JPS647271U - - Google Patents
Info
- Publication number
- JPS647271U JPS647271U JP9810187U JP9810187U JPS647271U JP S647271 U JPS647271 U JP S647271U JP 9810187 U JP9810187 U JP 9810187U JP 9810187 U JP9810187 U JP 9810187U JP S647271 U JPS647271 U JP S647271U
- Authority
- JP
- Japan
- Prior art keywords
- plated
- resin
- rotary
- cathode
- cathode disk
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000011521 glass Substances 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
- Electrolytic Production Of Metals (AREA)
- Manufacturing Optical Record Carriers (AREA)
Description
第1図、第2図は本考案になる円盤状回転式メ
ツキ装置の陰極構体の好適な一実施例を示し、第
1図はその分解斜視図、第2図は縦断側面図、第
3図は一般的な円盤状回転式メツキ装置を示す概
略断面図、第4図は従来の陰極構体の分解斜視図
、第5図は第4図の組立時の極部の部分断面図で
ある。
20……回転陰極盤、23……ガラス盤(被メ
ツキ物)、24……フレームリング、27……陰
極構体。
1 and 2 show a preferred embodiment of the cathode structure of the disk-shaped rotary plating device according to the present invention, FIG. 1 is an exploded perspective view thereof, FIG. 2 is a longitudinal sectional side view, and FIG. 4 is an exploded perspective view of a conventional cathode assembly, and FIG. 5 is a partial sectional view of the pole portion of FIG. 4 when assembled. 20... Rotating cathode disk, 23... Glass disk (object to be plated), 24... Frame ring, 27... Cathode structure.
Claims (1)
ングした金属製の回転陰極盤と、前記被メツキ物
および前記回転陰極盤とそれぞれ通電部を介して
接合される樹脂にてコーテイングした金属製のフ
レームリングとを有することを特徴とする円盤状
回転式メツキ装置の陰極構体。 A metal rotary cathode disk on which the object to be plated is placed and whose peripheral surface is coated with resin, and a resin-coated metal cathode disk that is joined to the object to be plated and the rotary cathode disk through current-carrying parts, respectively. A cathode structure for a disc-shaped rotary plating device, characterized in that it has a frame ring.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9810187U JPH0324599Y2 (en) | 1987-06-26 | 1987-06-26 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9810187U JPH0324599Y2 (en) | 1987-06-26 | 1987-06-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS647271U true JPS647271U (en) | 1989-01-17 |
JPH0324599Y2 JPH0324599Y2 (en) | 1991-05-29 |
Family
ID=31324063
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9810187U Expired JPH0324599Y2 (en) | 1987-06-26 | 1987-06-26 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0324599Y2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017137523A (en) * | 2016-02-01 | 2017-08-10 | アスカコーポレーション株式会社 | Semiconductor wafer |
-
1987
- 1987-06-26 JP JP9810187U patent/JPH0324599Y2/ja not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017137523A (en) * | 2016-02-01 | 2017-08-10 | アスカコーポレーション株式会社 | Semiconductor wafer |
Also Published As
Publication number | Publication date |
---|---|
JPH0324599Y2 (en) | 1991-05-29 |
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