JPWO2014020808A1 - Cooling structure and power conversion device - Google Patents

Cooling structure and power conversion device Download PDF

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JPWO2014020808A1
JPWO2014020808A1 JP2014527956A JP2014527956A JPWO2014020808A1 JP WO2014020808 A1 JPWO2014020808 A1 JP WO2014020808A1 JP 2014527956 A JP2014527956 A JP 2014527956A JP 2014527956 A JP2014527956 A JP 2014527956A JP WO2014020808 A1 JPWO2014020808 A1 JP WO2014020808A1
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cooling
heat transfer
cooling chamber
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泰仁 田中
泰仁 田中
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Fuji Electric Co Ltd
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Abstract

電力変換用の半導体スイッチング素子をケース体（１２）に内蔵し、このケース体の一面に放熱部材（１３）が形成された半導体パワーモジュール（１１）を備えおり、放熱部材に、ケース体と反対側で開口して冷却液が通流する冷却室（１３ａ）が設けられているとともに、記放熱部材に、冷却室を閉塞する閉塞部材（３）を接合した。A semiconductor switching element for power conversion is built in the case body (12), and a semiconductor power module (11) having a heat radiating member (13) formed on one surface of the case body is provided. The heat radiating member is opposite to the case body. A cooling chamber (13a) that is opened on the side and through which the coolant flows is provided, and a closing member (3) that closes the cooling chamber is joined to the heat dissipation member.

Description

本発明は、発熱体の熱を冷却する冷却構造体と、電力変換用の半導体スイッチング素子を内蔵したモジュール上に、所定間隔を保って上記半導体スイッチング素子を駆動する発熱回路部品を含む回路部品を実装した実装基板を支持するようにした電力変換装置に関する。   The present invention provides a circuit component including a heat generating circuit component that drives a semiconductor switching element at a predetermined interval on a cooling structure that cools heat of the heating element and a module that incorporates a semiconductor switching element for power conversion. The present invention relates to a power conversion device that supports a mounted substrate.

この種の電力変換装置としては、特許文献１に記載された電力変換装置が知られている。
この電力変換装置は、筐体内に、冷却液が通過する水冷ジャケットを配置し、この水冷ジャケット上に、電力変換用の半導体スイッチング素子としてのＩＧＢＴを内蔵したパワーモジュールを接合した装置である。そして、水冷ジャケットのパワーモジュールに接合する側に開口して冷却液が通流する冷却室及び流路を設け、パワーモジュールの水冷ジャケットに接合する側に、複数の冷却フィンが突出して設けられ、水冷ジャケット及びパワーモジュールを接合することで、水冷ジャケットの冷却室にパワーモジュールの複数の冷却フィンを配置し、複数の冷却フィンを冷却室内の冷却液で直接冷却する直接冷却方式を採用している。As this type of power conversion device, a power conversion device described in Patent Document 1 is known.
This power conversion device is a device in which a water cooling jacket through which a coolant passes is disposed in a casing, and a power module including an IGBT as a semiconductor switching element for power conversion is joined on the water cooling jacket. Then, a cooling chamber and a flow path that are opened on the side of the water cooling jacket that is joined to the power module and through which the coolant flows are provided, and a plurality of cooling fins are provided on the side that is joined to the water cooling jacket of the power module. By joining the water cooling jacket and the power module, a plurality of cooling fins of the power module are arranged in the cooling chamber of the water cooling jacket, and a direct cooling method is adopted in which the cooling fins are directly cooled with the coolant in the cooling chamber. .

特開２０１０−３５３４６号JP 2010-35346 A

ところで、大型重量物である水冷ジャケットは、加工機械による取り扱いが困難であり、この水冷ジャケットに冷却室及び流路を形成することで、加工コストの増大を招くおそれがある。
また、図７に示すように、水冷ジャケット５０及びパワーモジュール５１の接合位置にずれが生じると、水冷ジャケット５０に設けた冷却室５０ａの壁面と、パワーモジュール５１に設けた複数の冷却フィン５１ａの外郭との隙間が不均一となり（隙間ｔ１≠ｔ２）、入側流路５０ｂから冷却室５０ａに流れ込んだ冷却水が、隙間が大きい（隙間ｔ１）領域では流量を多くして流れ、隙間が小さい（隙間ｔ２）領域では流量を少なくして出側流路５０ｃに流れていき、複数の冷却フィン５１ａに対して冷却分布が不均一となるおそれがある。By the way, the water-cooled jacket, which is a large and heavy object, is difficult to handle by a processing machine, and forming the cooling chamber and the flow path in the water-cooled jacket may increase the processing cost.
Further, as shown in FIG. 7, when the joining position of the water cooling jacket 50 and the power module 51 is shifted, the wall surface of the cooling chamber 50 a provided in the water cooling jacket 50 and the plurality of cooling fins 51 a provided in the power module 51. The gap with the outer shell becomes non-uniform (gap t1 ≠ t2), and the cooling water that has flowed into the cooling chamber 50a from the inlet-side flow path 50b flows in an area where the gap is large (gap t1). In the (gap t2) region, the flow rate is decreased and flows into the outlet flow path 50c, and the cooling distribution may be nonuniform with respect to the plurality of cooling fins 51a.

本発明は、上記従来例の未解決の課題に着目してなされたものであり、加工コストの低減化を図るとともに、発熱体の冷却効率を向上させることができる冷却構造体を提供するとともに、加工コストの低減化を図るとともに、半導体スイッチング素子の冷却効率を向上させることができる電力変換装置を提供することを目的としている。   The present invention has been made paying attention to the unsolved problems of the above-described conventional example, and while providing a cooling structure capable of reducing the processing cost and improving the cooling efficiency of the heating element, An object of the present invention is to provide a power converter capable of reducing the processing cost and improving the cooling efficiency of the semiconductor switching element.

上記目的を達成するために、本発明の一態様に係る冷却構造体は、発熱体と、この発熱体の一面に形成された放熱部材を有する冷却構造体であって、前記放熱部材に、冷却液が通流する冷却室が設けられているとともに、前記放熱部材に、前記冷却室を閉塞する閉塞部材を接合した。
この一態様に係る冷却構造体によると、加工コストの低減化を図るとともに、発熱体の冷却効率を向上させることができる。In order to achieve the above object, a cooling structure according to an aspect of the present invention is a cooling structure including a heating element and a heat dissipation member formed on one surface of the heating element. A cooling chamber through which the liquid flows is provided, and a closing member for closing the cooling chamber is joined to the heat radiating member.
According to the cooling structure according to this aspect, the processing cost can be reduced and the cooling efficiency of the heating element can be improved.

また、本発明の一態様に係る電力変換装置は、半導体パワーモジュールの一面に形成された放熱部材を有する電力変換装置であって、前記放熱部材には、冷却液が通流する冷却室が設けられているとともに、前記放熱部材に、前記冷却室を閉塞する閉塞部材を接合した。
この一態様に係る電力変換装置によると、放熱部材は大型重量物ではなく、加工機械による取り扱いが容易であり、冷却室を容易に形成することができるので、加工コストの低減化を図ることができる。そして、半導体パワーモジュールの冷却効率を向上させることができる。The power converter according to an aspect of the present invention is a power converter having a heat radiating member formed on one surface of a semiconductor power module, and the heat radiating member is provided with a cooling chamber through which a coolant flows. In addition, a closing member for closing the cooling chamber is joined to the heat radiating member.
According to the power conversion device according to this aspect, the heat dissipating member is not a large heavy object, can be easily handled by the processing machine, and the cooling chamber can be easily formed, so that the processing cost can be reduced. it can. And the cooling efficiency of a semiconductor power module can be improved.

また、本発明の一態様に係る電力変換装置は、電力変換用の半導体スイッチング素子をケース体に内蔵し、当該ケース体の一面に放熱部材が形成された半導体パワーモジュールを備え、前記放熱部材に、前記ケース体と反対側で開口して冷却液が通流する冷却室が設けられているとともに、前記放熱部材に、前記冷却室を閉塞する閉塞部材を接合した。
この一態様に係る電力変換装置によると、放熱部材は大型重量物ではなく、加工機械による取り扱いが容易であり、冷却室を容易に形成することができるので、加工コストの低減化を図ることができる。そして、半導体パワーモジュールの冷却効率を向上させることができる。The power conversion device according to an aspect of the present invention includes a semiconductor power module in which a semiconductor switching element for power conversion is built in a case body, and a heat dissipation member is formed on one surface of the case body, and the heat dissipation member includes A cooling chamber that is opened on the opposite side of the case body and through which the coolant flows is provided, and a closing member that closes the cooling chamber is joined to the heat radiating member.
According to the power conversion device according to this aspect, the heat dissipating member is not a large heavy object, can be easily handled by the processing machine, and the cooling chamber can be easily formed, so that the processing cost can be reduced. it can. And the cooling efficiency of a semiconductor power module can be improved.

また、本発明の一態様に係る電力変換装置は、前記冷却室の底部から突出する複数の冷却フィンが形成されている。
この一態様に係る電力変換装置によると、複数の冷却フィンが冷却室の冷却液に直接接触するので、さらに冷却効率を向上させることができる。
また、本発明の一態様に係る電力変換装置は、前記冷却室の通流方向の両内壁と、前記冷却フィンとの間の間隔を均等に設定した。
この一態様に係る電力変換装置によると、通流方向の一方の内壁側と他方の内壁側の冷却液の流量を略同一とし、冷却分布を均一にすることができる。Moreover, the power converter device which concerns on 1 aspect of this invention is formed with the several cooling fin which protrudes from the bottom part of the said cooling chamber.
According to the power conversion device according to this aspect, since the plurality of cooling fins are in direct contact with the coolant in the cooling chamber, the cooling efficiency can be further improved.
Moreover, the power converter device which concerns on 1 aspect of this invention set the space | interval between the both inner walls of the flow direction of the said cooling chamber, and the said cooling fin equally.
According to the power conversion device according to this aspect, the flow rate of the cooling liquid on one inner wall side and the other inner wall side in the flow direction can be made substantially the same, and the cooling distribution can be made uniform.

また、本発明の一態様に係る電力変換装置は、前記複数の冷却フィンと前記閉塞部材との間に隙間を設け、当該隙間を均一にした。
この一態様に係る電力変換装置によると、複数の冷却フィンの間を流れる冷却液の流量も略同一とし、冷却室内の全ての領域の冷却分布をさらに均一にすることができる。Moreover, the power converter device which concerns on 1 aspect of this invention provided the clearance gap between the said several cooling fin and the said closure member, and the said clearance gap was made uniform.
According to the power conversion device according to this aspect, the flow rate of the coolant flowing between the plurality of cooling fins can be made substantially the same, and the cooling distribution in all the regions in the cooling chamber can be made more uniform.

さらに、本発明の一態様に係る電力変換装置は、前記複数の冷却フィンと前記閉塞部材との間に隙間を設け、当該隙間を均一にした。
この一態様に係る電力変換装置によると、腐食防止用のメッキが施されている冷却フィンは閉塞部材との間に隙間を設けているので、閉塞部材との接触によるメッキ剥がれを防止することができる。また、複数の冷却フィンと閉塞部材との間の隙間を均一にしたことで、複数の冷却フィンの先端側の冷却液の流量も略同一とし、冷却分布をさらに均一にすることができる。Furthermore, the power converter device which concerns on 1 aspect of this invention provided the clearance gap between the said several cooling fin and the said closure member, and the said clearance gap was made uniform.
According to the power conversion device according to this aspect, since the cooling fin that has been plated for corrosion prevention has a gap between the closing member, it is possible to prevent plating peeling due to contact with the closing member. it can. Further, since the gaps between the plurality of cooling fins and the closing member are made uniform, the flow rate of the coolant on the front end side of the plurality of cooling fins can be made substantially the same, and the cooling distribution can be made more uniform.

本発明に係る冷却構造体によると、加工コストの低減化を図るとともに、発熱体の冷却効率を向上させることができる。
また、本発明に係る電力変換装置によると、加工コストの低減化を図るとともに、半導体スイッチング素子の冷却効率を向上させることができる。The cooling structure according to the present invention can reduce the processing cost and improve the cooling efficiency of the heating element.
Moreover, according to the power converter device which concerns on this invention, while aiming at reduction of processing cost, the cooling efficiency of a semiconductor switching element can be improved.

本発明に係る電力変換装置の全体構成を示す断面図である。It is sectional drawing which shows the whole structure of the power converter device which concerns on this invention. 図１の電力変換装置の要部を示す断面図である。It is sectional drawing which shows the principal part of the power converter device of FIG. 本発明に係る放熱部材に一体に設けた冷却室及び複数の冷却フィンを示す図である。It is a figure which shows the cooling chamber and several cooling fin which were integrally provided in the thermal radiation member which concerns on this invention. 図２とは異なる位置の図１の電力変換装置の要部を示す断面図である。It is sectional drawing which shows the principal part of the power converter device of FIG. 1 of the position different from FIG. 伝熱支持用金属板を示す側面図である。It is a side view which shows the metal plate for heat transfer support. 発熱回路部品の全体の放熱経路を説明する図である。It is a figure explaining the heat dissipation path | route of the whole heat generating circuit components. 水冷ジャケットに冷却室を設け、この水冷ジャケットに接合するパワーモジュールに複数の冷却フィンが設けられている従来の装置を示す図である。It is a figure which shows the conventional apparatus by which the cooling chamber is provided in the water cooling jacket and the several cooling fin is provided in the power module joined to this water cooling jacket.

以下、本発明を実施するための形態（以下、実施形態という。）を、図面を参照しながら詳細に説明する。
図１は本発明の全体構成を示す断面図であり、図２は、図１の要部を拡大して示した図である。
図１の符号１は電力変換装置であって、この電力変換装置１は筐体２内に収納されている。筐体２は、合成樹脂材を成形したものであり、後述する閉塞部材３を挟んで上下に分割された下部筐体２Ａ及び上部筐体２Ｂで構成されている。DESCRIPTION OF EMBODIMENTS Hereinafter, modes for carrying out the present invention (hereinafter referred to as embodiments) will be described in detail with reference to the drawings.
FIG. 1 is a cross-sectional view showing the overall configuration of the present invention, and FIG. 2 is an enlarged view of the main part of FIG.
Reference numeral 1 in FIG. 1 is a power converter, and the power converter 1 is housed in a housing 2. The casing 2 is formed by molding a synthetic resin material, and includes a lower casing 2A and an upper casing 2B that are divided vertically with a closing member 3 to be described later interposed therebetween.

下部筐体２Ａは有底角筒体で構成されている。この下部筐体２Ａは開放上部が閉塞部材３で覆われ、内部に平滑用のフィルムコンデンサ４が収納されている。
上部筐体２Ｂは、上端及び下端を開放した角筒体２ａと、この角筒体２ａの上端を閉塞する蓋体２ｂとを備えている。そして、角筒体２ａの下端が閉塞部材３で閉塞されている。The lower housing 2A is a bottomed rectangular tube. The lower housing 2A is covered with a closing member 3 at the open upper portion, and a smoothing film capacitor 4 is accommodated therein.
The upper housing 2B includes a rectangular tube 2a having an open upper end and a lower end, and a lid 2b that closes the upper end of the rectangular tube 2a. The lower end of the rectangular tube 2 a is closed with the closing member 3.

この角筒体２ａの下端と閉塞部材３との間には、図示しないが、液状シール剤の塗布やゴム製パッキンの挟み込みなどのシール材が介在されている。
電力変換装置１は、電力変換用の例えばインバータ回路を構成する半導体スイッチング素子として例えば絶縁ゲートバイポーラトランジスタ（ＩＧＢＴ）を内蔵したパワーモジュール１１を備えている。このパワーモジュール１１は、扁平な直方体状の絶縁性のケース体１２内にＩＧＢＴを内蔵しており、ケース体１２の下面に、直方体状の熱伝導率の高い銅製からなる放熱部材１３が一体に設けられている。Between the lower end of the rectangular tube 2a and the closing member 3, a sealing material (not shown) such as application of a liquid sealing agent or sandwiching rubber packing is interposed.
The power conversion device 1 includes a power module 11 that incorporates, for example, an insulated gate bipolar transistor (IGBT) as a semiconductor switching element that forms, for example, an inverter circuit for power conversion. This power module 11 has an IGBT built in a flat rectangular parallelepiped insulating case body 12, and a rectangular parallelepiped heat dissipation member 13 made of copper having high thermal conductivity is integrally formed on the lower surface of the case body 12. Is provided.

放熱部材１３は、図３に示すように、放熱部材１３の下面中央部に、長方形状に開口する冷却室１３ａが形成されており、冷却室１３ａの長手方向の一方の壁部に、放熱部材１３の内部に形成した給水路１３ｂの給水口１３ｂ１が開口し、冷却室１３ａの長手方向の他方の壁部には、放熱部材１３の内部に形成した排水路１３ｃの排水口１３ｃ１が開口しており、給水口１３ｂ１から流れ込んだ冷却水は、図３の左側から右側を通流方向として冷却室１３ａを流れ、排水口１３ｃ１から流れ出るようになっている。給水路１３ｂ及び排水路１３ｃは、例えばフレキシブルホースを介して図示しない冷却水供給源に接続されている。   As shown in FIG. 3, the heat radiating member 13 is formed with a cooling chamber 13a having a rectangular opening at the center of the lower surface of the heat radiating member 13, and the heat radiating member is formed on one wall portion in the longitudinal direction of the cooling chamber 13a. The water supply port 13b1 of the water supply channel 13b formed inside 13 opens, and the water discharge port 13c1 of the water channel 13c formed inside the heat radiating member 13 opens on the other wall portion in the longitudinal direction of the cooling chamber 13a. The cooling water flowing from the water supply port 13b1 flows through the cooling chamber 13a from the left side to the right side in FIG. 3 and flows out from the drain port 13c1. The water supply channel 13b and the drainage channel 13c are connected to a cooling water supply source (not shown) via, for example, a flexible hose.

また、冷却室１３ａの底部１３ｄから複数の冷却フィン１７が突出している。
これら複数の冷却フィン１７は、隣接する冷却フィン１７，１７の間隔が同一に設定されているとともに、複数の冷却フィン１７の底部１３ｄからの高さは、閉塞部材３に接合する接合面１３ｆより僅かに低い同一高さに設定されている。
そして、冷却室１３ａの通流方向の両内壁１３ｇ，１３ｈに最も近い冷却フィン１７は、内壁１３ｇ，１３ｈに対して同一の隙間ｔ３に設定されている。A plurality of cooling fins 17 protrude from the bottom 13d of the cooling chamber 13a.
In the plurality of cooling fins 17, the spacing between adjacent cooling fins 17 and 17 is set to be the same, and the height from the bottom portion 13 d of the plurality of cooling fins 17 is higher than the joining surface 13 f joined to the closing member 3. It is set to a slightly lower height.
The cooling fins 17 closest to the inner walls 13g and 13h in the flow direction of the cooling chamber 13a are set to the same gap t3 with respect to the inner walls 13g and 13h.

ここで、放熱部材１３の冷却室１３ａ及び複数の冷却フィン１７の表面には腐食防止用のメッキが施されている。
そして、図１及び図２に示すように、放熱部材１３の下面（接合面）１３ｆに接合する閉塞部材３は、例えば熱伝導率の高いアルミニウム、アルミニウム合金を射出成形して形成されている。
閉塞部材３の上面（接合面）３ａには、放熱部材１３の冷却室１３ａの開口部を囲む位置に、四角枠状の周溝６が形成され、この周溝６にＯリング７が装着されている。
また、閉塞部材３の接合面３ａより外周側には、接合面３ａより一段低く形成された平坦な当接部３ｂが形成されている。
さらに、閉塞部材３には、下部筐体２Ａに保持されたフィルムコンデンサ４の絶縁被覆された正負の電極４ａを上下に挿通する挿通孔３ｅが形成されている。Here, the surface of the cooling chamber 13a of the heat radiating member 13 and the plurality of cooling fins 17 is plated for corrosion prevention.
As shown in FIGS. 1 and 2, the closing member 3 joined to the lower surface (joint surface) 13f of the heat radiating member 13 is formed, for example, by injection molding aluminum or aluminum alloy having high thermal conductivity.
A rectangular frame-shaped circumferential groove 6 is formed on the upper surface (joint surface) 3 a of the closing member 3 at a position surrounding the opening of the cooling chamber 13 a of the heat radiating member 13, and an O-ring 7 is attached to the circumferential groove 6. ing.
Further, a flat contact portion 3b formed one step lower than the joint surface 3a is formed on the outer peripheral side of the joint surface 3a of the closing member 3.
Further, the closing member 3 is formed with an insertion hole 3e through which the positive and negative electrodes 4a covered with insulation of the film capacitor 4 held by the lower housing 2A are vertically inserted.

図２に戻って、ケース体１２及び放熱部材１３には平面からみて四隅に固定ねじ１４を挿通する挿通孔１５が形成されている。また、ケース体１２の上面には、挿通孔１５の内側における４箇所に所定高さの基板固定部１６が突出形成されている。
基板固定部１６の上端には、パワーモジュール１１に内蔵されたＩＧＢＴを駆動する駆動回路等が実装された駆動回路基板２１が固定されている。また、駆動回路基板２１の上方に所定間隔を保ってパワーモジュール１１に内蔵されたＩＧＢＴを制御する相対的に発熱量の大きい、又は発熱密度の大きい発熱回路部品を含む制御回路等を実装した実装基板としての制御回路基板２２が固定されている。さらに、制御回路基板２２の上方に所定間隔を保ってパワーモジュール１１に内蔵されたＩＧＢＴに電源を供給する発熱回路部品を含む電源回路等を実装した実装基板としての電源回路基板２３が固定されている。Returning to FIG. 2, the case body 12 and the heat radiating member 13 are formed with insertion holes 15 through which the fixing screws 14 are inserted at the four corners as viewed from above. In addition, on the upper surface of the case body 12, substrate fixing portions 16 having a predetermined height are formed to protrude at four locations inside the insertion hole 15.
A driving circuit board 21 on which a driving circuit for driving an IGBT built in the power module 11 is mounted is fixed to the upper end of the board fixing unit 16. In addition, a mounting in which a control circuit including a heat generating circuit component having a relatively large heat generation amount or a high heat generation density is mounted on the drive circuit board 21 to control the IGBT built in the power module 11 with a predetermined interval. A control circuit board 22 as a board is fixed. Further, a power supply circuit board 23 as a mounting board on which a power supply circuit including a heating circuit component for supplying power to the IGBT built in the power module 11 is mounted at a predetermined interval above the control circuit board 22 is fixed. Yes.

そして、駆動回路基板２１は、基板固定部１６に対向する位置に形成した挿通孔２１ａ内に継ぎねじ２４の雄ねじ部２４ａを挿通し、この雄ねじ部２４ａを基板固定部１６の上面に形成した雌ねじ部１６ａに螺合することにより固定されている。
また、制御回路基板２２は継ぎねじ２４の上端に形成した雌ねじ部２４ｂに対向する位置に形成した挿通孔２２ａ内に継ぎねじ２５の雄ねじ部２５ａを挿通し、この雄ねじ部２５ａを継ぎねじ２４の雌ねじ部２４ｂに螺合することにより固定されている。Then, the drive circuit board 21 is inserted into the insertion hole 21 a formed at a position facing the board fixing part 16, and the male screw part 24 a of the joint screw 24 is inserted, and the male screw part 24 a is formed on the upper surface of the board fixing part 16. It is fixed by screwing into the part 16a.
Further, the control circuit board 22 inserts the male screw portion 25a of the joint screw 25 into an insertion hole 22a formed at a position facing the female screw portion 24b formed at the upper end of the joint screw 24, and this male screw portion 25a is inserted into the joint screw 24. It is fixed by screwing into the female screw portion 24b.

さらに、電源回路基板２３は継ぎねじ２５の上端に形成した雌ねじ部２５ｂに対向する位置に形成した挿通孔２３ａ内に固定ねじ２６を挿通し、この固定ねじ２６を継ぎねじ２５の雌ねじ部２５ｂに螺合することにより固定されている。
また、制御回路基板２２及び電源回路基板２３は、伝熱支持用金属板３２，３３によって筐体２を介することなく放熱部材１３への放熱経路を独自に形成するように支持されている。これら伝熱支持用金属板３２及び３３は、熱伝導率が高い金属板例えばアルミニウム又はアルミニウム合金製の金属板で形成されている。Further, the power supply circuit board 23 inserts a fixing screw 26 into an insertion hole 23 a formed at a position facing the female screw portion 25 b formed at the upper end of the joint screw 25, and this fixing screw 26 is inserted into the female screw portion 25 b of the joint screw 25. It is fixed by screwing.
Further, the control circuit board 22 and the power circuit board 23 are supported by the heat transfer supporting metal plates 32 and 33 so as to uniquely form a heat radiation path to the heat radiation member 13 without going through the housing 2. These heat transfer supporting metal plates 32 and 33 are formed of a metal plate having high thermal conductivity, for example, a metal plate made of aluminum or an aluminum alloy.

伝熱支持用金属板３２は、平板形状の伝熱支持板部３２ａと、この伝熱支持板部３２ａの右側端部から下方に折り曲げられて放熱部材１３に向けて延在する伝熱支持側板部３２ｂと、伝熱支持側板部３２ｂの下端部から左側に折り曲げられて放熱部材１３の下面に沿って延在する冷却体接触板部３２ｃとを一体に備えた部品である。
伝熱支持板部３２ａには、伝熱部材３５を介して制御回路基板２２が固定ねじ３６によって固定される。伝熱部材３５は、伸縮性を有する弾性体で電源回路基板２３と同じ外形寸法に構成されている。この伝熱部材３５としては、シリコンゴムの内部に金属フィラーを介在させることにより絶縁性能を発揮しながら伝熱性を高めたものが適用されている。The heat transfer support metal plate 32 includes a plate-shaped heat transfer support plate portion 32 a and a heat transfer support side plate that is bent downward from the right end portion of the heat transfer support plate portion 32 a and extends toward the heat radiating member 13. It is a component that integrally includes a portion 32b and a cooling body contact plate portion 32c that is bent leftward from the lower end portion of the heat transfer support side plate portion 32b and extends along the lower surface of the heat dissipation member 13.
The control circuit board 22 is fixed to the heat transfer support plate portion 32 a by a fixing screw 36 via a heat transfer member 35. The heat transfer member 35 is an elastic body having elasticity, and has the same outer dimensions as the power circuit board 23. As this heat transfer member 35, a member having improved heat transfer performance while exhibiting insulating performance by interposing a metal filler inside silicon rubber is applied.

また、伝熱支持用金属板３３は、平板形状の伝熱支持板部３３ａと、この伝熱支持板部３３ａの左側端部から下方に折り曲げられて放熱部材１３に向けて延在する伝熱支持側板部３３ｂと、伝熱支持側板部３３ｂの下端部から右側に折り曲げられて放熱部材１３の下面に沿って延在する冷却体接触板部３３ｃとを一体に備えた部品である。
伝熱支持板部３３ａには、前述した伝熱部材３５と同様の伝熱部材３７を介して電源回路基板２３が固定ねじ３８によって固定される。Further, the heat transfer support metal plate 33 includes a flat plate-shaped heat transfer support plate portion 33 a and heat transfer that is bent downward from the left end portion of the heat transfer support plate portion 33 a and extends toward the heat radiating member 13. The support side plate portion 33b and the cooling body contact plate portion 33c that is bent rightward from the lower end portion of the heat transfer support side plate portion 33b and extends along the lower surface of the heat radiating member 13 are integrally provided.
The power supply circuit board 23 is fixed to the heat transfer support plate portion 33a by a fixing screw 38 via a heat transfer member 37 similar to the heat transfer member 35 described above.

これら伝熱支持用金属板３２，３３を一体部品とすることで、熱抵抗を小さくしてより効率の良い放熱を行うことができる。また、伝熱支持用金属板３２の伝熱支持板部３２ａと伝熱支持側板部３２ｂとの連結部及び伝熱支持側板部３２ｂと冷却体接触板部３２ｃとの連結部とを湾曲部とし、伝熱支持用金属板３３の伝熱支持板部３３ａと伝熱支持側板部３３ｂとの連結部及び伝熱支持側板部３３ｂと冷却体接触板部３３ｃとの連結部とを湾曲部とすることで、電力変換装置１に伝達される上下振動や横揺れ等に対する耐振動性を向上することができる。   By using these heat transfer supporting metal plates 32 and 33 as an integral part, it is possible to reduce the thermal resistance and perform more efficient heat dissipation. Further, the connection portion between the heat transfer support plate portion 32a and the heat transfer support side plate portion 32b of the heat transfer support metal plate 32 and the connection portion between the heat transfer support side plate portion 32b and the cooling body contact plate portion 32c are set as curved portions. The connecting portion between the heat transfer support plate portion 33a and the heat transfer support side plate portion 33b of the heat transfer support metal plate 33 and the connection portion between the heat transfer support side plate portion 33b and the cooling body contact plate portion 33c are curved portions. Thus, it is possible to improve the vibration resistance against the vertical vibration and roll transmitted to the power conversion device 1.

図４に示すように、電源回路基板２３には、発熱回路部品３９が下面側に実装されており、電源回路基板２３、伝熱部材３７及び伝熱支持板部３３ａが、固定ねじ３８により積層状態で固定されており、伝熱支持板部３３ａの下面には、絶縁距離を短くするために絶縁シート４３が貼着されている。なお、これらの積層状態の部品を電源回路ユニットＵ３と称する。   As shown in FIG. 4, the heat circuit component 39 is mounted on the lower surface side of the power circuit board 23, and the power circuit board 23, the heat transfer member 37, and the heat transfer support plate portion 33 a are stacked by the fixing screw 38. The insulating sheet 43 is stuck to the lower surface of the heat transfer support plate portion 33a in order to shorten the insulation distance. Note that these stacked components are referred to as a power supply circuit unit U3.

この際、電源回路基板２３の下面側に実装された発熱回路部品３９が伝熱部材３７の弾性によって伝熱部材３７内に埋め込まれる。このため、発熱回路部品３９と伝熱部材３７との接触が過不足なく行われるとともに、伝熱部材３７と電源回路基板２３及び伝熱支持板部３３ａとの接触が良好に行われ、伝熱部材３７と電源回路基板２３及び伝熱支持板部３３ａとの間の熱抵抗を減少させることができる。   At this time, the heat generating circuit component 39 mounted on the lower surface side of the power circuit board 23 is embedded in the heat transfer member 37 by the elasticity of the heat transfer member 37. For this reason, the contact between the heat generating circuit component 39 and the heat transfer member 37 is performed without excess or deficiency, and the contact between the heat transfer member 37 and the power supply circuit board 23 and the heat transfer support plate portion 33a is performed satisfactorily. The thermal resistance between the member 37 and the power supply circuit board 23 and the heat transfer support plate portion 33a can be reduced.

また、図示しないが、制御回路基板２２の下面側にも発熱回路部品が実装されており、制御回路基板２２、伝熱部材３５及び伝熱支持板部３２ａが、固定ねじ３６により積層状態で固定されており、伝熱支持板部３２ａの下面には、絶縁距離を短くするために絶縁シート４２が貼着されている。なお、これらの積層状態の部品を制御回路ユニットＵ２と称する。   Although not shown, a heat generating circuit component is also mounted on the lower surface side of the control circuit board 22, and the control circuit board 22, the heat transfer member 35, and the heat transfer support plate portion 32 a are fixed in a stacked state by a fixing screw 36. An insulating sheet 42 is attached to the lower surface of the heat transfer support plate portion 32a in order to shorten the insulation distance. Note that these stacked components are referred to as a control circuit unit U2.

そして、制御回路基板２２の下面側に実装された発熱回路部品が伝熱部材３５の弾性によって伝熱部材３５内に埋め込まれ、制御回路基板２２と伝熱部材３５との接触が過不足なく行われるとともに、伝熱部材３５と制御回路基板２２及び伝熱支持板部３２ａとの接触が良好に行われ、伝熱部材３５と制御回路基板２２及び伝熱支持板部３２ａとの間の熱抵抗を減少させることができる。   Then, the heat generating circuit component mounted on the lower surface side of the control circuit board 22 is embedded in the heat transfer member 35 by the elasticity of the heat transfer member 35, so that the contact between the control circuit board 22 and the heat transfer member 35 is performed without excess or deficiency. In addition, the heat transfer member 35 and the control circuit board 22 and the heat transfer support plate part 32a are satisfactorily contacted, and the heat resistance between the heat transfer member 35, the control circuit board 22 and the heat transfer support plate part 32a is improved. Can be reduced.

また、伝熱支持用金属板の伝熱支持側板部３３ｂには、図５に示すように、パワーモジュール１１の図１に示す３相交流出力端子１１ｂに対応する位置に後述するブスバー５５を挿通する例えば方形の３つの挿通孔３３ｉが形成されている。このように、３つの挿通孔３３ｉを形成することにより、隣接する挿通孔３３ｉ間に比較的幅広の伝熱路Ｌｈを形成することができ、全体の伝熱路の断面積を増加させて効率よく伝熱することができる。また、振動に対する剛性も確保することができる。   Further, as shown in FIG. 5, a bus bar 55 described later is inserted into the heat transfer support side plate portion 33b of the heat transfer support metal plate at a position corresponding to the three-phase AC output terminal 11b shown in FIG. For example, three rectangular insertion holes 33i are formed. Thus, by forming the three insertion holes 33i, a relatively wide heat transfer path Lh can be formed between the adjacent insertion holes 33i, and the cross-sectional area of the entire heat transfer path is increased to improve efficiency. Can conduct heat well. Also, rigidity against vibration can be ensured.

同様に、伝熱支持用金属板３２の伝熱支持側板部３２ｂにも、パワーモジュール１１の正極及び負極端子１１ａに対向する位置にそれぞれ同様の挿通孔３２ｉが形成されている。この挿通孔３２ｉを形成することにより、上述した挿通孔３３ｉと同様の作用効果を得ることができる。
また、伝熱支持用金属板３２の冷却体接触板部３２ｃ及び伝熱支持用金属板３３の冷却体接触板部３３ｃには、図２に示すように、パワーモジュール１１の固定ねじ１４を挿通する挿通孔１５に対向する位置に固定部材挿通孔３２ｃ１，３３ｃ１が形成されている。Similarly, in the heat transfer support side plate portion 32b of the heat transfer support metal plate 32, similar insertion holes 32i are formed at positions facing the positive electrode and the negative electrode terminal 11a of the power module 11, respectively. By forming the insertion hole 32i, the same effect as that of the insertion hole 33i described above can be obtained.
Further, as shown in FIG. 2, the fixing screw 14 of the power module 11 is inserted into the cooling body contact plate portion 32c of the heat transfer support metal plate 32 and the cooling body contact plate portion 33c of the heat transfer support metal plate 33. Fixing member insertion holes 32c1 and 33c1 are formed at positions facing the insertion holes 15 to be formed.

