JPS6477509A - Composite molded body with skin and molding method thereof - Google Patents
Composite molded body with skin and molding method thereofInfo
- Publication number
- JPS6477509A JPS6477509A JP20091887A JP20091887A JPS6477509A JP S6477509 A JPS6477509 A JP S6477509A JP 20091887 A JP20091887 A JP 20091887A JP 20091887 A JP20091887 A JP 20091887A JP S6477509 A JPS6477509 A JP S6477509A
- Authority
- JP
- Japan
- Prior art keywords
- region
- recessed part
- wall
- skin material
- back side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
PURPOSE:To form a portion, in which base material is exposed, at the desired region by a method wherein a wall, which conceals from the surface a part of the region of a recessed part which has no need of skin material, is provided and, after the skin material is pasted onto the wall and formed, said wall is cut off. CONSTITUTION:A recessed part 2 with a rectangular section is integrally provided on the surface side of a composite molded body 1, on the back side of which a tubular portion 5 is projected backward so as to response to the recessed part 2. In the recessed part 2, a bottom wall 7 is provided so as to cross a space surrounded by the peripheral walls 6 of the recessed part 2 in order to divide the space in the recessed part 2 into two portions or into a first region A on the surface side and a second region B on the back side. The bottom wall 7 has a proper shape which is suitably selected so as to confine in advance a region which does not allow to be covered by a skin material 4 in the surface region of the peripheral walls 6 to the back side of the recessed part 2. Before the mounting of a resistor 9, the bottom wall 7 is removed by cutting its periphery off the peripheral walls 6, resulting in leaving the recessed part 2 to a through space. As a result, the inner peripheral surface of the first region A is covered by the skin material 4, while the base material 3 is exposed at the inner peripheral surface of the second region B.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62200918A JPH0796241B2 (en) | 1987-08-13 | 1987-08-13 | Composite molded article having skin and molding method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62200918A JPH0796241B2 (en) | 1987-08-13 | 1987-08-13 | Composite molded article having skin and molding method thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6477509A true JPS6477509A (en) | 1989-03-23 |
JPH0796241B2 JPH0796241B2 (en) | 1995-10-18 |
Family
ID=16432439
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62200918A Expired - Lifetime JPH0796241B2 (en) | 1987-08-13 | 1987-08-13 | Composite molded article having skin and molding method thereof |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0796241B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5236550A (en) * | 1992-04-24 | 1993-08-17 | National Semiconductor Corporation | Method for plasma etch of ruthenium |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62200917A (en) * | 1986-02-28 | 1987-09-04 | Toshiba Corp | Data conversion method |
-
1987
- 1987-08-13 JP JP62200918A patent/JPH0796241B2/en not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62200917A (en) * | 1986-02-28 | 1987-09-04 | Toshiba Corp | Data conversion method |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5236550A (en) * | 1992-04-24 | 1993-08-17 | National Semiconductor Corporation | Method for plasma etch of ruthenium |
Also Published As
Publication number | Publication date |
---|---|
JPH0796241B2 (en) | 1995-10-18 |
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