JPH0296741U - - Google Patents
Info
- Publication number
- JPH0296741U JPH0296741U JP472889U JP472889U JPH0296741U JP H0296741 U JPH0296741 U JP H0296741U JP 472889 U JP472889 U JP 472889U JP 472889 U JP472889 U JP 472889U JP H0296741 U JPH0296741 U JP H0296741U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- semiconductor integrated
- package
- marking
- mold package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000005538 encapsulation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP472889U JPH0296741U (cs) | 1989-01-18 | 1989-01-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP472889U JPH0296741U (cs) | 1989-01-18 | 1989-01-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0296741U true JPH0296741U (cs) | 1990-08-01 |
Family
ID=31207497
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP472889U Pending JPH0296741U (cs) | 1989-01-18 | 1989-01-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0296741U (cs) |
-
1989
- 1989-01-18 JP JP472889U patent/JPH0296741U/ja active Pending