JPWO2007135743A1 - Flat panel display device - Google Patents

Abstract

The display panel includes a display panel and a drive circuit board that drives the display panel. The display panel includes a front substrate, a rear substrate, and display cells interposed between the substrates. The rear substrate is a conductive substrate. A flat panel display device comprising: an insulating layer formed on a surface of a substrate facing a front substrate; and a drive circuit substrate mounted on the back surface of the conductive substrate.

Description

  The present invention relates to a flat panel display device such as a plasma display device (hereinafter referred to as a PDP device), a field emission display (FED) device, and a liquid crystal display (LCD) device, and more particularly to a display device in which a drive circuit board is mounted on a display panel. About.

  In recent years, PDP devices, LCD devices, FED devices, and the like have received much attention as image display devices that replace cathode ray tube display (CRT) devices.

  Among the flat panel display devices, a typical PDP device developed and produced as a thin large-screen TV and an information display device will be described below as an example, which has self-luminous, high brightness and high image quality characteristics. .

  In general, a PDP device has a display panel in which a pair of electrodes regularly arranged on two opposing glass substrates are provided, a discharge cell is formed between the barrier ribs, and a discharge gas is sealed between the barrier ribs. . A drive circuit board on which a drive circuit for applying a predetermined voltage to the electrodes of the display panel is mounted, and a connection line (flexible cable) for connecting the display panel and the drive circuit. Furthermore, a chassis for mounting a drive circuit board is provided along with a function for supporting the display panel.

  In the display panel, a voltage is applied to these electrodes, and discharge is performed in minute discharge cells sandwiched between partition walls. Thereby, each discharge cell coated with a phosphor emits light and displays an image. In order to perform image display, the regularly arranged discharge cells are selectively discharged.

  There are two types of PDP devices: a direct current type (DC type) in which electrodes are exposed in a discharge space, and an alternating current type (AC type) in which an electrode is covered with an insulating layer. Both are further classified into a refresh driving method and a memory driving method depending on the difference in display function and driving method.

  Further, the arrangement shape of the partition walls is divided into a stripe pattern and a mesh pattern. The drive circuit board is formed of a printed circuit board and is mounted on the rear surface of the chassis. A display panel is supported on the surface of the chassis, and the electrodes of the display panel and the drive circuit board are connected by a flexible cable.

  FIG. 15 is an exploded perspective view showing a configuration example of a conventional AC type PDP apparatus having stripe-shaped partition walls in a state where a front substrate, a rear substrate, and a chassis are separated from each other. In FIG. 15, two glass substrates 1 and 2 are arranged in parallel to each other and facing each other. Both are held at a constant interval by a partition wall 3 provided in parallel with each other on a glass substrate 2 serving as a back substrate.

  A discharge cell surrounded by the barrier ribs 3 is formed, and each discharge cell is filled with a discharge gas mainly composed of Xe and Ne. That is, the space between the partition walls becomes a discharge space (discharge cell) for generating discharge. On the surface of the front substrate (glass substrate) 1 facing the back substrate (glass substrate) 2, a plurality of display electrodes 4 are arranged in parallel to each other. The display electrode 4 is classified into a sustain electrode X and a scan electrode Y, and the sustain and scan electrodes are paired to generate a surface discharge between them. The display electrode 4 is mainly composed of a transparent electrode made of a transparent conductive material having a high light transmittance, and a bus electrode 5 made of a narrow and highly conductive metal material is used to apply a stable driving voltage. It forms along the edge part of a transparent electrode.

A dielectric layer 6 for driving an AC memory is formed so as to cover the composite electrode of the display electrode 4 and the bus electrode 5.
Further, a protective layer 7 is formed on the dielectric layer, which protects the dielectric layer and lowers the driving voltage.

  A plurality of address electrodes 8 are formed in parallel to each other on the surface of the rear substrate (glass substrate) 2 facing the front substrate (glass substrate) 1 so as to be orthogonal to the display electrodes 4 and the bus electrodes 5. A dielectric layer 9 is formed to cover the address electrodes 8. Further thereon, a stripe-patterned partition 3 is formed so as to sandwich the address electrode 8 therebetween. And the fluorescent substance layer 10 is provided so that the wall surface and bottom face of the groove | channel formed between the two partition walls 3 which face each other may be covered.

  The glass substrate 1 and the glass substrate 2 are sealed at the edges by a sealing layer 11 to form a display panel of a PDP device. On the other hand, a plate-like chassis 13 having substantially the same size as the display panel is attached to the back surface of the glass substrate 2 by an adhesive layer 12. Further, the bus electrodes and address electrodes 8 formed on the glass substrate 1 and the glass substrate 2 and the drive circuit board 14 are connected by a flexible cable 15.

  The AC type PDP apparatus of FIG. 15 is a surface discharge type, in which an AC voltage is applied to the sustain electrode and the scan electrode on the front substrate, and discharge is performed with an electric field leaking into the space. In this case, since alternating current is applied, the direction of the electric field changes corresponding to the frequency. Then, the phosphor layer 9 emits light by the ultraviolet rays generated by this discharge, and this light is transmitted through the front substrate as visible light to perform image display.

  As described above, the conventional PDP apparatus uses glass substrates for both the front substrate and the rear substrate. On the other hand, a structure in which the back substrate is made of a metal substrate is described in Document 1 (Japanese Patent Laid-Open No. 6-168669). The thing of the literature 1 uses a metal substrate instead of a glass substrate. This reduces the weight of the device and increases the heat dissipation effect. Further, the metal substrate also serves as an auxiliary discharge electrode necessary for the discharge display device, thereby improving the auxiliary discharge effect (trigger effect).

Similarly, when a metal substrate is used for the back substrate, a method for forming a thick film pattern on the metal substrate is described in Document 2 (Japanese Patent No. 3681025). In the case of Document 2, the coefficient of thermal expansion is 5.0 to 9.0 × 10 ⁻⁶ K so that there is little shrinkage with respect to elongation due to tension or changes due to the environment, and the pattern does not peel off during heating and cooling in the firing process. ^-1 metal sheet is used as the metal substrate.

  Then, after firing, a shrinkage-preventing layer that hardly shrinks in the horizontal direction of the pattern and shrinks only in the vertical direction (film thickness direction) is formed on the metal sheet, and then a base layer is formed on the shrinkage-preventing layer. After patterning the pattern forming paste on the underlayer, the pattern is brought into close contact through a baking process. The document mentions that since the method uses a metal sheet, the dimension of the pattern is stabilized because the anti-shrinkage layer and the base layer are formed, which has high impact resistance and is resistant to warping.

  Furthermore, in the thing of the literature 3 (Unexamined-Japanese-Patent No. 2000-164147), the metal substrate is similarly used for the back substrate instead of the glass substrate. Then, a circuit is patterned on the back surface of the metal substrate via an insulating film, and an integrated circuit element for driving a PDP device is mounted. Further, the display panel and the drive circuit board are integrally formed. In addition, the electrical connection between the drive circuit board and the electrode is made through a through hole formed in a metal substrate or an insulator formed on the peripheral portion thereof. This document mentions that the device manufacturing method can be simplified to reduce the size, weight and thickness.

  The conventional PDP apparatus shown in FIG. 15 uses a glass substrate as a constituent substrate of a display panel. Then, various layers, electrode patterns, partition walls and the like are sequentially formed on the glass substrate. After the display panel is completed, the display panel and the drive circuit board are attached to the front and back surfaces of the chassis, and the flexible cable is tangent.

  The glass substrate has the advantage of high surface smoothness and easy availability. However, the glass substrate tends to be chipped or cracked due to impact or the like. In the manufacture of a PDP device, a number of processes are passed through to completion, such as panel assembly, panel and chassis attachment, drive circuit board mounting on the chassis, and flexible cable tangent. Therefore, this is one of the factors that make the manufacturing process unstable.

  Further, the conventional PDP device includes a front side glass substrate, a back side glass substrate, an adhesive layer that bonds the back side glass substrate and the chassis, and a chassis. Therefore, the finished PDP device itself has a certain thickness, and the entire device is also heavy.

In the PDP device, each discharge cell emits light for forming an image, but also emits heat.
On the other hand, an adhesive layer and a chassis are attached to the back surface of the back glass substrate having poor thermal conductivity. Therefore, the heat dissipation of the display panel is poor and the discharge cells are thermally deteriorated. In order to improve the heat dissipation of the panel, there is a method of installing a cooling fan or a heat dissipation fin. However, if these are installed, the volume and weight of the PDP device will increase.

  Moreover, in the PDP device having a conventional structure, electrodes are respectively formed on both surfaces of the front substrate and the rear substrate facing each other. The electrodes on both the front substrate and the rear substrate are connected to the drive circuit substrate with a flexible cable. This complicates the flexible cable attachment process. Furthermore, since the flexible cable is exposed, there is a disadvantage that the flexible cable wire is easily damaged when the PDP device is assembled.

By the way, in order to reduce the weight of the PDP device panel, impact resistance, improve heat dissipation, stabilize the manufacturing process, etc., the documents 1 to 3 describe a structure using a back substrate formed of metal. ing.
However, in Documents 1 and 2, a flat panel display device that displays an image cannot be realized only with a display panel formed by bonding a front substrate and a rear substrate.

  That is, in order to complete the PDP device, it is necessary to mount a drive circuit board for driving the display panel. Therefore, it is necessary to separately provide a chassis for securing a space for mounting the drive circuit board and supporting the display panel.

  Further, in Document 3, a printed circuit board serving as a driving circuit board is integrally formed with a display panel by patterning through an insulating film on the back surface of a back substrate formed of metal. However, in order to realize a high definition display of the PDP device, it is necessary to increase the number of printed circuit boards. Therefore, the printed circuit board by patterning is not suitable for high-definition display. Further, when the display panel and the drive circuit board are integrally formed, detachment / attachment due to a failure of the drive circuit board is substantially impossible.

  The present invention includes a display panel and a drive circuit board that drives the display panel. The display panel includes a front substrate, a rear substrate, and a display cell interposed between the substrates, and the rear substrate is a conductive substrate. And a flat panel display device in which a drive circuit board is mounted on the back surface of the conductive substrate, and an insulating layer formed on the surface of the conductive substrate facing the front substrate.

  Furthermore, from another viewpoint, the present invention includes a display panel and a drive circuit board that drives the display panel, and the display panel includes a front substrate, a rear substrate, and a display cell interposed between the two substrates. The back substrate is formed of an insulating substrate, a conductive layer formed on the surface of the insulating substrate facing the front substrate, and an insulating layer formed on the surface of the conductive layer, and the drive circuit substrate is the insulating substrate. The flat panel display apparatus mounted in the back surface of the is provided.

  Furthermore, from another viewpoint, the present invention includes a display panel and a drive circuit board that drives the display panel, and the display panel includes a front substrate, a rear substrate, and a display cell interposed between the two substrates. The present invention provides a flat display device in which a back substrate is composed of an insulating substrate and a conductive layer formed on the back side of the insulating substrate, and a drive circuit substrate is mounted on the surface of the conductive layer.

A display electrode provided on a surface of the front substrate facing the rear substrate, an extraction electrode provided on the surface of the rear substrate facing the front substrate, a relay member connecting the display electrode and the extraction electrode, and an extraction electrode; You may further provide the connection line connected with a drive circuit board.
The rear substrate has an opening at a position outside the seal portion, and the connection line can connect the extraction electrode and the drive circuit substrate through the opening.
The relay member may be formed from an anisotropic conductive film or an anisotropic conductive paste.
The rear substrate may be integrally formed with a driving circuit board mounting portion that protrudes from the board surface and has a flat shape on which the driving circuit board can be mounted.

The display panel unit in the present invention includes a display panel unit of a display device such as a PDP, LCD, or FED.
The back substrate is preferably formed of a material having a thermal expansion coefficient of 10.0 × 10 ⁻⁶ K ⁻¹ or less.
The conductive substrate can be formed using a composite material of aluminum and carbon fiber, and the conductive substrate can be formed using a composite material of aluminum and silicon carbide, an invar material, a titanium material, or a carbon fiber material.
The insulating substrate can be formed of a fine ceramic material.
The insulating layer can be formed of amorphous aluminum oxide.
The conductive layer may be connected to the drive circuit board and used as the ground of the drive circuit board.

In the flat panel display device according to the present invention, a back substrate having a chassis function for supporting a display panel and mounting a drive circuit substrate is formed by a conductive substrate or an insulating substrate having a conductive layer. Has been completed.
Accordingly, an insulating substrate having a conductive substrate or a conductive layer has better mechanical properties such as impact resistance than a glass substrate used for a rear substrate of a conventional display panel.
Further, since it is not necessary to attach a reinforcing plate-like chassis to the back surface of the display panel unlike the conventional device, the display device can be made thinner and lighter.

It is a disassembled perspective view of 1st Embodiment of this invention. FIG. 2 is a partial cross-sectional perspective view of the PDP device shown in FIG. 1. It is sectional drawing of the PDP apparatus shown in FIG. FIG. 4 is a view corresponding to FIG. 3 showing a modification of the PDP device according to the first embodiment of the present invention. FIG. 3 is a diagram corresponding to FIG. 1 of a second embodiment of the present invention. FIG. 3 is a diagram corresponding to FIG. 2 of a second embodiment of the present invention. FIG. 4 is a diagram corresponding to FIG. 3 of a second embodiment of the present invention. It is the A section enlarged view of FIG. It is the B section enlarged view of FIG. FIG. 6 is a view corresponding to FIG. 1 of a third embodiment of the present invention. FIG. 6 is a diagram corresponding to FIG. 2 of a third embodiment of the present invention. FIG. 6 is a diagram corresponding to FIG. 3 of a third embodiment of the present invention. It is the C section enlarged view of FIG. It is the D section enlarged view of FIG. It is a disassembled perspective view of the conventional PDP apparatus.

Explanation of symbols

3 partition wall 4 display electrode 7 protective layer 9 rear substrate side dielectric layer 10 phosphor layer 101 front substrate (glass substrate)
DESCRIPTION OF SYMBOLS 102 Back substrate 103 Drive circuit board attaching part 104 Insulating layer 105 Bus electrode 106 Address electrode 107 Drive circuit board 108 Flexible cable 109 Conductive layer 110 Ground line

The embodiment according to the present invention will be described by taking as an example the case where it is applied to a PDP apparatus.
First Embodiment First, a first embodiment is shown in FIGS. FIG. 1 is an exploded perspective view in which a front substrate, a rear substrate, and a drive circuit unit (a drive circuit substrate, a flexible cable) are separated, and FIG. 2 is a perspective view showing an assembled state of these. FIG. 3 is a sectional view of the assembly. FIG. 4 is a view corresponding to FIG. 3 showing a modification of the first embodiment.

    FIG. 3 shows a case where an insulating layer 104 is formed on one surface of a conductive substrate 102a as the back substrate 102. FIG. 4 shows a case where the back substrate 102 is made of a non-conductive substrate 102b. In the structure shown in FIG. 4, after the conductive layer 109 is formed over the substrate 102b, the insulating layer 104 is further formed.

In these drawings, a front substrate 101 is a glass substrate used in a conventional PDP apparatus, that is, soda lime glass is provided with heat resistance, and is called SiO ₂ − called high strain point glass in which thermal deformation and thermal shrinkage are suppressed. Al ₂ O ₃ —R ₂ O—R′O (R ₂ O: alkali oxide, R′O: alkaline earth metal oxide) glass.

On the other hand, the back substrate 102 shown in FIG. 3 has a thermal expansion coefficient comparable to or lower than that of the glass substrate constituting the front substrate 101, that is, has a thermal expansion coefficient of 10.0 × 10 ⁻⁶ K ⁻¹ or less. And a conductive substrate 102a and an insulating layer 104 formed thereon. The conductive substrate 102a is formed of, for example, a conductor material such as a composite material of aluminum and carbon fiber, a composite material of aluminum and silicon carbide, an invar material, a titanium material, or a carbon fiber material. If a conductive substrate is used, the heat generated by the display panel can be dissipated well. Further, the back substrate 102 shown in FIG. 4 has a conductive layer 109 made of Cu, Cr, Al or the like formed on the surface of an insulating substrate 102b such as a fine ceramic material, and further an insulating layer 104 formed thereon.

  3 and 4, the insulating layer 104 can be formed by, for example, forming amorphous aluminum oxide by an open-air CVD method or other known methods. The back substrate formed in this way has a characteristic that mechanical properties such as impact resistance are superior to a glass substrate used for a back substrate of a display panel of a conventional PDP device.

  3 and 4, a drive circuit board mounting portion 103 on which the drive circuit board 107 is mounted is integrally formed on the back surface of the back board 102. According to the drive circuit board mounting portion 103, the drive circuit board can be mounted apart from the rear substrate, so that the heat dissipation of the circuit board can be improved. The drive circuit board mounting portion 103 serves not only to mount the drive circuit board 107 but also to support the display panel. The drive circuit board 107 is formed of a printed circuit board used in a conventional PDP device.

  The drive circuit board mounting portion 103 forms the conductive substrate 102a (FIG. 3) or the insulating substrate 102b (FIG. 4) by cutting. Alternatively, it is formed by integral molding by molten metal forging, joining by welding, or other methods.

  As shown in FIG. 3, in the PDP device of this embodiment, in the display panel itself, the back substrate is composed of the conductive substrate 102a described above as the back substrate having the chassis function and the insulating layer 104 formed on the surface thereof. Except for the configuration, it is the same as the conventional configuration of FIG.

  That is, after the insulating layer 104 is formed on the surface of the back substrate 102 facing the front substrate 101, the address electrode 106 is formed.

  Display electrodes 4 (FIG. 3) and bus electrodes 105 are formed on the surface of the glass substrate constituting the front substrate 101 facing the back substrate 102. 3 is formed on the rear substrate 102, and the display electrode 4, the dielectric layer 6 and the protective layer 7 shown in FIG. 3 are formed on the front substrate 101. .

  The mutual relationship among the dielectric layer, the protective layer, the phosphor layer, the electrodes, and the barrier ribs is not different from the conventional one shown in FIG. 15, and can be formed by a conventional manufacturing facility and a known manufacturing method.

  That is, the bus electrode 105 and the address electrode 106 are a three-layered Cr—Cu—Cr electrode or Al electrode formed by a photoetching method or the like, a screen printing method of Ag paste or a photolithography method using a photosensitive Ag paste, or the like. It is the Ag electrode formed by. The display electrode 4 of the front substrate 101 is formed by a photoetching method or the like using ITO (Indium Tin Oxide) which is a transparent conductive material.

  The dielectric layer 6 of the front substrate 101 and the dielectric layer 9 of the back substrate 102 are formed by a screen printing method using a low melting glass paste or a laminating method using a sheet-like low melting glass.

  The protective layer 7 of the front substrate 101 is formed using magnesium oxide (MgO) by a vapor deposition beam method, an ion plating method, or the like. The partition 3 of the back substrate 102 is formed by a sandblasting method, a photolithography method using a photosensitive glass paste, or the like. The phosphor layer 10 is formed by a screen printing method or the like.

  15 is formed on the front substrate 101 and the rear substrate 102 on which the electrode pattern, various layers, partition walls, and the like are formed as described above, by a screen printing method or a dispenser coating method. 102 is bonded. After that, the display panel is subjected to an evacuation process for evacuating the inside of the panel, sealing of a discharge gas mixed with Xe and Ne, a sealing process by heat sealing of the seal layer, an aging process for stabilizing light emission characteristics and discharge characteristics, etc. Is completed.

  After the display panel is completed, as shown in FIGS. 1 and 2, a flexible cable 108 for connecting the bus electrode 105 and the address electrode 106 of the display panel and the drive circuit board 107 mounted on the rear substrate 102 is connected to the bus electrode 105. And to the address electrode 106.

  The method for connecting the drive circuit and the electrodes is the same as that of the conventional PDP device. That is, the end of the flexible cable 108 is connected to the bus electrode 105 and the address electrode 106 by a thermocompression bonding method through an anisotropic conductive film (ACF), or is connected by other methods.

  After the connection, the drive circuit board 107 is mounted on the back surface of the back substrate 102. The drive circuit board 107 may be mounted on the drive circuit board mounting portion 103 (FIGS. 3 and 4) with screws or other methods. After mounting the drive circuit board 107, the other end of the flexible cable 108 having one end connected to the bus electrode 105 and the address electrode 106 is connected to the drive circuit board 107.

