JPS648261A - Formation of thin organic film - Google Patents

Formation of thin organic film

Info

Publication number
JPS648261A
JPS648261A JP16378487A JP16378487A JPS648261A JP S648261 A JPS648261 A JP S648261A JP 16378487 A JP16378487 A JP 16378487A JP 16378487 A JP16378487 A JP 16378487A JP S648261 A JPS648261 A JP S648261A
Authority
JP
Japan
Prior art keywords
vessel
org
substrate
frequency
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16378487A
Other languages
Japanese (ja)
Inventor
Toru Watanabe
Katsuya Okumura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP16378487A priority Critical patent/JPS648261A/en
Publication of JPS648261A publication Critical patent/JPS648261A/en
Pending legal-status Critical Current

Links

Landscapes

  • Formation Of Insulating Films (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

PURPOSE:To form a thin org. film of good coating at a high deposition speed by imposing a substrate material on a grounding electrode, mounting an org. target to a high-frequency impressing electrode and specifying the pressure of an inert gas in a vessel to a specific range. CONSTITUTION:The substrate 1 is imposed on the grounding electrode 2 provided in the vessel 8 and the surface of the high-frequency impressing electrode 4 opposite thereto is covered by the target 3 consisting of an org. material such as heat resistant polyphenylene sulfide. The inert gas such as argon is introduced from an introducing hole 6 into the vessel 8 and is discharged at a specified rate from a discharge hole 7. The pressure in the vessel 8 is maintained in a 30mTorr-1Torr range. The high frequency is impressed between the two electrodes 2 and 4 to generate an electric discharge in the vessel 8. The thin org. film is deposited at the high deposition speed on the substrate 1 as sputtering progresses.
JP16378487A 1987-06-30 1987-06-30 Formation of thin organic film Pending JPS648261A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16378487A JPS648261A (en) 1987-06-30 1987-06-30 Formation of thin organic film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16378487A JPS648261A (en) 1987-06-30 1987-06-30 Formation of thin organic film

Publications (1)

Publication Number Publication Date
JPS648261A true JPS648261A (en) 1989-01-12

Family

ID=15780644

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16378487A Pending JPS648261A (en) 1987-06-30 1987-06-30 Formation of thin organic film

Country Status (1)

Country Link
JP (1) JPS648261A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004077539A1 (en) * 2003-02-28 2004-09-10 Fujitsu Limited Etching resistant film, process for producing the same, surface cured resist pattern, process for producing the same, semiconductor device and process for producing the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004077539A1 (en) * 2003-02-28 2004-09-10 Fujitsu Limited Etching resistant film, process for producing the same, surface cured resist pattern, process for producing the same, semiconductor device and process for producing the same
EP1598858A1 (en) * 2003-02-28 2005-11-23 Fujitsu Limited Etching resistant film, process for producing the same, surface cured resist pattern, process for producing the same, semiconductor device and process for producing the same
EP1598858B1 (en) * 2003-02-28 2014-04-09 Fujitsu Limited Process for producing etching resistant film, surface cured resist pattern, process for producing surface modified resist pattern, and process for producing semiconductor device

Similar Documents

Publication Publication Date Title
FR2412619B1 (en)
JPS6483656A (en) Method and vacuum painting machine for applying film to base layer
WO2000055388A3 (en) Method and apparatus for arc deposition
US5215638A (en) Rotating magnetron cathode and method for the use thereof
EP0238434A3 (en) Method for depositing a layer of abrasive material on a substrate
CA2069329A1 (en) Method for coating substrates with silicon based compounds
CA2107242A1 (en) An Evaporation System for Gas Jet Deposition on Thin Film Materials
DE69217233T2 (en) DEVICE AND METHOD FOR COATING SUBSTRATES BY PLASMA DISCHARGE
AU5704986A (en) Glow discharge deposition
EP0359567A3 (en) Plasma processing method and apparatus
EP0686708A4 (en) Film forming method and film forming apparatus
DE59602601D1 (en) Device for coating substrates in a vacuum
JPS648261A (en) Formation of thin organic film
EP0244874A3 (en) Luminescent material, process for producing it and luminescent semiconductor device using it
JPS5435178A (en) Ultrafine particle depositing apparatus
JPS57150154A (en) Manufacture for information recording body
JP2854130B2 (en) Apparatus for coating substrates by sputtering
SE8501281L (en) PROCEDURE FOR CLOTHING OF CERAMIC SUBSTANCES AND QUARTERS WITH MATERIALS ELECTRICALLY TRANSFERRED TO THE ANGPHASE
JPS56169116A (en) Manufacture of amorphous silicon film
Bessot New Vacuum Deposition Techniques. Evolution and Trends
JPS6480023A (en) Formation of thin film and apparatus therefor
Severin Materials for Cathode Sputtering
JPS56105475A (en) Coating apparatus and method of substrate by cathode spattering and use
JPS56155640A (en) Plasma spray process for obtaining metal compound material
Bringmann et al. Apparatus for Coating a Substrate by Plasma-Chemical Vapour Deposition or Cathodic Sputtering and Process Using the Apparatus