JPS64794A - Multilayer interconnection board - Google Patents
Multilayer interconnection boardInfo
- Publication number
- JPS64794A JPS64794A JP3036488A JP3036488A JPS64794A JP S64794 A JPS64794 A JP S64794A JP 3036488 A JP3036488 A JP 3036488A JP 3036488 A JP3036488 A JP 3036488A JP S64794 A JPS64794 A JP S64794A
- Authority
- JP
- Japan
- Prior art keywords
- electric source
- board
- layers
- interconnection
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE: To increase the number of I/O electrodes for signals and the number of electrodes for electric source supply in a multilayer interconnection board by a method wherein the areas of the respective conductor layers in the ceramic laminated interconnection board are successively increased or reduced to expose step-shape pads for electric source supply on the side of the board.
CONSTITUTION: When a ceramic laminated board which has electric source layer in its inner layers, a plurality of ceramic sheets on which conductor layers are printed and all of which have areas different from each other are laminated to expose the electric source layers in a step-shape and the exposed electric source layers are used as pads for electric source supply. The areas of the ceramic sheets of inner electric source interconnection layers in the ceramic laminated board are successively reduced toward the surface of the board or, to the contrary, reduced toward the rear of the board. The exposed step-shape electric source supply pads 6 which can be connected to the external circuits are connected to the inner electric source interconnection layers 5 and, on the rear of the ceramic laminated board, fixed electric source supply pins 2 made of material same as the material of the inner electric source interconnection layers are connected to the inner electric source interconnection layers 5 with through-holes 4.
COPYRIGHT: (C)1989,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63030364A JP2611304B2 (en) | 1987-02-26 | 1988-02-12 | Multilayer wiring board |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62-41545 | 1987-02-26 | ||
JP4154587 | 1987-02-26 | ||
JP63030364A JP2611304B2 (en) | 1987-02-26 | 1988-02-12 | Multilayer wiring board |
Publications (3)
Publication Number | Publication Date |
---|---|
JPH01794A JPH01794A (en) | 1989-01-05 |
JPS64794A true JPS64794A (en) | 1989-01-05 |
JP2611304B2 JP2611304B2 (en) | 1997-05-21 |
Family
ID=26368696
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63030364A Expired - Lifetime JP2611304B2 (en) | 1987-02-26 | 1988-02-12 | Multilayer wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2611304B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0417951U (en) * | 1990-06-01 | 1992-02-14 | ||
JPH0613533A (en) * | 1992-06-24 | 1994-01-21 | Toshiba Corp | Multichip module |
JP2009158761A (en) * | 2007-12-27 | 2009-07-16 | Ngk Spark Plug Co Ltd | Wiring board for electronic component inspection device |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59500032A (en) * | 1982-01-13 | 1984-01-05 | エルクシイ | Backplane power connection system and method of manufacturing the system |
JPS63284898A (en) * | 1987-05-15 | 1988-11-22 | Ibiden Co Ltd | Shielding package for surface mounting part |
-
1988
- 1988-02-12 JP JP63030364A patent/JP2611304B2/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59500032A (en) * | 1982-01-13 | 1984-01-05 | エルクシイ | Backplane power connection system and method of manufacturing the system |
JPS63284898A (en) * | 1987-05-15 | 1988-11-22 | Ibiden Co Ltd | Shielding package for surface mounting part |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0417951U (en) * | 1990-06-01 | 1992-02-14 | ||
JPH0613533A (en) * | 1992-06-24 | 1994-01-21 | Toshiba Corp | Multichip module |
JP2009158761A (en) * | 2007-12-27 | 2009-07-16 | Ngk Spark Plug Co Ltd | Wiring board for electronic component inspection device |
Also Published As
Publication number | Publication date |
---|---|
JP2611304B2 (en) | 1997-05-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |