JPS6480030A - Semiconductor element transfer device - Google Patents
Semiconductor element transfer deviceInfo
- Publication number
- JPS6480030A JPS6480030A JP23577487A JP23577487A JPS6480030A JP S6480030 A JPS6480030 A JP S6480030A JP 23577487 A JP23577487 A JP 23577487A JP 23577487 A JP23577487 A JP 23577487A JP S6480030 A JPS6480030 A JP S6480030A
- Authority
- JP
- Japan
- Prior art keywords
- belt
- storage holes
- elements
- semiconductor elements
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Die Bonding (AREA)
Abstract
PURPOSE:To transfer semiconductor elements by the movement of a belt by placing a belt having a plurality of storage holes for receiving semiconductor elements in contact with a belt receiver having a smooth upper surface. CONSTITUTION:A metallic belt 1 having a plurality of storage holes 2 for receiving semiconductor elements 4 and perforations 3 is moved in the direction of an arrow A by a pulley 11 having a feed clink 12. The elements 4 put in the storage holes 2 of the belt 1 are moved in the direction of an arrow 14 by an air flow 13 and sucked so as to abut on one side 2a of the storage holes 2. With the belt 1 moving, one side 2b of the storage holes 2 abuts on one side 4b of the elements 4, so the elements 4 have their two sides 4a, 4b contacted with the two sides 2a, 2b of the storage holes 2 as represented in the hatched section, and are correctly positioned and transferred.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23577487A JPH0812874B2 (en) | 1987-09-19 | 1987-09-19 | Semiconductor element transfer device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23577487A JPH0812874B2 (en) | 1987-09-19 | 1987-09-19 | Semiconductor element transfer device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6480030A true JPS6480030A (en) | 1989-03-24 |
JPH0812874B2 JPH0812874B2 (en) | 1996-02-07 |
Family
ID=16991040
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23577487A Expired - Fee Related JPH0812874B2 (en) | 1987-09-19 | 1987-09-19 | Semiconductor element transfer device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0812874B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001332383A (en) * | 2000-03-17 | 2001-11-30 | Seiko Epson Corp | Manufacturing method of organic el display body, arrangement method of semiconductor element, manufacturing method of semiconductor device |
JP2010019599A (en) * | 2008-07-08 | 2010-01-28 | Nec Electronics Corp | Jig for inspecting semiconductor chip, apparatus and method for inspection, and method of manufacturing semiconductor device |
-
1987
- 1987-09-19 JP JP23577487A patent/JPH0812874B2/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001332383A (en) * | 2000-03-17 | 2001-11-30 | Seiko Epson Corp | Manufacturing method of organic el display body, arrangement method of semiconductor element, manufacturing method of semiconductor device |
JP2010019599A (en) * | 2008-07-08 | 2010-01-28 | Nec Electronics Corp | Jig for inspecting semiconductor chip, apparatus and method for inspection, and method of manufacturing semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JPH0812874B2 (en) | 1996-02-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |