JPS6483138A - Inspecting method of retaining ring - Google Patents

Inspecting method of retaining ring

Info

Publication number
JPS6483138A
JPS6483138A JP24119487A JP24119487A JPS6483138A JP S6483138 A JPS6483138 A JP S6483138A JP 24119487 A JP24119487 A JP 24119487A JP 24119487 A JP24119487 A JP 24119487A JP S6483138 A JPS6483138 A JP S6483138A
Authority
JP
Japan
Prior art keywords
ring
retaining ring
inspection
liquid
spheres
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24119487A
Other languages
Japanese (ja)
Inventor
Yoshiyuki Igarashi
Takashi Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP24119487A priority Critical patent/JPS6483138A/en
Publication of JPS6483138A publication Critical patent/JPS6483138A/en
Pending legal-status Critical Current

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  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

PURPOSE:To facilitate detection by a method wherein a retaining ring is removed from a rotary armature, the shape of the retaining ring is changed by bending to generate a tensile stress in the inner peripheral surface thereof, and in this state an examination liquid is made to penetrate into a crack. CONSTITUTION:First a retaining ring is removed from a rotor of a rotary armature by releasing the shrink fit of the ring. Next, a hydraulic jack 2, for instance, is set inside the retaining ring 1 and extended to apply a load in the radius direction F onto the ring 1, so that the shape of the ring be changed to be elliptical. In this state, subsequently, spheres wherein a tensile stress is high relatively. e.g. spheres D1 and D2 of about 45 degrees, are set as part to be examined, and liquid penetrant inspection is executed therefor. Moreover the angular position of the ring 1 in relation to the jack 2 is shifted, and the inspection is executed for the remaining parts by the same process. By this method, an inspection liquid is made to penetrate into a crack, and thus even very small cracks can be detected easily and without fail.
JP24119487A 1987-09-25 1987-09-25 Inspecting method of retaining ring Pending JPS6483138A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24119487A JPS6483138A (en) 1987-09-25 1987-09-25 Inspecting method of retaining ring

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24119487A JPS6483138A (en) 1987-09-25 1987-09-25 Inspecting method of retaining ring

Publications (1)

Publication Number Publication Date
JPS6483138A true JPS6483138A (en) 1989-03-28

Family

ID=17070610

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24119487A Pending JPS6483138A (en) 1987-09-25 1987-09-25 Inspecting method of retaining ring

Country Status (1)

Country Link
JP (1) JPS6483138A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0384002A2 (en) * 1989-02-20 1990-08-29 Widmann Sicherungsanlagen Gmbh Surface testing of round rings
BE1005371A0 (en) * 1988-02-29 1993-07-06 Westinghouse Electric Corporation Method and apparatus for detection of cracks in restraint coulonnes.
CN102648405A (en) * 2009-11-20 2012-08-22 独立行政法人产业技术综合研究所 Method of examining defects, wafer subjected to defect examination or semiconductor element manufactured using the wafer, quality control method for wafer or semiconductor element, and defect examining device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE1005371A0 (en) * 1988-02-29 1993-07-06 Westinghouse Electric Corporation Method and apparatus for detection of cracks in restraint coulonnes.
EP0384002A2 (en) * 1989-02-20 1990-08-29 Widmann Sicherungsanlagen Gmbh Surface testing of round rings
CN102648405A (en) * 2009-11-20 2012-08-22 独立行政法人产业技术综合研究所 Method of examining defects, wafer subjected to defect examination or semiconductor element manufactured using the wafer, quality control method for wafer or semiconductor element, and defect examining device

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