JPWO2012147919A1 - Heater and glow plug equipped with the same - Google Patents

Heater and glow plug equipped with the same Download PDF

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JPWO2012147919A1
JPWO2012147919A1 JP2013512466A JP2013512466A JPWO2012147919A1 JP WO2012147919 A1 JPWO2012147919 A1 JP WO2012147919A1 JP 2013512466 A JP2013512466 A JP 2013512466A JP 2013512466 A JP2013512466 A JP 2013512466A JP WO2012147919 A1 JPWO2012147919 A1 JP WO2012147919A1
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resistor
lead
heater
recess
insulating base
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JP5766282B2 (en
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日浦　規光
規光 日浦
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Kyocera Corp
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F23—COMBUSTION APPARATUS; COMBUSTION PROCESSES
    • F23Q—IGNITION; EXTINGUISHING-DEVICES
    • F23Q7/00—Incandescent ignition; Igniters using electrically-produced heat, e.g. lighters for cigarettes; Electrically-heated glowing plugs
    • F23Q7/001—Glowing plugs for internal-combustion engines
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F23—COMBUSTION APPARATUS; COMBUSTION PROCESSES
    • F23Q—IGNITION; EXTINGUISHING-DEVICES
    • F23Q7/00—Incandescent ignition; Igniters using electrically-produced heat, e.g. lighters for cigarettes; Electrically-heated glowing plugs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F23—COMBUSTION APPARATUS; COMBUSTION PROCESSES
    • F23Q—IGNITION; EXTINGUISHING-DEVICES
    • F23Q7/00—Incandescent ignition; Igniters using electrically-produced heat, e.g. lighters for cigarettes; Electrically-heated glowing plugs
    • F23Q7/22—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
    • H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
    • H05B3/148—Silicon, e.g. silicon carbide, magnesium silicide, heating transistors or diodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/18—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor the conductor being embedded in an insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/40—Heating elements having the shape of rods or tubes
    • H05B3/42—Heating elements having the shape of rods or tubes non-flexible
    • H05B3/48—Heating elements having the shape of rods or tubes non-flexible heating conductor embedded in insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/027—Heaters specially adapted for glow plug igniters

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Resistance Heating (AREA)

Abstract

【課題】急速昇温等の際に抵抗体に大電流が流れても抵抗体とリードとの接合部の端部に多大な応力集中が発生することを抑制された高い信頼性および耐久性を有するヒータおよびこれを備えたグロープラグを提供する。【解決手段】ヒータ（１）は、発熱部（４）を有する抵抗体（３）と、抵抗体（３）の端部に接合されたリード（８）と、抵抗体（３）およびリード（８）を被覆する絶縁基体（９）とを備え、抵抗体（３）とリード（８）との接合部は、リード（８）は抵抗体（３）よりも太い形状であって、リード（８）の先端部に抵抗体（３）の端部が入り込むようにして接続されているとともに、抵抗体（３）の端面には凹部が設けられ、該凹部にリード（８）の一部が入り込んでいる。[PROBLEMS] To achieve high reliability and durability in which a great stress concentration is prevented from occurring at an end portion of a joint between a resistor and a lead even when a large current flows through the resistor during rapid temperature rise or the like. Provided are a heater having a glow plug and a glow plug having the heater. A heater (1) includes a resistor (3) having a heat generating portion (4), a lead (8) joined to an end of the resistor (3), a resistor (3) and a lead ( 8) and an insulating base (9) covering the lead (8). The lead (8) is thicker than the resistor (3) at the joint between the resistor (3) and the lead (8). 8) is connected so that the end of the resistor (3) enters the tip of the resistor (3), and a recess is provided on the end surface of the resistor (3), and a part of the lead (8) is provided in the recess. It has entered.

Description

本発明は、例えば燃焼式車載暖房装置における点火用若しくは炎検知用のヒータ、石油ファンヒータ等の各種燃焼機器の点火用のヒータ、自動車エンジンのグロープラグ用のヒータ、酸素センサ等の各種センサ用のヒータ、測定機器の加熱用のヒータ等に利用されるヒータおよびこれを備えたグロープラグに関するものである。   The present invention is, for example, for a heater for ignition or flame detection in a combustion-type in-vehicle heating device, a heater for ignition of various combustion devices such as an oil fan heater, a heater for a glow plug of an automobile engine, and various sensors such as an oxygen sensor. In particular, the present invention relates to a heater used for a heater, a heater for heating a measuring instrument, and a glow plug including the heater.

自動車エンジンのグロープラグ等に用いられるヒータは、発熱部を有する抵抗体、リードおよび絶縁基体を含む構成になっている。そして、リードの抵抗が抵抗体の抵抗より小さくなるように、これらの材料選定や形状設計がされている。   A heater used for a glow plug of an automobile engine includes a resistor having a heat generating portion, a lead, and an insulating base. These materials are selected and the shape is designed so that the resistance of the lead is smaller than the resistance of the resistor.

ここで、抵抗体とリードとの接合部は、形状変化点であったり材料組成変化点であったりするので、使用時の発熱や冷却での熱膨張の差に起因した影響を受けないように接合面積を大きくする目的で、リードの軸方向に平行な断面で視たときに抵抗体とリードとの界面が斜めになっているものが知られている（例えば、特許文献１，２を参照）。   Here, the joint between the resistor and the lead is a point of change in shape or a point of change in material composition, so that it is not affected by the difference in thermal expansion during heat generation or cooling during use. In order to increase the bonding area, it is known that the interface between the resistor and the lead is oblique when viewed in a cross section parallel to the axial direction of the lead (see, for example, Patent Documents 1 and 2). ).

