JPS6478799A - Manufacture of printed wiring board - Google Patents

Manufacture of printed wiring board

Info

Publication number
JPS6478799A
JPS6478799A JP23697087A JP23697087A JPS6478799A JP S6478799 A JPS6478799 A JP S6478799A JP 23697087 A JP23697087 A JP 23697087A JP 23697087 A JP23697087 A JP 23697087A JP S6478799 A JPS6478799 A JP S6478799A
Authority
JP
Japan
Prior art keywords
board
manufacture
scraps
holes
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP23697087A
Other languages
Japanese (ja)
Other versions
JPH0639075B2 (en
Inventor
Susumu Kawage
Toru Kanbara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Elna Co Ltd
Original Assignee
Elna Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Elna Co Ltd filed Critical Elna Co Ltd
Priority to JP62236970A priority Critical patent/JPH0639075B2/en
Publication of JPS6478799A publication Critical patent/JPS6478799A/en
Publication of JPH0639075B2 publication Critical patent/JPH0639075B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching

Landscapes

  • Details Of Cutting Devices (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE: To enhance the productivity of printed wirings by giving ultrasonic vibrations under liquid to a printed circuit board having punching scraps in through holes, and removing the scraps simply. CONSTITUTION: A printed circuit board having clogged holes is immersed in a liquid (for example, water, glycol, etc.), and ultrasonic waves of for example 19.5 Hz are impressed to the board for three min. Thereby the board is vibrated, and the scraps are allowed to fall out from the through holes in the board and are removed.
JP62236970A 1987-09-21 1987-09-21 Method for manufacturing printed wiring board Expired - Lifetime JPH0639075B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62236970A JPH0639075B2 (en) 1987-09-21 1987-09-21 Method for manufacturing printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62236970A JPH0639075B2 (en) 1987-09-21 1987-09-21 Method for manufacturing printed wiring board

Publications (2)

Publication Number Publication Date
JPS6478799A true JPS6478799A (en) 1989-03-24
JPH0639075B2 JPH0639075B2 (en) 1994-05-25

Family

ID=17008462

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62236970A Expired - Lifetime JPH0639075B2 (en) 1987-09-21 1987-09-21 Method for manufacturing printed wiring board

Country Status (1)

Country Link
JP (1) JPH0639075B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1109429A2 (en) * 1999-12-17 2001-06-20 Matsushita Electric Industrial Co., Ltd. A method of manufacturing a circuit board and its manufacturing apparatus

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5722432A (en) * 1980-06-02 1982-02-05 Mitsubishi Electric Corp Flywheel
JPS62176794A (en) * 1986-01-30 1987-08-03 ワカバ工業株式会社 Removing device for material to be punched of stamping machine

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5722432A (en) * 1980-06-02 1982-02-05 Mitsubishi Electric Corp Flywheel
JPS62176794A (en) * 1986-01-30 1987-08-03 ワカバ工業株式会社 Removing device for material to be punched of stamping machine

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1109429A2 (en) * 1999-12-17 2001-06-20 Matsushita Electric Industrial Co., Ltd. A method of manufacturing a circuit board and its manufacturing apparatus
US6820331B2 (en) 1999-12-17 2004-11-23 Matsushita Electric Industrial Co., Ltd. Method of manufacturing a circuit board and its manufacturing apparatus
US7143772B2 (en) 1999-12-17 2006-12-05 Matsushita Electric Industrial Co., Ltd. Method of manufacturing a circuit board and its manufacturing apparatus

Also Published As

Publication number Publication date
JPH0639075B2 (en) 1994-05-25

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