JPWO2012053270A1 - Vacuum pump - Google Patents

Abstract

Provided is a vacuum pump in which substrate wiring is simple and the substrate can be easily cooled. A plate 201 is disposed so as to close the opening of the casing on the pump body 100 side, and the plate 201 has a substrate unit structure that also serves as the casing on the control unit 200 side. The AMB control board 209 and the atmosphere side connection board 211 are directly soldered and integrated with the pins 207 of the terminal 210 fixedly penetrating into the plate 201. Therefore, the casing part and the seal structure can be configured simply. For this reason, an expensive drip-proof connector 1 or 3 is not required, and a drip-proof structure can be configured with an inexpensive terminal 210. The electronic components mounted on the vacuum side AMB control board 209 and the air side atmosphere side connection board 211 can be cooled at a time through cooling of the plate 201.

Description

  The present invention relates to a vacuum pump, and more particularly to a vacuum pump in which substrate wiring is simple and the substrate can be easily cooled.

With the recent development of electronics, the demand for semiconductors such as memories and integrated circuits is increasing rapidly.
These semiconductors are manufactured by doping impurities into a highly pure semiconductor substrate to impart electrical properties, or by forming fine circuits on the semiconductor substrate by etching.

  These operations need to be performed in a high vacuum chamber in order to avoid the influence of dust in the air. A vacuum pump is generally used for evacuating the chamber. However, a turbo molecular pump, which is one of the vacuum pumps, is used frequently from the viewpoints of particularly low residual gas and easy maintenance.

  Also, in the semiconductor manufacturing process, there are many processes in which various process gases are applied to the semiconductor substrate. The turbo molecular pump not only evacuates the chamber, but also exhausts these process gases from the chamber. Also used.

  The turbo molecular pump includes a pump body and a control device that controls the pump body. The pump body and the control device are usually connected by a cable and a connector plug mechanism. As a method for reducing the number of pins of the connector connector plug of the pump main body and the control device and simplifying the substrate wiring, there is known a method of arranging the motor and magnetic bearing control substrate on the vacuum side as in Patent Document 1. .

JP 2007-508492 A

  However, when the control board is arranged on the vacuum side in this way, there is a possibility that the electrolytic solution in the electrolytic capacitor, which is one of the electronic elements necessary for control, may burst.

  In addition, when an electronic device that generates heat is installed in a vacuum, heat conduction in the vacuum is only heat radiation, and heat storage is likely to occur, which may lead to failure. Furthermore, since the substrate is exposed to corrosive gas depending on pump use conditions, it is necessary to take anti-corrosion measures for the substrate such as a mold, which also causes heat storage, which may lead to abnormal overheating of the electronic device.

  Similarly, as another method for simplifying the board wiring, as shown in FIG. 4, the male connector 1 is arranged at the lower part of the pump body 310, while the female connector 3 is arranged at the upper part of the control device 320. There is a structure in which the pump body 310 and the control device 320 are integrated by connecting the connectors. However, at this time, the male and female connectors on the pump side and the control device side may be reversed.

  However, in this case, the connectors 1 and 3 have a highly sealed vacuum seal structure and need to be drip-proof, and the pump main body 310 and the controller 320 need to be cooled respectively. Further, two plates for separating the pump main body 310 and the control device 320 from each other are required, ie, the bottom plate plate 5 on the pump main body 310 side and the upper plate 7 on the control device 320 side. Further, the back-side terminal pins 9 and 11 of the connectors 1 and 3 have solder cups 13 necessary for soldering with cables as shown in FIG. For this reason, the cost was high.

  The present invention has been made in view of such conventional problems, and an object of the present invention is to provide a vacuum pump in which substrate wiring is simple and the substrate can be easily cooled.

  For this reason, the present invention (Claim 1) is attached with a vacuum pump main body having a plate on the bottom surface, a control unit having the plate as a part of the housing, and leaving exposed portions on both surfaces through the plate. A plurality of pins, a first substrate attached to an exposed portion of the pins on the vacuum pump body side and disposed in a vacuum atmosphere inside the vacuum pump body, and an exposed portion of the pins on the control unit side And a second substrate disposed in the air atmosphere inside the control unit.

  The plate, the first substrate, and the second substrate were integrated through pins. For this reason, the structure of a vacuum pump can be simplified. For example, only one plate can be disposed between the pump body and the control unit. Since the structure is integrated, it is not necessary to perform wiring work between the substrates again.

  The first substrate can be disposed on the vacuum side, and an electronic element that is difficult to place in the vacuum can be provided on the second substrate on the atmosphere side. Since the first substrate is arranged on the vacuum side, it is not necessary to provide the wiring of the electromagnet and the sensor to the outside, and the wiring between the first substrate and the second substrate can be reduced as much as possible. Further, since solder can be attached between the periphery of the pin and the substrate, a pin without a solder cup can be selected. For this reason, manufacturing cost can be held down.

  The present invention (Claim 2) is characterized in that an electrolytic capacitor is attached to the second substrate.

  Electrolytic capacitors cannot be placed in a vacuum due to problems such as rupture. Therefore, it was decided to attach to the second substrate. The electrolytic capacitor is preferably attached at a position close to the pins on the substrate. As a result, the supply voltage can be stabilized in the same manner as when installed on the vacuum side.

  Further, according to the present invention (invention 3), a water-cooled tube is provided in the base portion of the vacuum pump body.

  The first substrate on the vacuum side and the second substrate on the atmosphere side can be cooled at once by cooling the plate with a water cooling tube. Therefore, the structure can be simplified.

  Further, according to the present invention (Claim 4), a sealing member is provided between the plate and the base portion and between the plate and the wall of the casing of the control unit.

  Since the pump body and the control unit are integrated and provided with a seal member, it is not necessary to provide a separate casing and seal structure as in the prior art. For this reason, a casing part and a seal structure can be comprised simply. Further, unlike the conventional case, an expensive drip-proof connector is not required, and an inexpensive connector can be used.

  As described above, according to the present invention (Claim 1), since the plate, the first substrate, and the second substrate are integrated via the pins, the configuration of the vacuum pump can be simplified. The first substrate can be disposed on the vacuum side, and an electronic element that is difficult to place in the vacuum can be provided on the second substrate on the atmosphere side. By arranging the first substrate on the vacuum side, the wiring between the first substrate and the second substrate can be reduced as much as possible.

Configuration diagram of an embodiment of the present invention Terminal structure Diagram showing how the pins are soldered to the board Diagram showing another way to simplify board wiring The figure which shows the mode of the pin which has a solder cup

Hereinafter, embodiments of the present invention will be described. FIG. 1 shows a configuration diagram of an embodiment of the present invention. In FIG. 1, a turbo molecular pump 10 has a pump main body 100 and a control unit 200 integrated with a single aluminum plate 201 interposed therebetween.
The plate 201 serves as both the bottom surface of the pump body 100 and the top surface of the control unit 200. However, the plate 201 can be composed of two sheets.

  An intake port 101 is formed at the upper end of the cylindrical outer cylinder 127 of the pump body 100. On the inner side of the outer cylinder 127, there is provided a rotating body 103 in which a plurality of rotating blades 102a, 102b, 102c,... By turbine blades for sucking and exhausting gas are formed radially and in multiple stages.

  A rotor shaft 113 is attached to the center of the rotating body 103, and the rotor shaft 113 is levitated and supported in the air by a so-called 5-axis control magnetic bearing.

  In the upper radial electromagnet 104, four electromagnets are arranged in pairs with an X axis and a Y axis that are radial coordinate axes of the rotor shaft 113 and are orthogonal to each other. An upper radial sensor 107 composed of four electromagnets is provided adjacent to and corresponding to the upper radial electromagnet 104. The upper radial direction sensor 107 is configured to detect the radial displacement of the rotating body 103 and send it to the control device 300 described later.

  In the control device 300, excitation of the upper radial electromagnet 104 is controlled through a compensation circuit having a PID adjustment function based on the displacement signal detected by the upper radial sensor 107, and the upper radial position of the rotor shaft 113 is determined. adjust.

  The rotor shaft 113 is formed of a high permeability material (such as iron) and is attracted by the magnetic force of the upper radial electromagnet 104. Such adjustment is performed independently in the X-axis direction and the Y-axis direction.

  Further, the lower radial electromagnet 105 and the lower radial sensor 108 are arranged in the same manner as the upper radial electromagnet 104 and the upper radial sensor 107, and the lower radial position of the rotor shaft 113 is set to the upper radial position. It is adjusted in the same way.

  Furthermore, axial electromagnets 106A and 106B are arranged with a disk-shaped metal disk 111 provided at the lower part of the rotor shaft 113 sandwiched vertically. The metal disk 111 is made of a high permeability material such as iron. An axial sensor 109 is provided to detect the axial displacement of the rotor shaft 113, and the axial displacement signal is sent to the control device 300.

  The axial electromagnets 106A and 106B are subjected to excitation control via a compensation circuit having a PID adjustment function of the control device 300 based on the axial displacement signal. The axial electromagnet 106A and the axial electromagnet 106B attract the metal disk 111 upward and downward by magnetic force.

  As described above, the control device 300 appropriately adjusts the magnetic force exerted by the axial electromagnets 106A and 106B on the metal disk 111, causes the rotor shaft 113 to magnetically float in the axial direction, and holds the rotor shaft 113 in a non-contact manner. ing.

  The motor 121 includes a plurality of magnetic poles arranged circumferentially so as to surround the rotor shaft 113. Each magnetic pole is controlled by the control device 300 so as to rotationally drive the rotor shaft 113 through an electromagnetic force acting between the rotor shaft 113 and the magnetic pole.

  A plurality of fixed blades 123a, 123b, 123c,... Are arranged with a slight gap from the rotor blades 102a, 102b, 102c,. The rotor blades 102a, 102b, 102c,... Are each inclined at a predetermined angle from a plane perpendicular to the axis of the rotor shaft 113 in order to transfer exhaust gas molecules downward by collision.

Similarly, the fixed blades 123 are also formed to be inclined at a predetermined angle from a plane perpendicular to the axis of the rotor shaft 113, and are arranged alternately with the stages of the rotary blades 102 toward the inside of the outer cylinder 127. ing.
And one end of the fixed wing | blade 123 is supported in the state inserted and inserted between the several fixed wing | blade spacer 125a, 125b, 125c ... stacked.

  The fixed blade spacer 125 is a ring-shaped member and is made of a metal such as a metal such as aluminum, iron, stainless steel, or copper, or an alloy containing these metals as components.

  An outer cylinder 127 is fixed to the outer periphery of the fixed blade spacer 125 with a slight gap. A base portion 129 is disposed at the bottom of the outer cylinder 127, and a threaded spacer 131 is disposed between the lower portion of the fixed blade spacer 125 and the base portion 129. An exhaust port 133 is formed below the threaded spacer 131 in the base portion 129 and communicates with the outside.

The threaded spacer 131 is a cylindrical member made of metal such as aluminum, copper, stainless steel, iron, or an alloy containing these metals as a component, and a plurality of spiral thread grooves 131a are formed on the inner peripheral surface thereof. It is marked.
The direction of the spiral of the thread groove 131 a is a direction in which molecules of the exhaust gas move toward the exhaust port 133 when the molecules of the exhaust gas move in the rotation direction of the rotating body 103.

  A rotating blade 102d is suspended from the lowermost portion of the rotating body 103 following the rotating blades 102a, 102b, 102c. The outer peripheral surface of the rotary blade 102d is cylindrical and projects toward the inner peripheral surface of the threaded spacer 131, and is close to the inner peripheral surface of the threaded spacer 131 with a predetermined gap. Yes.

  The base portion 129 is a disk-like member that constitutes the base portion of the turbo molecular pump 10, and is generally made of a metal such as iron, aluminum, or stainless steel.

  Since the base part 129 physically holds the turbo molecular pump 10 and also has a function of a heat conduction path, a metal having rigidity such as iron, aluminum and copper and high thermal conductivity is used. Is desirable.

  In such a configuration, when the rotary blade 102 is driven by the motor 121 and rotates together with the rotor shaft 113, exhaust gas from the chamber is sucked through the intake port 101 by the action of the rotary blade 102 and the fixed blade 123.

  Exhaust gas sucked from the inlet 101 passes between the rotary blade 102 and the fixed blade 123 and is transferred to the base portion 129. At this time, the temperature of the rotor blades 102 increases due to frictional heat generated when the exhaust gas contacts or collides with the rotor blades 102, conduction or radiation of heat generated by the motor 121, etc. It is transmitted to the fixed wing 123 side by conduction with gas molecules of the exhaust gas.

The fixed blade spacers 125 are joined to each other at the outer peripheral portion, and heat received by the fixed blade 123 from the rotor blade 102, frictional heat generated when exhaust gas contacts or collides with the fixed blade 123, and the like are used for the outer cylinder 127 and the screw. This is transmitted to the attached spacer 131.
The exhaust gas transferred to the threaded spacer 131 is sent to the exhaust port 133 while being guided by the screw groove 131a.

  Further, the gas sucked from the intake port 101 enters the electrical component side including the motor 121, the lower radial electromagnet 105, the lower radial sensor 108, the upper radial electromagnet 104, the upper radial sensor 107, and the like. To prevent this, the electrical component is covered with a stator column 122, and the interior of the electrical component is maintained at a predetermined pressure with a purge gas.

  Next, the configuration of the control device 300 will be described. The electronic components constituting the control device 300 are separately stored in the bottom space 301 on the pump main body 100 side formed between the plate 201 and the base 129 and the control unit 200. The inside of the bottom space 301 is a vacuum atmosphere, and the inside of the control unit 200 is an air atmosphere.

  A hole is provided in a part of the plate 201, and a body portion 205 of a terminal 210 as shown in FIG. The terminal 210 has a cylindrical body 205 protruding from the upper surface of a substantially rectangular plate-shaped bottom part 203, and a large number of pins 207 pass through the substantially rectangular plate-shaped bottom part 203 and the body 205. It is attached.

  The upper part of the pin 207 is exposed above the plate 201 and passes through the small hole 212 of the AMB control board 209. The upper part of the pin 207 is soldered to the AMB control board 209 at the small hole 212 portion of the AMB control board 209 as shown in FIG. On the AMB control board 209, electronic parts for controlling the magnetic bearing are mounted.

  The pin 207 and each electronic component on the AMB control board 209 are electrically connected via the soldered portion.

  On the other hand, the lower portion of the pin 207 is exposed below the plate 201 and penetrates the atmosphere-side connection substrate 211. The lower part of the pin 207 is soldered to the atmosphere-side connection board 211 at a small hole 212 portion of the atmosphere-side connection board 211 as shown in FIG. Electronic components that mainly control the motor 121 are mounted on the atmosphere-side connection substrate 211. The pin 207 and each electronic component on the atmosphere side connection substrate 211 are electrically connected via the soldered portion.

  Further, an electrolytic capacitor 213 is arranged near the pin 207 on the atmosphere side connection substrate 211 with the element facing the plate 201 side. A heat sink 215 is disposed between the atmosphere side connection substrate 211 and the plate 201. As a result, the AMB control board 209, the plate 201, and the atmosphere side connection board 211 are integrated into one structure.

  Furthermore, some electronic components other than those for magnetic bearing control and motor control are mounted on the bottom control boards 217 and 219. However, the board is not strictly arranged depending on the use, but each electronic component except the electrolytic capacitor 213 may be appropriately mounted on the AMB control board 209 in a vacuum.

  An O-ring 221 is embedded between the plate 201 and the base 129 around the bottom space 301, and an O-ring 223 is embedded between the plate 201 and the wall 225 that forms the casing of the control unit 200 to prevent drip. It has a specification structure.

  Further, by disposing a water-cooled tube near the plate 201 in the base portion 129 (the water-cooled tube 149 in FIG. 1), the plate 201 can be cooled via the base portion 129.

Next, the operation of the control device 300 will be described.
A plate 201 is disposed so as to close the opening of the casing on the pump body 100 side, and the plate 201 has a substrate unit structure that also serves as the casing on the control unit 200 side. The AMB control board 209 and the atmosphere side connection board 211 are directly soldered and integrated with the pins 207 of the terminal 210 fixedly penetrating into the plate 201. Accordingly, only one plate 201 is required between the pump body 100 and the control unit 200.

  In addition, since the pump body 100 and the control unit 200 are integrated, the casing portion and the seal structure can be simply configured, unlike the case where the pump casing 100 and the seal structure are independent from each other as in the prior art. For this reason, unlike the conventional FIG. 4, the expensive drip-proof connector 1, 3 is not required, and it can be configured with an inexpensive terminal 210.

  Then, through cooling of the plate 201 by the water-cooled tube 149, the electronic components respectively mounted on the vacuum side AMB control board 209 and the atmosphere side atmosphere connection board 211 can be cooled at a time. Therefore, the same water cooling pipe 149 can be used for a plurality of cooling objects, and the cooling structure can be simplified.

  Further, as shown in FIG. 3, since the solder 231 is attached to the pins 207 around the body of the pins 207 with respect to the substrates 209 and 211, those without solder cups can be selected. For this reason, an expensive pin with a solder cup is not used, and the manufacturing cost can be suppressed.

  Further, the AMB control board 209 is disposed in the bottom space 301 on the vacuum side, and an electronic element that is difficult to be placed in a vacuum is provided on the atmosphere side connection board 211. Since the AMB control board 209, the plate 201, and the atmosphere side connection board 211 are integrated into one structure via the pins 207, it is not necessary to perform wiring work between the boards again.

  Since the electronic components for controlling the magnetic bearings are disposed in the bottom space 301 on the vacuum side, it is not necessary to bring out the wiring of the electromagnet and the sensor, and wiring between the AMB control board 209 and the atmosphere side connection board 211 is eliminated. And the number of pins 207 can be reduced as much as possible.

  Furthermore, the electrolytic capacitor 213 for stabilizing the supply voltage of the magnetic bearing is preferably installed as close as possible to the control electronic component on the AMB control board 209. However, it cannot be placed in a vacuum due to the above-mentioned problems such as rupture. Therefore, the electrolytic capacitor 213 is placed near the pin 207 of the atmosphere side connection substrate 211. As a result, the supply voltage could be stabilized in the same manner as when installed on the vacuum side.

10 turbo molecular pump 13 solder cup 100 pump body 102 rotor blade 104 upper radial electromagnet 105 lower radial electromagnet 106A, B axial electromagnet 107 upper radial sensor 108 lower radial sensor 109 axial sensor 111 metal disk 113 rotor Shaft 121 Motor 122 Stator column 123 Fixed blade 125 Fixed blade spacer 127 Outer cylinder 129 Base 131 Spacer 133 Exhaust port 149 Water-cooled pipe 200 Control unit 201 Plate 203 Substantially rectangular plate-shaped bottom surface portion 205 Body portion 207 Pin 208 Support member 209 AMB control Substrate 210 Terminal 211 Atmosphere side connection substrate 212 Small hole 213 Electrolytic capacitor 215 Heat sink 221, 223 O-ring 300 Controller 301 Bottom space

Claims (4)

A vacuum pump body (100) having a plate (201) on the bottom surface;
A control unit (200) having the plate (201) as a part of the housing;
A plurality of pins (207) attached through the plate (201) while leaving exposed portions on both sides;
A first substrate (209) attached to an exposed portion of the pin (207) on the vacuum pump body (100) side and disposed in a vacuum atmosphere inside the vacuum pump body (100);
And a second substrate (211) that is attached to an exposed portion of the pin (207) on the control unit (200) side and is disposed in an air atmosphere inside the control unit (200). To vacuum pump.   The vacuum pump according to claim 1, wherein an electrolytic capacitor (213) is attached to the second substrate (211).   The vacuum pump according to claim 1 or 2, wherein a water-cooled pipe (149) is provided in a base portion (129) of the vacuum pump body (100).   Seal members (221, 223) are provided between the plate (201) and the base portion (129) and between the plate (201) and the wall of the casing of the control unit (200). The vacuum pump according to any one of claims 1 to 3.

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