JPS6489396A - Cooling device for electronic circuit - Google Patents

Cooling device for electronic circuit

Info

Publication number
JPS6489396A
JPS6489396A JP24500187A JP24500187A JPS6489396A JP S6489396 A JPS6489396 A JP S6489396A JP 24500187 A JP24500187 A JP 24500187A JP 24500187 A JP24500187 A JP 24500187A JP S6489396 A JPS6489396 A JP S6489396A
Authority
JP
Japan
Prior art keywords
cooling air
package
vanes
constitution
electronic circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP24500187A
Other languages
Japanese (ja)
Other versions
JPH0563117B2 (en
Inventor
Toshifumi Sano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP24500187A priority Critical patent/JPS6489396A/en
Publication of JPS6489396A publication Critical patent/JPS6489396A/en
Publication of JPH0563117B2 publication Critical patent/JPH0563117B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To allow a certain, optimal control of cooling air with a simple constitution by controlling with upper and lower bars on a link mechanism the opening and closing operation of vanes of a vane mechanism arranged between package guides. CONSTITUTION:When an electronic circuit package 1 is not inserted into a package guide, vanes 6 of a vane mechanism 3 are closed with a lower bar 8 being pulled by a spring 16, whereby the flow of cooling air is blocked. Upon insertion of the package 1, a guide pin 5 thereof presses a connecting part 15 of an upper bar 7 to rotate the vanes 6 to an opening position, whereby cooling air is introduced to the package 1. At this point, cooling air flow volume is adjusted by rotating angle of the vanes 6 being changed in function of the mounting position of the pin 5. According to the constitution, cooling air can be controlled optimally without fail with a simple constitution which requires no dummy module or cover plate.
JP24500187A 1987-09-29 1987-09-29 Cooling device for electronic circuit Granted JPS6489396A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24500187A JPS6489396A (en) 1987-09-29 1987-09-29 Cooling device for electronic circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24500187A JPS6489396A (en) 1987-09-29 1987-09-29 Cooling device for electronic circuit

Publications (2)

Publication Number Publication Date
JPS6489396A true JPS6489396A (en) 1989-04-03
JPH0563117B2 JPH0563117B2 (en) 1993-09-09

Family

ID=17127103

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24500187A Granted JPS6489396A (en) 1987-09-29 1987-09-29 Cooling device for electronic circuit

Country Status (1)

Country Link
JP (1) JPS6489396A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5528455A (en) * 1995-04-26 1996-06-18 Tektronix, Inc. Modular instrument chassis
US6381147B1 (en) * 1998-05-15 2002-04-30 Hybricon Corporation Card guide including air deflector means
GB2369249B (en) * 2000-11-06 2004-06-09 3Com Corp Cooling apparatus including a flow guide
JP2009170649A (en) * 2008-01-16 2009-07-30 Nec Corp Information processor, electronic apparatus, and housing unit

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5528455A (en) * 1995-04-26 1996-06-18 Tektronix, Inc. Modular instrument chassis
US6381147B1 (en) * 1998-05-15 2002-04-30 Hybricon Corporation Card guide including air deflector means
GB2369249B (en) * 2000-11-06 2004-06-09 3Com Corp Cooling apparatus including a flow guide
JP2009170649A (en) * 2008-01-16 2009-07-30 Nec Corp Information processor, electronic apparatus, and housing unit

Also Published As

Publication number Publication date
JPH0563117B2 (en) 1993-09-09

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