そして放熱部材１３の挿通孔１５及び冷却体接触板部３２ｃ，３３ｃの固定部材挿通孔３２ｃ１，３３ｃ１に固定ねじ１４を挿通し、固定ねじ１４を閉塞部材３に形成した雌ねじ部に螺合させる。
これにより、伝熱支持用金属板３２，３３の冷却体接触板部３２ｃ，３３ｃを、パワーモジュール１１の放熱部材１３の下面１３ａと閉塞部材３の当接部３ｂとに当接し、放熱部材１３及び閉塞部材３で挟持して固定する。Then, the fixing screw 14 is inserted into the insertion hole 15 of the heat radiating member 13 and the fixing member insertion holes 32c1 and 33c1 of the cooling body contact plate portions 32c and 33c, and the fixing screw 14 is screwed into the female screw portion formed in the closing member 3.
Thereby, the cooling body contact plate portions 32c and 33c of the heat transfer supporting metal plates 32 and 33 are brought into contact with the lower surface 13a of the heat radiating member 13 of the power module 11 and the abutting portion 3b of the closing member 3, thereby And it is clamped by the closing member 3 and fixed.

この際、閉塞部材３の周溝６に装着した０リング７が、放熱部材１３の接合面１３ｆに当接して弾性変形しながら押しつぶされ、冷却室１３ａに溜まった冷却水が外部に漏れるのを防止する液密封止が施される。
また、図１に示すように、パワーモジュール１１の正負の直流入力端子に１１ａに、ブスバー５５が接続され、ブスバー５５の他端に閉塞部材３を貫通するフィルムコンデンサ４の正負の電極４ａが固定ねじ５１で連結されている。また、パワーモジュール１１の負極端子１１ａに、外部のコンバータ（図示せず）に接続する接続コード５２の先端に固定された圧着端子５３が固定されている。At this time, the 0 ring 7 attached to the circumferential groove 6 of the closing member 3 is pressed against the joint surface 13f of the heat radiating member 13 while being elastically deformed, and the cooling water accumulated in the cooling chamber 13a leaks outside. A liquid tight seal is applied to prevent it.
Further, as shown in FIG. 1, a bus bar 55 is connected to the positive and negative DC input terminals of the power module 11 to 11 a, and the positive and negative electrodes 4 a of the film capacitor 4 penetrating the closing member 3 are fixed to the other end of the bus bar 55. They are connected by screws 51. Further, a crimp terminal 53 fixed to the tip of a connection cord 52 connected to an external converter (not shown) is fixed to the negative electrode terminal 11 a of the power module 11.

さらに、パワーモジュール１１の３相交流出力端子１１ｂに、ブスバー５５の一端を固定ねじ５６で接続し、このブスバー５５の途中に電流センサ５７が配置されている。そして、ブスバー５５の他端に圧着端子５９が固定ねじ６０で接続されている。圧着端子５９は、外部の３相電動モータ（図示せず）に接続したモータ接続ケーブル５８に固定されている。   Further, one end of the bus bar 55 is connected to the three-phase AC output terminal 11 b of the power module 11 with a fixing screw 56, and a current sensor 57 is arranged in the middle of the bus bar 55. A crimp terminal 59 is connected to the other end of the bus bar 55 with a fixing screw 60. The crimp terminal 59 is fixed to a motor connection cable 58 connected to an external three-phase electric motor (not shown).

この状態で、外部のコンバータ（図示せず）から直流電力を供給するとともに、電源回路基板２３に実装された電源回路、制御回路基板２２に実装された制御回路を動作状態とし、制御回路から例えばパルス幅変調信号でなるゲート信号を駆動回路基板２１に実装された駆動回路を介してパワーモジュール１１に供給する。これによって、パワーモジュール１１に内蔵されたＩＧＢＴが制御されて、直流電力を交流電力に変換する。変換した交流電力は３相交流出力端子１１ｂからブスバー５５を介してモータ接続ケーブル５８に供給し、３相電動モータ（図示せず）を駆動制御する。   In this state, DC power is supplied from an external converter (not shown), and the power supply circuit mounted on the power supply circuit board 23 and the control circuit mounted on the control circuit board 22 are set in an operating state. A gate signal that is a pulse width modulation signal is supplied to the power module 11 via a drive circuit mounted on the drive circuit board 21. As a result, the IGBT built in the power module 11 is controlled to convert DC power into AC power. The converted AC power is supplied from the three-phase AC output terminal 11b to the motor connection cable 58 via the bus bar 55 to drive and control a three-phase electric motor (not shown).

このとき、パワーモジュール１１に内蔵されたＩＧＢＴで発熱するが、パワーモジュール１１の放熱部材１３は、冷却水が通流する冷却室１３ａと、冷却室１３ａの底部１３ｄから突出した複数の冷却フィン１７とを備えた水冷ジャケットを構成しているので、パワーモジュール１１は効率良く冷却される。
一方、制御回路基板２２及び電源回路基板２３に実装されている制御回路及び電源回路には発熱回路部品３９が含まれており、これら発熱回路部品３９で発熱を生じる。このとき、発熱回路部品３９は制御回路基板２２及び電源回路基板２３の下面側に実装されている。At this time, the IGBT built in the power module 11 generates heat, but the heat dissipation member 13 of the power module 11 includes a cooling chamber 13a through which cooling water flows and a plurality of cooling fins 17 protruding from the bottom 13d of the cooling chamber 13a. Therefore, the power module 11 is efficiently cooled.
On the other hand, the control circuit and the power supply circuit mounted on the control circuit board 22 and the power supply circuit board 23 include a heat generating circuit component 39, and the heat generating circuit component 39 generates heat. At this time, the heat generating circuit component 39 is mounted on the lower surface side of the control circuit board 22 and the power supply circuit board 23.

そして、これら制御回路基板２２及び電源回路基板２３の下面側には、熱伝導率が高く弾性を有する伝熱部材３５及び３７を介して伝熱支持用金属板３２，３３の伝熱支持板部３２ａ，３３ａが設けられている。伝熱支持用金属板３２，３３は、伝熱支持板部３２ａ，３３ａと、伝熱支持側板部３２ｂ，３３ｂと、冷却体接触板部３２ｃ，３３ｃとを一体化した部品であって熱抵抗が小さい部材なので、図６に示すように、伝熱支持用金属板３２，３３に伝達された熱は、水冷ジャケットを構成している放熱部材１３に直接接触した冷却体接触板部３２ｃ，３３ｃから放熱部材１３に放熱され、効率の良い放熱を行うことができる。   And on the lower surface side of these control circuit board 22 and power supply circuit board 23, heat transfer support plate portions of metal plates 32, 33 for heat transfer support are provided through heat transfer members 35 and 37 having high thermal conductivity and elasticity. 32a and 33a are provided. The heat transfer support metal plates 32 and 33 are components in which the heat transfer support plate portions 32a and 33a, the heat transfer support side plate portions 32b and 33b, and the cooling body contact plate portions 32c and 33c are integrated, and have a thermal resistance. 6, the heat transferred to the heat transfer supporting metal plates 32 and 33 is directly contacted with the heat radiating member 13 constituting the water cooling jacket, as shown in FIG. The heat is dissipated from the heat to the heat radiating member 13, and efficient heat radiation can be performed.

なお、本発明の発熱体がパワーモジュール１１に対応している。
本実施形態の電力変換装置１によると、放熱部材１３は大型重量物ではなく、加工機械による取り扱いが容易であり、冷却室１３ａ、複数の冷却フィン１７を容易に形成することができるので、加工コストの低減化を図ることができる。
また、放熱部材１３の冷却室１３ａには、通流方向の両内壁１３ｇ，１３ｈとの隙間を同一（ｔ３）に設定して複数の冷却フィン１７が突出しており、給水路１３ｂから冷却室１３ａに流れ込んだ冷却水は、通流方向の内壁１３ｇ，１３ｈ側の流量を略同一として排水路１３ｃまで流れる。また、複数の冷却フィン１７の隣接する冷却フィン１７，１７の間隔も同一に設定されているので、複数の冷却フィン１７の間を流れる冷却水の流量も略同一となる。したがって、冷却室１３ａを通流する冷却水は、複数の冷却フィン１７の冷却分布を均一にすることができる。The heating element of the present invention corresponds to the power module 11.
According to the power conversion device 1 of the present embodiment, the heat radiating member 13 is not a large heavy object and can be easily handled by a processing machine, and the cooling chamber 13a and the plurality of cooling fins 17 can be easily formed. Cost can be reduced.
The cooling chamber 13a of the heat radiating member 13 has a plurality of cooling fins 17 protruding from the water supply channel 13b with the gaps between the inner walls 13g and 13h in the flow direction set to the same (t3). The cooling water that has flowed into the water flows to the drainage channel 13c with substantially the same flow rate on the inner walls 13g and 13h in the flow direction. In addition, since the intervals between adjacent cooling fins 17 and 17 of the plurality of cooling fins 17 are set to be the same, the flow rate of the cooling water flowing between the plurality of cooling fins 17 is also substantially the same. Therefore, the cooling water flowing through the cooling chamber 13a can make the cooling distribution of the plurality of cooling fins 17 uniform.

また、図７で示した従来装置では、水冷ジャケット５０及びパワーモジュール５１の接合位置にずれが生じると、水冷ジャケット５０に設けた冷却室５０ａと、この冷却室５０ａに配置されるパワーモジュール５１の複数の冷却フィン５１ａの位置が変化するが、本実施形態のように、放熱部材１３が冷却室１３ａ及び複数の冷却フィン１７を備えているので、冷却室１３ａ内の複数の冷却フィン１７の位置合わせが不要となる。   Further, in the conventional apparatus shown in FIG. 7, when the joining position of the water cooling jacket 50 and the power module 51 is shifted, the cooling chamber 50a provided in the water cooling jacket 50 and the power module 51 disposed in the cooling chamber 50a are arranged. Although the positions of the plurality of cooling fins 51a change, since the heat radiation member 13 includes the cooling chamber 13a and the plurality of cooling fins 17 as in the present embodiment, the positions of the plurality of cooling fins 17 in the cooling chamber 13a. Matching becomes unnecessary.

また、放熱部材１３及び閉塞部材３を接合すると、複数の冷却フィン１７の先端は、閉塞部材３との間に僅かな隙間を設けて対向する。これにより、閉塞部材３に対する複数の冷却フィン１７の先端の接触を回避し、冷却フィン１７の表面を覆っているメッキの剥がれが防止されるので、メッキの剥がれによる冷却フィンの腐食を防止することができる。
なお、図１及び図２で示した制御回路ユニットＵ２及び電源回路ユニットＵ３において、伝熱部材３５及び３７を制御回路基板２２及び電源回路基板２３と同じ外形とした場合について説明した。しかしながら、本発明は上記構成に限定されるものではなく、伝熱部材３５及び３７を発熱回路部品３９が存在する箇所にのみ設けるようにしてもよい。Further, when the heat radiating member 13 and the closing member 3 are joined, the tips of the plurality of cooling fins 17 are opposed to each other with a slight gap between the closing member 3. Thereby, contact of the tips of the plurality of cooling fins 17 with respect to the closing member 3 is avoided, and peeling of the plating covering the surface of the cooling fins 17 is prevented, so that corrosion of the cooling fins due to peeling of the plating is prevented. Can do.
In the control circuit unit U2 and the power circuit unit U3 shown in FIGS. 1 and 2, the case where the heat transfer members 35 and 37 have the same outer shape as the control circuit board 22 and the power circuit board 23 has been described. However, the present invention is not limited to the above-described configuration, and the heat transfer members 35 and 37 may be provided only where the heat generating circuit component 39 exists.

また、図１及び図２においては、制御回路基板２２及び電源回路基板２３で発熱回路部品３９を裏面側の伝熱部材３５及び３７側に実装する場合について説明した。しかしながら、本発明は上記構成に限定されるものではない。すなわち、制御回路基板２２及び電源回路基板２３の伝熱部材３５及び３７とは反対側の外周領域に、発熱回路部品３９を実装するようにしてよい。   1 and 2, the case where the heat generating circuit component 39 is mounted on the heat transfer members 35 and 37 on the back surface side using the control circuit board 22 and the power supply circuit board 23 has been described. However, the present invention is not limited to the above configuration. That is, the heat generating circuit component 39 may be mounted on the outer peripheral area of the control circuit board 22 and the power supply circuit board 23 on the opposite side to the heat transfer members 35 and 37.

さらに、図１及び図２においては、平滑用のコンデンサとしてフィルムコンデンサ４を適用した場合について説明したが、これに限定されるものではなく、円柱状の電解コンデンサを適用するようにしてもよい。
また、本発明に係る電力変換装置１を、電気自動車に適用する場合について説明したが、これに限定されるものではなく、軌条を走行する鉄道車両にも本発明を適用することができ、任意の電気駆動車両に適用することができる。さらに電力変換装置１としては電気駆動車両に限らず、他の産業機器における電動モータ等のアクチュエータを駆動する場合に本発明の電力変換装置１を適用することができる。Furthermore, although the case where the film capacitor 4 is applied as a smoothing capacitor has been described in FIGS. 1 and 2, the present invention is not limited to this, and a cylindrical electrolytic capacitor may be applied.
Moreover, although the case where the power converter device 1 which concerns on this invention is applied to an electric vehicle was demonstrated, it is not limited to this, This invention can be applied also to the rail vehicle which drive | works a rail, and is arbitrary. It can be applied to an electrically driven vehicle. Furthermore, the power conversion device 1 is not limited to an electrically driven vehicle, and the power conversion device 1 of the present invention can be applied when driving an actuator such as an electric motor in other industrial equipment.

