JPS6473632A - Probe device - Google Patents

Probe device

Info

Publication number
JPS6473632A
JPS6473632A JP62231918A JP23191887A JPS6473632A JP S6473632 A JPS6473632 A JP S6473632A JP 62231918 A JP62231918 A JP 62231918A JP 23191887 A JP23191887 A JP 23191887A JP S6473632 A JPS6473632 A JP S6473632A
Authority
JP
Japan
Prior art keywords
sensor
wafer
measured
base
probe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62231918A
Other languages
Japanese (ja)
Other versions
JPH0719819B2 (en
Inventor
Masaji Hiruta
Yuichi Abe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP62231918A priority Critical patent/JPH0719819B2/en
Publication of JPS6473632A publication Critical patent/JPS6473632A/en
Publication of JPH0719819B2 publication Critical patent/JPH0719819B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To inspect without damaging an element to be measured by providing a proximity sensor for detecting the presence or absence of the element to be measured in noncontact with a predetermined position in a probe device for measuring by positioning and connecting a probe mounted on a probe card with an electrode pad. CONSTITUTION:A proximity sensor for detecting the presence or absence of a wafer 2, such as a capacitance sensor 10 as a pressure sensor, is held by a holding mechanism 12 for finely regulating it through an arm 11 in directions X, Y and Z. Here, the sensor 10 is so disposed that the end of a surface to be sensed is disposed substantially at the center of the array of probe 9 of an opening formed at a probe card 8. Further, the sensing surface of the sensor 10 is provided in parallel with the wafer 2 of the element to be measured and the wafer placing base 7. Thus, it is possible to measure the capacitances between the sensor 10 and the base 7 provided at the opposite position, and between the base and the semiconductor wafer 2 placed on the base 7. The change in the capacitance measured and is used to detect the presence or absence of a wafer in front of the sensor 10.
JP62231918A 1987-09-14 1987-09-14 Probe device Expired - Fee Related JPH0719819B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62231918A JPH0719819B2 (en) 1987-09-14 1987-09-14 Probe device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62231918A JPH0719819B2 (en) 1987-09-14 1987-09-14 Probe device

Publications (2)

Publication Number Publication Date
JPS6473632A true JPS6473632A (en) 1989-03-17
JPH0719819B2 JPH0719819B2 (en) 1995-03-06

Family

ID=16931100

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62231918A Expired - Fee Related JPH0719819B2 (en) 1987-09-14 1987-09-14 Probe device

Country Status (1)

Country Link
JP (1) JPH0719819B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5436571A (en) * 1990-08-20 1995-07-25 Tokyo Electron Limited Probing test method of contacting a plurality of probes of a probe card with pads on a chip on a semiconductor wafer
US6337218B1 (en) 1999-05-28 2002-01-08 International Business Machines Corporation Method to test devices on high performance ULSI wafers

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5436571A (en) * 1990-08-20 1995-07-25 Tokyo Electron Limited Probing test method of contacting a plurality of probes of a probe card with pads on a chip on a semiconductor wafer
US6337218B1 (en) 1999-05-28 2002-01-08 International Business Machines Corporation Method to test devices on high performance ULSI wafers

Also Published As

Publication number Publication date
JPH0719819B2 (en) 1995-03-06

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees