JPS6482555A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS6482555A
JPS6482555A JP24184487A JP24184487A JPS6482555A JP S6482555 A JPS6482555 A JP S6482555A JP 24184487 A JP24184487 A JP 24184487A JP 24184487 A JP24184487 A JP 24184487A JP S6482555 A JPS6482555 A JP S6482555A
Authority
JP
Japan
Prior art keywords
lead
package
sealing material
frame
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24184487A
Other languages
Japanese (ja)
Inventor
Masao Arimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP24184487A priority Critical patent/JPS6482555A/en
Publication of JPS6482555A publication Critical patent/JPS6482555A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To decrease a packaging area and still to enable a packaged element to be checked correctly, by disposing a semiconductor element fixed on a frame within a sealing material and projecting a lead of the frame from the lower face of the sealing material. CONSTITUTION:In a semiconductor device 8, a lead 7 of a frame 2 in a package 1 composed of a sealing material such as resin or the like is bent downwards to project from the lower face of the package 1, and then extended downwards. The extended lead 7 is bent outwards and then bent upwards. The distal end 7b is laid along the side face of the package 1 and any excessive part thereof is cut off such that the tip end is flush with the top face of the package 1. The lead 7 of the semiconductor device 8 is joined to a substrate 5 at joining points 7a by means of solder 5. The lead projected from the lower face of the package decreases a distance from the external end of the sealing material to the end on the side of the lead and hence decreases a packaging area in comparison with the case where the lead is projected from the side face. It also enables the packaged elements to be checked correctly without errors.
JP24184487A 1987-09-24 1987-09-24 Semiconductor device Pending JPS6482555A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24184487A JPS6482555A (en) 1987-09-24 1987-09-24 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24184487A JPS6482555A (en) 1987-09-24 1987-09-24 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS6482555A true JPS6482555A (en) 1989-03-28

Family

ID=17080345

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24184487A Pending JPS6482555A (en) 1987-09-24 1987-09-24 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS6482555A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5208214A (en) * 1988-12-29 1993-05-04 Hoechst Aktiengesellschaft Multiphase superconductor and process for its production
WO2001057924A1 (en) * 2000-02-02 2001-08-09 Infineon Technologies Ag Semiconductor component with contacts provided on the lower side thereof, and method for producing the same
JP2002049334A (en) * 1999-11-01 2002-02-15 Rohm Co Ltd Light emitting display device and producing method thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5208214A (en) * 1988-12-29 1993-05-04 Hoechst Aktiengesellschaft Multiphase superconductor and process for its production
JP2002049334A (en) * 1999-11-01 2002-02-15 Rohm Co Ltd Light emitting display device and producing method thereof
WO2001057924A1 (en) * 2000-02-02 2001-08-09 Infineon Technologies Ag Semiconductor component with contacts provided on the lower side thereof, and method for producing the same

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