JPS647271U - - Google Patents

Info

Publication number
JPS647271U
JPS647271U JP9810187U JP9810187U JPS647271U JP S647271 U JPS647271 U JP S647271U JP 9810187 U JP9810187 U JP 9810187U JP 9810187 U JP9810187 U JP 9810187U JP S647271 U JPS647271 U JP S647271U
Authority
JP
Japan
Prior art keywords
plated
resin
rotary
cathode
cathode disk
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9810187U
Other languages
Japanese (ja)
Other versions
JPH0324599Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9810187U priority Critical patent/JPH0324599Y2/ja
Publication of JPS647271U publication Critical patent/JPS647271U/ja
Application granted granted Critical
Publication of JPH0324599Y2 publication Critical patent/JPH0324599Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Manufacturing Optical Record Carriers (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図、第2図は本考案になる円盤状回転式メ
ツキ装置の陰極構体の好適な一実施例を示し、第
1図はその分解斜視図、第2図は縦断側面図、第
3図は一般的な円盤状回転式メツキ装置を示す概
略断面図、第4図は従来の陰極構体の分解斜視図
、第5図は第4図の組立時の極部の部分断面図で
ある。 20……回転陰極盤、23……ガラス盤(被メ
ツキ物)、24……フレームリング、27……陰
極構体。
1 and 2 show a preferred embodiment of the cathode structure of the disk-shaped rotary plating device according to the present invention, FIG. 1 is an exploded perspective view thereof, FIG. 2 is a longitudinal sectional side view, and FIG. 4 is an exploded perspective view of a conventional cathode assembly, and FIG. 5 is a partial sectional view of the pole portion of FIG. 4 when assembled. 20... Rotating cathode disk, 23... Glass disk (object to be plated), 24... Frame ring, 27... Cathode structure.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 被メツキ物を載置し、周面を樹脂にてコーテイ
ングした金属製の回転陰極盤と、前記被メツキ物
および前記回転陰極盤とそれぞれ通電部を介して
接合される樹脂にてコーテイングした金属製のフ
レームリングとを有することを特徴とする円盤状
回転式メツキ装置の陰極構体。
A metal rotary cathode disk on which the object to be plated is placed and whose peripheral surface is coated with resin, and a resin-coated metal cathode disk that is joined to the object to be plated and the rotary cathode disk through current-carrying parts, respectively. A cathode structure for a disc-shaped rotary plating device, characterized in that it has a frame ring.
JP9810187U 1987-06-26 1987-06-26 Expired JPH0324599Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9810187U JPH0324599Y2 (en) 1987-06-26 1987-06-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9810187U JPH0324599Y2 (en) 1987-06-26 1987-06-26

Publications (2)

Publication Number Publication Date
JPS647271U true JPS647271U (en) 1989-01-17
JPH0324599Y2 JPH0324599Y2 (en) 1991-05-29

Family

ID=31324063

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9810187U Expired JPH0324599Y2 (en) 1987-06-26 1987-06-26

Country Status (1)

Country Link
JP (1) JPH0324599Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017137523A (en) * 2016-02-01 2017-08-10 アスカコーポレーション株式会社 Semiconductor wafer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017137523A (en) * 2016-02-01 2017-08-10 アスカコーポレーション株式会社 Semiconductor wafer

Also Published As

Publication number Publication date
JPH0324599Y2 (en) 1991-05-29

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