以上のように、本発明に係る冷却構造体は、加工コストの低減化を図り、発熱体の冷却効率を向上させるのに有用であり、本発明に係る電力変換装置は、加工コストの低減化を図るとともに、半導体スイッチング素子の冷却効率を向上させるのに有用である。   As described above, the cooling structure according to the present invention is useful for reducing the processing cost and improving the cooling efficiency of the heating element, and the power conversion device according to the present invention reduces the processing cost. This is useful for improving the cooling efficiency of the semiconductor switching element.

１…電力変換装置、２…筐体、２Ａ…下部筐体、２Ｂ…上部筐体、２ａ…角筒体、２ｂ…蓋体、３…閉塞部材、３ｂ…当接部、３ｃ…冷却体の上面、３ｅ…挿通孔、４…フィルムコンデンサ、４ａ…正負の電極、５…浸漬部、６…周溝、７…Ｏリング、８…当接部、１１…パワーモジュール、１１ａ…負極端子、１１ｂ…３相交流出力端子、１２…ケース体、１３…放熱部材、１３ａ…冷却室、１３ｂ…給水路、１３ｂ１…給水口、１３ｃ…排水路、１３ｃ１…排水口、１３ｄ…底部、１３ｆ接合面、１３ｇ，１３ｈ…内、１４…固定ねじ、１５…挿通孔、１６…基板固定部、１６ａ…雌ねじ部、１７…冷却フィン、２１…駆動回路基板、２１ａ…挿通孔、２２…制御回路基板、２２ａ…挿通孔、２３…電源回路基板、２３ａ…挿通孔、２４ａ…雄ねじ部、２４ｂ…雌ねじ部、２５ａ…雄ねじ部、２５ｂ…雌ねじ部、３２，３３…伝熱支持用金属板、３２ａ…伝熱支持板部、３２ｂ…伝熱支持側板部、３２ｃ…冷却体接触板部、３２ｃ，３３ｃ…冷却体接触板部、３２ｃ１，３３ｃ１…固定部材挿通孔、３２ｉ…挿通孔、３３ａ…伝熱支持板部、３３ｂ…伝熱支持側板部、３３ｃ…冷却体接触板部、３３ｉ…挿通孔、３５…伝熱部材、３７…伝熱部材、３９…発熱回路部品、４２…絶縁シート、４３…絶縁シート、５１…固定ねじ、５２…接続コード、５３，５９…圧着端子、５５…ブスバー、５７…電流センサ、５８…モータ接続ケーブル、６０…固定ねじ   DESCRIPTION OF SYMBOLS 1 ... Power converter device, 2 ... Housing | casing, 2A ... Lower housing | casing, 2B ... Upper housing | casing, 2a ... Square cylinder body, 2b ... Cover body, 3 ... Closure member, 3b ... Contact part, 3c ... Cooling body Upper surface, 3e ... insertion hole, 4 ... film capacitor, 4a ... positive and negative electrodes, 5 ... immersion part, 6 ... circumferential groove, 7 ... O-ring, 8 ... contact part, 11 ... power module, 11a ... negative electrode terminal, 11b 3 phase alternating current output terminal, 12 ... case body, 13 ... heat dissipation member, 13a ... cooling chamber, 13b ... water supply channel, 13b1 ... water supply port, 13c ... drainage channel, 13c1 ... drainage port, 13d ... bottom, 13f joint surface, 13g, 13h ... inside, 14 ... fixing screw, 15 ... insertion hole, 16 ... substrate fixing part, 16a ... internal thread part, 17 ... cooling fin, 21 ... drive circuit board, 21a ... insertion hole, 22 ... control circuit board, 22a ... Insertion hole, 23 ... Power supply circuit board, 23a ... Insertion hole, 24 ... male screw part, 24b ... female screw part, 25a ... male screw part, 25b ... female screw part, 32, 33 ... heat transfer support metal plate, 32a ... heat transfer support plate part, 32b ... heat transfer support side plate part, 32c ... cooling body Contact plate part, 32c, 33c ... Cooling body contact plate part, 32c1, 33c1 ... Fixing member insertion hole, 32i ... Insertion hole, 33a ... Heat transfer support plate part, 33b ... Heat transfer support side plate part, 33c ... Coolant contact plate 33i ... insertion hole, 35 ... heat transfer member, 37 ... heat transfer member, 39 ... heat generating circuit component, 42 ... insulating sheet, 43 ... insulating sheet, 51 ... fixing screw, 52 ... connection cord, 53, 59 ... crimping Terminal, 55 ... Busbar, 57 ... Current sensor, 58 ... Motor connection cable, 60 ... Fixing screw

Claims (6)

発熱体と、この発熱体の一面に形成された放熱部材を有する冷却構造体であって、
前記放熱部材に、冷却液が通流する冷却室が設けられているとともに、
前記放熱部材に、前記冷却室を閉塞する閉塞部材を接合したことを特徴とする冷却構造体。A cooling structure having a heating element and a heat radiating member formed on one surface of the heating element,
The heat radiating member is provided with a cooling chamber through which a coolant flows,
A cooling structure, wherein a closing member for closing the cooling chamber is joined to the heat radiating member. 半導体パワーモジュールの一面に形成された放熱部材を有する電力変換装置であって、
前記放熱部材には、冷却液が通流する冷却室が設けられているとともに、
前記放熱部材に、前記冷却室を閉塞する閉塞部材を接合したことを特徴とする電力変換装置。A power conversion device having a heat dissipation member formed on one surface of a semiconductor power module,
The heat radiating member is provided with a cooling chamber through which a coolant flows,
A power conversion device, wherein a closing member that closes the cooling chamber is joined to the heat radiating member. 電力変換用の半導体スイッチング素子をケース体に内蔵し、当該ケース体の一面に放熱部材が形成された半導体パワーモジュールを備え、
前記放熱部材に、前記ケース体と反対側で開口して冷却液が通流する冷却室が設けられているとともに、
前記放熱部材に、前記冷却室を閉塞する閉塞部材を接合したことを特徴とする電力変換装置。The semiconductor switching element for power conversion is built in the case body, and includes a semiconductor power module in which a heat dissipation member is formed on one surface of the case body,
The heat radiating member is provided with a cooling chamber that is opened on the side opposite to the case body and through which a coolant flows,
A power conversion device, wherein a closing member that closes the cooling chamber is joined to the heat radiating member. 前記冷却室の底部から突出する複数の冷却フィンが形成されていることを特徴とする請求項３記載の電力変換装置。   The power conversion device according to claim 3, wherein a plurality of cooling fins protruding from a bottom portion of the cooling chamber are formed. 前記冷却室の通流方向の両内壁と、前記冷却フィンとの間の間隔を均等に設定したことを特徴とする請求項４記載の電力変換装置。   The power converter according to claim 4, wherein an interval between both inner walls in the flow direction of the cooling chamber and the cooling fin is set to be equal. 前記複数の冷却フィンと前記閉塞部材との間に隙間を設け、当該隙間を均一にしたことを特徴とする請求項４又は５に記載の電力変換装置。   The power converter according to claim 4 or 5, wherein a gap is provided between the plurality of cooling fins and the closing member, and the gap is made uniform.
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