JPS6474222A - Sealing compound - Google Patents

Sealing compound

Info

Publication number
JPS6474222A
JPS6474222A JP22923587A JP22923587A JPS6474222A JP S6474222 A JPS6474222 A JP S6474222A JP 22923587 A JP22923587 A JP 22923587A JP 22923587 A JP22923587 A JP 22923587A JP S6474222 A JPS6474222 A JP S6474222A
Authority
JP
Japan
Prior art keywords
residue
arom
represented
formula
phenylene
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22923587A
Other languages
Japanese (ja)
Inventor
Fumitoshi Ikejiri
Kunisuke Fukui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Petrochemical Industries Ltd
Original Assignee
Mitsui Petrochemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Petrochemical Industries Ltd filed Critical Mitsui Petrochemical Industries Ltd
Priority to JP22923587A priority Critical patent/JPS6474222A/en
Publication of JPS6474222A publication Critical patent/JPS6474222A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To obtain a sealing compd. having no corrosiveness, excellent moldability, heat resistance, mechanical characteristics and dimensional stability, being capable of improving productivity, and comprising a wholly arom. polyester contg. specific constituting units with a specific ratio. CONSTITUTION:A sealing cpd. comprises a melt-moldable wholly arom. polyester composed of an arom. oxycarboxylic acid residue (A) represented by formula I (wherein Ar<1> is a divalent arom. hydrocarbon group and 60mol.% or more thereof is p-phenylene), an arom. diol residue (B) represented by formula II (wherein Ar<2> is a divalent arom. group selected from p-phenylene and 4,4'- biphenylene), 4,4'-dihydroxydiphenyl ether residue (C) represented by formula II and an arom. dicarboxylic acid residue (D) represented by formula IV (wherein Ar<3> is a divalent arom. hydrocarbon group and 60mol.% or more thereof is p-phenylene) and wherein residue A amounts to 30-80mol.%, residue B 1-20mol.%, residue C 1-32mol.%, and residue D 10-35mol.% respectively based on the total mole no. of all the residues and the sum of the mole no. of residue B and residue C is equal to the mole no. of residue D.
JP22923587A 1987-09-12 1987-09-12 Sealing compound Pending JPS6474222A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22923587A JPS6474222A (en) 1987-09-12 1987-09-12 Sealing compound

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22923587A JPS6474222A (en) 1987-09-12 1987-09-12 Sealing compound

Publications (1)

Publication Number Publication Date
JPS6474222A true JPS6474222A (en) 1989-03-20

Family

ID=16888945

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22923587A Pending JPS6474222A (en) 1987-09-12 1987-09-12 Sealing compound

Country Status (1)

Country Link
JP (1) JPS6474222A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2909215B2 (en) * 1993-05-14 1999-06-23 イー・アイ・デユポン・ドウ・ヌムール・アンド・カンパニー Liquid crystal polymer composition

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2909215B2 (en) * 1993-05-14 1999-06-23 イー・アイ・デユポン・ドウ・ヌムール・アンド・カンパニー Liquid crystal polymer composition

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