特開2002−334768号公報JP 2002-334768 A 特開2003−22889号公報JP 2003-22889 A

近年、従来以上の急速昇温が求められているため、エンジン動作開始時に抵抗体に大電流を流す必要性がでてきた。このように、ヒータに大電流を流して使用する場合には、抵抗体とリードとの界面を斜めにして接合面積を大きくしていたとしても、抵抗体とリードとの熱膨張差が大きく、接合部（抵抗体の端部またはリードの端部）に熱応力が集中して、クラックが入るという問題が生じてきた。   In recent years, since there has been a demand for rapid temperature increase more than before, it has become necessary to flow a large current through the resistor at the start of engine operation. In this way, when using a heater with a large current flowing, even if the interface between the resistor and the lead is slanted to increase the bonding area, the difference in thermal expansion between the resistor and the lead is large. There has been a problem that thermal stress concentrates on the joint (resistor end or lead end) and cracks occur.

本発明は、上記従来の問題点に鑑みて案出されたものであり、その目的は、急速昇温等の際に抵抗体に大電流が流れても抵抗体とリードとの接合部に多大な熱応力が集中することを抑制された高い信頼性および耐久性を有するヒータを提供することである。   The present invention has been devised in view of the above-mentioned conventional problems, and the purpose of the present invention is to greatly increase the junction between the resistor and the lead even when a large current flows through the resistor during rapid temperature rise or the like. It is an object to provide a heater having high reliability and durability in which concentrated thermal stress is suppressed.

本発明のヒータは、絶縁基体と、該絶縁基体に埋設された抵抗体と、前記絶縁基体に埋設され、先端側で前記抵抗体に接続されるとともに後端側で前記絶縁基体の表面に導出されたリードとを備え、該リードは前記抵抗体よりも太い形状であって、前記リードの先端部に前記抵抗体の端部が入り込むようにして接続されているとともに、前記抵抗体の端面には凹部が設けられ、該凹部に前記リードの一部が入り込んでいることを特徴とするものである。   The heater of the present invention includes an insulating base, a resistor embedded in the insulating base, and embedded in the insulating base, connected to the resistor on the front end side and led to the surface of the insulating base on the rear end side. The lead is thicker than the resistor, and is connected so that the end of the resistor enters the tip of the lead, and is connected to the end surface of the resistor. Is provided with a recess, and a part of the lead enters the recess.

また、本発明のヒータは、上記の構成のヒータと、前記リードと電気的に接続されて前記ヒータを保持する金属製保持部材とを備えたグロープラグとして使用できる。   The heater of the present invention can be used as a glow plug including the heater having the above-described configuration and a metal holding member that is electrically connected to the lead and holds the heater.

本発明のヒータによれば、急速昇温の際に大電流が流れても、抵抗体よりも抵抗値の低いリードに抵抗体の内側の熱を散逸させることができる。したがって、接合部に熱がこもるのを抑制して、発熱による負荷を低減できる。その結果、繰り返し温度を上下させても、接合部にクラックが入るのを抑制することができる。これにより、ヒータの信頼性および耐久性が向上する。   According to the heater of the present invention, even if a large current flows at the time of rapid temperature rise, the heat inside the resistor can be dissipated to the lead having a resistance value lower than that of the resistor. Therefore, it is possible to suppress heat from being accumulated in the joint portion and to reduce a load due to heat generation. As a result, even if the temperature is repeatedly raised and lowered, cracks can be prevented from entering the joint. Thereby, the reliability and durability of the heater are improved.

（ａ）は本発明のヒータの実施の形態の一例を示す要部拡大縦断面図であり、（ｂ）は（ａ）に示すＸ−Ｘ線における横断面図である。(A) is a principal part expanded longitudinal sectional view which shows an example of embodiment of the heater of this invention, (b) is a cross-sectional view in the XX line shown to (a). （ａ）は本発明のヒータの実施の形態の他の例を示す要部拡大縦断面図であり、（ｂ）は（ａ）に示すＸ−Ｘ線における横断面図である。(A) is a principal part expanded longitudinal sectional view which shows the other example of embodiment of the heater of this invention, (b) is a cross-sectional view in the XX line shown to (a). （ａ）は本発明のヒータの実施の形態の他の例を示す要部拡大縦断面図であり、（ｂ）は（ａ）に示すＸ−Ｘ線における横断面図である。(A) is a principal part expanded longitudinal sectional view which shows the other example of embodiment of the heater of this invention, (b) is a cross-sectional view in the XX line shown to (a). （ａ）は本発明のヒータの実施の形態の他の例を示す要部拡大縦断面図であり、（ｂ）は（ａ）に示すＸ−Ｘ線における横断面図である。(A) is a principal part expanded longitudinal sectional view which shows the other example of embodiment of the heater of this invention, (b) is a cross-sectional view in the XX line shown to (a). （ａ）、（ｂ）は、それぞれ本発明のヒータの実施の形態の他の例を示す要部拡大縦断面図である。(A), (b) is the principal part expansion longitudinal cross-sectional view which shows the other example of embodiment of the heater of this invention, respectively. 本発明のグロープラグの実施の形態の一例を示す概略縦断面図である。It is a schematic longitudinal cross-sectional view which shows an example of embodiment of the glow plug of this invention.

以下、本発明のヒータの実施の形態の例について図面を参照して詳細に説明する。   Hereinafter, an example of an embodiment of a heater of the present invention will be described in detail with reference to the drawings.

図１（ａ）は本発明のヒータの実施の形態の一例を示す縦断面図、図１（ｂ）は図１（ａ）に示すＸ−Ｘ線における横断面図である。また、図２（ａ）は本発明のヒータの実施の形態の他の例を示す縦断面図であり、図２（ｂ）は図２（ａ）に示すＸ−Ｘ線における横断面図である。   FIG. 1A is a longitudinal sectional view showing an example of an embodiment of the heater of the present invention, and FIG. 1B is a transverse sectional view taken along line XX shown in FIG. 2A is a longitudinal sectional view showing another example of the embodiment of the heater of the present invention, and FIG. 2B is a transverse sectional view taken along line XX shown in FIG. 2A. is there.

本実施の形態のヒータ１は、絶縁基体９と、絶縁基体９に埋設された抵抗体３と、絶縁基体９に埋設され、先端側で抵抗体３に接続されるとともに後端側で絶縁基体９の表面に導出されたリード８とを備え、リード８は抵抗体３よりも太い形状であって、リード８の先端部に抵抗体３の端部が入り込むようにして接続されているとともに、抵抗体３の端面には凹部31が設けられ、該凹部31にリード８の一部が入り込んでいる。   The heater 1 according to the present embodiment includes an insulating base 9, a resistor 3 embedded in the insulating base 9, and an insulating base 9 embedded in the insulating base 9, connected to the resistor 3 on the front end side, and insulated on the rear end side. 9 and a lead 8 led out to the surface of the resistor 9, and the lead 8 is thicker than the resistor 3, and is connected so that the end of the resistor 3 enters the tip of the lead 8, A concave portion 31 is provided on the end surface of the resistor 3, and a part of the lead 8 enters the concave portion 31.

本実施の形態のヒータ１における絶縁基体９は、例えば棒状に形成されたものである。この絶縁基体９は抵抗体３およびリード８を被覆しており、言い換えると、抵抗体３およびリード８が絶縁基体９に埋設されている。ここで、絶縁基体９はセラミックスからなることが好ましく、これにより、金属よりも高温まで耐えることができるようになるので、急速昇温時の信頼性がより向上したヒータ１を提供することが可能になる。具体的には、酸化物セラミックス，窒化物セラミックス，炭化物セラミックス等の電気的な絶縁性を有するセラミックスが挙げられる。特に、絶縁基体９は、窒化珪素質セラミックスからなることが好適である。窒化珪素質セラミックスは、主成分である窒化珪素が高強度、高靱性、高絶縁性および耐熱性の観点で優れているからである。この窒化珪素質セラミックスは、例えば、主成分の窒化珪素に対して、焼結助剤として３〜12質量％のＹ２Ｏ３，Ｙｂ２Ｏ３，Ｅｒ２Ｏ３等の希土類元素酸化物、0.5〜３質量％のＡｌ２Ｏ３、さらに焼結体に含まれるＳｉＯ２量として1.5〜５質量％となるようにＳｉＯ２を混合し、所定の形状に成形し、その後、1650〜1780℃でホットプレス焼成することにより得ることができる。The insulating base 9 in the heater 1 of the present embodiment is formed in a rod shape, for example. The insulating substrate 9 covers the resistor 3 and the lead 8. In other words, the resistor 3 and the lead 8 are embedded in the insulating substrate 9. Here, it is preferable that the insulating base 9 is made of ceramics, which can withstand temperatures higher than that of metal, so that it is possible to provide the heater 1 with improved reliability at the time of rapid temperature rise. become. Specifically, ceramics having electrical insulation properties such as oxide ceramics, nitride ceramics, carbide ceramics can be given. In particular, the insulating substrate 9 is preferably made of silicon nitride ceramics. This is because silicon nitride ceramics is excellent in terms of high strength, high toughness, high insulating properties, and heat resistance. This silicon nitride ceramic is, for example, 3 to 12% by mass of a rare earth element oxide such as Y 2 O 3 , Yb 2 O 3 , Er 2 O 3 as a sintering aid with respect to silicon nitride as a main component, 0.5 to 3% by mass of Al 2 O 3 , and further SiO 2 is mixed so that the amount of SiO 2 contained in the sintered body is 1.5 to 5% by mass, molded into a predetermined shape, and then 1650 to 1780 ° C. It can be obtained by hot press firing.

また、絶縁基体９として窒化珪素質セラミックスから成るものを用いる場合、ＭｏＳｉ２，ＷＳｉ２等を混合し分散させることが好ましい。この場合、母材である窒化珪素質セラミックスの熱膨張率を抵抗体３の熱膨張率に近づけることができ、ヒータ１の耐久性を向上させることができる。In the case of using a made of silicon nitride ceramics as the insulating substrate 9, it is preferable to mixing MoSi 2, WSi 2, etc. dispersed. In this case, the coefficient of thermal expansion of the silicon nitride ceramic that is the base material can be brought close to the coefficient of thermal expansion of the resistor 3, and the durability of the heater 1 can be improved.

抵抗体３は、図１に示すような直線形状であればリード８間の領域を発熱部４とすることができ、選択的に発熱部４とするには、一部断面積を小さくした領域やらせん形状の領域を設けるとよい。また、図２に示すような折返し形状をなしている場合、抵抗体３のリード８間の領域を発熱部４とすることができ、折返しの中間点付近が最も発熱する発熱部４となる。この抵抗体３としては、Ｗ，Ｍｏ，Ｔｉなどの炭化物、窒化物、珪化物などを主成分とするものを使用することができる。絶縁基体９が上述の材料の場合、絶縁基体９との熱膨張率の差が小さい点、高い耐熱性を有する点および比抵抗が小さい点で、上記の材料のなかでも炭化タングステン（ＷＣ）が抵抗体３の材料として優れている。さらに、絶縁基体９が窒化珪素質セラミックスからなる場合、抵抗体３は無機導電体のＷＣを主成分とし、これに添加される窒化珪素の含有率が20質量％以上であるものが好ましい。例えば、窒化珪素質セラミックスから成る絶縁基体９中において、抵抗体３となる導体成分は窒化珪素と比較して熱膨張率が大きいため、通常は引張応力がかかった状態にある。これに対して、抵抗体３中に窒化珪素を添加することにより、抵抗体３の熱膨張率を絶縁基体９の熱膨張率に近づけて、ヒータ１の昇温時および降温時の熱膨張率の差による応力を緩和することができる。   If the resistor 3 has a linear shape as shown in FIG. 1, the region between the leads 8 can be used as the heat generating portion 4. A spiral region may be provided. In addition, when the folded shape as shown in FIG. 2 is formed, the region between the leads 8 of the resistor 3 can be the heat generating portion 4, and the vicinity of the middle point of the folding is the heat generating portion 4 that generates the most heat. As this resistor 3, the thing which has a carbide | carbonized_material, nitride, silicide, etc., such as W, Mo, Ti, etc. as a main component can be used. In the case where the insulating base 9 is made of the above-described material, tungsten carbide (WC) is one of the above materials because it has a small difference in thermal expansion coefficient from the insulating base 9, high heat resistance, and low specific resistance. It is excellent as a material for the resistor 3. Further, when the insulating base 9 is made of silicon nitride ceramics, the resistor 3 is preferably composed mainly of WC of an inorganic conductor, and the content of silicon nitride added thereto is 20% by mass or more. For example, in the insulating substrate 9 made of silicon nitride ceramics, the conductor component serving as the resistor 3 has a higher coefficient of thermal expansion than silicon nitride, and thus is usually in a state where tensile stress is applied. On the other hand, by adding silicon nitride into the resistor 3, the thermal expansion coefficient of the resistor 3 is brought close to the thermal expansion coefficient of the insulating base 9, and the thermal expansion coefficient when the heater 1 is heated and lowered. The stress due to the difference can be relaxed.

また、抵抗体３に含まれる窒化珪素の含有量が40質量％以下であるときには、抵抗体３の抵抗値を比較的小さくして安定させることができる。従って、抵抗体３に含まれる窒化珪素の含有量は20質量％〜40質量％であることが好ましい。より好ましくは、窒化珪素の含有量は25質量％〜35質量％がよい。また、抵抗体３への同様の添加物として、窒化珪素の代わりに窒化硼素を４質量％〜12質量％添加することもできる。   Further, when the content of silicon nitride contained in the resistor 3 is 40% by mass or less, the resistance value of the resistor 3 can be made relatively small and stabilized. Therefore, the content of silicon nitride contained in the resistor 3 is preferably 20% by mass to 40% by mass. More preferably, the content of silicon nitride is 25% by mass to 35% by mass. Further, as a similar additive to the resistor 3, boron nitride can be added in an amount of 4% by mass to 12% by mass instead of silicon nitride.

抵抗体３の厚み（図２（ｂ）に示す上下方向の厚み）は、0.5ｍｍ〜1.5ｍｍがよく、抵抗体３の幅（図２（ｂ）に示す水平方向の幅）は、0.3ｍｍ〜1.3ｍｍがよい。この範囲内とすることにより、抵抗体３の抵抗値を小さくして十分に発熱させることができる。また、絶縁基体９が例えば半割りの成型体を積層して形成してなる積層構造の場合において、積層構造の絶縁基体９の積層界面の密着性を保持することができる。   The thickness of the resistor 3 (the vertical thickness shown in FIG. 2B) is preferably 0.5 mm to 1.5 mm, and the width of the resistor 3 (the horizontal width shown in FIG. 2B) is 0.3 mm. ~ 1.3mm is good. By setting it within this range, the resistance value of the resistor 3 can be reduced to sufficiently generate heat. In addition, in the case where the insulating base 9 has a laminated structure formed by laminating, for example, halved molded bodies, the adhesion at the laminated interface of the insulating base 9 having a laminated structure can be maintained.

抵抗体３の端部に接合されたリード８は、Ｗ，Ｍｏ，Ｔｉなどの炭化物、窒化物、珪化物などを主成分とするものを使用することができ、例えば絶縁基体９の形成材料を抵抗体３よりも多く含んだり、抵抗体３よりも断面積を大きくしたりするなど、抵抗体３よりも単位長さ当たりの抵抗値が低くなっているものである。   The lead 8 joined to the end of the resistor 3 can be composed mainly of carbides such as W, Mo, Ti, nitrides, silicides, and the like. The resistance value per unit length is lower than that of the resistor 3, such as including more than the resistor 3 or having a larger cross-sectional area than the resistor 3.

このリード８は、抵抗体３と同様の材料を用いて形成することができる。特に、ＷＣが、絶縁基体９との熱膨張率の差が小さい点、高い耐熱性を有する点および比抵抗が小さい点で、リード８の材料として好適である。また、絶縁基体９が窒化珪素質セラミックスからなる場合、リード８は無機導電体であるＷＣを主成分とし、これに窒化珪素を含有量が15質量％以上となるように添加することが好ましい。窒化珪素の含有量が増すにつれてリード８の熱膨張率を絶縁基体９の熱膨張率に近づけることができる。また、窒化珪素の含有量が40質量％以下であるときには、リード８の抵抗値が小さくなるとともに安定する。従って、窒化珪素の含有量は15質量％〜40質量％が好ましい。より好ましくは、窒化珪素の含有量は20質量％〜35質量％とするのがよい。なお、リード８は、抵抗体３よりも断面積を大きくすることの他、絶縁基体９の形成材料の含有量を抵抗体３よりも少なくすることによって、単位長さ当たりの抵抗値が低くなっていてもよい。   The lead 8 can be formed using the same material as the resistor 3. In particular, WC is suitable as a material for the lead 8 in that the difference in coefficient of thermal expansion from the insulating base 9 is small, the heat resistance is high, and the specific resistance is small. When the insulating substrate 9 is made of silicon nitride ceramics, the lead 8 is preferably composed mainly of WC, which is an inorganic conductor, and silicon nitride is added to the lead 8 so that the content is 15% by mass or more. As the silicon nitride content increases, the thermal expansion coefficient of the lead 8 can be made closer to the thermal expansion coefficient of the insulating substrate 9. Further, when the content of silicon nitride is 40% by mass or less, the resistance value of the lead 8 becomes small and stable. Therefore, the content of silicon nitride is preferably 15% by mass to 40% by mass. More preferably, the content of silicon nitride is 20% by mass to 35% by mass. In addition to making the cross-sectional area larger than that of the resistor 3 and reducing the content of the forming material of the insulating base 9 less than that of the resistor 3, the lead 8 has a lower resistance value per unit length. It may be.

そして、図１および図２に示したように、リード８は抵抗体３よりも太い形状であって、リード８の先端部に抵抗体３の端部が入り込むようにして接続されているとともに、抵抗体３の端面には凹部31が設けられ、この凹部31にリード８の一部が入り込んでいる。すなわち、抵抗体３とリード８との接合部は、まずリード８の先端部に抵抗体３の端部が入り込み、リード８の先端部に入り込んだ抵抗体３の端面に設けられた凹部31にリード８の一部が入り込んだ構成になっている。なお、ここでいう接合部とは、リード８の軸方向に平行な断面で視たとき、抵抗体３とリード８との界面が存在する領域のことをいう。   1 and 2, the lead 8 is thicker than the resistor 3, and is connected so that the end of the resistor 3 enters the tip of the lead 8, A concave portion 31 is provided on the end surface of the resistor 3, and a part of the lead 8 enters the concave portion 31. That is, at the junction between the resistor 3 and the lead 8, the end of the resistor 3 first enters the tip of the lead 8, and the recess 31 provided on the end surface of the resistor 3 enters the tip of the lead 8. A part of the lead 8 is inserted. The term “joint portion” as used herein refers to a region where the interface between the resistor 3 and the lead 8 exists when viewed in a cross section parallel to the axial direction of the lead 8.

抵抗体３の端部は、リード８の先端部に例えば0.1〜1.0ｍｍ入り込むのが好ましく、抵抗体３の端面に設けられた凹部31の深さは抵抗体３の端部のリード８の先端部に入り込む量に応じて異なるが、例えば0.01〜0.3ｍｍである。凹部31の形状としては、断面形状（開口部形状）が円形、楕円形、多角形などが挙げられるが、凹部31の断面形状が円形の場合は、直径が例えば0.05〜1.3ｍｍであるのが好ましい。   The end of the resistor 3 preferably enters, for example, 0.1 to 1.0 mm into the tip of the lead 8, and the depth of the recess 31 provided on the end of the resistor 3 is the tip of the lead 8 at the end of the resistor 3. For example, it is 0.01 to 0.3 mm, although it varies depending on the amount entering the part. Examples of the shape of the recess 31 include a circular shape, an elliptical shape, a polygonal shape, and the like in the cross-sectional shape (opening shape). If the cross-sectional shape of the concave portion 31 is a circle, the diameter is, for example, 0.05 to 1.3 mm. preferable.

このような構成により、急速昇温の際に大電流が流れても、抵抗体３よりも抵抗値の低いリード８に抵抗体３の内側の熱を散逸させることができる。したがって、接合部に熱がこもるのを抑制して、発熱による負荷を低減できる。   With such a configuration, even when a large current flows during rapid temperature rise, the heat inside the resistor 3 can be dissipated to the lead 8 having a resistance value lower than that of the resistor 3. Therefore, it is possible to suppress heat from being accumulated in the joint portion and to reduce a load due to heat generation.

すなわち、凹部31の内側が抵抗体３に比して低抵抗であるリード８の組成になるため、発熱負荷が低減し、応力低減できる。   That is, since the inside of the recess 31 has the composition of the lead 8 having a lower resistance than the resistor 3, the heat generation load is reduced and the stress can be reduced.

その結果、急速昇温の際に大電流が流れても、接合部にクラックが入るのを抑制することができる。さらに、繰り返し電流を流して温度を上下させても接合部にクラックが入るのを抑制することができ、ヒータ１の信頼性および耐久性が向上する。   As a result, even if a large current flows at the time of rapid temperature rise, it is possible to suppress cracks from entering the joint. Furthermore, cracks can be prevented from entering the joint even when the temperature is raised and lowered by repeatedly applying current, and the reliability and durability of the heater 1 are improved.

ここで、本実施の形態のヒータ１は、図３と図４に示したように、接合部における抵抗体３の凹部31が抵抗体３の端面の中央部に設けられていることが好ましい。これにより、急速昇温の際に大電流が流れて抵抗体３が急激に発熱しても、散逸しにくい抵抗体３の内部に発生する熱を凹部31の内部のリード８を通して外周方向にほぼ均等に散逸させることができる。これにより、応力集中を低減できるので、長期使用でも製品抵抗が変化しないように構成することができる。   Here, in the heater 1 of the present embodiment, as shown in FIGS. 3 and 4, it is preferable that the concave portion 31 of the resistor 3 in the joint portion is provided in the central portion of the end surface of the resistor 3. As a result, even if a large current flows during rapid temperature rise and the resistor 3 suddenly generates heat, the heat generated in the resistor 3 that is not easily dissipated is almost almost directed to the outer periphery through the lead 8 inside the recess 31. Can be dissipated evenly. Thereby, since stress concentration can be reduced, it can be configured so that the product resistance does not change even after long-term use.

なお、図３に示すヒータ１は、抵抗体３の端部がリード８の先端部の横断面ほぼ中央部に入り込む形状になっていて、図４に示すヒータ１は、抵抗体３の端部がリード８の先端部の横断面内側寄りに入り込んで、抵抗体３からヒータ１の表面までの距離が長く使用時における絶縁性に優れているという点で、図４に示す形状のほうが好ましい。   The heater 1 shown in FIG. 3 has a shape in which the end portion of the resistor 3 enters the substantially central portion of the cross section of the tip portion of the lead 8, and the heater 1 shown in FIG. The shape shown in FIG. 4 is more preferable because it enters the inner side of the cross section of the tip of the lead 8 and has a long distance from the resistor 3 to the surface of the heater 1 and is excellent in insulation during use.

また、図５(ａ)、図５（ｂ）に示したように、接合部における抵抗体３の凹部31の内面には角部がないことが好ましい。凹部31の内面に鋭角な角部を持たない、すなわち内面が二次曲面になっていることで、凹部31に応力集中せず、亀裂が発生しない。その結果、長期使用によっても製品抵抗が変化しない。従って、ヒータ１の信頼性および耐久性がさらに向上する。なお、図５（ａ）に示すヒータ１は、抵抗体３の端面ほぼ全面にかけて凹部31が設けられた形状になっていて、図５（ｂ）に示すヒータ１は、抵抗体３の端面のほぼ中央部付近のみに凹部31が設けられた形状になっているが、発熱負荷がより低減し、効果的に応力低減できるという点で、図５（ａ）に示す形状のほうが好ましい。   Further, as shown in FIG. 5A and FIG. 5B, it is preferable that the inner surface of the concave portion 31 of the resistor 3 in the joint portion has no corner portion. Since the inner surface of the recess 31 does not have an acute corner, that is, the inner surface is a quadratic curved surface, no stress is concentrated on the recess 31 and no crack is generated. As a result, the product resistance does not change even with long-term use. Therefore, the reliability and durability of the heater 1 are further improved. The heater 1 shown in FIG. 5A has a shape in which a recess 31 is provided over almost the entire end surface of the resistor 3, and the heater 1 shown in FIG. Although the concave portion 31 is provided almost only in the vicinity of the central portion, the shape shown in FIG. 5A is preferable in that the heat generation load is further reduced and the stress can be effectively reduced.

また、接合部における抵抗体３の凹部31が抵抗体３の両方の端面に設けられていることが好ましい。これにより、陽極側、負極側に関係なく、発熱による負荷を低減できるので、陽極側、負極側を気にせずにセッティングして長期間使用しても、製品抵抗が変化しない。従って、ヒータ１の信頼性および耐久性をより向上させることができる。   Moreover, it is preferable that the recessed part 31 of the resistor 3 in the junction is provided on both end faces of the resistor 3. As a result, the load due to heat generation can be reduced regardless of the anode side or the negative electrode side, so that the product resistance does not change even if the anode side and the negative electrode side are set and used for a long period of time. Therefore, the reliability and durability of the heater 1 can be further improved.

なお、図１乃至図５に示すヒータ１は、抵抗体３の端部がリード８の先端部に取り囲まれるように入り込んでいる形状のものである。本発明のヒータとしては、リード８が抵抗体３よりも太い形状であって、リード８の先端部に抵抗体３の端部が入り込むようにして接続されていれば、必ずしも抵抗体３の端部が全周にわたってリード８の先端部に取り囲まれておらず、例えば一部または複数箇所が切り欠かれていてもよいが、好ましくは、抵抗体３の端部がリード８の先端部に取り囲まれるように入り込んでいるのがよい。これにより、急速昇温時、熱膨張する抵抗体３を覆うリード８が、線膨張係数の違う絶縁性セラミックスとの緩衝材の役割を果たし、応力集中を低減することによって亀裂が発生しない。その結果、長期使用によっても製品抵抗が変化しない。従って、ヒータ１の信頼性および耐久性をより向上させることができる。   Note that the heater 1 shown in FIGS. 1 to 5 has a shape in which the end of the resistor 3 is inserted so as to be surrounded by the tip of the lead 8. In the heater of the present invention, if the lead 8 is thicker than the resistor 3 and is connected so that the end of the resistor 3 enters the tip of the lead 8, the end of the resistor 3 is not necessarily required. The end of the resistor 3 is preferably surrounded by the tip of the lead 8, although the portion may not be surrounded by the tip of the lead 8, for example, a part or a plurality of portions may be cut out. It is good to get in. Thereby, at the time of rapid temperature rise, the lead 8 covering the thermally expanding resistor 3 serves as a buffer material with insulating ceramics having different linear expansion coefficients, and cracks are not generated by reducing stress concentration. As a result, the product resistance does not change even with long-term use. Therefore, the reliability and durability of the heater 1 can be further improved.

本実施の形態のヒータ１は、図６に示すように、当該ヒータ１と、リード８と電気的に接続されてヒータ１を保持する金属製保持部材７とを備えたグロープラグとして使用することが好ましい。金属製保持部材７は、ヒータ１を保持する筒状体であり、セラミック基体９の側面に引き出された一方のリード８にロウ材などで接合される。これにより、高温のエンジン中でON/OFFが繰り返されながら長期使用しても、ヒータ１の抵抗が変化しないので、どんなときでも着火性に優れたグロープラグを提供できる。   As shown in FIG. 6, the heater 1 of the present embodiment is used as a glow plug including the heater 1 and a metal holding member 7 that is electrically connected to the lead 8 and holds the heater 1. Is preferred. The metal holding member 7 is a cylindrical body that holds the heater 1, and is joined to one lead 8 drawn to the side surface of the ceramic base 9 with a brazing material or the like. As a result, the resistance of the heater 1 does not change even if it is used for a long time while being repeatedly turned on and off in a high-temperature engine.

次に、本実施の形態のヒータ１の製造方法について説明する。   Next, the manufacturing method of the heater 1 of this Embodiment is demonstrated.

本実施の形態のヒータ１は、例えば、抵抗体３、リード８および絶縁基体９の形状の金型を用いた射出成形法等によって形成することができる。   The heater 1 of the present embodiment can be formed by, for example, an injection molding method using a die having the shape of the resistor 3, the lead 8, and the insulating base 9.

まず、導電性セラミック粉末，樹脂バインダー等を含む、抵抗体３およびリード８となる導電性ペーストを作製するとともに、絶縁性セラミック粉末，樹脂バインダー等を含む絶縁基体９となるセラミックペーストを作製する。   First, a conductive paste to be the resistor 3 and the lead 8 including the conductive ceramic powder and the resin binder is manufactured, and a ceramic paste to be the insulating base 9 including the insulating ceramic powder and the resin binder is manufactured.

次に、導電性ペーストを用いて射出成形法等によって抵抗体３となる所定パターンの導電性ペーストの成形体（成形体Ａ）を形成する。成形体Ａを金型内に保持した状態で、導電性ペーストを金型内に充填してリード８となる所定パターンの導電性ペーストの成形体（成形体Ｂ）を形成する。これにより、成形体Ａと、それに接続された成形体Ｂとが、金型内に保持された状態となる。   Next, a conductive paste molded body (molded body A) having a predetermined pattern to be the resistor 3 is formed using the conductive paste by an injection molding method or the like. With the molded body A held in the mold, the conductive paste is filled into the mold to form a conductive paste molded body (molded body B) having a predetermined pattern to be the leads 8. Thereby, the molded object A and the molded object B connected to it will be in the state hold | maintained in the metal mold | die.

次に、金型内に成形体Ａおよび成形体Ｂを保持した状態で、金型の一部を絶縁基体９成形用のものに取り替えた後、金型内に絶縁基体９となるセラミックペーストを充填する。これにより、成形体Ａおよび成形体Ｂがセラミックペーストの成形体（成形体Ｃ）で覆われたヒータ１の成形体（成形体Ｄ）が得られる。   Next, in a state where the molded body A and the molded body B are held in the mold, a part of the mold is replaced with one for forming the insulating base 9, and then the ceramic paste that becomes the insulating base 9 is placed in the mold. Fill. Thereby, the molded body (molded body D) of the heater 1 in which the molded body A and the molded body B are covered with the molded body of the ceramic paste (molded body C) is obtained.

次に、得られた成形体Ｄを例えば1650℃〜1800℃の温度、30ＭＰａ〜50ＭＰａの圧力で焼成することにより、ヒータ１を作製することができる。焼成は、水素ガス等の非酸化性ガス雰囲気中で行なうことが好ましい。   Next, the obtained molded body D is fired at, for example, a temperature of 1650 ° C. to 1800 ° C. and a pressure of 30 MPa to 50 MPa, whereby the heater 1 can be manufactured. The firing is preferably performed in a non-oxidizing gas atmosphere such as hydrogen gas.

本発明の実施例のヒータを以下のようにして作製した。   The heater of the Example of this invention was produced as follows.

まず、炭化タングステン（ＷＣ）粉末を50質量％、窒化珪素（Ｓｉ３Ｎ４）粉末を35質量％、樹脂バインダーを15質量％含む導電性ペーストを、金型内に射出成形して抵抗体となる成形体Ａを作製した。First, a conductive paste containing 50% by mass of tungsten carbide (WC) powder, 35% by mass of silicon nitride (Si 3 N 4 ) powder, and 15% by mass of a resin binder is injection-molded into a mold to form a resistor. A formed product A was produced.

次に、この成形体Ａを金型内に保持した状態で、リードとなる上記の導電性ペーストを金型内に充填することにより、成形体Ａと接続させてリードとなる成形体Ｂを形成した。このとき、種々の形状を有する金型を用いて、抵抗体とリードとの接合部を形成した。   Next, with the molded body A held in the mold, the mold is filled with the conductive paste to be the lead, thereby forming the molded body B to be connected to the molded body A. did. At this time, joints between the resistor and the lead were formed using molds having various shapes.

次に、成形体Ａおよび成形体Ｂを金型内に保持した状態で、窒化珪素（Ｓｉ３Ｎ４）粉末を85質量％、焼結助剤としてのイッテリビウム（Ｙｂ）の酸化物（Ｙｂ２Ｏ３）を10質量％、抵抗体およびリードに熱膨張率を近づけるためのＷＣを５質量％含むセラミックペーストを、金型内に射出成形した。これにより、絶縁基体となる成形体Ｃ中に成形体Ａおよび成形体Ｂが埋設された構成の成形体Ｄを形成した。Next, 85% by mass of silicon nitride (Si 3 N 4 ) powder and ytterbium (Yb) oxide (Yb 2 ) as a sintering aid while the molded body A and the molded body B are held in the mold. A ceramic paste containing 10% by mass of O 3 ) and 5% by mass of WC for bringing the coefficient of thermal expansion close to the resistor and the lead was injection molded into a mold. Thereby, the molded object D of the structure by which the molded object A and the molded object B were embed | buried in the molded object C used as an insulating base was formed.

次に、得られた成形体Ｄを円筒状の炭素製の型に入れた後、窒素ガスから成る非酸化性ガス雰囲気中で、1700℃、35ＭＰａの圧力でホットプレスを行ない焼結した。得られた焼結体の表面に露出したリード端部に金具製保持部材をロウ付けしてヒータを作製した。   Next, the obtained molded body D was put into a cylindrical carbon mold, and was then sintered by hot pressing at 1700 ° C. and a pressure of 35 MPa in a non-oxidizing gas atmosphere composed of nitrogen gas. A bracket holding member was brazed to the end of the lead exposed on the surface of the obtained sintered body to produce a heater.

ここで、実施例として図２に示す形態を作製した。そのときの抵抗体３の上下方向の厚み0.9ｍｍ、水平方向の幅0.6ｍｍで、抵抗体３の端部はリード８の先端部に0.5ｍｍ入り込んでおり、抵抗体３の端面に設けられた凹部31の深さ0.05ｍｍ、凹部31の径0.5ｍｍのヒータを作製した。   Here, the form shown in FIG. 2 was produced as an example. At this time, the resistor 3 has a vertical thickness of 0.9 mm and a horizontal width of 0.6 mm, and the end of the resistor 3 is inserted into the tip of the lead 8 by 0.5 mm, and is provided on the end surface of the resistor 3. A heater having a recess 31 depth of 0.05 mm and a recess 31 diameter of 0.5 mm was produced.

また、比較例として、抵抗体３の上下方向の厚み0.9ｍｍ、水平方向の幅0.6ｍｍで、抵抗体３の端部はリード８の先端部に入り込んでおらず、抵抗体３の端面には凹部31がないヒータを作製した。   As a comparative example, the resistor 3 has a vertical thickness of 0.9 mm and a horizontal width of 0.6 mm, and the end of the resistor 3 does not enter the tip of the lead 8. A heater having no recess 31 was produced.

これらのヒータを用いて冷熱サイクル試験を行なった。冷熱サイクル試験の条件は、まずヒータに通電して抵抗体の温度が1400℃になるように印加電圧を設定し、１）５分間通電、２）２分間非通電の１），２）を１サイクルとし、１万サイクル繰り返した。   A cold cycle test was conducted using these heaters. The conditions of the thermal cycle test are as follows: First, energize the heater and set the applied voltage so that the temperature of the resistor is 1400 ° C. 1) Energize for 5 minutes, 2) Deenergize for 2 minutes 1), 2) The cycle was 10,000 cycles.

冷熱サイクル試験前後のヒータの抵抗値の変化を測定したところ、本発明実施例の試料は抵抗変化が１％以下であった。また、この試料の抵抗体とリードとの接続部に局部発熱の痕跡もなく、マイクロクラックも見られなかった。これに対し、比較例の試料は、抵抗変化が５％以上であり、マイクロクラックが確認できた。   When the change in the resistance value of the heater before and after the thermal cycle test was measured, the resistance change of the sample of the example of the present invention was 1% or less. Further, there was no trace of local heat generation at the connection portion between the resistor and the lead of this sample, and no microcracks were observed. On the other hand, the resistance change of the sample of the comparative example was 5% or more, and microcracks were confirmed.

１：ヒータ
３：抵抗体
31：凹部
４：発熱部
７：金属製保持部材
８：リード
９：絶縁基体1: Heater 3: Resistor
31: Concave part 4: Heat generating part 7: Metal holding member 8: Lead 9: Insulating substrate

Claims (6)

絶縁基体と、
該絶縁基体に埋設された抵抗体と、
前記絶縁基体に埋設され、先端側で前記抵抗体に接続されるとともに後端側で前記絶縁基体の表面に導出されたリードとを備え、
該リードは前記抵抗体よりも太い形状であって、前記リードの先端部に前記抵抗体の端部が入り込むようにして接続されているとともに、前記抵抗体の端面には凹部が設けられ、該凹部に前記リードの一部が入り込んでいることを特徴とするヒータ。An insulating substrate;
A resistor embedded in the insulating substrate;
A lead embedded in the insulating base, connected to the resistor on the front end side and led to the surface of the insulating base on the rear end side;
The lead is thicker than the resistor, and is connected so that the end of the resistor enters the leading end of the lead, and a recess is provided on the end surface of the resistor, A heater characterized in that a part of the lead enters the recess. 前記凹部が前記抵抗体の端面の中央部に設けられていることを特徴とする請求項１に記載のヒータ。   The heater according to claim 1, wherein the recess is provided in a central portion of an end face of the resistor. 前記凹部の内面は角部がないことを特徴とする請求項１または請求項２に記載のヒータ。   The heater according to claim 1 or 2, wherein the inner surface of the recess has no corners. 前記凹部が前記抵抗体の両方の端面に設けられていることを特徴とする請求項１乃至請求項３のうちいずれかに記載のヒータ。   The heater according to any one of claims 1 to 3, wherein the recess is provided on both end faces of the resistor. 前記抵抗体の端部が前記リードの先端部に取り囲まれるように入り込んでいることを特徴とする請求項１乃至請求項４のうちいずれかに記載のヒータ。   The heater according to any one of claims 1 to 4, wherein an end portion of the resistor is inserted so as to be surrounded by a tip end portion of the lead. 請求項１に記載のヒータと、前記リードと電気的に接続されて前記ヒータを保持する金属製保持部材とを備えたことを特徴とするグロープラグ。   A glow plug comprising: the heater according to claim 1; and a metal holding member that is electrically connected to the lead and holds the heater.
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