apparatus for mounting an electronic component on a substrate is referred to as a “mounting device”, and the state where the electronic component is soldered by reflow is referred to as “ It is called “mounting state”.

  In the component mounting inspection apparatus of the present invention, the mounting state prediction unit calculates a self-alignment force that acts on the electronic component in the step of reflowing the solder, and compares the self-alignment force with the weight of the electronic component. It may be predicted whether or not the position of the electronic component with respect to the electrode pad falls within the appropriate range. In this way, even if the self-alignment force works, if the electronic component is too heavy and the electronic component does not move to an appropriate position, the mounting state predicting means predicts a defective product, so that the inspection accuracy is further increased. .

  Thus, in the component mounting inspection apparatus of the present invention using the self-alignment force, the mounting state predicting means calculates the self-alignment force, the surface tension of the solder, the electrode pad, and the printed solder. The self-alignment force may be calculated using a parameter relating to an overlapping region where the terminal of the mounted electronic component overlaps. In this way, the self-alignment force can be obtained appropriately. In addition, as a parameter regarding an overlapping area | region, the outer periphery length, area, etc. of the overlapping area | region are mentioned, for example.

  Further, in the component mounting inspection apparatus of the present invention that utilizes self-alignment force, the mounting state predicting means, when the electronic component has a plurality of terminals, the self-alignment force acting on the electronic component, You may calculate as a sum total of the self-alignment force in the electrode pad corresponding to each terminal with which an electronic component is provided. If it carries out like this, the self-alignment force which acts on the electronic component provided with the several terminal can be calculated | required appropriately.

  In this case, the wearing state prediction means may calculate the sum in consideration of the direction of each self-alignment force. If it carries out like this, the self-alignment force which acts on the electronic component provided with the several terminal can be calculated | required more appropriately. Note that the direction of the self-alignment force is a direction from the center of the overlapping region to the center of the electrode pad.

Explanatory drawing of the production line 10. FIG. FIG. 3 is a block diagram of the component mounting inspection device 18. The flowchart of a component mounting inspection routine. Explanatory drawing of self-alignment force FL and FR.

  Preferred embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is an explanatory diagram of the production line 10.

  In the production line 10, a solder printing device 12, a solder printing inspection device 14, a component mounting device 16, a component mounting inspection device 18, and a reflow furnace 20 are arranged in order from the upstream side. A substrate 50 supplied from a substrate supply device (not shown) to the production line 10 includes electrode pads 52 and 56 at a plurality of predetermined positions. The board | substrate 50 is sequentially carried in to each apparatus 12-20 which comprises the manufacturing line 10 with the conveyor which is not shown in figure, and is unloaded after processing in each apparatus 12-20. The devices 12 to 18 are connected to the management computer 22 via a communication cable so that bidirectional communication is possible. The management computer 22 includes information on the substrate 50 (the type / size of the substrate 50, the position information of each electrode pad provided on the substrate 50, the type / size / mounting position of each electronic component mounted on the substrate 50, and a plurality of electronic components. Component mounting order, terminal position information of each electronic component, etc.) are stored.

  A circle in FIG. 1 is a partially enlarged view of the substrate 50. In this circle, as electrode pads provided on the substrate 50, two first electrode pads 52 corresponding to the rectangular first electronic component 60 and four second electrodes corresponding to the square second electronic component 70 are provided. The pad 56 is illustrated. Two terminals connected to the two first electrode pads 52 are provided on the back surface of the first electronic component 60 (the surface facing the substrate 50), and four second terminals are provided on the back surface of the second electronic component 70. Four terminals connected to the electrode pad 56 are provided. The substrate 50 includes a large number of electrode pads in addition to the first and second electrode pads 52 and 56, and the substrate 50 includes a large number of electronic components in addition to the first and second electronic components 60 and 70. Is implemented.