  As shown in FIG. 4, when the back substrate is formed of a non-conductive substrate 102 b, the conductive layer 109 becomes a common ground by being electrically connected to the drive circuit substrate 107. As a conduction method, each drive circuit board 107 and the conductor layer 109 are connected by a ground line 110, or a screw (metal) for mounting the drive circuit board is brought into contact with the conductor layer 109.

  In FIG. 4, the conductive layer 109 is formed on the surface of the back substrate facing the front substrate 101, but may be formed on the back surface of the back substrate, that is, on the drive circuit substrate mounting surface. When the conductive layer is formed on the back surface of the back substrate, the heat generated by the display panel can be dissipated well.

  As described above, the embodiment of the PDP apparatus according to the present invention uses a base material that is superior in mechanical properties such as impact resistance as compared with a glass substrate used for a rear substrate of a conventional display panel. Thus, a rear substrate having a chassis function is formed. Therefore, it is not necessary to attach a plate-like chassis portion to the back surface of the panel as in the conventional device, and the conventional PDP device production technology is applied except that an insulating layer is formed on the back substrate, and the entire PDP device is thin. There is an advantage that the weight can be reduced.

Second Embodiment FIGS. 5 to 9 show a second embodiment. FIGS. 5 and 6 show a state in which the front substrate, the rear substrate, and the drive circuit unit (drive circuit substrate, flexible cable) are separated from each other and the assembled state. Except for the method of connecting the bus electrode on the front substrate side of the display panel and the drive circuit board, the configuration is the same as that of the embodiment shown in FIG.

  In the second embodiment, as shown in FIG. 5 to FIG. 7, a display panel unit is constituted by a glass substrate constituting the front substrate 201 and a rear substrate 202 that is slightly larger than the front substrate 201.

That is, the front substrate 201 is formed of a conventional glass substrate called a high strain point glass, and the conductor base forming the back substrate 202 is made of a material having a thermal expansion coefficient of 10.0 × 10 ⁻⁶ K ⁻¹ or less, For example, it is formed of a composite material of aluminum and carbon fiber, a composite material of aluminum and silicon carbide, an invar material, a titanium material, or a carbon fiber material.

Further, when the back substrate 202 is an insulator base having a conductive layer, the top substrate is formed of a fine ceramic material or other material having a thermal expansion coefficient of 10.0 × 10 ⁻⁶ K ⁻¹ or less. A conductive layer is formed on the substrate. On the surface of the back substrate 202 facing the front substrate 201, an amorphous aluminum oxide is formed by an atmospheric open CVD method or other known methods, as in the first embodiment.

  On the other hand, a driving circuit board mounting portion 203 on which the driving circuit board 207 is mounted is integrally formed on the back surface of the rear board 202. The drive circuit board mounting portion 203 has a role of supporting the display panel as well as mounting of the drive circuit board 207.

  Address electrodes 206 are formed on the upper surface of the insulating layer 204. The display electrode 4 and the bus electrode 205 are formed on the surface of the glass substrate 201 serving as the front substrate facing the back substrate 202. As in the embodiment shown in FIG. 3, the dielectric layer 9, the barrier ribs 3, and the phosphor layer 10 are formed on the back substrate 202. Similar to the embodiment shown in FIG. 3, the dielectric layer 6 and the protective layer 7 are formed on the front substrate 201.

  The mutual relationship among the dielectric layer, the protective layer, the phosphor layer, the electrodes, and the barrier ribs is not different from the conventional one shown in FIG. 15, and can be formed by a conventional manufacturing facility and a known manufacturing method.

  Then, when the front substrate 201 and the rear substrate 202 are bonded and assembled, the peripheral edges of the substrates 201 and 202 are sealed with a seal layer 212 as shown in FIGS. An extraction electrode 209 is formed in advance on the rear substrate 202 outside the seal layer 212.

  When sealing with the sealing layer 212, the bus electrode 205 on the surface of the front substrate 201 facing the rear substrate 202 is connected to the extraction electrode 209 via the relay terminal 213.

Here, the relay terminal 213 is formed using an anisotropic conductive material such as an anisotropic conductive film (ACF) or an anisotropic conductive paste (ACP), and is connected by a thermocompression bonding method. The
Next, one end of the flexible cable 208 is thermocompression bonded to the end portion of the extraction electrode 209 via the anisotropic conductive film 211.

  Next, one end of the flexible cable 208 is thermocompression bonded to the address electrode 206. The other ends of the flexible cable 208 connected to the extraction electrode 209 and the flexible cable 208 connected to the address electrode 206 are connected to the drive circuit board 207, respectively.

  Similar to the embodiment shown in FIG. 4, when the back substrate 202 is formed of a non-conductive base and a conductive layer formed on the base, the conductive layer may be used as the ground of the drive circuit substrate 207. it can.

  As described above, in the second embodiment, the surface of the back substrate facing the front substrate is not only connected to the electrode formed on the back substrate, but also to the end of the electrode on the surface of the front substrate facing the back substrate. It also has an extraction electrode. That is, since all the electrodes of the display panel connected to the drive circuit board 207 are directed in the same direction, there is an advantage that the connection of the flexible cable is simplified.

Third Embodiment FIGS. 10 to 14 show a third embodiment. 10 and 11 show a state in which the front substrate, the rear substrate, and the drive circuit unit (drive circuit substrate, flexible cable) are separated, and the assembled state.

  In the third embodiment, similarly to the second embodiment, a display panel is constituted by a glass substrate constituting the front substrate 301 and a rear substrate 302 that is slightly larger than the front substrate 301.

That is, the front substrate 301 is formed of a conventional glass substrate called a high strain point glass, and the conductor base forming the back substrate 302 is made of a material having a thermal expansion coefficient of 10.0 × 10 ⁻⁶ K ⁻¹ or less, For example, it is formed of a composite material of aluminum and carbon fiber, a composite material of aluminum and silicon carbide, an invar material, a titanium material, or a carbon fiber material.

Further, when the back substrate 302 is an insulator base having a conductor layer, a base formed using a fine ceramic material or other base material having a thermal expansion coefficient of 10.0 × 10 ⁻⁶ K ⁻¹ or less. A conductor layer is formed thereon.

  As in the first and second embodiments, the insulating layer 304 is formed on the surface of the rear substrate 302 facing the front substrate 301 by using an amorphous aluminum oxide by an open-air CVD method or by another known method. .

  On the other hand, a drive circuit board mounting portion 303 on which the drive circuit board 307 is mounted is integrally formed on the back surface of the back board 302. The drive circuit board mounting portion 303 serves not only to mount the drive circuit board 307 but also to support the display panel.

  Address electrodes 306 are formed on the upper surface of the insulating layer 304. The display electrode 4 and the bus electrode 305 are formed on the surface of the glass substrate 301 serving as the front substrate facing the back substrate 302. Similar to the embodiment shown in FIG. 3, the rear substrate 302 is formed with the dielectric layer 9, the barrier ribs 3, and the phosphor layer 10. A dielectric layer 6 and a protective layer 7 shown in FIG. 3 are formed on the front substrate 301.

  The mutual relationship among the dielectric layer, the protective layer, the phosphor layer, the electrodes, and the barrier ribs is not different from the conventional one shown in FIG.

  In this embodiment, through holes 310 are formed on each of the four sides of the back substrate 302. The through hole 310 is formed in advance on the base for forming the back substrate 302 having the chassis function, or is formed by cutting, shearing, laser processing, water jet processing, or the like after the base is formed without the through hole 310. Or may be formed by other methods.

  Then, when the front substrate 301 and the rear substrate 302 are bonded and assembled, the peripheral edges of the substrates 301 and 302 are sealed with a seal layer 312 as shown in FIGS.

  An extraction electrode 309 is formed in advance on the rear substrate 302 outside the seal layer 312. When sealing with the sealing layer 312, the bus electrode 305 on the surface of the front substrate 301 facing the back substrate 302 is connected to the extraction electrode 309 via the relay terminal 313.

  Here, the relay terminal 313 is formed using an anisotropic conductive material such as an anisotropic conductive film (ACF) or an anisotropic conductive paste (ACP), and is connected by a thermocompression bonding method. The

Next, one end of the drive circuit connection line 308 is thermocompression bonded to the end portion of the extraction electrode 309 via the anisotropic conductive film 311.
Next, one end of the flexible cable 308 is thermocompression bonded to the address electrode 306. The other end of each of the flexible cable 308 connected to the lead electrode 309 and the flexible cable 308 connected to the address electrode 306 is drawn through the through hole 310 and connected to the drive circuit board 207.

  Further, when the back substrate 302 is formed with a non-conductive base as in the first and second embodiments, the conductor layer formed on the base becomes a common ground by conducting with the drive circuit substrate 307.

  As described above, in the third embodiment, not only the electrode formed on the surface of the rear substrate facing the front substrate, but also the end portion of the electrode on the surface of the front substrate facing the rear substrate, An extraction electrode intended to apply a voltage is also provided. Further, a through hole is formed around the back substrate, and a flexible cable for connecting the display panel and the drive circuit board is passed through the through hole.

  That is, since all the electrodes of the display panel connected to the drive circuit board are oriented in the same direction, there is an advantage that the flexible cable connection process is simplified and the flexible cable is guarded by the rear substrate.

  As described above, the PDP device has been described as an example. However, the embodiment of the present invention can be applied to other types of flat panel display devices, and is not limited to the above-described embodiment, and is outside the scope of the claims. As long as it is not, it can be used in various forms.

  The present invention can be used not only for PDP devices but also for FED devices and LCD devices.

Claims (14)

  The display panel includes a display panel and a drive circuit board that drives the display panel. The display panel includes a front substrate, a rear substrate, and display cells interposed between the substrates. The rear substrate is a conductive substrate. A flat panel display device comprising: an insulating layer formed on a surface of a substrate facing a front substrate; and a drive circuit substrate mounted on the back surface of the conductive substrate.   The display panel includes a display panel and a drive circuit board that drives the display panel. The display panel includes a front substrate, a rear substrate, and display cells interposed between the two substrates. The rear substrate is an insulating substrate. A flat panel display comprising a conductive layer formed on the surface of the substrate facing the front substrate and an insulating layer formed on the surface of the conductive layer, and a driving circuit board mounted on the back surface of the insulating substrate. apparatus.   The display panel includes a display panel and a drive circuit board that drives the display panel. The display panel includes a front substrate, a rear substrate, and display cells interposed between the two substrates. The rear substrate is an insulating substrate. A flat display device comprising a conductive layer formed on the back side of a substrate and a drive circuit board mounted on the surface of the conductive layer.   A display electrode provided on a surface of the front substrate facing the rear substrate, an extraction electrode provided on the surface of the rear substrate facing the front substrate, a relay member connecting the display electrode and the extraction electrode, and an extraction electrode; The flat panel display device according to claim 1, further comprising a connection line connected to the drive circuit board.   The flat panel display device according to claim 4, wherein the rear substrate has an opening at a position outside the seal portion, and the connection line connects the extraction electrode and the drive circuit substrate through the opening.   6. The flat panel display device according to claim 4, wherein the relay member is formed from an anisotropic conductive film or an anisotropic conductive paste.   4. The flat panel according to claim 1, wherein the back substrate is integrally formed with a drive circuit board mounting portion that protrudes from the board surface and has a flat shape on which the drive circuit board can be mounted. Display device. 4. The flat panel display device according to claim 1, wherein the back substrate is made of a material having a thermal expansion coefficient of 10.0 × 10 ⁻⁶ K ⁻¹ or less.   The flat panel display device according to claim 1, wherein the conductive substrate is formed of a composite material of aluminum and carbon fiber.   2. The flat panel display panel device according to claim 1, wherein the conductive substrate is formed of a composite material of aluminum and silicon carbide.   The flat panel display device according to claim 1, wherein the conductive substrate is formed of an invar material, a titanium material, or a carbon fiber material.   4. The flat panel display device according to claim 2, wherein the insulating substrate is made of a fine ceramic material.   4. The flat panel display device according to claim 1, wherein the insulating layer is made of amorphous aluminum oxide.   4. The flat panel display device according to claim 2, wherein the conductive layer is connected to the drive circuit board and used as a ground of the drive circuit board.

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