JPS6473632A - Probe device - Google Patents
Probe deviceInfo
- Publication number
- JPS6473632A JPS6473632A JP62231918A JP23191887A JPS6473632A JP S6473632 A JPS6473632 A JP S6473632A JP 62231918 A JP62231918 A JP 62231918A JP 23191887 A JP23191887 A JP 23191887A JP S6473632 A JPS6473632 A JP S6473632A
- Authority
- JP
- Japan
- Prior art keywords
- sensor
- wafer
- measured
- base
- probe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
PURPOSE:To inspect without damaging an element to be measured by providing a proximity sensor for detecting the presence or absence of the element to be measured in noncontact with a predetermined position in a probe device for measuring by positioning and connecting a probe mounted on a probe card with an electrode pad. CONSTITUTION:A proximity sensor for detecting the presence or absence of a wafer 2, such as a capacitance sensor 10 as a pressure sensor, is held by a holding mechanism 12 for finely regulating it through an arm 11 in directions X, Y and Z. Here, the sensor 10 is so disposed that the end of a surface to be sensed is disposed substantially at the center of the array of probe 9 of an opening formed at a probe card 8. Further, the sensing surface of the sensor 10 is provided in parallel with the wafer 2 of the element to be measured and the wafer placing base 7. Thus, it is possible to measure the capacitances between the sensor 10 and the base 7 provided at the opposite position, and between the base and the semiconductor wafer 2 placed on the base 7. The change in the capacitance measured and is used to detect the presence or absence of a wafer in front of the sensor 10.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62231918A JPH0719819B2 (en) | 1987-09-14 | 1987-09-14 | Probe device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62231918A JPH0719819B2 (en) | 1987-09-14 | 1987-09-14 | Probe device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6473632A true JPS6473632A (en) | 1989-03-17 |
JPH0719819B2 JPH0719819B2 (en) | 1995-03-06 |
Family
ID=16931100
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62231918A Expired - Fee Related JPH0719819B2 (en) | 1987-09-14 | 1987-09-14 | Probe device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0719819B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5436571A (en) * | 1990-08-20 | 1995-07-25 | Tokyo Electron Limited | Probing test method of contacting a plurality of probes of a probe card with pads on a chip on a semiconductor wafer |
US6337218B1 (en) | 1999-05-28 | 2002-01-08 | International Business Machines Corporation | Method to test devices on high performance ULSI wafers |
-
1987
- 1987-09-14 JP JP62231918A patent/JPH0719819B2/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5436571A (en) * | 1990-08-20 | 1995-07-25 | Tokyo Electron Limited | Probing test method of contacting a plurality of probes of a probe card with pads on a chip on a semiconductor wafer |
US6337218B1 (en) | 1999-05-28 | 2002-01-08 | International Business Machines Corporation | Method to test devices on high performance ULSI wafers |
Also Published As
Publication number | Publication date |
---|---|
JPH0719819B2 (en) | 1995-03-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |