JPS648744U - - Google Patents
Info
- Publication number
- JPS648744U JPS648744U JP10235387U JP10235387U JPS648744U JP S648744 U JPS648744 U JP S648744U JP 10235387 U JP10235387 U JP 10235387U JP 10235387 U JP10235387 U JP 10235387U JP S648744 U JPS648744 U JP S648744U
- Authority
- JP
- Japan
- Prior art keywords
- resin mask
- semiconductor package
- lead frame
- meltable
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000012778 molding material Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10235387U JPS648744U (cs) | 1987-07-03 | 1987-07-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10235387U JPS648744U (cs) | 1987-07-03 | 1987-07-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS648744U true JPS648744U (cs) | 1989-01-18 |
Family
ID=31332185
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10235387U Pending JPS648744U (cs) | 1987-07-03 | 1987-07-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS648744U (cs) |
-
1987
- 1987-07-03 JP JP10235387U patent/JPS648744U/ja active Pending