JPWO2014185435A1 - Composition for insulating material - Google Patents

Abstract

Excellent adhesion to electronic devices such as touch panels. Furthermore, the composition for insulating materials which has tolerance (chemical resistance) with respect to developing solutions, such as an organic solvent, is provided. A composition for an insulating material comprising a siloxane oligomer having a crosslinkable functional group, a polymerization initiator, and an adhesion promoter. The adhesion promoter is a coordination compound of aluminum and / or zirconium, a carbodiimide compound, a mercaptosilane. A siloxane oligomer containing a compound and having a crosslinkable functional group contains trioxysilylalkyl acrylate or trioxysilylalkyl methacrylate, further contains a polyfunctional acrylic monomer, and a poly N-methoxymethyl compound as a chemical resistance improver including.

Description

  The present invention relates to a composition for an insulating material that is a raw material for an insulating film formed on the surface of an electronic device.

  In an electronic device such as a touch panel and a flat panel display, a glass surface and a wiring region serving as a substrate are covered with an insulating film and protected from heat, moisture, impact, and the like. In forming an insulating film on an electronic device, the following steps (1) to (4) are generally performed: (1) A coating composition is formed by applying a raw material composition of an insulating film to a surface to be protected. (2) A step of placing a mask having a predetermined pattern on the coating film, (3) A step of curing a portion of the coating film not covered with the mask, (4) Using a developer The process of developing the mask pattern. Here, when the developing step (4) is carried out, there has often been a problem that the developer enters between the cured film and the electronic device and the insulating coating is peeled off. Therefore, in forming the insulating coating on the electronic device, it is important to sufficiently adhere the insulating coating to the surface of the electronic device while ensuring the resistance of the insulating coating.

  The physical properties such as resistance and adhesion of the insulating coating are affected by the composition of the raw material composition constituting the insulating coating. For example, as a raw material composition of a conventional insulating film, polysiloxane obtained by hydrolytic condensation of tetraethoxysilane and plural kinds of silane compounds, a compound having two or more ethylenically unsaturated groups, and a photo radical initiated polymerization agent Is known (for example, see Patent Document 1). This raw material composition is applied onto a substrate, and the formed coating film is irradiated with radiation in a state where a photomask having a predetermined pattern is placed, and the unirradiated portion of the cured film is dissolved with an alkali developer. By removing, the insulating film of patent document 1 is formed.

JP2012-212114A

  Generally, an electronic device is composed of a plurality of different substances, and these are exposed on the surface. For example, taking a touch panel as an example, the touch panel has a transparent electrode made of indium-tin oxide (ITO) and a drive circuit containing a metal such as molybdenum or aluminum on a glass substrate. Therefore, in order to improve the adhesion of the insulating film to the touch panel, it is necessary to use a material having high affinity for these different types of substances. Further, it is necessary to ensure the resistance (chemical resistance) of the insulating film to the developer so that the developer does not easily enter between the insulating film and the touch panel.

  In this regard, since the raw material composition of Patent Document 1 used to form the insulating film is mainly composed of a silane compound, the insulating film formed from the raw material composition is not applied to the glass substrate. It is expected to show a certain degree of adhesion. However, it is difficult to increase the adhesion and resistance of the insulating coating even to ITO constituting the transparent electrode and the metal constituting the drive circuit. The raw material composition of Patent Document 1 contains a compound having two or more ethylenically unsaturated groups in addition to the silane compound, which is added to improve the strength of the film, It does not function to improve adhesion and resistance.

  In forming an insulating film on an electronic device, it is not easy to increase adhesion to a glass substrate and at the same time to adhere to a part other than the glass substrate. On the other hand, it is difficult to realize sufficient adhesion with the conventional insulating film including the above-mentioned Patent Document 1.

  The present invention has been made in view of the above problems, and is referred to as a raw material composition of an insulating film having excellent adhesion to an electronic device such as a touch panel (hereinafter referred to as “composition for insulating material”). ). Furthermore, it aims at providing the composition for insulating materials which has tolerance (chemical resistance) with respect to developing solutions, such as an organic solvent.

In order to solve the above problems, the characteristic configuration of the composition for insulating material according to the present invention is
A siloxane oligomer having a crosslinkable functional group;
A polymerization initiator;
An adhesion promoter;
It is to include.

  Since the composition for an insulating material of this configuration includes a siloxane oligomer having a crosslinkable functional group, a polymerization initiator, and an adhesion promoter, an insulating film is formed on the surface of an electronic device using the composition for an insulating material. When the is formed, good adhesion to the constituent materials (glass, ITO, and metal) of the electronic device can be realized. As a result, the insulating coating can be prevented from peeling from the electronic device during pattern development with the developer and after pattern formation, and the quality of the electronic device can be stabilized.

In the composition for an insulating material according to the present invention,
The adhesion promoter preferably contains a coordination compound of aluminum and / or zirconium.

As a result of diligent research, the present inventors have used an aluminum and / or zirconium coordination compound as an adhesion promoter contained in an insulating material composition. It has been found that it exhibits excellent adhesion to all the constituent materials of the device (glass, ITO, and metal).
Therefore, using the composition for an insulating material containing a siloxane oligomer having a crosslinkable functional group having this structure, a polymerization initiator, and an adhesion promoter containing a coordination compound of aluminum and / or zirconium, the surface of the electronic device is used. When the insulating film is formed, the adhesion effect of the insulating film to the electronic device can be improved. As a result, the insulating coating can be prevented from peeling from the electronic device during pattern development with the developer and after pattern formation, and the quality of the electronic device can be stabilized.

In the composition for an insulating material according to the present invention,
The adhesion promoter preferably contains a carbodiimide compound.

As a result of intensive studies, the present inventors have found that when a carbodiimide compound is used as an adhesion promoter contained in the composition for an insulating material, good adhesion to molybdenum is exhibited. A carbodiimide compound has been conventionally used as a crosslinking agent, and good adhesion to molybdenum is a new finding found by the present inventors.
Therefore, when an insulating film is formed on the surface of an electronic device using a composition for an insulating material containing an adhesion promoter containing a siloxane oligomer having a crosslinkable functional group of this configuration, a polymerization initiator, and a carbodiimide compound, Good adhesion can be realized even for a drive circuit (including molybdenum) which has been difficult to adhere in the past.

In the composition for an insulating material according to the present invention,
The adhesion promoter preferably contains a mercaptosilane compound.

The mercaptosilane compound is conventionally used as an adhesive for a compound having a double bond such as rubber. However, as a result of earnest research, the present inventors have used a mercaptosilane compound for a transparent electrode. It has been found that it has good adhesion to ITO.
Therefore, when an insulating film is formed on the surface of an electronic device by using the composition for an insulating material containing a siloxane oligomer having a crosslinkable functional group of this configuration, a polymerization initiator, and an adhesion promoter containing a mercaptosilane compound, The adhesion effect of the insulating film to the electronic device can be further improved.

In the composition for an insulating material according to the present invention,
The siloxane oligomer having a crosslinkable functional group preferably contains trioxysilylalkyl acrylate or trioxysilylalkyl methacrylate.

Trioxysilylalkyl acrylate and trioxysilylalkyl methacrylate are crosslinkable silane compounds containing an acrylic group having excellent transparency.
Therefore, when the siloxane oligomer having a crosslinkable functional group is prepared so as to contain trioxysilylalkyl acrylate or trioxysilylalkyl methacrylate, the transparency of the insulating coating can be improved.

In the composition for an insulating material according to the present invention,
It is preferable to further contain a polyfunctional acrylic monomer.

The polyfunctional acrylic monomer functions as a crosslinking agent for trioxysilylalkyl acrylate and trioxysilylalkyl methacrylate.
Therefore, when the siloxane oligomer having a crosslinkable functional group contains trioxysilylalkyl acrylate or trioxysilylalkyl methacrylate, when a polyfunctional acrylic monomer is used in combination, the composition for insulating material is crosslinked and cured. Since the sensitivity is improved and the crosslinking reaction can proceed even at a low temperature, a strong insulating film having good chemical resistance can be formed.

In the composition for an insulating material according to the present invention,
As the chemical resistance improver, it is preferable to include a poly N-methoxymethyl compound or a photoacid generator.

The poly N-methoxymethyl compound is used as a thermal crosslinking agent, the photoacid generator is used as a resin curing agent, and these promote the polymerization of a siloxane oligomer having a crosslinkable functional group. Contribute to.
Therefore, when a poly N-methoxymethyl compound or a photoacid generator is added as a chemical resistance improver to the composition for an insulating material, polymerization of the siloxane oligomer having a crosslinkable functional group is promoted, and the formed insulating film Has a high hardness, and as a result, the chemical resistance of the insulating coating is improved.

FIG. 1 is a schematic view of a capacitive touch panel to which the composition for an insulating material of the present invention is applied.

  Hereinafter, the embodiment regarding the composition for insulating materials of this invention is described. In the following embodiments, a capacitive touch panel will be described as an example of an electronic device that is a target for forming an insulating film.

  FIG. 1 is a schematic view of a capacitive touch panel 100 to which the composition for an insulating material of the present invention is applied. The capacitive touch panel 100 includes a transparent electrode 20 made of ITO and a drive circuit 30 made of a metal material such as aluminum or molybdenum on a substrate glass 10. In the present embodiment, a region where the substrate glass 10 is exposed is defined as a glass region A, a region where the transparent electrode 20 is present is defined as an ITO region B, and a region where the drive circuit 30 is present is defined as a metal region C. In order to protect the glass region A, the ITO region B, and the metal region C, a composition for an insulating material is applied to the entire surface of the capacitive touch panel 100 and reacted to form an insulating film.

[Insulating material composition]
The composition for an insulating material of the present invention, which is a raw material for the insulating film, includes (a) a siloxane oligomer having a crosslinkable functional group, (b) a polymerization initiator, and (c) an adhesion promoter as a basic composition. Including. Hereinafter, these basic compositions will be described.

(A) Siloxane oligomer having a crosslinkable functional group The siloxane oligomer having a crosslinkable functional group is, for example, the following general formula (1);
CH ₂ = C (R) —COO— (CH ₂ ) _n —Si (OR ′) ₃ (1)
R: Hydrogen or methyl group R ′: Hydrolytic copolycondensation of an organosilane compound represented by any alkyl group with phenyltrialkoxysilane, methyltrialkoxysilane, and any other hydrolyzable organosilane compound The siloxane oligomer obtained by doing this is mentioned.

  Specific examples of the organic silane compound of formula (1) include, as examples of n = 1 in formula (1), acryloxymethyltrimethoxysilane, acryloxymethyltriethoxysilane, methacryloxymethyltrimethoxysilane, and Methacryloxymethyltriethoxysilane, examples of n = 2 in formula (1) include 2-acryloxyethyltrimethoxysilane, 2-acryloxyethyltriethoxysilane, 2-methacryloxyethyltrimethoxysilane, and 2- Methacryloxyethyltriethoxysilane, examples of n = 3 in formula (1) include 3-acryloxypropyltrimethoxysilane, 3-acryloxypropyltriethoxysilane, 3-methacryloxypropyltrimethoxysilane, and 3- Methacryloxypropyltriethoxysilane in formula (1) = Examples of 4, 4-acryloxy-butyl trimethoxy silane, 4-acryloxy-butyl triethoxysilane, 4-methacryloxy butyl trimethoxysilane, and 4-methacryloxy and butyl triethoxy silane. Regarding R ′ in the formula (1), when the carbon number of the alkyl group of R ′ exceeds 4, the hydrolysis polymerization reaction becomes extremely slow, so R ′ is a methyl group, an ethyl group, a propyl group, or a butyl group. It is preferable that a methyl group or an ethyl group is more preferable.

  Examples of the phenyltrialkoxysilane used for the hydrolytic copolycondensation polymerization include phenyltrimethoxysilane and phenyltriethoxysilane. Examples of methyltrialkoxysilane used for hydrolysis copolycondensation include methyltrimethoxysilane and methyltriethoxysilane.

  Other optional hydrolyzable organosilane compounds include tetramethoxysilane, tetraethoxysilane, tetraacetoxysilane, tetraisocyanatosilane, tetrakis (acetoxime) silane, trimethoxysilane, triethoxysilane, vinyltrimethoxysilane, Vinyltriethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-glycidoxypropyltrimethoxysilane, dimethyldimethoxysilane, dimethyldiethoxysilane, dimethyldiacetoxysilane, dimethylmethoxyacetoxysilane, Dimethyldiisocyanatosilane, dimethylmethoxyisocyanatosilane, dimethylbis (acetoxime) silane, methylvinyldimethoxysilane, methylphenyldimethoxysilane, and Diphenyl dimethoxy silane. These organosilane compounds can be used alone or in combination of two or more.

  Hydrolytic copolycondensation involves diluting the organic silane compound in a solvent such as ethanol, acetone, or butyl acetate as necessary, and then water and a catalytic amount of acid (hydrochloric acid, acetic acid, nitric acid, phosphoric acid, etc.) required for the reaction. ) Or a base (ammonia, triethylamine, cyclohexylamine, tetramethylammonium hydroxide, etc.) is added, and the reaction is performed under stirring and reflux conditions at an arbitrary temperature.

  The siloxane oligomer having a crosslinkable functional group preferably contains trioxysilylalkyl acrylate or trioxysilylalkyl methacrylate. Trioxysilylalkyl acrylate and trioxysilylalkyl methacrylate are crosslinkable silane compounds containing an acrylic group having excellent transparency. For this reason, when the siloxane oligomer having a crosslinkable functional group is prepared so as to contain trioxysilylalkyl acrylate or trioxysilylalkyl methacrylate, the transparency of the insulating coating can be improved.

When the siloxane oligomer having a crosslinkable functional group contains trioxysilylalkyl acrylate or trioxysilylalkyl methacrylate, it is preferable to use a polyfunctional acrylic monomer in combination. The polyfunctional acrylic monomer functions as a cross-linking agent for trioxysilylalkyl acrylate and trioxysilylalkyl methacrylate, which improves the sensitivity when the composition for insulating materials is cross-linked and cured, and further enables cross-linking reaction even at low temperatures. Can be advanced. As a result, a stronger insulating film can be formed. Examples of the polyfunctional acrylic monomer include (a-1) a bifunctional acrylate, (a-2) a trifunctional acrylate, and (a-3) a tetrafunctional or higher acrylate. Examples of usable polyfunctional acrylic monomers are as follows. In the following description, “(meth) acrylate” represents methacrylate or acrylate. "EO-modified" is ethoxylated (meth) acrylates, specifically, -OCOCH = CH ₂ or _{-OCO-C (CH} 3) = instead of _{CH 2, - (OC 2 H} 4) n - OCOCH═CH ₂ or — (OC ₂ H ₄ ) _n —OCOC (CH ₃ ) ═CH ₂ represents an ethoxy acrylate having a structure where n is a positive integer. "PO-modified" was propoxylated (meth) acrylates, specifically, -OCOCH = CH ₂ or _{-OCO-C (CH} 3) = instead of _{CH 2, - (OC 3 H} 6) n - OCOCH═CH ₂ or — (OC ₃ H ₆ ) _n —OCOC (CH ₃ ) ═CH ₂ represents a propoxy acrylate having a structure where n is a positive integer.

(A-1) Bifunctional acrylate 1,3-butylene glycol (meth) acrylate, 1,4-butanediol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, 1,9-nonanediol Di (meth) acrylate, 1,10-decanediol di (meth) acrylate, neopentyl glycol (meth) acrylate, tricyclodecane dimethanol di (meth) acrylate, hydroxypivalic acid neopentyl glycol di (meth) acrylate, Diethylene glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, tetraethylene glycol di (meth) acrylate, polyethylene glycol (200) di (meth) acrylate, polyethylene glycol (400) di (meth) acrylate Rate, polyethylene glycol (600) di (meth) acrylate, dipropylene glycol di (meth) acrylate, tripropylene glycol di (meth) acrylate, tetrapropylene glycol di (meth) acrylate, polypropylene glycol (200) di (meth) acrylate , Polypropylene glycol (400) di (meth) acrylate, polypropylene glycol (600) di (meth) acrylate, EO-modified 1,6-hexanediol di (meth) acrylate, PO-modified 1,6-hexanediol di (meth) acrylate , EO-modified neopentyl glycol di (meth) acrylate, PO-modified neopentyl glycol di (meth) acrylate, EO-modified bisphenol A di (meth) acrylate, PO-modified bisphenol Nord A di (meth) acrylate, tris (2-hydroxyethyl) isocyanurate di (meth) acrylate.

(A-2) Trifunctional acrylate trimethylolpropane tri (meth) acrylate, EO modified trimethylolpropane tri (meth) acrylate, PO modified trimethylolpropane tri (meth) acrylate, glycerin tri (meth) acrylate, EO modified glycerin Tri (meth) acrylate, PO-modified glycerin tri (meth) acrylate, pentaerythritol tri (meth) acrylate, EO-modified pentaerythritol tri (meth) acrylate, PO-modified pentaerythritol tri (meth) acrylate, Tris (2-hydroxyethyl) Isocyanuric acid tri (meth) acrylate, ε-caprolactone-modified tris (2-hydroxyethyl) isocyanuric acid tri (meth) acrylate, triallyl isocyanuric acid.

(A-3) Tetrafunctional or higher acrylate ditrimethylolpropane tetra (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, EO-modified ditrimethylol Propane tetra (meth) acrylate, EO modified pentaerythritol tetra (meth) acrylate, EO modified dipentaerythritol penta (meth) acrylate, EO modified dipentaerythritol hexa (meth) acrylate, PO modified ditrimethylolpropane tetra (meth) acrylate, PO-modified pentaerythritol tetra (meth) acrylate, PO-modified dipentaerythritol penta (meth) acrylate, PO-modified dipentaerythritol Ruhekisa (meth) acrylate.

(B) Polymerization initiator As the polymerization initiator, a photopolymerization initiator or a thermal polymerization initiator can be used, but a photoradical generator used in general negative photolithography is preferred. Specifically, 2,2-dimethoxy-1,2-diphenylethane-1-one, 1-hydroxycyclohexyl-phenyl ketone, 2-hydroxy-2-methyl-1-phenyl-propan-1-one, 1- [4- (2-hydroxyethoxy) -phenyl] -2-hydroxy-2-methyl-1-propan-1-one, and 2-hydroxy-1- {4- [4- (2-hydroxy-2-methyl) Benzylmethyl ketals such as -propionyl) -benzyl] phenyl} -2-methyl-propan-1-one; 2-methyl-1- (4-methylthiophenyl) -2-morpholinopropan-1-one, 2-benzyl 2-dimethylamino-1- (4-morpholinophenyl) -butan-1-one, and 2- (dimethylamino) -2-[(4-methylphenyl) methyl ] Α-aminoalkylphenones such as 1- [4- (4-morpholinyl) phenyl] -1-butan-1-one; 2,4,6-trimethylbenzoyldiphenylphosphine oxide, and bis (2,4,4) Acylphosphine oxides such as 6-trimethylbenzoyl) -phenylphosphine oxide; bis (η5-2,4-cyclopentadien-1-yl) -bis (2,6-difluoro-3- (1H-pyrrol-1-yl) ) -Phenyl) titanium and the like; 1- [4- (phenylthio) phenyl] -1,2-octanedione 2-O-benzoyloxime, ethanone 1- [9-ethyl-6- (2-methylbenzoyl) Oxime esters such as -9H-carbazol-3-yl] -1- (O-acetyloxime); benzophenone, 4 Methylbenzophenone, 4-trimethylbenzophenone, 4-phenylbenzophenone, 4- (4'-methylphenylthio) benzophenone, methyl 2-benzoylbenzoate, 4,4'-bis (dimethylamino) benzophenone, and 4,4'- Benzophenones such as bis (diethylamino) benzophenone; 2-isopropylthioxanthone (ITX), 4-isopropylthioxanthone, 2,4-diethylthioxanthone, 2,4-diethylthioxanthone, 2,4-diisopropylthioxanthone, 2-chlorothioxanthone, and Thioxanthones such as 1-chloro-4-propoxythioxanthone; 2-ethylanthraquinone, camphorquinone, benzyl, benzoin isopropyl ether, benzoin isobutyl ether, , 2'-bis (2-chlorophenyl) -4,5,4 ', 5'-tetraphenyl-2'H- (1,2')-biimidazole (BCIM), 10-butyl-2-chloroacridone And tris (4-dimethylaminophenyl) methane. These polymerization initiators can be used alone or in combination of two or more. Further, for the purpose of improving sensitivity and shifting the photosensitive wavelength range, it can be combined with any photosensitizer.

  The addition amount of a polymerization initiator is 0.5-40 weight part with respect to 100 weight part of siloxane oligomers which have a crosslinkable functional group, Preferably it is 1-20 weight part. If the addition amount is less than 0.5 parts by weight, the photosensitivity becomes insufficient.

(C) Adhesion promoter The adhesion promoter improves the adhesion of an insulating coating formed by reacting the composition for an insulating material of the present invention to an electronic device. As a result of intensive studies, the present inventors have found that (c-1) a coordination compound of aluminum and / or zirconium, (c-2) a carbodiimide compound, and (c-3) a mercaptosilane as particularly effective adhesion promoters. The compound was found. Hereinafter, each compound will be described. (C-1) The coordination compound of aluminum and / or zirconium is preferably used in the form of a “chelate compound” which is a kind of “coordination compound”. Therefore, in the following description, the “coordinating compound of aluminum and / or zirconium” will be specifically described by taking “a chelate compound of aluminum and / or zirconium” as an example.

(C-1) Aluminum and / or Zirconium Chelate Compound Aluminum and / or zirconium chelate compound is used as a substance that improves the adhesion of the insulating coating. The chelate compound of aluminum and / or zirconium has adhesiveness regardless of the material. Therefore, the chelate compound of aluminum and / or zirconium is useful for improving the adhesion of the insulating coating to all of the glass region A, ITO region B, and metal region C shown in FIG.

  The aluminum chelate compound can be synthesized by reacting 0.5 to 3 equivalents of a chelating agent with aluminum alkoxide. Examples of the aluminum alkoxide include trimethoxyaluminum, triethoxyaluminum, tri-n-propoxyaluminum, triisopropoxyaluminum, tributoxyaluminum, triisobutoxyaluminum, trisec-butoxyaluminum, and tritert-butylaluminum. The zirconium chelate compound can be synthesized by reacting a zirconium alkoxide with 0.5 to 4 equivalents of a chelating agent. Chelating agents used for the reaction with aluminum and zirconium include acetylacetone, cyclopentane-1,3-dione, cyclohexane-1,3-dione, benzoylacetone, methyl acetoacetate, ethyl acetoacetate, methyl benzoylacetate, benzoyl Β-diketones such as ethyl acetate, methyl 4-methoxybenzoyl acetate, and ethyl 4-methoxybenzoyl acetate; triethanolamine, diethanolamine, N-methyldiethanolamine, monoethanolamine, N-methylethanolamine, and N, N- Examples include alkanolamines such as dimethylethanolamine. The above aluminum chelate compound and zirconium chelate compound can be used as they are, but can also be used as a partial hydrolysis product to which a small amount of water is added.

  The amount of the aluminum and / or zirconium chelate compound added is 0.1 to 20 parts by weight, preferably 1 to 10 parts by weight, based on 100 parts by weight of the siloxane oligomer having a crosslinkable functional group. If the added amount is less than 0.1 parts by weight, the effect is not exhibited. If the added amount is more than 20 parts by weight, the hardness of the film is lowered, which may cause white turbidity and coloring.

(C-2) Carbodiimide compound Although the carbodiimide compound is originally used as a crosslinking agent, in the present invention, it is used as a substance that improves the adhesion of the insulating coating. The carbodiimide compound exhibits good adhesion particularly to a metal (such as molybdenum). Therefore, the carbodiimide compound is useful for improving the adhesion of the insulating film to the metal region C shown in FIG.

  The carbodiimide compound has a —N═C═N— bond in the skeleton. The carbodiimide compound is obtained by, for example, carbodiimidizing polyisocyanate by a carbon dioxide condensation reaction in the presence of a phospholene oxide carbodiimidization catalyst such as 3-methyl-1-phenyl-2-phospholene-1-oxide. can get. Examples of the polyisocyanate include hexamethylene diisocyanate, xylylene diisocyanate, 2,2,4-trimethylhexamethylene diisocyanate, 1,12-diisocyanate decane, norbornane diisocyanate, 2,4-bis (8-isocyanate octyl) -1, Examples include 3-dioctylcyclobutane, 4,4′-dicyclohexylmethane diisocyanate, tetramethylxylylene diisocyanate, isophorone diisocyanate, 2,4,6-triisopropylphenyl diisocyanate, 4,4′-diphenylmethane diisocyanate, and tolylene diisocyanate. . Commercially available carbodiimide resins such as carbodilite V-03, V-05, V-07, V-09 (manufactured by Nisshinbo Co., Ltd.) can also be used.

  The addition amount of the carbodiimide compound is 0.5 to 200 parts by weight, preferably 5 to 50 parts by weight, based on 100 parts by weight of the siloxane oligomer having a crosslinkable functional group. If the added amount is less than 0.5 parts by weight, the effect is lost, and if it is more than 50 parts by weight, the heat resistance of the film is deteriorated, and it may cause cloudiness and coloring.

(C-3) Mercaptosilane Compound The mercaptosilane compound is originally used as an adhesive for a compound having a double bond such as rubber. In the present invention, the mercaptosilane compound is a substance that improves the adhesion of the insulating coating. used. Mercaptosilane compounds exhibit particularly good adhesion to ITO. Therefore, the mercaptosilane compound is useful for improving the adhesion of the insulating film to the ITO region B shown in FIG.

The mercaptosilane compound has the following general formula (2):
(HS (CH ₂ ) _n ) _1-m (CH ₃ ) _m Si (OR) _3-m (2)
n: integer of 0 to 4 m: integer of 0 to 1 R: a silane coupling agent having a mercapto group represented by an arbitrary alkyl group.

  Specific examples of the silane coupling agent represented by formula (2) include trimethoxysilane thiol, triethoxysilane thiol, (mercaptomethyl) trimethoxysilane, (mercaptomethyl) triethoxysilane, and (2-mercaptoethyl) trimethoxy. Silane, (2-mercaptoethyl) triethoxysilane, (3-mercaptopropyl) trimethoxysilane, (3-mercaptopropyl) triethoxysilane, (4-mercaptobutyl) trimethoxysilane, (3-mercaptobutyl) triethoxy Silane, methyldimethoxysilanethiol, methyldiethoxysilanethiol, methyl (mercaptomethyl) dimethoxysilane, methyl (mercaptomethyl) diethoxysilane, methyl (2-mercaptoethyl) dimethoxysilane, methyl (2-me Captoethyl) diethoxysilane, methyl (3-mercaptopropyl) dimethoxysilane, methyl (3-mercaptopropyl) diethoxysilane, methyl (4-mercaptobutyl) dimethoxysilane, and methyl (3-mercaptobutyl) diethoxysilane Can be mentioned. Among these, (3-mercaptopropyl) trimethoxysilane and (3-mercaptopropyl) triethoxysilane are preferably used because they have a high effect as an adhesion improver and are easily available.

  The addition amount of a mercaptosilane compound is 0.01-25 weight part with respect to 100 weight part of siloxane oligomers which have a crosslinkable functional group, Preferably it is 0.1-10 weight part. If the addition amount is less than 0.01 parts by weight, the effect is lost, and if it is more than 25 parts by weight, the heat resistance of the film is deteriorated. In addition, since it takes time to dry the membrane, it is also uneconomical.

  The composition for an insulating material of the present invention is an organic solvent used in the development step in addition to the above-mentioned (a) siloxane oligomer having a crosslinkable functional group, (b) a polymerization initiator, and (c) an adhesion promoter. In order to improve resistance to chemicals (chemical resistance), chemical resistance improvers can be included. Examples of the chemical resistance improver include (d-1) a poly N-methoxymethyl compound and (d-2) a photoacid generator.

(D-1) Poly N-methoxymethyl compound The poly N-methoxymethyl compound is used as a thermal crosslinking agent, and contributes to the promotion of polymerization of a siloxane oligomer having a crosslinkable functional group in the present invention. A poly N-methoxymethyl compound is a compound containing a methylated methylol group (NCH ₂ OCH ₃ ) bonded to one or more nitrogen atoms in the molecule. Specifically, methylated methylol melamine resins such as Nicalac MW-30HM, MW-390, MW-100LM, MX-750LM (manufactured by Sanwa Chemical Co., Ltd.), Nicalac MX-270, MX-280, MX-290 Examples thereof include methylated urea derivatives represented by Sanwa Chemical Co., Ltd. When the composition for insulating material of the present invention contains a poly N-methoxymethyl compound, the formed insulating film has high hardness, and the resistance of the insulating film such as an organic solvent to the developer (chemical resistance). Will improve.

  The addition amount of the poly N-methoxymethyl compound is 0.01 to 25 parts by weight, preferably 0.1 to 10 parts by weight, based on 100 parts by weight of the siloxane oligomer having a crosslinkable functional group. If the addition amount is less than 0.01 parts by weight, the effect is lost, and if it is more than 25 parts by weight, the heat resistance of the film is deteriorated. In addition, since it takes time to dry the membrane, it is also uneconomical.

(D-2) Photoacid generator The photoacid generator is originally used as a curing agent such as an epoxy resin, and contributes to the promotion of polymerization of a siloxane oligomer having a crosslinkable functional group in the present invention. As the photoacid generator, one having sensitivity to g-line (wavelength 463 nm) or i-line (wavelength 365 nm) is used. Specifically, 2- (4-methoxystyryl) -4,6-bistrichloromethyl-1,3,5-triazine, and 2- [2- (5-methylfuran-2-yl) vinyl] -4 1,6-bistrichloromethyl-1,3,5-triazine substituted trichloromethyltriazine; trifluoromethanesulfonic acid N-hydroxynaphthalimide and perfluorobutanesulfonic acid N-hydroxy-5-norborene-2,3- Salts of N-hydroxydicarboxylic imides such as dicarboximide; diazide disulfones such as bis (4-methylphenylsulfonyl) diazomethane; onium salts such as triarylsulfonium hexafluorophosphate and diaryl iodonium hexafluorophosphate Can be mentioned. In addition, photocation generators such as onium salts that can be used for curing epoxy resins and having sensitivity on the lower wavelength side of less than 365 nm, and electron transfer dyes such as suitable acridine, coumarin, and aromatic condensed ring compounds It is also possible to use in combination with a sensitizer. The photoacid generator can also be used in combination with the above-mentioned poly N-methoxymethyl compound. When the composition for insulating materials of the present invention contains a photoacid generator, the formed insulating film has high hardness, and the resistance (chemical resistance) to the developer of the insulating film such as an organic solvent is improved. To do.

  The addition amount of a photo-acid generator is 0.01-30 weight part with respect to 100 weight part of siloxane oligomers which have a crosslinkable functional group, Preferably it is 0.1-15 weight part. If the amount added is less than 0.01 parts by weight, the effect is lost. When the addition amount is more than 30 parts by weight, the photoacid generator remains as an unstable impurity in the film, and the characteristics (heat resistance, etc.) of the film are impaired. It is also uneconomical.

  In forming the insulating film on the electronic device, for example, the composition for insulating material is reacted by solution polymerization. In this case, the composition for an insulating material is used in a state dissolved in (e) a solvent. Examples of usable solvents are shown below.

(E) Solvent methanol, ethanol, n-propyl alcohol, isopropyl alcohol, n-butyl alcohol, isobutyl alcohol, sec-butyl alcohol, tert-butyl alcohol, n-amyl alcohol, isoamyl alcohol, 2-methylbutanol, sec-amyl Alcohol, n-hexyl alcohol, 2-methylpentanol, 2-ethylbutanol, n-heptyl alcohol, n-octyl alcohol, 2-ethylhexanol, n-decyl alcohol, cyclohexanol, cyclohexane methanol, 2-methylcyclohexanol, Benzyl alcohol, 3-methoxy-1-butanol, diacetone alcohol, propylene glycol, 1,2-butanediol, 1,3-butanediol, diethylene glycol Call, and alcohol solvents such as dipropylene glycol.

  Acetone, methyl ethyl ketone, methyl n-propyl ketone, methyl isopropyl ketone, methyl n-butyl ketone, methyl isobutyl ketone, methyl n-amyl ketone, methyl isoamyl ketone, methyl n-hexyl ketone, dipropyl ketone, diisobutyl ketone, cyclohexanone, cyclopentanone , Ketone solvents such as 2-methylcyclohexanone, acetylacetone, γ-butyrolactone, and γ-valerolactone.

  Ethers such as di-n-propyl ether, diisopropyl ether, di-n-butyl ether, di-n-amyl ether, methyltetrahydrofuran, and dioxane;

  Ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol mono n-propyl ether, ethylene glycol monoisopropyl ether, ethylene glycol mono n-butyl ether, ethylene glycol monoisobutyl ether, ethylene glycol monophenyl ether, diethylene glycol monomethyl ether, diethylene glycol mono Ethyl ether, diethylene glycol mono n-propyl ether, diethylene glycol monoisopropyl ether, diethylene glycol mono n-butyl ether, diethylene glycol monoisobutyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol n-propyl ether , Propylene glycol isopropyl ether, propylene glycol n-butyl ether, propylene glycol isobutyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, dipropylene glycol n-propyl ether, dipropylene glycol isopropyl ether, dipropylene glycol n-butyl ether , Glycol monoethers such as dipropylene glycol isobutyl ether and butylene glycol monomethyl ether.

  Glycol monoacylates such as ethylene glycol monoacetate, diethylene glycol monoacetate, triethylene glycol monoacetate, propylene glycol monoacetate, and dipropylene glycol monoacetate.

  Ethylene glycol monomethyl ether acetate, ethylene glycol monomethyl ether propionate, ethylene glycol monoethyl ether acetate, ethylene glycol mono n-propyl ether acetate, ethylene glycol monoisopropyl ether acetate, ethylene glycol mono n-butyl ether acetate, ethylene glycol monoisobutyl ether Acetate, ethylene glycol monophenyl ether acetate, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, diethylene glycol mono n-propyl ether acetate, diethylene glycol monoisopropyl ether acetate, diethylene glycol mono n-butyl ether acetate Tate, diethylene glycol monoisobutyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol mono n-propyl ether acetate, propylene glycol monoisopropyl ether acetate, propylene glycol mono n-butyl ether acetate, propylene glycol monoisobutyl ether Acetate, dipropylene glycol monomethyl ether acetate, dipropylene glycol monoethyl ether acetate, dipropylene glycol mono n-propyl ether acetate, dipropylene glycol monoisopropyl ether acetate, dipropylene glycol mono n-butyl ether acetate, and di Glycol monomethyl ether acylates such as Russia propylene glycol monoisobutyl ether acetate.

  Ethylene glycol dimethyl ether, ethylene glycol diethyl ether, ethylene glycol methyl ethyl ether, ethylene glycol di n-propyl ether, ethylene glycol diisopropyl ether, ethylene glycol di n-butyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol methyl ethyl ether, diethylene glycol methyl n -Propyl ether, diethylene glycol methyl isopropyl ether, diethylene glycol methyl n-butyl ether, diethylene glycol di n-propyl ether, diethylene glycol diisopropyl ether, diethylene glycol di n-butyl ether, diethylene glycol methyl n-hexyl ether Ter, triethylene glycol dimethyl ether, triethylene glycol diethyl ether, triethylene glycol methyl ethyl ether, triethylene glycol methyl n-butyl ether, triethylene glycol di n-butyl ether, triethylene glycol methyl n-hexyl ether, propylene glycol dimethyl ether, propylene Glycol methyl ethyl ether, propylene glycol diethyl ether, propylene glycol di n-propyl ether, propylene glycol diisopropyl ether, propylene glycol di n-butyl ether, propylene glycol diisobutyl ether, dipropylene glycol dimethyl ether, dipropylene glycol methyl ethyl ether, dipropylene glycol Diethyl ether, dipropylene glycol methyl n-butyl ether, dipropylene glycol di n-propyl ether, dipropylene glycol di n-butyl ether, dipropylene glycol diisobutyl ether, and dipropylene glycol methyl mono n-hexyl ether Kind.

  Glycol diacylates such as ethylene glycol diacetate, diethylene glycol diacetate, triethylene glycol diacetate, propylene glycol diacetate, propylene glycol diacetate, and propylene glycol diacetate.

  Ethyl acetate, n-propyl acetate, isopropyl acetate, n-butyl acetate, isobutyl acetate, sec-butyl acetate, n-amyl acetate, isoamyl acetate, 3-methoxybutyl acetate, 2-ethylbutyl acetate, 2-ethylhexyl acetate, benzyl acetate , Cyclohexyl acetate, 2-methylcyclohexyl acetate, methyl acetoacetate, ethyl acetoacetate, ethyl propionate, n-butyl propionate, isoamyl propionate, methyl methoxypropionate, methyl lactate, ethyl lactate, n-butyl lactate, and lactic acid Esters such as ester solvents such as n-amyl.

  Ethylene glycol, ethyl ether propionate, ethylene glycol methyl ether acetate, ethylene glycol ethyl ether acetate, diethylene glycol methyl ether acetate, diethylene glycol ethyl ether acetate, diethylene glycol n-butyl ether acetate, propylene glycol methyl ether acetate, propylene glycol ethyl ether acetate, propylene Ether acetate solvents such as glycol propyl ether acetate, dipropylene glycol methyl ether acetate, and dipropylene glycol ethyl ether acetate.

  Acetonitrile, N-methylpyrrolidinone, N-ethylpyrrolidinone, N-propylpyrrolidinone, N-butylpyrrolidinone, N-hexylpyrrolidinone, N-cyclohexylpyrrolidinone, N, N-dimethylformamide, N, N-dimethylacetamide, and N, N-dimethyl sulfoxide and the like.

  Of the above solvents, glycol ethers are preferable, and particularly preferable solvents are propylene glycol monomethyl ether, propylene glycol monopropyl ether, and propylene glycol monomethyl ether acetate. Moreover, said solvent can be used individually or in combination of 2 or more types.

  In the composition for insulating materials of the present invention, (f) other additives may be contained. Other additives are exemplified below.

(F) Other additives : oligomers such as polyurethane acrylate, polyepoxy acrylate, and acrylic-modified polydimethylsiloxane; surfactants; filler materials such as silica powder, alumina powder, and zirconia powder; pigments such as carbon black and phthalocyanine . The addition amount of other additives is appropriately adjusted according to the type of additive, the formation conditions of the insulating film, and the like.

  About the composition for insulating materials of this invention, the evaluation test of the adhesiveness with respect to an electronic device and the tolerance (chemical resistance) with respect to an organic solvent was done. The compositions for insulating materials prepared according to the present invention are designated as Examples 1 to 21, and the compositions for insulating materials prepared for comparison are designated as Comparative Examples 1 to 5.

<Adhesion test: Examples 1 to 13 and Comparative Example 1>
Assuming the glass region A, ITO region B, and metal region C in the capacitive touch panel 100 shown in FIG. 1, three types of substrates (glass substrate, ITO substrate, metal substrate) having different surface materials were produced. As the glass substrate, a chemically strengthened alkali aluminosilicate glass (Corning cover glass trade name “Gorilla (registered trademark)”, 0.7 mm thickness, 40.5 cm × 46 cm) ultrasonically cleaned with pure water was used. As the ITO substrate, after the glass substrate was washed, ITO was formed into a film with a thickness of 150 nm by a sputtering method, annealed in air at 150 ° C. for 30 minutes, and then ultrasonically washed again with pure water. After the glass substrate is washed, Mo, Al, and Mo are successively formed into a thickness of 50 nm, 200 nm, and 50 nm, respectively, in this order by a sputtering method, ultrasonically washed with pure water, and then dried by spraying nitrogen gas. We used what we did.

Table 1 shows the composition of the insulating material composition in Examples 1 to 13 and Comparative Example 1, and the results of the adhesion evaluation test of the insulating coating formed from the insulating material composition. The composition for an insulating material was prepared as a coating solution by aging a mixture of the components according to the composition shown in Table 1 for a whole day and night. The insulating composition (coating solution) was applied to each substrate using a spin coater (1000 rpm), dried at 100 ° C. for 1 minute, and then exposed to ultraviolet rays (wavelength: 365 nm, intensity: 100 mJ / cm ² ). Thereafter, development was performed using a 2.38% tetramethylammonium hydroxide aqueous solution for 1 minute, washing with water and air drying, followed by heat treatment at 150 ° C. for 15 minutes to form a transparent insulating film on the substrate. The film thickness of the insulating coating at this time was 3 to 5 μm. The adhesion test is performed according to the cross-cut method, cross-cut tape method, and cross-cut method specified in the former “JIS K5400 paint general test method”. Rated by stage. Specifically, eleven scratches were formed on the insulating coating on the substrate at intervals of 1 mm using a cutter knife, and a total of 100 square areas of 1 mm × 1 mm were formed. An adhesive tape was pressure-bonded onto this using a rubber roller, and then the adhesive tape was peeled off, and the number of square areas detached from the substrate was counted.

  Each composition shown in Table 1 is explained below. The unit of the blending amount (numerical value) in each example and comparative example is parts by weight. In Table 1, the chemical resistance evaluation test results are also shown for reference.

[1] PMQC:
It is a phenylmethylsiloxane polymer containing 20 mol% of methacryloxy groups, and corresponds to the “siloxane oligomer having a crosslinkable functional group” described in the above embodiment. PMQC is commercially available from APM and has, for example, the following chemical structural formula.

[２]ＰＧＭＥＡ：
プロピレングリコールモノメチルエータルアセテートであり、上記実施形態で説明した「溶媒」に相当する。
[３]ＢＡＰＯ：
ビス（２，４，６−トリメチルベンゾイル）−フェニルホスフィンオキシドであり、上記実施形態で説明した「重合開始剤」に相当する。ＢＡＰＯは、ＢＡＳＦ社より商品名「イルガキュア（登録商標）８１９」として市販されている。
[４]ＭＷ−３９０：
メチル化メラミン樹脂であり、上記実施形態で説明した「ポリＮ−メトキシメチル化合物」に相当する。ＭＷ−３９０は、株式会社三和ケミカルより市販されている。
[５]ＡＰ−Ａ：
上記実施形態で説明した「アルミニウムのキレート化合物」に相当する。ＡＰ−Ａは、アルミニウムトリｓｅｃ−ブトキシド（ワコーケミカル社製）１０ｇにアセト酢酸エチル（ワコーケミカル社製）７．９ｇを混合し、１時間静置後、１ｍｏｌ／ｋｇの硝酸水溶液０．７５ｇを添加し、２−プロパノールで１００ｇに希釈して生成した。
[６]ＡＰ−Ｚ：
上記実施形態で説明した「ジルコニウムのキレート化合物」に相当する。ＡＰ−Ｚは、８０％ジルコニウムテトラｎ−ブトキシドブタノール溶液（アルドリッチ社製）２０ｇにアセト酢酸エチル（ワコーケミカル社製）８．２ｇを混合し、１時間静置後、１ｍｏｌ／ｋｇの硝酸水溶液０．７５ｇを添加し、２−プロパノールで１００ｇに希釈して生成した。
[７]Ｖ−０７：
カルボジライト油性樹脂用改質剤であり、上記実施形態で説明した「カルボジイミド化合物」に相当する。Ｖ−０７は、日清紡ケミカル社より市販されている
[８]ＳＨＴＥＳ：
３−メルカプトプロピルトリエトキシシランであり、上記実施形態で説明した「メルカプトシラン化合物」に相当する。

