JPS649712A - Resin molding device - Google Patents

Resin molding device

Info

Publication number
JPS649712A
JPS649712A JP16614587A JP16614587A JPS649712A JP S649712 A JPS649712 A JP S649712A JP 16614587 A JP16614587 A JP 16614587A JP 16614587 A JP16614587 A JP 16614587A JP S649712 A JPS649712 A JP S649712A
Authority
JP
Japan
Prior art keywords
mold unit
resin molding
force
molding
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16614587A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0535658B2 (enrdf_load_stackoverflow
Inventor
Yoshinori Uemoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP16614587A priority Critical patent/JPS649712A/ja
Publication of JPS649712A publication Critical patent/JPS649712A/ja
Publication of JPH0535658B2 publication Critical patent/JPH0535658B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/03—Injection moulding apparatus
    • B29C45/04—Injection moulding apparatus using movable moulds or mould halves

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP16614587A 1987-07-02 1987-07-02 Resin molding device Granted JPS649712A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16614587A JPS649712A (en) 1987-07-02 1987-07-02 Resin molding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16614587A JPS649712A (en) 1987-07-02 1987-07-02 Resin molding device

Publications (2)

Publication Number Publication Date
JPS649712A true JPS649712A (en) 1989-01-13
JPH0535658B2 JPH0535658B2 (enrdf_load_stackoverflow) 1993-05-27

Family

ID=15825884

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16614587A Granted JPS649712A (en) 1987-07-02 1987-07-02 Resin molding device

Country Status (1)

Country Link
JP (1) JPS649712A (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0297009U (enrdf_load_stackoverflow) * 1989-01-19 1990-08-02
JPH02214629A (ja) * 1989-02-15 1990-08-27 Toshifumi Wakayama トランスファー成形機
JPH05301260A (ja) * 1992-04-23 1993-11-16 Sato Tekkosho:Kk 低圧射出成形法および低圧射出成形機
EP0594863A4 (en) * 1992-04-13 1995-05-24 Apic Yamada Corp TRANSFER MOLDING METHOD AND APPARATUS.
KR20210137892A (ko) * 2020-05-11 2021-11-18 아피쿠 야마다 가부시키가이샤 수지 몰딩 장치 및 클리닝 방법

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100646249B1 (ko) 2004-04-08 2006-11-23 주식회사 엘지화학 혼성 담지 메탈로센 촉매를 이용한 가공성 및 내압 특성이뛰어난 급수관 파이프용 폴리에틸렌 및 그의 제조방법

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5587517A (en) * 1978-12-27 1980-07-02 Hitachi Ltd Method and apparatus for cleaning resin-molding mold
JPS58157620U (ja) * 1982-04-16 1983-10-21 株式会社イデヤ 電子部品の自動樹脂成型ユニット

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5587517A (en) * 1978-12-27 1980-07-02 Hitachi Ltd Method and apparatus for cleaning resin-molding mold
JPS58157620U (ja) * 1982-04-16 1983-10-21 株式会社イデヤ 電子部品の自動樹脂成型ユニット

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0297009U (enrdf_load_stackoverflow) * 1989-01-19 1990-08-02
JPH02214629A (ja) * 1989-02-15 1990-08-27 Toshifumi Wakayama トランスファー成形機
EP0594863A4 (en) * 1992-04-13 1995-05-24 Apic Yamada Corp TRANSFER MOLDING METHOD AND APPARATUS.
JPH05301260A (ja) * 1992-04-23 1993-11-16 Sato Tekkosho:Kk 低圧射出成形法および低圧射出成形機
KR20210137892A (ko) * 2020-05-11 2021-11-18 아피쿠 야마다 가부시키가이샤 수지 몰딩 장치 및 클리닝 방법

Also Published As

Publication number Publication date
JPH0535658B2 (enrdf_load_stackoverflow) 1993-05-27

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees