JPWO2013094555A1 - Exposure apparatus and exposure mask - Google Patents

Abstract

  An exposure apparatus capable of shortening the exposure mask switching time is provided. The exposure apparatus (1) includes a substrate (10) and a plurality of exposure patterns (41 to 44) that transmit exposure light (L), and exposure light is applied to the substrate (10) through the exposure patterns (41 to 44). An exposure mask (40) for irradiating (L). The substrate (10) includes a first irradiation region (16) and a second irradiation side provided on the rear side of the moving direction (DR1) in which the substrate (10) moves during exposure with respect to the first irradiation region (16). And an irradiation region (18). The first irradiation region (16) is exposed through the exposure pattern (41) while moving the substrate (10), and after the exposure of the first irradiation region (16) is completed, the movement of the substrate (10) is continued. The exposure mask (40) is moved while switching from the exposure pattern (41) to the exposure pattern (42), and the second irradiation region is passed through the exposure pattern (42) while continuing the movement of the substrate (10). (18) is exposed.

Description

  The present invention relates to an exposure apparatus and an exposure mask, and more particularly to an exposure apparatus that transfers a pattern drawn on the exposure mask to a substrate, and an exposure mask that is preferably used in the exposure apparatus.

  Conventionally, with regard to an exposure mask device, a plurality of drawing patterns necessary for each exposure process in each manufacturing process are mounted on the same mask, a necessary drawing pattern is selected in each exposure process, and the other block patterns are shielded from light. An exposure apparatus has been proposed (see, for example, Japanese Patent Application Laid-Open No. 2003-21892 (Patent Document 1)).

JP 2003-21892 A

  In the apparatus described in Japanese Patent Laying-Open No. 2003-21892 (Patent Document 1), since a plurality of drawing patterns are formed on one mask, one mask can be used for a plurality of exposure processes, The number of masks is reduced. However, since a plurality of drawing patterns are two-dimensionally formed on one mask, it may take time to switch the drawing patterns. Therefore, it is difficult to switch the drawing pattern without stopping the movement of the substrate to be exposed, and there is a problem that the production efficiency cannot be improved.

  The present invention has been made in view of the above problems, and a main object thereof is to provide an exposure apparatus that can shorten the exposure mask switching time. Another object of the present invention is to provide an exposure mask suitably used for the exposure apparatus.

  An exposure apparatus according to the present invention includes a flat plate-shaped substrate, a stage on which the substrate is mounted, the substrate being moved in the surface direction of the substrate, a light source that generates exposure light irradiated on the substrate, and exposure that transmits the exposure light. A plurality of patterns are formed, and an exposure mask that irradiates the substrate with exposure light through the exposure pattern, and a mask drive unit that moves the exposure mask in parallel with the substrate are provided. The substrate has a first irradiation region and a second irradiation region provided on the rear side in the direction in which the substrate moves during exposure with respect to the first irradiation region. The exposure pattern includes a first pattern and a second pattern different from the first pattern. The first irradiation area is exposed through the first pattern while moving the substrate by the stage, and after the exposure of the first irradiation area is completed, the exposure mask is moved while continuing the movement of the substrate, and the first pattern is moved from the first pattern. Switching to the two patterns is performed, and the second irradiation region is exposed through the second pattern while continuing the movement of the substrate. Here, the surface direction of the substrate refers to a direction in which the front surface and the back surface of the flat substrate extend and is orthogonal to the thickness direction of the substrate.

  In the exposure apparatus, exposure of the second irradiation area may be started during switching from the first pattern to the second pattern. Or in the said exposure apparatus, you may start exposure of a 2nd irradiation area | region after completion | finish of switching from a 1st pattern to a 2nd pattern.

  The exposure mask according to the present invention is an exposure mask used in the exposure apparatus according to any one of the above aspects, and a plurality of exposure patterns are arranged in the moving direction of the exposure mask.

  The said exposure mask WHEREIN: The 2nd pattern may be provided in the back side of the moving direction in the exposure process of a board | substrate with respect to a 1st pattern.

  In the exposure mask, the exposure pattern is formed so as to extend in a direction orthogonal to the moving direction of the exposure mask, and a shielding region that shields the exposure light is exposed between the first pattern and the second pattern. You may form so that it may extend in the direction orthogonal to the moving direction of a mask.

  According to the exposure apparatus of the present invention, the exposure mask switching time can be shortened, and the production efficiency can be improved.

It is a schematic diagram which shows the outline of a structure of exposure apparatus. It is a schematic diagram which shows the relationship between the board | substrate exposed in an exposure apparatus, and an exposure mask. It is a schematic diagram which shows schematic structure of the exposure mask used for the exposure process of a board | substrate. FIG. 6 is a first schematic diagram illustrating a state of exposure pattern switching according to the first embodiment. FIG. 10 is a second schematic diagram showing the exposure pattern switching state of the first embodiment. FIG. 10 is a third schematic diagram illustrating an exposure pattern switching state according to the first embodiment. FIG. 10 is a fourth schematic diagram illustrating an exposure pattern switching state in the first embodiment. FIG. 10 is a fifth schematic diagram illustrating an exposure pattern switching state in the first embodiment. FIG. 10 is a sixth schematic diagram illustrating an exposure pattern switching state according to the first embodiment. FIG. 10 is a first schematic diagram illustrating an exposure pattern switching state according to the second embodiment. FIG. 10 is a second schematic diagram showing an exposure pattern switching state in the second embodiment. FIG. 10 is a third schematic diagram illustrating an exposure pattern switching state according to the second embodiment. FIG. 10 is a fourth schematic diagram showing an exposure pattern switching state in the second embodiment. FIG. 10 is a fifth schematic diagram illustrating an exposure pattern switching state according to the second embodiment. FIG. 10 is a sixth schematic diagram illustrating an exposure pattern switching state according to the second embodiment. FIG. 10 is a first schematic diagram illustrating an exposure pattern switching state according to the third embodiment. FIG. 10 is a second schematic diagram showing an exposure pattern switching state in the third embodiment. FIG. 10 is a third schematic diagram illustrating an exposure pattern switching state according to the third embodiment. FIG. 10 is a fourth schematic diagram illustrating an exposure pattern switching state according to the third embodiment. FIG. 10 is a fifth schematic diagram illustrating an exposure pattern switching state according to the third embodiment.

  Embodiments of the present invention will be described below with reference to the drawings. In the following drawings, the same or corresponding parts are denoted by the same reference numerals, and description thereof will not be repeated.

(Embodiment 1)
FIG. 1 is a schematic diagram showing an outline of the configuration of the exposure apparatus 1. The exposure apparatus 1 is used as an apparatus for irradiating the photo-alignment film material with ultraviolet rays, for example. As shown in FIG. 1, the exposure apparatus 1 includes a stage 20 on which a flat substrate 10 is mounted, a light source 30 that generates exposure light L irradiated on the substrate 10, and a predetermined pattern transferred to the substrate 10. A formed exposure mask 40 and a mask driving unit 50 for holding the exposure mask 40 are provided. The exposure apparatus 1 irradiates the substrate 10 placed on the stage 20 with the exposure light L generated by the light source 30 through the exposure mask 40. Thus, the exposure apparatus 1 transfers a predetermined pattern to the first and second irradiation areas 16 and 18 provided on the surface of the substrate 10.

  1 indicates the moving direction of the stage 20, that is, the moving direction DR1 of the substrate 10 placed on the stage 20. The stage 20 moves the substrate 10 in a direction along a straight line extending in the surface direction of the substrate 10. 1 indicate the moving direction DR2 of the exposure mask 40. The mask drive unit 50 includes a main body 51, a drive shaft 52, and a mask holding unit 53. The driving force generated in the main body 51 is transmitted to the mask holder 53 via the drive shaft 52, and the mask holder 53 reciprocates in the left-right direction in the figure. As the mask holder 53 moves, the exposure mask 40 held on the lower surface of the mask holder 53 reciprocates in the movement direction DR2. The movement direction DR2 of the exposure mask 40 is parallel to the movement direction DR1 of the substrate 10.

  The substrate 10 is mounted on the stage 20, and the exposure mask 40 is disposed above the substrate 10 so as to face the substrate 10. The exposure apparatus 1 has a mask holding unit 53, and the exposure mask 40 used for the exposure processing of the substrate 10 is attached to the mask holding unit 53. By irradiating the substrate 10 with the exposure light L through the exposure mask 40 from the light source 30, the exposure processing of the substrate 10 is performed. The exposure light L may be, for example, ultraviolet light. In this case, the light source 30 is an ultraviolet light source that generates ultraviolet light. The exposure light L may be irradiated perpendicularly to the surface of the substrate 10 or may be irradiated obliquely with respect to the surface of the substrate 10.

  The exposure apparatus 1 also includes a control unit 80. The control unit 80 transmits a control signal C <b> 1 to the light source 30 to control irradiation or stop of the exposure light L from the light source 30. The control unit 80 transmits a control signal C2 to the mask driving unit 50, and controls the movement of the exposure mask 40 along the movement direction DR2. The controller 80 transmits a control signal C3 to the stage 20 and controls the movement of the substrate 10 along the movement direction DR1.

  FIG. 2 is a schematic diagram showing the relationship between the substrate 10 exposed in the exposure apparatus 1 and the exposure mask 40. FIG. 2 shows a single substrate 10 in plan view, and shows an arrangement of a mask group composed of a plurality of exposure masks 40 with respect to the substrate 10. The exposure mask 40 is small with respect to the substrate 10, and the exposure processing of the entire substrate 10 is performed by arranging a plurality of exposure masks 40 side by side. In addition, it is not limited to the mask group containing the some exposure mask 40, The structure which can implement the exposure process of the board | substrate 10 whole with a single exposure mask may be sufficient. Each exposure mask 40 is held by a mask holding portion 53 whose side shape is shown in FIG. The mask holding part 53 has a frame shape that engages with the peripheral part of the exposure mask 40 so as not to obstruct the optical path of the exposure light L that is irradiated from the light source 30 to the substrate 10 via the exposure mask 40. Is provided.

  A moving direction DR2 of the exposure mask 40 is indicated by a double-headed arrow shown in FIG. This double arrow also indicates the direction of relative movement of the exposure mask 40 with respect to the substrate 10. When at least one of the substrate 10 mounted on the stage 20 and the exposure mask 40 attached to the mask holding unit 53 moves in the horizontal direction in the drawing, the substrate 10 and the exposure mask 40 are double-headed. Move in the direction of.

  The plurality of exposure masks 40 are arranged in two rows in a direction orthogonal to the direction of relative movement between the substrate 10 and the exposure mask 40. The plurality of exposure masks 40 are arranged so that the entire surface of the substrate 10 can be exposed. Two masks adjacent in a direction orthogonal to the relative movement direction of the substrate 10 and the exposure mask 40 are arranged in different rows. The irradiation areas of the exposure light L irradiated onto the substrate 10 via these two exposure masks 40 may be adjacent to each other without any gap, or the irradiation areas may partially overlap.

  FIG. 3 is a schematic diagram showing a schematic configuration of an exposure mask 40 used for the exposure processing of the substrate 10. As shown in FIG. 3, a plurality of exposure patterns 41, 42, 43, 44 are drawn on one exposure mask 40. The exposure patterns 41, 42, 43, and 44 have a property of transmitting the exposure light L. Of the four exposure patterns 41, 42, 43, and 44, one of the exposure patterns suitable for the exposure processing of the substrate 10 to be processed is selected, and the exposure light L is transmitted via the selected exposure pattern. By irradiating the substrate 10, the substrate 10 is exposed. The number of exposure patterns drawn on one exposure mask 40 is not limited and may be an arbitrary number.

  When the substrate 10 is a substrate for a liquid crystal panel, for example, in an exposure mask 40, the exposure pattern 41 is for a 45-type TFT (Thin Film Transistor) substrate, and the exposure pattern 42 is for a 45-type CF (Color Filter) substrate. The exposure pattern 43 can be formed as a pattern for a 75-type TFT substrate, and the exposure pattern 44 can be formed as a pattern for a 75-type CF substrate. That is, different drawing patterns are formed in the plurality of exposure patterns 41, 42, 43, 44. The same drawing pattern may be formed in a part of the plurality of exposure patterns 41, 42, 43, 44.

  The four exposure patterns 41, 42, 43, 44 are surrounded by the edge 45 of the exposure mask 40. Shielding regions 46, 47, 48 are interposed between the respective exposure patterns 41, 42, 43, 44 adjacent to the movement direction DR2 of the exposure mask 40. The shielding regions 46, 47, and 48 are made of a material that does not transmit the exposure light L, such as chromium, and shields the exposure light L. The shielding area 46 is interposed between the exposure patterns 41 and 42 and separates the exposure pattern 41 and the exposure pattern 42 from each other. The shielding area 47 is interposed between the exposure patterns 42 and 43 and separates the exposure pattern 42 and the exposure pattern 43 from each other. The shielding area 47 is interposed between the exposure patterns 43 and 44 and separates the exposure pattern 43 and the exposure pattern 44 from each other.

  The plurality of exposure patterns 41, 42, 43, and 44 are arranged only in the movement direction DR2 of the exposure mask 40 indicated by a double arrow in FIG. 3, and are not arranged in the direction intersecting the movement direction DR2. When the exposure mask 40 is moved to switch the exposure patterns 41, 42, 43, and 44, the exposure mask 40 only needs to be translated in the movement direction DR2. Each of the plurality of exposure patterns 41, 42, 43, 44 is formed in a straight line extending in the vertical direction in the figure orthogonal to the moving direction DR 2 of the exposure mask 40. Therefore, the shielding regions 46, 47, 48 that separate the exposure patterns 41, 42, 43, 44 are also formed in a straight line extending in the vertical direction in the figure orthogonal to the moving direction DR2 of the exposure mask 40. The drawing pattern drawn on each of the exposure patterns 41, 42, 43, and 44 is preferably a linear pattern parallel to the moving direction DR2 of the exposure mask 40 as shown in FIG.

  4 to 9 are schematic diagrams showing the switching state of the exposure patterns 41 and 42 according to the first embodiment. In the following drawings, the substrate 10 and the exposure mask 40 are shown in the configuration of the exposure apparatus 1 shown in FIG. 1, but the stage 20 for moving the substrate 10 and the exposure mask 40 are moved for simplicity. The mask driving unit 50, the light source 30, and the like are not shown. Regarding the switching operation of the exposure patterns 41 and 42 using the exposure apparatus 1 having the above-described configuration for optimally exposing the irradiation areas 16 and 18 on which different patterns on the surface of the substrate 10 are to be exposed, FIGS. This will be described with reference to FIG.

  In the present embodiment, the substrate 10 includes different substrates 11 and 12, the first irradiation region 16 is provided on the substrate 11, and the second irradiation region 18 is provided on the substrate 12. The substrate 11 is a substrate disposed on the front side in the movement direction DR1 of the substrate 10, and the substrate 12 is a substrate disposed on the rear side in the movement direction DR1 of the substrate 10. For this reason, the second irradiation region 18 is provided behind the first irradiation region 16 in the movement direction DR1 in which the substrates 11 and 12 move during exposure. The exposure mask 40 includes an exposure pattern 41 as a first pattern and an exposure pattern 42 as a second pattern different from the first pattern. The exposure pattern 42 is provided behind the exposure pattern 41 in the movement direction DR1 of the substrates 11 and 12 during the exposure process.

