JPS6487017A - Manufacture of copper or copper alloy foil for circuit board - Google Patents

Manufacture of copper or copper alloy foil for circuit board

Info

Publication number
JPS6487017A
JPS6487017A JP24355887A JP24355887A JPS6487017A JP S6487017 A JPS6487017 A JP S6487017A JP 24355887 A JP24355887 A JP 24355887A JP 24355887 A JP24355887 A JP 24355887A JP S6487017 A JPS6487017 A JP S6487017A
Authority
JP
Japan
Prior art keywords
copper
alloy foil
copper alloy
foil
manufacture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24355887A
Other languages
Japanese (ja)
Inventor
Yoshiaki Aramaki
Masahiro Tsuji
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eneos Corp
Original Assignee
Nippon Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining Co Ltd filed Critical Nippon Mining Co Ltd
Priority to JP24355887A priority Critical patent/JPS6487017A/en
Publication of JPS6487017A publication Critical patent/JPS6487017A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Straightening Metal Sheet-Like Bodies (AREA)

Abstract

PURPOSE:To prevent the generation of contraction, and to secure an excellent flatness by giving the bending of a specific radius to a band-like copper or copper alloy foil, along an edge line of a pressurized fluid which has been jetted linearly from a hole, and also, executing the tension leveling of a specific elongation. CONSTITUTION:From one or plural holes 3 of a header 2, a prescribed fluid such as water or a rolling oil emulsion, etc., is jetted in the width direction of a band-like copper or copper alloy foil 1. By adjusting a bend radius of this copper or copper alloy foil 1 between 1.5R-2.5Rmm, leveling of a foil of 10mum-60mum is executed moderately. As for an elongation of the copper or copper alloy foil by tension leveling, 0.2-1.5% is suitable. In such a way, no wrinkle is generated in the plating process, the generation of contraction is prevented, and an excellent flatness by which uniform etching can be executed is obtained.
JP24355887A 1987-09-30 1987-09-30 Manufacture of copper or copper alloy foil for circuit board Pending JPS6487017A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24355887A JPS6487017A (en) 1987-09-30 1987-09-30 Manufacture of copper or copper alloy foil for circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24355887A JPS6487017A (en) 1987-09-30 1987-09-30 Manufacture of copper or copper alloy foil for circuit board

Publications (1)

Publication Number Publication Date
JPS6487017A true JPS6487017A (en) 1989-03-31

Family

ID=17105637

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24355887A Pending JPS6487017A (en) 1987-09-30 1987-09-30 Manufacture of copper or copper alloy foil for circuit board

Country Status (1)

Country Link
JP (1) JPS6487017A (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52130456A (en) * 1976-04-26 1977-11-01 Ishikawajima Harima Heavy Ind Method and device for rolling
JPS5319962A (en) * 1976-08-10 1978-02-23 Yoshizaki Kozo Method of manufacturing extremely thin steel plate for manufacturing cans
JPS542259A (en) * 1977-06-09 1979-01-09 Yoshizaki Kozo Method of making thin steel sheet for can production
JPS5519420A (en) * 1978-07-28 1980-02-12 Hitachi Ltd Method and device of camber correction of tension leveller
JPS6127112A (en) * 1984-07-17 1986-02-06 Nippon Steel Corp Correcting method of speed synchronization of elongation controlling motor
JPS61216814A (en) * 1985-03-22 1986-09-26 Sumitomo Metal Ind Ltd Adjusting method for thickness and width of metal band
JPS6245423A (en) * 1985-08-26 1987-02-27 Mitsubishi Heavy Ind Ltd Straightening head for static pressure type leveller

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52130456A (en) * 1976-04-26 1977-11-01 Ishikawajima Harima Heavy Ind Method and device for rolling
JPS5319962A (en) * 1976-08-10 1978-02-23 Yoshizaki Kozo Method of manufacturing extremely thin steel plate for manufacturing cans
JPS542259A (en) * 1977-06-09 1979-01-09 Yoshizaki Kozo Method of making thin steel sheet for can production
JPS5519420A (en) * 1978-07-28 1980-02-12 Hitachi Ltd Method and device of camber correction of tension leveller
JPS6127112A (en) * 1984-07-17 1986-02-06 Nippon Steel Corp Correcting method of speed synchronization of elongation controlling motor
JPS61216814A (en) * 1985-03-22 1986-09-26 Sumitomo Metal Ind Ltd Adjusting method for thickness and width of metal band
JPS6245423A (en) * 1985-08-26 1987-02-27 Mitsubishi Heavy Ind Ltd Straightening head for static pressure type leveller

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