JPS6473613A - Furnace for heat-treating semiconductor substrate - Google Patents

Furnace for heat-treating semiconductor substrate

Info

Publication number
JPS6473613A
JPS6473613A JP23083187A JP23083187A JPS6473613A JP S6473613 A JPS6473613 A JP S6473613A JP 23083187 A JP23083187 A JP 23083187A JP 23083187 A JP23083187 A JP 23083187A JP S6473613 A JPS6473613 A JP S6473613A
Authority
JP
Japan
Prior art keywords
heat
inner cylinder
coolant
furnace
space
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP23083187A
Other languages
Japanese (ja)
Other versions
JPH0722137B2 (en
Inventor
Yusuke Muraoka
Takamasa Sakai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Dainippon Screen Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Manufacturing Co Ltd filed Critical Dainippon Screen Manufacturing Co Ltd
Priority to JP62230831A priority Critical patent/JPH0722137B2/en
Publication of JPS6473613A publication Critical patent/JPS6473613A/en
Publication of JPH0722137B2 publication Critical patent/JPH0722137B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

PURPOSE:To make it possible to quickly control the temperature within a furnace by providing an inner cylinder inside the outer cylinder, forming the inner cylinder into a heat ray reflecting mirror, and providing a heat exchange type cooling means in the space between the inner cylinder and the outer cylinder, thereby absorbing radiation heat and convection heat. CONSTITUTION:An inner cylinder 5 is formed of a heat-resistant quartz glass, and on the inner surface thereof, an evaporated film of gold is deposited and formed as a heat ray reflecting mirror 6. A heat exchange type cooling means 10 is provided in a space 7 so as to surround the inner cylinder 5 and comprised of a plurality of coolant circulation pipes 11 and multiple annular heat absorbing fins 12a provided on the coolant circulation pipes 11. The coolant circulation pipes 11 are passing through the multiple heat absorbing fins 12a shaped in a doughnut so as to surround the inner cylinder 5 and so as to be parallel with the axis of the furnace, and both ends thereof are made to communicate with the coolant ports 16, 16 formed within a pair ot flanges 15, 15. A cooling pump 17 for compressively feeding a coolant is communicatively connected to the coolant port 16, the radiation heat and the conduction and convection heats from the inner cylinder 5 leaking into the space 7 are absorbed by the heat absorbing fins 12a or 12b and ejected through the coolant to the outside of the furnace.
JP62230831A 1987-09-14 1987-09-14 Heat treatment furnace for semiconductor substrates Expired - Fee Related JPH0722137B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62230831A JPH0722137B2 (en) 1987-09-14 1987-09-14 Heat treatment furnace for semiconductor substrates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62230831A JPH0722137B2 (en) 1987-09-14 1987-09-14 Heat treatment furnace for semiconductor substrates

Publications (2)

Publication Number Publication Date
JPS6473613A true JPS6473613A (en) 1989-03-17
JPH0722137B2 JPH0722137B2 (en) 1995-03-08

Family

ID=16913960

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62230831A Expired - Fee Related JPH0722137B2 (en) 1987-09-14 1987-09-14 Heat treatment furnace for semiconductor substrates

Country Status (1)

Country Link
JP (1) JPH0722137B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006284077A (en) * 2005-03-31 2006-10-19 Kumamoto Technology & Industry Foundation Heat radiation reflecting furnace
DE102004046198B4 (en) * 2003-09-24 2009-07-30 Advics Co., Ltd., Kariya Vehicle wheel speed calculation device and antilock brake control device provided therewith

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5481270U (en) * 1977-11-21 1979-06-08
JPS5649500U (en) * 1979-09-25 1981-05-01

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5481270U (en) * 1977-11-21 1979-06-08
JPS5649500U (en) * 1979-09-25 1981-05-01

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004046198B4 (en) * 2003-09-24 2009-07-30 Advics Co., Ltd., Kariya Vehicle wheel speed calculation device and antilock brake control device provided therewith
JP2006284077A (en) * 2005-03-31 2006-10-19 Kumamoto Technology & Industry Foundation Heat radiation reflecting furnace

Also Published As

Publication number Publication date
JPH0722137B2 (en) 1995-03-08

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Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees