JPS64794A - Multilayer interconnection board - Google Patents

Multilayer interconnection board

Info

Publication number
JPS64794A
JPS64794A JP3036488A JP3036488A JPS64794A JP S64794 A JPS64794 A JP S64794A JP 3036488 A JP3036488 A JP 3036488A JP 3036488 A JP3036488 A JP 3036488A JP S64794 A JPS64794 A JP S64794A
Authority
JP
Japan
Prior art keywords
electric source
board
layers
interconnection
ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3036488A
Other languages
Japanese (ja)
Other versions
JP2611304B2 (en
JPH01794A (en
Inventor
Jun Inasaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP63030364A priority Critical patent/JP2611304B2/en
Publication of JPH01794A publication Critical patent/JPH01794A/en
Publication of JPS64794A publication Critical patent/JPS64794A/en
Application granted granted Critical
Publication of JP2611304B2 publication Critical patent/JP2611304B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Abstract

PURPOSE: To increase the number of I/O electrodes for signals and the number of electrodes for electric source supply in a multilayer interconnection board by a method wherein the areas of the respective conductor layers in the ceramic laminated interconnection board are successively increased or reduced to expose step-shape pads for electric source supply on the side of the board.
CONSTITUTION: When a ceramic laminated board which has electric source layer in its inner layers, a plurality of ceramic sheets on which conductor layers are printed and all of which have areas different from each other are laminated to expose the electric source layers in a step-shape and the exposed electric source layers are used as pads for electric source supply. The areas of the ceramic sheets of inner electric source interconnection layers in the ceramic laminated board are successively reduced toward the surface of the board or, to the contrary, reduced toward the rear of the board. The exposed step-shape electric source supply pads 6 which can be connected to the external circuits are connected to the inner electric source interconnection layers 5 and, on the rear of the ceramic laminated board, fixed electric source supply pins 2 made of material same as the material of the inner electric source interconnection layers are connected to the inner electric source interconnection layers 5 with through-holes 4.
COPYRIGHT: (C)1989,JPO&Japio
JP63030364A 1987-02-26 1988-02-12 Multilayer wiring board Expired - Lifetime JP2611304B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63030364A JP2611304B2 (en) 1987-02-26 1988-02-12 Multilayer wiring board

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP62-41545 1987-02-26
JP4154587 1987-02-26
JP63030364A JP2611304B2 (en) 1987-02-26 1988-02-12 Multilayer wiring board

Publications (3)

Publication Number Publication Date
JPH01794A JPH01794A (en) 1989-01-05
JPS64794A true JPS64794A (en) 1989-01-05
JP2611304B2 JP2611304B2 (en) 1997-05-21

Family

ID=26368696

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63030364A Expired - Lifetime JP2611304B2 (en) 1987-02-26 1988-02-12 Multilayer wiring board

Country Status (1)

Country Link
JP (1) JP2611304B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0417951U (en) * 1990-06-01 1992-02-14
JPH0613533A (en) * 1992-06-24 1994-01-21 Toshiba Corp Multichip module
JP2009158761A (en) * 2007-12-27 2009-07-16 Ngk Spark Plug Co Ltd Wiring board for electronic component inspection device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59500032A (en) * 1982-01-13 1984-01-05 エルクシイ Backplane power connection system and method of manufacturing the system
JPS63284898A (en) * 1987-05-15 1988-11-22 Ibiden Co Ltd Shielding package for surface mounting part

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59500032A (en) * 1982-01-13 1984-01-05 エルクシイ Backplane power connection system and method of manufacturing the system
JPS63284898A (en) * 1987-05-15 1988-11-22 Ibiden Co Ltd Shielding package for surface mounting part

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0417951U (en) * 1990-06-01 1992-02-14
JPH0613533A (en) * 1992-06-24 1994-01-21 Toshiba Corp Multichip module
JP2009158761A (en) * 2007-12-27 2009-07-16 Ngk Spark Plug Co Ltd Wiring board for electronic component inspection device

Also Published As

Publication number Publication date
JP2611304B2 (en) 1997-05-21

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term