  The solder printing apparatus 12 screen-prints cream solder on a plurality of electrode pads (for example, the first and second electrode pads 52 and 56) formed on the surface of the substrate 50. The solder printing apparatus 12 acquires information related to the substrate 50 from the management computer 22 in advance, and prints solder on a plurality of electrode pads formed on the substrate 50 using a metal screen corresponding to the substrate 50. . As a result, the first solder 54 is printed on the first electrode pad 52, the second solder 58 is printed on the second electrode pad 56, and the solder is similarly printed on the other electrode pads. .

  The solder print inspection device 14 includes an inspection head for inspecting the position of the solder printed on the substrate 50, and a head moving device for moving the inspection head along the XY plane (a surface parallel to the plate surface of the substrate 50). I have. The inspection head includes a light source that irradiates slit light so that a grating is formed on the surface of the substrate 50, and a camera that images the light grating formed on the surface of the substrate obliquely from two directions. The line of light that constitutes the grating formed by the irradiated slit light shifts at the place where the solder is printed with respect to the place where the solder is not printed. The amount of this shift varies depending on the thickness (height) of the solder. The solder print inspection device 14 uses such a principle and processes image data photographed by the camera, so that the position of the solder printed corresponding to each electrode pad (for example, in the case of rectangular solder) XY coordinates at the four corners) are recognized. The solder printing inspection device 14 determines whether or not the deviation between the normal position of the solder printed corresponding to each electrode pad and the actual solder position is within an allowable range, and all the solder deviations are detected. The board 50 that is within the allowable range is supplied to the next component mounting apparatus 16, and the board 50 that is not so is removed from the production line 10.

  Note that the solder print inspection apparatus 14 acquires information about the substrate 50 from the management computer 22 in advance, and based on the position information of each electrode pad formed on the substrate 50, the printed solder's normal position and displacement Set the allowable range.

  The component mounting device 16 includes a mounting head that mounts an electronic component on the substrate 50 and a head moving device that moves the mounting head along the XY plane. The mounting head includes a nozzle that can move in the Z direction (vertical direction). The component mounting apparatus 16 acquires information related to the board 50 from the management computer 22 in advance, and based on the information, the type / size / mounting position of the electronic components to be mounted on the board 50, the mounting order of the electronic components, etc. The electronic components are sequentially mounted on the board 50 in accordance with the recognition. In mounting, the component mounting device 16 adsorbs an electronic component supplied from a feeder (not shown) to the nozzle tip by applying a negative pressure to the nozzle, and moves the nozzle together with the head in the XY directions. The negative pressure of the nozzle is released at the position, and the electronic component is mounted on the target position on the substrate 50. Thereby, the terminal provided in each electronic component will be in the state which contacted the solder printed on the electrode pad. As a result, two terminals (not shown) provided on the first electronic component 60 are in contact with the first solder 54 printed on the two first electrode pads 52, and printing is performed on the four second pads 56. Four terminals (not shown) provided on the second electronic component 70 are in contact with the second solder 58 thus formed.

  The component mounting inspection device 18 includes an inspection head that inspects the position of the electronic component mounted on the substrate 50, and a head moving device that moves the inspection head along the XY plane. As with the solder printing inspection apparatus 14, the inspection head includes a light source that irradiates slit light so that a grating is formed on the surface of the substrate 50, and a camera that images the light grating formed on the surface of the substrate obliquely from two directions. And. The component mounting inspection device 18 processes image data photographed by a camera using the same principle as the solder printing inspection device 14, thereby positioning each electronic component mounted on the substrate 50 (for example, a rectangular shape). In the case of an electronic component, the four corners (XY coordinates) are recognized. Further, the component mounting inspection device 18 acquires and stores the position information of each electrode pad of the substrate 50 from the management computer 22 in advance, and acquires and stores the solder position information from the solder printing inspection device 14. Yes. The component mounting inspection device 18 predicts whether or not the mounting position of the electronic component on the electronic pad after reflow is appropriate based on the position information of the electrode pad, the position information of the solder, and the position information of the electronic component. This point will be described later in detail. The component mounting inspection device 18 supplies the substrate 50 to the reflow furnace 20 when it is predicted that the mounting positions of all electronic components will be appropriate after reflowing. Remove from the production line 10.

  The reflow furnace 20 melts the solder by heating the substrate 50 and then solidifies the solder by cooling to fix each electronic component on the electrode pad of the substrate 50.

  Next, the component mounting inspection device 18 will be described in more detail. FIG. 2 is a block diagram of the component mounting inspection apparatus 18. The component mounting inspection device 18 includes a controller 18a, an inspection head 18b, a head moving device 18c, and a storage 18d. The controller 18a is composed of a well-known CPU, ROM, RAM, and the like, and executes various control programs, for example, a component mounting inspection routine described later. The inspection head 18b includes the above-described camera and light source. This camera captures and captures image data based on a command signal from the controller 18a, and transmits the image data to the controller 18a. The light source irradiates the substrate 50 with slit light when the camera takes an image. The head moving device 18c moves the inspection head 18b along the XY plane based on a command signal from the controller 18a. The storage 18d is composed of a large-capacity memory such as a hard disk, and stores image data captured by the camera, results of analysis of the image data by the controller 18a, and the like. The component mounting inspection apparatus 18 can communicate with the management computer 22 and the solder print inspection apparatus 14 in two ways.

  Next, a component mounting inspection routine executed by the component mounting inspection apparatus 18 will be described below with reference to FIG. FIG. 3 is a flowchart of the component mounting inspection routine.

  The controller 18a of the component mounting inspection apparatus 18 starts a component mounting inspection routine each time the board 50 on which the electronic component has been mounted is conveyed from the component mounting apparatus 16. When starting this routine, the controller 18a first outputs an imaging command signal for the substrate 50 to the inspection head 18b (step S110). The controller 18a receives in advance information related to the current board 50 from the management computer 22, and stores the information in the storage 18d. When the size of the substrate 50 is within the imaging area of the camera, the controller 18a outputs a movement command to the head moving device 18c so as to position the camera above the substrate 50, and issues a shooting command to the camera after the movement is completed. Output. On the other hand, when the size of the substrate 50 does not fit in the shooting area of the camera, the controller 18a sets a plurality of shooting points, outputs a movement command to the head moving device 18c so as to move sequentially to the shooting points, and Each time it reaches, a shooting command is output to the camera. Thereby, the board | substrate 50 is image | photographed separately with a camera.

  Next, the controller 18a acquires the image data of the board 50 from the camera of the inspection head 18b, and calculates the position information of the terminals of the electronic components mounted on the board 50 (step S120). The substrate 50 has a plurality of marks for specifying XY coordinates. The XY coordinates of the mark are included in the information regarding the substrate 50 received from the management computer 22 by the controller 18a. The controller 18a calculates the position information of the electronic component (information that can specify the contour of the electronic component) based on the mark included in the image data. For example, when the electronic component is rectangular, the controller 18a obtains XY coordinates of the four corners of the electronic component. Further, terminals are provided on the back surface of the electronic component, that is, the surface facing the substrate 50. Information about how many terminals are provided in one electronic component and where the terminals are provided in the electronic component is included in the information related to the board 50 received from the management computer 22 by the controller 18a. Therefore, the controller 18a can identify the position information of the terminals of the electronic components mounted on the board 50 (the outline of the terminals) from the position information of the electronic components mounted on the board 50 and the information on the terminals acquired from the management computer 22. Information) can be calculated. For example, if the terminal is rectangular, the controller 18a determines the XY coordinates of the four corners of the terminal.

  Next, the controller 18a reads the electrode pad position information and the solder position information from the storage 18d (step S130). The electrode pad position information is one of information related to the substrate 50 received by the controller 18a from the management computer 22, and is stored in the storage 18d. The position information of the electrode pad is information that can specify the contour of the electrode pad. For example, when the electrode pad is rectangular, the position information is the XY coordinates of the four corners of the electrode pad. The solder position information is information received by the controller 18a from the solder print inspection apparatus 14 before the current board 50 is conveyed to the component mounting inspection apparatus 18, and is stored in the storage 18d. The position information of the solder is information that can specify the outline of the printed solder. For example, when the printed solder is rectangular, it is the XY coordinates of the four corners of the solder.

  Next, the controller 18a, based on the position information of the electrode pads, the position information of the solder, and the position information of the terminals of the electronic components, does not take into account the self-alignment force described later, and the electronic components for all the electrode pads after reflow It is determined whether or not it is certain that the position falls within a predetermined appropriate range (step S140). If the determination in step S140 is affirmative, the controller 18a outputs a command to the conveyor (not shown) to advance the substrate 50 to the reflow furnace 20 (step S170), and ends this routine. An example in which an affirmative determination is made in step S140 is a case where the printed solder position matches the target position and the electronic component position also matches the target position. On the other hand, if the determination in step S140 is negative, the controller 18a performs the process of step S150.

In step S150, the controller 18a calculates the self-alignment force in each electronic component based on the position information of the electrode pad, the position information of the solder, and the position information of the terminal of the electronic component. Specifically, the controller 18a first determines an overlapping region where the electrode pad, the solder, and the electronic component terminal overlap based on the positional information of the electrode pad, the positional information of the solder, and the positional information of the terminal of the electronic component. And the length L of the outer periphery of the overlap region is obtained. Next, the controller 18a calculates the product (= σ · L) of the surface tension σ of the solder and the length L of the outer periphery of the overlapping region, and uses this value as the magnitude of the self-alignment force. Further, the controller 18a obtains a direction from the center position of the overlapping region to the center position of the electrode pad, and sets this direction as the direction of the self-alignment force. For this reason, the self-alignment force is expressed as a vector quantity. Usually, a plurality of electrode pads correspond to one electronic component. That is, one electronic component has a plurality of terminals, and each of the plurality of terminals is soldered to the electrode pad. Therefore, the self-alignment force that acts on one electronic component is the sum of the self-alignment force in each electrode pad (see the following formula).
Self-alignment force acting on one electronic component =
Σ (Self-alignment force at each electrode pad)

  Here, an example in which the controller 18a calculates the self-alignment force in each electronic component will be described with reference to FIG. FIG. 4 is an explanatory diagram of the self-alignment forces FL and FR in each of the two first electrode pads 52. The first electronic component 60 has already been described with reference to FIG. 1 and is a horizontally long rectangular parallelepiped that includes one first terminal 62 on both sides of the back surface. The two first terminals 62 of the first electronic component 60 are respectively soldered to the two first electrode pads 52 provided on the substrate 50. It is assumed that the printed first solder 54 is printed with being shifted to the lower right in the drawing with respect to the first electrode pad 52 when printed by the solder printer 12. Further, it is assumed that the first electronic component 60 is mounted with being shifted to the lower left in the figure with respect to the first electrode pad 52 when mounted by the component mounting device 16. Under such circumstances, the controller 18 a calculates the self-alignment force for each first electrode pad 52. That is, regarding the left first electrode pad 52, the controller 18 a determines the position information of the left first electrode pad 52, the position information of the left first solder 54, and the position of the first terminal 62 on the left side of the first electronic component 60. Based on the information, the overlapping area AL (hatched area in the figure) where the three members overlap is obtained, the outer peripheral length L of the overlapping area AL is obtained, and the product of the solder surface tension σ and the length L is self The size of the alignment force FL is assumed. Further, the controller 18a obtains a direction from the center position CL of the overlap area AL toward the center position cL of the first electrode pad 52, and sets this direction as the direction of the self-alignment force FL. The controller 18a similarly determines the overlapping area AR and the center positions CR and cR for the first electrode pad 52 on the right side, and determines the magnitude and direction of the self-alignment force FR. Then, the controller 18a sets the sum of the self-alignment forces (vector amounts) FL and FR in the left and right first electrode pads 52 as the self-alignment force F acting on the electronic component 60.

  Returning to the flowchart of FIG. 3, after step S150, the controller 18a determines whether self-alignment is effective when the solder is reflowed, that is, the position of the electronic component relative to the electrode pad after the solder is reflowed It is predicted whether or not the range is entered (step S160). The controller 18a checks whether or not self-alignment works for each electronic component mounted on the board 50 one by one. Whether or not self-alignment works for one electronic component is determined by whether or not the self-alignment force acting on the electronic component is greater than the weight of the electronic component. That is, if the self-alignment force acting on the electronic component is larger than the weight of the electronic component, it is determined that the electronic component is effective, and otherwise, it is determined that the electronic component is not effective. If the controller 18a determines that all the electronic components mounted on the board 50 are effective in self-alignment, the controller 18a makes an affirmative determination in step S160. To do.

  If the determination in step S160 is affirmative, the controller 180a outputs a command to advance the substrate 50 to the reflow furnace to a conveyor (not shown) (step S170), and ends this routine. On the other hand, if the determination in step S160 is negative, the controller 180a outputs a command to the conveyor (not shown) to remove the substrate 50 from the production line 10 (step S180), and ends this routine.

  Here, the correspondence between the components of the present embodiment and the components of the present invention will be clarified. The component mounting inspection apparatus 18 of the present embodiment corresponds to the component mounting inspection apparatus of the present invention, and the controller 18a corresponds to a position information acquisition unit and a mounting state prediction unit.

  According to the present embodiment described above, the controller 18a allows the electronic component to the electrode pad after the step of reflowing the solder based on the positional information of the electrode pad, the printed solder, and the terminal of the mounted electronic component. It is predicted whether or not the position falls within a predetermined appropriate range. In other words, the controller 18a considers the deviation even if the position of the solder actually printed on the electrode pad is deviated from the target position or the position of the electronic component actually attached to the solder is deviated from the target position. Then, it is predicted whether or not the position of the electronic component with respect to the electrode pad after the solder reflow step falls within a predetermined appropriate range. As a result, the inspection accuracy performed before reflow in the component mounting inspection apparatus 18 is sufficiently high.

  Further, the controller 18a compares the self-alignment force and the weight of the electronic component to predict whether or not the position of the electronic component with respect to the electrode pad falls within an appropriate range. For this reason, since the controller 18a predicts a defective product when the electronic component is too heavy and the electronic component does not move to an appropriate position even if the self-alignment force is applied, the inspection accuracy is further increased.

  Further, the controller 18a obtains a product (= σ · L) of the surface tension σ of the solder and the outer peripheral length L of the overlapping region where the electrode pad, the printed solder, and the terminal of the mounted electronic component overlap. Is the magnitude of the self-alignment force. For this reason, self-alignment force can be calculated | required appropriately.

  Furthermore, when the electronic component has a plurality of terminals, the controller 18a calculates the self-alignment force as a vector amount acting on the electronic component as the sum of the self-alignment force in the electrode pad corresponding to each terminal. To do. For this reason, the self-alignment force which acts on the electronic component provided with the some terminal can be calculated | required appropriately.

  In addition, the controller 18a calculates the total self-alignment force in each electrode pad in consideration of the direction of each self-alignment force. For this reason, the self-alignment force which acts on the electronic component provided with the some terminal can be calculated | required more appropriately.

  It should be noted that the present invention is not limited to the above-described embodiment, and it goes without saying that the present invention can be implemented in various modes as long as it belongs to the technical scope of the present invention.

  For example, in the above-described embodiment, it is preferable that the controller 18a also predicts whether or not a component standing will occur at the time of reflow when performing the determination in step S160. In the case of a square electronic component having two terminals such as the first electronic component 60, if the self-alignment force between the two electrode pads is not balanced, one terminal is in contact with the solder while the other is in contact with the other. The phenomenon that the terminal floats from the solder occurs. This phenomenon is called component standing. Such component standing tends to occur when the self-alignment force f1 at one electrode pad is twice or more the self-alignment force f2 at the other electrode. That is, if the condition of 1/2 <(f1 / f2) <2 is satisfied, it is predicted that no part standing will occur, and if this condition is not satisfied, it is predicted that the part standing will occur. If the controller 18a predicts that component standing will occur, the controller 18a may determine that the self-alignment is not effective in step S160. In this way, the inspection accuracy is further increased.

  In the above-described embodiment, the magnitude of the self-alignment force is the product (= σ · L) of the surface tension σ of the solder and the length L of the outer periphery of the overlapping region. It may be a product of the area S (= σ · S), or may be obtained by an empirical formula obtained after repeating the experiment.

  In the above-described embodiment, when an electronic component has a plurality of terminals, whether or not self-alignment works for one electronic component may be determined as follows. That is, the weight of the electronic component is divided into the weight applied to each electrode pad, the self-alignment force in each electrode pad is compared with the weight applied to each electrode pad, and the self-alignment force is greater in any electrode pad. If it is larger, it may be determined that self-alignment is effective for the electronic component.

  In the above-described embodiment, the solder print inspection device 14 may expand or reduce the allowable range of deviation of the printed solder based on the statistics of the inspection result of the component mounting inspection device 18.

  In the embodiment described above, the controller 18a may determine whether or not self-alignment is effective in step S160, and then output the result to a notification unit (speaker, display, etc.). For example, the controller 18a may output the determination result through a speaker or display it through a display.

  INDUSTRIAL APPLICABILITY The present invention can be used for the inspection of the mounting state of an electronic component performed after the electronic component is mounted on the solder printed on the electrode of the substrate and before the solder is reflowed.

DESCRIPTION OF SYMBOLS 10 Production line, 12 Solder printing apparatus, 14 Solder printing inspection apparatus, 16 Component mounting apparatus, 18 Component mounting inspection apparatus, 18a Controller, 18b Inspection head, 18c Head moving apparatus, 18d Storage, 20 Reflow furnace, 22 Management computer, 50 Substrate, 52 first electrode pad, 54 first solder, 56 second electrode pad, 58 second solder, 60 first electronic component, 62 first terminal, 70 second electronic component.

Claims (6)

A component mounting inspection apparatus for inspecting the mounting state of the electronic component before reflowing the solder after mounting the electronic component on the solder printed on the electrode pad of the substrate,
Position information acquisition means for acquiring position information of the electrode pads, position information of the printed solder, and position information of terminals of the mounted electronic component;
The electrons with respect to the electrode pad after the step of reflowing the solder based on the position information of the electrode pad, the printed solder and the terminal of the mounted electronic component acquired by the position information acquisition means Mounting state prediction means for predicting whether or not the position of the component falls within a predetermined appropriate range;
A component mounting inspection device. The mounting state predicting means calculates a self-alignment force acting on the electronic component in the step of reflowing the solder, and compares the self-alignment force with the weight of the electronic component to position the electronic component with respect to the electrode pad. Predict whether or not will fall within the proper range,
The component mounting inspection apparatus according to claim 1. When the mounting state prediction means calculates the self-alignment force, the surface tension of the solder, the parameter relating to the overlapping region where the electrode pad, the printed solder, and the terminal of the mounted electronic component overlap. Calculating the self-alignment force using
The component mounting inspection apparatus according to claim 2. When the electronic component has a plurality of terminals, the mounting state predicting means calculates a self-alignment force acting on the electronic component as a sum of self-alignment forces in electrode pads corresponding to the terminals included in the electronic component. Calculate as
The component mounting inspection apparatus according to claim 2 or 3. The mounting state prediction means calculates the sum in consideration of the direction of each self-alignment force.
The component mounting inspection apparatus according to claim 4. The mounting state prediction means sets the direction of the self-alignment force to a direction from the center of the overlapping region toward the center of the electrode pad.
The component mounting inspection apparatus according to claim 5.

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