  First, as an exposure preparation, after the exposure mask 40 is held by the mask holder 53 and the position of the held exposure mask 40 is adjusted, the exposure patterns 41 and 42 to be used are formed at any position of the exposure mask 40. To figure out. When the exposure patterns 41 and 42 to be described later are switched, the exposure mask 40 is moved so that the set position of the exposure pattern 42 acquired in advance and the position of the actual exposure pattern 42 are aligned with each other. Position accuracy has been improved.

  In FIG. 4, the exposure light L is irradiated via the exposure pattern 41 to the first irradiation region 16 provided on the surface of the substrate 11 while moving the substrates 11 and 12 in the movement direction DR1 by the stage 20. Yes. At this time, the exposure mask 40 is stopped. The substrate 11 is irradiated with the exposure light L via the exposure mask 40 while relatively moving the exposure mask 40 and the substrate 11 with the moving speed of the substrate 11 as a relative speed. Thereby, one exposure pattern 41 formed on the exposure mask 40 is transferred to the first irradiation region 16 of the substrate 11, and the substrate 11 is subjected to scanning exposure.

  As the substrate 11 continues to move from the state of FIG. 4, the exposure light L is exposed to the entire first irradiation region 16, and the state shown in FIG. 5 is obtained. When the exposure light L reaches the rear end side of the first irradiation region 16 in the movement direction DR1 of the substrate 11, the exposure processing of the first irradiation region 16 is completed. By directly detecting the position of the substrate 10 or detecting the state of the stage 20 that moves the substrate 10, it is confirmed that the exposure light L has reached the rear end of the first irradiation region 16. It is determined that 16 exposures have been completed.

  It is not necessary to irradiate the exposure light L to an area on the surface of the substrate 11 that is outside the first irradiation area 16 because the exposure process need not be performed. Therefore, when the exposure light L reaches the rear end side of the first irradiation region 16 and the exposure processing of the first irradiation region 16 is completed, the light source 30 may stop the irradiation of the exposure light L.

  When the substrate 11 is further moved, the exposure possible region L0 in which the light generated by the light source 30 can be irradiated to the substrate 10 via the exposure pattern 41 is completely removed from the first irradiation region 16 as shown in FIG. Become. The light source 30 may stop the irradiation of the exposure light L at this timing. When the exposure possible region L0 leaves the first irradiation region 16, switching from the exposure pattern 41 to the exposure pattern 42 is started. Upon completion of the exposure process for the first irradiation region 16, the exposure mask 40 moves in the movement direction DR2, which is the same direction as the movement direction DR1 of the substrate 10.

  During the movement of the exposure mask 40 for switching from the exposure pattern 41 to the exposure pattern 42, the movement of the substrate 10 is also continued without being stopped. The exposure mask 40 completes switching from the exposure pattern 41 to the exposure pattern 42 before the exposure possible region L0 overlaps the second irradiation region 18. When the substrate 12 moves until the exposure possible region L0 overlaps the second irradiation region 18, the exposure patterns 41 and 42 have already been switched, and the exposure processing of the second irradiation region 18 is possible. Therefore, there is no need to stop the substrate 12 and wait for switching of the exposure patterns 41 and 42. Therefore, the production efficiency is improved.

  In order to switch the exposure patterns 41 and 42, the exposure mask 40 is moved in the movement direction DR2 toward a predetermined coordinate, and the movement of the substrates 11 and 12 is continued. Due to this movement, the exposure possible region L0 shown in FIG. 7 changes from the state in the middle of the transition from the exposure pattern 41 to the exposure pattern 42, and the exposure possible region L0 shown in FIG. To do. When the exposure possible region L0 overlaps the exposure pattern 42, the exposure mask 40 stops.

  Thereafter, the substrate 10 continues to move, so that the exposure possible region L0 is in a state shown in FIG. In this state, the light source 30 resumes the irradiation of the exposure light L while continuing the movement of the substrate 12, whereby the exposure processing of the second irradiation region 18 is started. The exposure process for the second irradiation region 18 is started after the switching from the exposure pattern 41 to the exposure pattern 42 is completed.

  In the state where the exposure light L can be irradiated through the exposure pattern 42 shown in FIG. 8, the exposure possible region L0 has not yet reached the second irradiation region 18. The switching of the exposure patterns 41 and 42 is completed faster than the substrate 12 is moved to a state where the exposure process of the second irradiation region 18 is possible. Therefore, it is not necessary to separately secure time for switching the exposure patterns 41 and 42, and the time required for the exposure process can be shortened, so that the production efficiency can be improved.

(Embodiment 2)
10 to 15 are schematic diagrams showing the switching state of the exposure patterns 41 and 42 according to the second embodiment. In the first embodiment, the first irradiation region 16 is provided on the substrate 11 and the second irradiation region 18 is provided on another substrate 12 different from the substrate 11. However, in the second embodiment, a single irradiation region 16 is provided. The substrate 10 is provided with both the first irradiation region 16 and the second irradiation region 18. The second embodiment is an example corresponding to the case where the substrate 10 is a glass substrate for a liquid crystal panel, for example, and a plurality of different types of liquid crystal panels are formed from a single glass substrate.

  10 to 14 correspond to FIGS. 4 to 7 and 9 described in the first embodiment. As shown in FIGS. 10 to 14, similarly to the first embodiment, the exposure patterns 41 and 42 are switched during the movement of the substrate 10. Switching of the exposure patterns 41 and 42 is completed within the time from the exposure possible region L0 passing through the first irradiation region 16 to overlapping the second irradiation region 18, and exposure is performed as in the first embodiment. Processing time has been reduced.

  FIG. 15 shows the movement of the exposure mask 40 for returning the exposure pattern after the exposure processing of the second irradiation region 18 is completed. When the exposure processing of the substrate 10 is completed and the exposure possible region L0 deviates from the second irradiation region 18, the exposure mask 40 moves in the moving direction DR2 shown in FIG. As a result, the exposure possible region L0 returns from the exposure pattern 42 to the exposure pattern 41, and the next substrate is prepared for exposure processing.

(Embodiment 3)
16 to 20 are schematic diagrams showing the switching status of the exposure patterns 41 and 42 according to the third embodiment. In the first and second embodiments, the exposure mask 40 is switched after the exposure processing of the first irradiation region 16 is completed, and the exposure processing of the second irradiation region 18 is started after the switching from the exposure pattern 41 to the exposure pattern 42 is completed. It was. On the other hand, in the third embodiment, the exposure process of the second irradiation region 18 is started with the substrate 10 and the exposure mask 40 both moved. That is, in the third embodiment, the exposure of the second irradiation region 18 is started during the switching from the exposure pattern 41 to the exposure pattern 42.

  Similar to the second embodiment, one substrate 10 is provided with both the first irradiation region 16 and the second irradiation region 18. In FIG. 16, the exposure light L is irradiated through the exposure pattern 41 to the irradiation region 16 on the surface of the substrate 11 while moving the substrate 10 in the movement direction DR1. At this time, the exposure mask 40 is stopped. Thereby, one exposure pattern 41 formed on the exposure mask 40 is transferred to the first irradiation region 16 of the substrate 10, and the substrate 10 is subjected to scanning exposure.

  As the substrate 10 continues to move from the state of FIG. 16, the exposure light L is exposed to the entire first irradiation region 16, and the state shown in FIG. 17 is obtained. When the exposure light L reaches the rear end side of the first irradiation region 16 in the movement direction DR1 of the substrate 10, the exposure processing of the first irradiation region 16 is completed. At this timing, the movement of the exposure mask 40 in the movement direction DR2 is started while continuing the movement of the substrate 10, and switching from the exposure pattern 41 to the exposure pattern 42 is started.

  By moving the exposure mask 40 in the movement direction DR2 for switching between the exposure patterns 41 and 42 and continuing the movement of the substrate 10, the exposure light L shown in FIG. Both are transmitted and the substrate 10 is irradiated. The exposure process of the second irradiation region 18 is started by irradiating the second irradiation region 18 with the exposure light L via the exposure pattern 42. At this time, the exposure process to the second irradiation region 18 of the substrate 10 is performed while moving the exposure mask 40.

  When the exposure mask 40 reaches a position where all of the exposure light L generated by the light source 30 is irradiated onto the substrate 10 via the exposure pattern 42, the exposure mask 40 stops. Thereafter, the substrate 10 further continues to move, whereby the scanning exposure of the second irradiation region 18 is continued, and the state shown in FIG. 19 is obtained. From the state shown in FIG. 19, the movement of the substrate 10 is continued, and the scanning exposure of the second irradiation region 18 is performed.

  FIG. 20 shows the movement of the exposure mask 40 for returning the exposure pattern after the exposure processing of the second irradiation region 18 is completed. When the exposure processing of the substrate 10 is completed and the exposure possible region L0 deviates from the second irradiation region 18, the exposure mask 40 moves in the movement direction DR2 shown in FIG. As a result, the exposure possible region L0 returns from the exposure pattern 42 to the exposure pattern 41, and the next substrate is prepared for exposure processing.

  According to the exposure apparatus of the third embodiment, after the exposure of the first irradiation region 16 is completed, the second irradiation that is performed during the switching of the exposure patterns 41 and 42 without waiting for the completion of the switching of the exposure patterns 41 and 42. Exposure of area 18 is started. Therefore, the time required for the exposure process can be further shortened, and the production efficiency can be further improved. In addition, by allowing the substrate 10 to be irradiated with the exposure light L via both of the exposure patterns 41 and 42, the interval between the first irradiation region 16 and the second irradiation region 18 can be reduced. The area | region which is not used for the exposure process among the one board | substrates 10 can be reduced, and the utilization efficiency of the board | substrate 10 can be improved.

  Although the embodiment of the present invention has been described as above, the embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  DESCRIPTION OF SYMBOLS 1 Exposure apparatus 10, 11, 12 Substrate, 16 1st irradiation area, 18 2nd irradiation area, 20 stages, 30 Light source, 40 Exposure mask, 41, 42, 43, 44 Exposure pattern, 46, 47, 48 Shielding area, 50 mask driving section, 51 main body section, 52 driving shaft, 53 mask holding section, 80 control section, DR1 substrate moving direction, DR2 exposure mask moving direction, L exposure light, L0 exposure possible area.

Claims (6)

A plate-shaped substrate;
A stage on which the substrate is mounted and the substrate is moved in the surface direction of the substrate;
A light source that generates exposure light applied to the substrate;
A plurality of exposure patterns that transmit the exposure light, and an exposure mask that irradiates the exposure light to the substrate through the exposure pattern;
A mask drive unit that moves the exposure mask in parallel with the substrate,
The substrate has a first irradiation region, and a second irradiation region provided on the rear side in the direction in which the substrate moves during exposure with respect to the first irradiation region,
The exposure pattern includes a first pattern and a second pattern different from the first pattern,
The first irradiation area is exposed through the first pattern while moving the substrate by the stage, and the exposure mask is moved while continuing the movement of the substrate after the exposure of the first irradiation area is completed. An exposure apparatus that performs switching from the first pattern to the second pattern and exposes the second irradiation region through the second pattern while continuing to move the substrate.   The exposure apparatus according to claim 1, wherein exposure of the second irradiation area is started during switching from the first pattern to the second pattern.   The exposure apparatus according to claim 1, wherein exposure of the second irradiation area is started after the switching from the first pattern to the second pattern is completed. An exposure mask used in the exposure apparatus according to claim 1,
A plurality of the exposure patterns are arranged in the movement direction of the exposure mask.   The exposure mask according to claim 4, wherein the second pattern is provided on the rear side in the movement direction of the substrate during the exposure process with respect to the first pattern. The exposure pattern is formed to extend in a direction perpendicular to the moving direction of the exposure mask,
The shielding area which shields the said exposure light between the said 1st pattern and said 2nd pattern is formed so that it may extend in the direction orthogonal to the moving direction of the said exposure mask. 5. The exposure mask according to 5.

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