[2] PGMEA:
Propylene glycol monomethyl ether acetate, which corresponds to the “solvent” described in the above embodiment.
[3] BAPO:
Bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide, which corresponds to the “polymerization initiator” described in the above embodiment. BAPO is commercially available from BASF under the trade name “Irgacure (registered trademark) 819”.
[4] MW-390:
It is a methylated melamine resin and corresponds to the “poly N-methoxymethyl compound” described in the above embodiment. MW-390 is commercially available from Sanwa Chemical Co., Ltd.
[5] AP-A:
This corresponds to the “aluminum chelate compound” described in the above embodiment. AP-A was prepared by mixing 7.9 g of ethyl acetoacetate (manufactured by Wako Chemical Co., Ltd.) with 10 g of aluminum tri-sec-butoxide (manufactured by Wako Chemical Co., Ltd.) and letting it stand for 1 hour. Added and diluted to 100 g with 2-propanol.
[6] AP-Z:
This corresponds to the “zirconium chelate compound” described in the above embodiment. AP-Z was mixed with 20 g of an 80% zirconium tetra-n-butoxide butanol solution (Aldrich) mixed with 8.2 g of ethyl acetoacetate (Wako Chemical Co.), allowed to stand for 1 hour, and then added with a 1 mol / kg nitric acid aqueous solution. .75 g was added and diluted to 100 g with 2-propanol.
[7] V-07:
It is a modifier for carbodilite oil-based resin and corresponds to the “carbodiimide compound” described in the above embodiment. V-07 is commercially available from Nisshinbo Chemical Co., Ltd.
[8] SHTES:
It is 3-mercaptopropyltriethoxysilane and corresponds to the “mercaptosilane compound” described in the above embodiment.

  From Table 1, the insulating film formed from the composition for insulating materials of Examples 1 to 13 prepared according to the composition of the present invention is 1B to 5B good for any of the glass substrate, the ITO substrate, and the metal substrate. Showed good adhesion. It was also confirmed that adhesion was improved when (c-1) aluminum and / or zirconium chelate compound, (c-2) carbodiimide compound, and (c-3) mercaptosilane compound were used in combination as adhesion promoters. It was done. In particular, Example 13 using three types of adhesion promoters showed pore adhesion (5B) for all glass substrates, ITO substrates, and metal substrates. On the other hand, Comparative Example 1 containing no adhesion promoter resulted in poor adhesion (0B) to any of the glass substrate, ITO substrate, and metal substrate.

  Table 2 summarizes the effects of single use and combination use of adhesion promoters in the insulating material composition. Regarding the symbols in Table 2, “−” means poor adhesion, “+” means good adhesion, and “++” means very good adhesion. As shown in Table 2, it became clear that excellent adhesion could be obtained by combining an appropriate adhesion promoter depending on the type of substrate.

<Chemical resistance test: Examples 14 to 21, Comparative Examples 2 to 5>
A substrate on which an insulating film is formed in the same manner as in Examples 1 to 13 is immersed in a drug (organic solvent) in which 60 parts by weight of dimethyl sulfoxide and 40 parts by weight of monoethanolamine are mixed, and immersed for 5 minutes at 65 ° C. The chemical resistance of the insulating coating was evaluated from the rate of change (%) in film thickness before and after. The film thickness of the insulating coating was measured by a light interference type film thickness measuring device (NanoSpec / AFT 5100) manufactured by Nanometrics. The film thickness of the insulating coating before immersion was 4.0 μm.

  Table 3 shows the composition of the composition for insulating material in Examples 14 to 21 and Comparative Examples 2 to 5, and the results of the chemical resistance evaluation test for the insulating coating formed from the composition for insulating material.

  For each composition shown in Table 3, the composition not shown in Table 1 will be described below. The unit of the blending amount (numerical value) in each example and comparative example is parts by weight. For reference, Table 3 also shows the results of the adhesion evaluation test.

[9] TMPTA:
Trimethylolpropane acrylate, which corresponds to the “polyfunctional acrylic monomer” described in the above embodiment.
[10] DPHA:
It is dipentaerythritol hexaacrylate and corresponds to the “multifunctional acrylic monomer” described in the above embodiment.
[11] MMP:
Methyl methoxypropionate, which corresponds to the “solvent” described in the above embodiment.
[12] TRI-A:
It is 2- (4-methoxystyryl) -4,6-bistrichloromethyl-1,3,5-triazine and functions as a photoacid generator.
[13] ITX:
2-Isopropylthioxanthone, which corresponds to the “polymerization initiator” described in the above embodiment.
[14] DMAB-EH:
It is 2-ethylhexyl 4-dimethylaminobenzoate and functions as an auxiliary agent for the polymerization initiator.

  From Table 3, the insulation film formed from the composition for insulating materials of Examples 14 to 21 prepared according to the composition of the present invention has a small measured value of change in film thickness (−0.3% to 0.1%). ) Substantially no change in film thickness was observed. That is, it was confirmed that these insulating coatings have excellent resistance to solvents. On the other hand, in Comparative Examples 2 and 4 that did not contain a chemical resistance improver, the change in the film thickness of the insulating coating was large (15%, 18%), and it was not practically usable. In Comparative Examples 3 and 5, since the chemical resistance improver is contained in the composition for insulating material, the change in the film thickness of the insulating coating is smaller than in Comparative Examples 2 and 4, but the present invention However, it was not sufficient because it did not contain an adhesion promoter (c) which is a basic composition of Accordingly, it has been found that in order to improve the chemical resistance of the insulating coating, it is necessary to contain an adhesion promoter and a chemical resistance improver in the composition for insulating material.

  The composition for an insulating material of the present invention can be used to form an insulating film used for an electronic device such as a touch panel and a flat panel display, but has excellent adhesion to metal and glass. It can also be used for surface treatment, decoration, painting, etc.

Claims (7)

A siloxane oligomer having a crosslinkable functional group;
A polymerization initiator;
An adhesion promoter;
A composition for an insulating material.   The composition for an insulating material according to claim 1, wherein the adhesion promoter includes a coordination compound of aluminum and / or zirconium.   The composition for an insulating material according to claim 1, wherein the adhesion promoter includes a carbodiimide compound.   The said adhesion promoter is a composition for insulating materials as described in any one of Claims 1-3 containing a mercaptosilane compound.   The composition for insulating materials according to any one of claims 1 to 4, wherein the siloxane oligomer having a crosslinkable functional group contains trioxysilylalkyl acrylate or trioxysilylalkyl methacrylate.   The composition for insulating materials according to claim 5, further comprising a polyfunctional acrylic monomer.   The composition for insulating materials according to any one of claims 1 to 6, comprising a poly N-methoxymethyl compound or a photoacid generator as a chemical resistance improver.

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