JPS6481579A - Forming method for reference face of solid-state image pickup device - Google Patents

Forming method for reference face of solid-state image pickup device

Info

Publication number
JPS6481579A
JPS6481579A JP62239838A JP23983887A JPS6481579A JP S6481579 A JPS6481579 A JP S6481579A JP 62239838 A JP62239838 A JP 62239838A JP 23983887 A JP23983887 A JP 23983887A JP S6481579 A JPS6481579 A JP S6481579A
Authority
JP
Japan
Prior art keywords
image pickup
reference face
tilt
accuracy
solid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62239838A
Other languages
Japanese (ja)
Inventor
Masao Honma
Naoaki Motoi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP62239838A priority Critical patent/JPS6481579A/en
Publication of JPS6481579A publication Critical patent/JPS6481579A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Abstract

PURPOSE:To improve the back focus accuracy and tilt accuracy in mounting an image pickup device to a lens or the like by processing further a reference face in parallel with an element surface to the package uppermost part after the mount of the image pickup element. CONSTITUTION:A solid-state image pickup element 3 such as a CCD is bonded onto an inner bottom face 2 of a ceramic package 1. Then the tilt of the element surface 4 is detected by a laser range finder or the like and the uppermost part 5 of the package 1 is cut off to make the part 5 in parallel with the element surface 4 to form a reference face A. Since the reference face A is formed with high accuracy, the tilt is decreased in the mount onto the lens or the like and the tilt accuracy and back focus accuracy are improved.
JP62239838A 1987-09-24 1987-09-24 Forming method for reference face of solid-state image pickup device Pending JPS6481579A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62239838A JPS6481579A (en) 1987-09-24 1987-09-24 Forming method for reference face of solid-state image pickup device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62239838A JPS6481579A (en) 1987-09-24 1987-09-24 Forming method for reference face of solid-state image pickup device

Publications (1)

Publication Number Publication Date
JPS6481579A true JPS6481579A (en) 1989-03-27

Family

ID=17050614

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62239838A Pending JPS6481579A (en) 1987-09-24 1987-09-24 Forming method for reference face of solid-state image pickup device

Country Status (1)

Country Link
JP (1) JPS6481579A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7929858B2 (en) 1998-03-17 2011-04-19 Nikon Corporation Image-capturing apparatus, electronic still camera, method and apparatus for processing mounting surface of image-capturing apparatus and metal member contact structure
US8564716B2 (en) 2007-11-21 2013-10-22 Lg Innotek Co., Ltd. Camera module
WO2015151172A1 (en) * 2014-03-31 2015-10-08 パイオニア株式会社 Image pickup device and method for manufacturing same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7929858B2 (en) 1998-03-17 2011-04-19 Nikon Corporation Image-capturing apparatus, electronic still camera, method and apparatus for processing mounting surface of image-capturing apparatus and metal member contact structure
US8564716B2 (en) 2007-11-21 2013-10-22 Lg Innotek Co., Ltd. Camera module
WO2015151172A1 (en) * 2014-03-31 2015-10-08 パイオニア株式会社 Image pickup device and method for manufacturing same

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