JPS649378A - Semiconductor testing apparatus - Google Patents

Semiconductor testing apparatus

Info

Publication number
JPS649378A
JPS649378A JP62164426A JP16442687A JPS649378A JP S649378 A JPS649378 A JP S649378A JP 62164426 A JP62164426 A JP 62164426A JP 16442687 A JP16442687 A JP 16442687A JP S649378 A JPS649378 A JP S649378A
Authority
JP
Japan
Prior art keywords
under test
device under
tests
time
relay contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62164426A
Other languages
Japanese (ja)
Inventor
Takashi Omura
Hideo Matsui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP62164426A priority Critical patent/JPS649378A/en
Publication of JPS649378A publication Critical patent/JPS649378A/en
Pending legal-status Critical Current

Links

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

PURPOSE:To eliminate time, during which tests cannot be performed, by providing a plurality of stations, on which devices under tests are mounted, at test heads, providing a plurality of relay contacts, which are connected to the measuring pins of a plurality of the stations, thereby using index time effectively. CONSTITUTION:When tests for a device under test 1b are performed on a socket 4a (a relay contact 7a is conducted), the next device under test 1c is conveyed on a socket 4b. The device 1c is in a standy state. When the tests of the device under test 1b are finished, the relay contact 7a is made nonconducting, and a relay contact 7b is conducted. Then, the device under test 1c is tested. At this time, the device under test 1b is replaced with the next device under test with a conveyer 2a. Since the other device under test can be tested during the index time of one device under test, the index time can be utilized effectively.
JP62164426A 1987-07-01 1987-07-01 Semiconductor testing apparatus Pending JPS649378A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62164426A JPS649378A (en) 1987-07-01 1987-07-01 Semiconductor testing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62164426A JPS649378A (en) 1987-07-01 1987-07-01 Semiconductor testing apparatus

Publications (1)

Publication Number Publication Date
JPS649378A true JPS649378A (en) 1989-01-12

Family

ID=15792929

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62164426A Pending JPS649378A (en) 1987-07-01 1987-07-01 Semiconductor testing apparatus

Country Status (1)

Country Link
JP (1) JPS649378A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0425846U (en) * 1990-06-22 1992-03-02
JPH0657322A (en) * 1992-08-13 1994-03-01 Yoshio Miyamoto Skid button for walking beam type heating furnace
JP2009198375A (en) * 2008-02-22 2009-09-03 Seiko Epson Corp Component testing device
JP2010054521A (en) * 2009-12-11 2010-03-11 Seiko Epson Corp Component test apparatus and component transport method
US8008939B2 (en) 2008-03-11 2011-08-30 Seiko Epson Corporation Component test apparatus and component transport method
CN102680879A (en) * 2012-06-01 2012-09-19 中利腾晖光伏科技有限公司 Light attenuation test-bed suitable for photovoltaic cell slice

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0425846U (en) * 1990-06-22 1992-03-02
JPH0657322A (en) * 1992-08-13 1994-03-01 Yoshio Miyamoto Skid button for walking beam type heating furnace
JP2009198375A (en) * 2008-02-22 2009-09-03 Seiko Epson Corp Component testing device
US8008939B2 (en) 2008-03-11 2011-08-30 Seiko Epson Corporation Component test apparatus and component transport method
US8558570B2 (en) 2008-03-11 2013-10-15 Seiko Epson Corporation Component test apparatus and component transport method
JP2010054521A (en) * 2009-12-11 2010-03-11 Seiko Epson Corp Component test apparatus and component transport method
CN102680879A (en) * 2012-06-01 2012-09-19 中利腾晖光伏科技有限公司 Light attenuation test-bed suitable for photovoltaic cell slice

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