JPS6482555A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS6482555A JPS6482555A JP24184487A JP24184487A JPS6482555A JP S6482555 A JPS6482555 A JP S6482555A JP 24184487 A JP24184487 A JP 24184487A JP 24184487 A JP24184487 A JP 24184487A JP S6482555 A JPS6482555 A JP S6482555A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- package
- sealing material
- frame
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE:To decrease a packaging area and still to enable a packaged element to be checked correctly, by disposing a semiconductor element fixed on a frame within a sealing material and projecting a lead of the frame from the lower face of the sealing material. CONSTITUTION:In a semiconductor device 8, a lead 7 of a frame 2 in a package 1 composed of a sealing material such as resin or the like is bent downwards to project from the lower face of the package 1, and then extended downwards. The extended lead 7 is bent outwards and then bent upwards. The distal end 7b is laid along the side face of the package 1 and any excessive part thereof is cut off such that the tip end is flush with the top face of the package 1. The lead 7 of the semiconductor device 8 is joined to a substrate 5 at joining points 7a by means of solder 5. The lead projected from the lower face of the package decreases a distance from the external end of the sealing material to the end on the side of the lead and hence decreases a packaging area in comparison with the case where the lead is projected from the side face. It also enables the packaged elements to be checked correctly without errors.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24184487A JPS6482555A (en) | 1987-09-24 | 1987-09-24 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24184487A JPS6482555A (en) | 1987-09-24 | 1987-09-24 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6482555A true JPS6482555A (en) | 1989-03-28 |
Family
ID=17080345
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP24184487A Pending JPS6482555A (en) | 1987-09-24 | 1987-09-24 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6482555A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5208214A (en) * | 1988-12-29 | 1993-05-04 | Hoechst Aktiengesellschaft | Multiphase superconductor and process for its production |
WO2001057924A1 (en) * | 2000-02-02 | 2001-08-09 | Infineon Technologies Ag | Semiconductor component with contacts provided on the lower side thereof, and method for producing the same |
JP2002049334A (en) * | 1999-11-01 | 2002-02-15 | Rohm Co Ltd | Light emitting display device and producing method thereof |
-
1987
- 1987-09-24 JP JP24184487A patent/JPS6482555A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5208214A (en) * | 1988-12-29 | 1993-05-04 | Hoechst Aktiengesellschaft | Multiphase superconductor and process for its production |
JP2002049334A (en) * | 1999-11-01 | 2002-02-15 | Rohm Co Ltd | Light emitting display device and producing method thereof |
WO2001057924A1 (en) * | 2000-02-02 | 2001-08-09 | Infineon Technologies Ag | Semiconductor component with contacts provided on the lower side thereof, and method for producing the same |
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